Continuous rolling type electroplating device for thin film

By designing a film continuous rolling electroplating device, including multiple plating rollers and discharge rollers, the electroplating transmission distance of the film in the electrolyte is extended, the electroplating uneven problem caused by the short film transportation distance is solved, and the electroplating quality is improved.

CN222961583UActive Publication Date: 2025-06-10广东芯华镁半导体技术有限公司
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Patent Information

Application Number
CN202421900109.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-07
Publication Date
2025-06-10
Estimated Expiration
2034-08-07

AI Technical Summary

Technical Problem

In the existing film continuous rolling electroplating device, the film transport distance is short, resulting in poor plating effect and inability to evenly distribute the current, which leads to uneven electroplating of film products, affecting the quality of subsequent processing.

Method used

A film continuous rolling electroplating device is designed, including an electrolytic cell, a first, second and third electroplating rollers, and a discharge roller. The film is transmitted sequentially through these rollers, extending the electroplating transmission distance and ensuring uniform distribution of current.

Benefits of technology

By extending the electroplating transmission distance of the film in the electrolyte, the electroplating quality of the film products is improved, the uniformity of the electroplating layer is ensured, and the problem of uneven electroplating is solved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a continuous rolling type electroplating device for a thin film. The continuous rolling type electroplating device comprises an electrolytic bath, the electrolytic bath is provided with a feeding hole and a discharging hole of a film product; the electrolytic bath is provided with a first feeding roller which can rotate, and a first electroplating roller, a second electroplating roller and a third electroplating roller which are arranged in electrolyte and can rotate; the lowest point of the first feeding roller is horizontally tangent to the highest point of the first electroplating roller; the second electroplating roller is positioned below the first electroplating roller, and the third electroplating roller is positioned below the first feeding roller; the lowest point of the second electroplating roller is horizontally tangent to the lowest point of the third electroplating roller, and the discharging roller is arranged close to the discharging opening; the upper surface of the film is matched with the first feeding roller, and the lower surface of the film is matched with the first electroplating roller, so that a first electroplating conveying section of the film is formed; and the lower surface of the film is sequentially matched with the second electroplating roller and the third electroplating roller to form a second transmission section of the film. According to the technical scheme, the electroplating quality of a thin film electroplating product is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of electroplating devices, in particular to a thin-film continuous rolling electroplating device. Background Art

[0002] The thin-film continuous rolling electroplating device is mainly used in the technical field of electroplating the base materials of flexible circuit boards. Generally, in order to improve production efficiency and the stability of product quality, when performing surface electroplating treatment on a thin film, a continuous rolling electroplating treatment method is adopted, and the entire process of electroplating the thin film is usually continuous. As shown in Figure 1, in an existing technical solution, when electroplating the thin-film base material for a flexible circuit board, it usually goes through key steps such as a rewinding and feeding device, hot water washing, micro-etching, cleaning, pre-electroplating, water washing and drying, secondary copper plating, antioxidant treatment, blowing and washing, and secondary drying. Among them, the secondary copper plating process is a key step to ensure the electroplating quality of the flexible circuit board. However, in the prior art, when performing secondary electroplating on thin-film products, problems that usually occur are that the transportation distance of the thin film is short, the electroplating effect is poor, and the current cannot be evenly distributed on the surface of the thin film, resulting in uneven electroplating of the thin-film product, thereby affecting the processing quality of subsequent products. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a thin-film continuous rolling electroplating device to solve the problems of short transportation distance of the thin film and poor electroplating effect during the electroplating process.

[0004] To achieve this purpose, the utility model adopts the following technical solutions:

[0005] A thin-film continuous rolling electroplating device, characterized in that it includes an electrolytic cell for containing electrolyte; the electrolytic cell has a feed inlet and a discharge outlet for thin-film products;

[0006] The electrolytic cell is provided with a first feeding roller and a discharge roller that can both rotate, and a first electroplating roller, a second electroplating roller, and a third electroplating roller that can both rotate and are placed in the electrolyte;

[0007] The lowest point of the first feeding roller is horizontally tangent to the highest point of the first electroplating roller; the second electroplating roller is located below the first electroplating roller, and the third electroplating roller is located below the first feeding roller; the lowest point of the second electroplating roller is horizontally tangent to the lowest point of the third electroplating roller, and the discharge roller is arranged close to the discharge outlet;

[0008] During the electroplating process, the thin film continuously enters from the feed inlet, successively passes through the first feeding roller, the first electroplating roller, the second electroplating roller, the third electroplating roller, and the discharge roller, and is sent out from the discharge outlet;

[0009] The upper surface of the film cooperates with the first feeding roller, and the lower surface of the film cooperates with the first electroplating roller to form the first electroplating transmission section of the film; the lower surface of the film cooperates with the second electroplating roller and the third electroplating roller in sequence to form the second electroplating transmission section of the film.

[0010] Optionally, the first electroplating transmission section is equal to the second electroplating transmission section.

[0011] Optionally, the second electroplating roller is arranged directly below the first electroplating roller.

[0012] Optionally, a second feeding roller is further arranged in the electrolytic cell, and the second feeding roller is arranged above the electrolyte.

[0013] The second feeding roller is arranged away from the discharge port, and the upper surface of the film cooperates with the second feeding roller before passing through the first feeding roller.

[0014] Optionally, it further includes a lead screw, a fixed seat and a moving member. The fixed seat is installed on the electrolytic cell. The two ends of the lead screw are respectively rotationally matched with the fixed seat. The lead screw is in threaded cooperation with the moving member. By rotating the lead screw, the moving member can move in the extending direction of the lead screw; the moving member is connected to the second feeding roller so that the distance of the second feeding roller relative to the feeding port can be adjusted.

[0015] Optionally, a driving motor is further arranged on the moving member, and the driving motor can drive the second feeding roller to rotate.

[0016] Optionally, it further includes a guide rail fixed to the electrolytic cell. The extending direction of the guide rail is parallel to the lead screw, and the moving member is in sliding cooperation with the guide rail.

[0017] Optionally, a roller is further arranged at one end of the second feeding roller facing away from the moving member, and the roller is in rotational cooperation with the

[0018] second feeding roller; the electrolytic cell is further fixedly connected with a lower guiding member, and the contact surface between the roller and the lower guiding member is adapted and can roll relative to the lower guiding member.

[0019] Optionally, it further includes a connecting member. The connecting member is in rotational cooperation with the second feeding roller, and the other part of the connecting member is in rotational cooperation with the roller.

[0020] Optionally, the number of the rollers is two, and the two rollers are respectively in rotational cooperation with the connecting member and are arranged on both sides of the second feeding roller.

[0021] Optionally, the electrolytic cell is further provided with an upper guide member, which is disposed above the roller and opposite to the lower guide member.

[0022] Compared with the prior art, the utility model has the following beneficial effects:

[0023] In the technical solution of the utility model, during electroplating, the thin film continuously enters from the feed port, successively passes through the first feeding roller, the first electroplating roller, the second electroplating roller, the third electroplating roller and the discharging roller, and is sent out from the discharging port; the upper surface of the thin film cooperates with the first feeding roller, and the lower surface of the thin film cooperates with the first electroplating roller to form the first electroplating transmission section of the thin film; the lower surface of the thin film successively

[0024] cooperates with the second electroplating roller and the third electroplating roller to form the second electroplating transmission section of the thin film. At this time, the upper surface of the thin film in the first electroplating transmission section faces upward, and the lower surface of the thin film faces downward. Due to the influence of gravity in the first electroplating transmission section, the metal electroplating layer deposited on the upper surface of the thin film is thicker than the metal electroplating layer on the lower surface of the thin film; in the second electroplating transmission section, the lower surface of the thin film faces upward, and the thin

[0025] film's upper surface faces downward, so that enough metal electroplating layer can be deposited on the lower surface of the thin film to balance the problem of inconsistent electroplating layer thickness brought in the first electroplating transmission section, and improve the uniformity of the electroplating layer of the thin film. And in this technical solution, the setting of the first electroplating transmission section and the second electroplating transmission section prolongs the electroplating transmission distance of the thin film in the electrolyte, and further improves the

[0026] electroplating quality of the thin film product. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts,

[0028] other drawings can also be obtained according to these drawings.

[0029] The structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those who are familiar with this technology to understand and read, and are not used to limit the limiting conditions that the present utility model can be implemented. Therefore, they do not have technical substance significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present utility model can produce and the purposes that can be achieved, should still fall within the scope that the technical content disclosed by the present utility model can cover.

[0030] FIG. 1 is a process flow chart of the prior art;

[0031] Figure 2 is a schematic structural diagram of an embodiment of the present utility model;

[0032] Figure 3 is a sectional view of an embodiment of the present utility model;

[0033] Figure 4 is a cross-sectional view of an embodiment of the present utility model;

[0034] Figure 5 is a schematic structural diagram of an embodiment of the present utility model;

[0035] Figure 6 is a sectional view of an embodiment of the present utility model;

[0036] Figure 7 is an enlarged view of part A in Figure 6;

[0037] Figure 8 is a sectional view of an embodiment of the present utility model;

[0038] Figure 9 is an enlarged view of part B in Figure 8;

[0039] Illustration: 100, thin film continuous rolling electroplating device; 110, electrolytic cell; 110a, electrolyte; 111, feed inlet; 112, discharge outlet; 120, first feeding roller; 130, discharge roller; 140, first electroplating roller; 150, second electroplating roller; 160, third electroplating roller; 170, second feeding roller; 181, lead screw; 182, fixed seat; 183, moving part; 184, driving motor;

[0040] 185, guide rail; 186, roller; 187, lower guiding part; 188, connecting part; 189, upper guiding part; 200, thin film. Detailed implementation manners

[0041] In order to make the technical objectives, features, and advantages of the present utility model more obvious and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously,

[0042] The embodiments described below are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts

[0043] all fall within the scope of protection of the present utility model.

[0044] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be intermediate components present simultaneously.

[0045] When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be intermediate components present simultaneously.

[0046] The technical solution of the present utility model will be further described below in conjunction with the drawings and through specific embodiments.

[0047] The thin film continuous rolling electroplating device 100 is mainly used in the technical field of electroplating the substrate of flexible printed circuit boards. Generally, in order to improve production efficiency and the stability of product quality, when performing surface electroplating treatment on the thin film 200, a continuous

[0048] rolling electroplating treatment method is adopted, and the entire process of electroplating the thin film 200 is usually carried out continuously. As shown in FIG. 1, in an existing technical solution, when electroplating the substrate of the thin film 200 for flexible printed circuit boards, it usually goes through key steps such as unwinding 11, hot water washing 12, micro-etching 13, cleaning 14, pre-electroplating 15, water washing and drying 16, secondary copper plating 17, antioxidant treatment 18, blow washing 19, secondary drying 20, and winding 21. Among them, the secondary copper plating 17 process is a key step to ensure the electroplating quality of flexible printed circuit boards. However, in the prior art, when performing secondary electroplating on the thin film 200 product, the common problems usually include

[0049] The transportation distance of the thin film 200 is short, the electroplating effect is poor, and the current cannot be evenly distributed on the surface of the thin film 200, resulting in uneven electroplating of the thin film 200 product, and thus affecting the processing quality of subsequent products.

[0050] The embodiment of the present utility model provides a thin film continuous rolling electroplating device 100.

[0051] Please refer to FIGS. 2, 3 and 4. The described thin-film continuous rolling electroplating device 100 includes an electrolytic cell 110 for containing an electrolyte 110a; the electrolytic cell 110 has a feed inlet 111 and a discharge outlet 112 for the thin-film 200 product; the electrolytic cell 110 is provided with a first feed roller 120 and a discharge roller 130 that are both rotatable, and a first electroplating roller 140, a second electroplating roller 150 and a third electroplating roller 160 that are all rotatable and placed in the electrolyte 110a; the lowest point of the first feed roller 120 is horizontally tangent to the highest point of the first electroplating roller 140; the second electroplating roller 150 is located below the first electroplating roller 140, and the third electroplating roller 160 is located below the first feed roller 120; the lowest point of the second electroplating roller 150 is horizontally tangent to the lowest point of the third electroplating roller 160, and the discharge roller 130 is arranged close to the discharge outlet 112; during the electroplating process, the thin-film 200 continuously enters from the feed inlet 111, sequentially passes through the first feed roller 120, the first electroplating roller 140, the second electroplating roller 150, the third electroplating roller 160 and the discharge roller 130, and is sent out from the discharge outlet 112; the upper surface of the thin-film 200 cooperates with the first feed roller 120, and the lower surface of the thin-film 200 cooperates with the first electroplating roller 140 to form a first electroplating transmission section of the thin-film 200; the lower surface of the thin-film 200 sequentially cooperates with the second electroplating roller 150 and the third electroplating roller 16 to form a second electroplating transmission section for electroplating the thin-film 200.

[0052] It can be understood that in the technical solution of the present invention, during electroplating, the thin-film 200 continuously enters from the feed inlet 111 and sequentially passes through the first feed roller 120, the first electroplating roller 140, the second electroplating roller 150, the third electroplating roller 160 and the

[0053] discharge roller 130 and is sent out from the discharge outlet 112; the upper surface of the thin-film 200 cooperates with the first feed roller 120, and the lower surface of the thin-film 200 cooperates with an electroplating roller to form a first electroplating transmission section of the thin-film 200; the lower surface of the thin-film 200 sequentially cooperates with the second electroplating roller 150 and the third electroplating roller to form a second electroplating transmission section of the thin-film 200. At this time, the upper surface of the thin-film 200 in the first electroplating transmission section faces upward, and the lower surface of the thin-film 200 faces downward. Due to the influence of gravity in the first electroplating transmission section, the metal electroplating layer deposited on the upper surface of the thin-film 200 is thicker than the metal electroplating layer on the lower surface of the thin-film 200; in the second electroplating transmission section, the lower surface

[0054] Face up, the upper surface of the film 200 faces down, so that enough metal plating layers can be deposited on the lower surface of the film 200 to balance the problem of inconsistent plating layer thickness brought by the first plating transfer section and improve the uniformity of the plating layer of the film 200.

[0055] And in this technical solution, the settings of the first plating transfer section and the second plating transfer section extend the plating transfer distance of the film 200 in the electrolyte 110a, thereby improving the plating quality of the film 200 product.

[0056] It should also be noted that when the electroplated product of the film 200 is a flexible circuit board, the material of the film 200 is preferably a PE film.

[0057] It should also be noted that in the above embodiment, the rotation directions of the first feeding roller 120 and the discharging roller 130 are the same; the rotation directions of the first plating roller 140, the second plating roller 150, and the third plating roller 160 are the same.

[0058] It should also be noted that a part of the first feeding roller 120 is placed in the electrolyte 110a in the electrolytic cell 110, so that the film 200 can be effectively electroplated in the first plating transfer section.

[0059] It should also be noted that the tangent line between the first feeding roller 120 and the first plating roller 140 is horizontal; the tangent line between the second feeding roller 170 and the third feeding roller is horizontal.

[0060] It should also be noted that for the convenience of description, in all embodiments of the present invention, it is defined that in the first plating transfer section, the surface of the film 200 facing upward is the upper surface of the film 200, and the surface of the film 200 facing downward is the lower surface of the film 200.

[0061] Please refer to FIG. 4. In a preferred embodiment, to make the metal plating layers on the upper and lower surfaces of the film 200 more uniform, the first plating transfer section is equal to the second plating transfer section.

[0062] Preferably, in order to avoid non-uniform deposition of the film 200 between the first plating roller 140 and the second plating roller 150, the second plating roller 150 is arranged directly below the first plating roller 140.

[0063] It can be understood that in order to ensure synchronous rotation, the diameters of the first plating roller 140, the second plating roller 150, and the third plating roller 160 are usually set to be the same. The second plating roller 150 is arranged directly below the first plating roller 140. At this time, the film 200 is in a vertical state, reducing the influence of gravity during the metal deposition process.

[0064] Optionally, the third electroplating roller 160 is disposed directly below the first feeding roller 120.

[0065] Referring to FIGS. 3 and 4, in a specific embodiment, a second feeding roller 170 is further disposed in the electrolytic cell 110. The second feeding roller 170 is disposed above the electrolytic solution 110a. The second feeding roller 170 is disposed away from the discharge port. The upper surface of the film 200 cooperates with the second feeding roller 170 before passing through the first feeding roller 120.

[0066] It can be understood that after the film 200 is pretreated, it needs to be immediately washed and dried. The arrangement of the second feeding roller 170 extends the transmission distance of the film 200 product, which is beneficial to the evaporation of the moisture on the surface of the film 200.

[0067] Referring to FIGS. 2, 6 and 7, in a specific embodiment, the film continuous rolling electroplating device 100 further includes a lead screw 181, a fixed seat 182 and a moving member 183. The fixed seat 182 is installed on the electrolytic cell 110. The two ends of the lead screw 181 are respectively rotationally matched with the fixed seat 182. The lead screw 181 is in threaded cooperation with the moving member 183. By rotating the lead screw 181, the moving member 183 can move in the extending direction of the lead screw 181; the moving member 183 is connected to the second feeding roller 170 so that the distance of the second feeding roller 170 relative to the feeding port 111 can be adjusted.

[0068] It can be understood that since the number of electroplating rollers cooperating with the film 200 in the electrolytic cell 110 is large, in order to ensure the effective cooperation and transmission between the film 200 and the first electroplating roller 140, the second electroplating roller 150 and the third electroplating roller 160, the distance of the second feeding roller 170 relative to the feeding port 111 can be adjusted to adjust the tension of the film 200 so that the film 200 can be effectively transmitted in the electrolytic cell 110.

[0069] Specifically, in order for the second feeding roller 170 to feed automatically, the moving member 183 is further provided with a driving motor 184, and the driving motor 184 can drive the second feeding roller 170 to rotate.

[0070] Specifically, in order to make the moving member 183 move stably, the film continuous rolling electroplating device 100 further includes a guide rail 185 fixed to the electrolytic cell 110. The extending direction of the guide rail 185 is parallel to that of the lead screw 181, and the moving member 183 is slidably matched with the guide rail 185.

[0071] Specifically, in order to make the moving member 183 move stably, the film continuous rolling electroplating device 100 further includes a guide rail 185 fixed to the electrolytic cell 110. The extending direction of the guide rail 185 is parallel to that of the lead screw 181, and the moving member 183 is slidably mated with the guide rail 185.

[0072] Further, referring to FIGS. 5, 8 and 9, a roller 186 is further provided at one end of the second feeding roller 170 away from the moving member 183. The roller 186 is rotationally engaged with the second feeding roller 170; the electrolytic cell 110 is further fixedly connected with a lower guiding member

[0073] 187. The contact surface of the roller 186 and the lower guiding member 187 is adapted, and the roller 186 can roll relative to the lower guiding member 187. It can be understood that the roller 186 is provided to reduce friction. The contact surface of the roller 186 and the lower guiding member 187 is adapted to prevent the roller 186 from shifting or jamming.

[0074] Specifically, the film continuous rolling electroplating device 100 further includes a connecting member 188. The connecting member 188 is rotationally engaged with the second feeding roller 170, and another part of the connecting member 188 is rotationally engaged with the roller 186.

[0075] Further, the number of the rollers 186 is two. The two rollers 186 are respectively rotationally engaged with the connecting member 188 and are arranged on both sides of the second feeding roller 170.

[0076] It can be understood that the setting of the connecting member 188 can prevent the roller from sliding relative to the lower guiding member 187 when the second feeding roller 170 rotates. The setting of the number of the rollers 186 being two can further make the roller 186 relatively fixed relative to the lower guiding member 187 after the second feeding roller 170 adjusts the tension of the film 200.

[0077] Optionally, when the surface of the roller 186 is a V-shaped convex structure, the lower guiding member 187 has a V-shaped groove.

[0078] Optionally, when the surface of the roller 186 is a V-shaped groove structure, the lower guiding member 187 has an inverted V-shaped structure.

[0079] In a specific embodiment, as shown in FIG. 5, the electrolytic cell 110 is further provided with an upper guiding member 189. The upper guiding member 189 is arranged above the roller 186 and is opposite to the lower guiding member 187. It can be understood that the upper guiding member 189 can be used for dust prevention and also for guiding.

[0080] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these

[0081] modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A thin film continuous rolling electroplating device, characterized in that: The invention comprises an electrolytic cell, wherein the electrolytic cell is used to contain electrolyte; the electrolytic cell has a feed port and a discharge port for thin film products; the electrolytic cell is provided with a first feeding roller and a discharge roller, both of which are capable of rotating, and a first electroplating roller, a second electroplating roller and a third electroplating roller, both of which are capable of rotating and are placed in the electrolyte; the lowest point of the first feeding roller is horizontally tangent to the highest point of the first electroplating roller; the second electroplating roller is located below the first electroplating roller, and the third electroplating roller is located below the first feeding roller; the lowest point of the second electroplating roller is horizontally tangent to the lowest point of the third electroplating roller, and the discharge roller is arranged close to the discharge port; During the electroplating process, the film continuously enters from the feed port, passes through the first feeding roller, the first electroplating roller, the second electroplating roller, the third electroplating roller and the discharging roller in sequence, and is sent out from the discharging port; the upper surface of the film cooperates with the first feeding roller, and the lower surface of the film cooperates with the first electroplating roller to form a first electroplating transmission section of the film; the lower surface of the film cooperates with the second electroplating roller and the third electroplating roller in sequence to form a second electroplating transmission section of the film.

2. The thin film continuous rolling electroplating device according to claim 1, characterized in that: The first electroplating transmission section is equal to the second electroplating transmission section; and / or the second electroplating roller is arranged directly below the first electroplating roller.

3. The thin film continuous rolling electroplating device according to claim 1, characterized in that: A second feed roller is also provided in the electrolytic cell. The second feed roller is provided above the electrolyte and is far away from the discharge port. The upper surface of the film cooperates with the second feed roller before passing through the first feed roller.

4. The thin film continuous rolling electroplating device according to claim 3, characterized in that: It also includes a screw rod, a fixed seat and a moving part. The fixed seat is installed on the electrolytic cell. The two ends of the screw rod are respectively rotatably matched with the fixed seat. The screw rod is threadedly matched with the moving part. By rotating the screw rod, the moving part can move in the extension direction of the screw rod; the moving part is connected to the second feeding roller so that the distance between the second feeding roller and the feed port can be adjusted.

5. The thin film continuous rolling electroplating device according to claim 4, characterized in that: The moving member is also provided with a driving motor, and the driving motor can drive the second feeding roller to rotate.

6. The thin film continuous rolling electroplating device according to claim 4, characterized in that: It also includes a guide rail fixed to the electrolytic cell, the extension direction of the guide rail is parallel to the lead screw, and the moving part is slidably matched with the guide rail.

7. The thin film continuous rolling electroplating device according to claim 4, characterized in that: A roller is also provided at one end of the second feeding roller away from the moving part, and the roller is rotatably matched with the second feeding roller; the electrolytic cell is also fixedly connected to a lower guide part, and the roller is adapted to the contact surface of the lower guide part and can roll relative to the lower guide part.

8. The thin film continuous rolling electroplating device according to claim 7, characterized in that: It also includes a connecting piece, which is rotationally matched with the second feeding roller, and another part of the connecting piece is rotationally matched with the roller.

9. The thin film continuous rolling electroplating device according to claim 8, characterized in that: The number of the rollers is two, and the two rollers are respectively rotatably matched with the connecting member and are arranged on both sides of the second feeding roller.

10. The thin film continuous rolling electroplating device according to claim 9, characterized in that: The electrolytic cell is also provided with an upper guide member, which is arranged above the roller and opposite to the lower guide member.