Display module and display device

Abstract

The utility model relates to the technical field of display preparation, and provides a display module and a display device.The display module comprises a cover plate and a display panel, the side, facing the cover plate, of the first surface of the cover plate is sunken, and the first surface is the face, close to the display panel, of the cover plate; the display panel comprises a display area, a bending area and a binding area, the bending area is connected with the display area and the binding area, and the orthographic projection of the display area is within the orthographic projection of the cover plate; the supporting layer is located on the side, away from the cover plate, of the display area and is integrally formed; wherein the supporting layer forms a containing space, the bending area is located in the containing space, and after the bending area is bent, the binding area is located on the side, away from the display area, of the supporting layer.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] The purpose of the background technology description provided here is to give an overall background of the present application. The statements in this section merely provide background related to the present application and do not necessarily constitute prior art.

[0003] At present, organic light-emitting diode (OLED) wearable products are constantly updated and developed rapidly, and spherical display is one of the hottest research directions. Users' demand for spherical display products is also becoming stronger and stronger.

[0004] However, the reliability of the display module in the related art is poor. Utility Model Content

[0005] In view of the above problems, the present application proposes a display module, a method for preparing the display module and a display device to solve the problem of poor reliability of the display module in the related art.

[0006] The present application provides a display module, comprising

[0007] A cover plate and a display panel, wherein a first surface of the cover plate is recessed toward one side of the cover plate, and the first surface is a surface of the cover plate close to the display panel;

[0008] The display panel comprises a display area, a bending area and a binding area, the bending area is connected to the display area and the binding area respectively, and the orthographic projection of the display area is within the orthographic projection of the cover plate;

[0009] A supporting layer, located at a side of the display area away from the cover plate and integrally formed;

[0010] The supporting layer forms an accommodating space, the bending area is located in the accommodating space, and after the bending area is bent, the binding area is located on a side of the supporting layer away from the display area.

[0011] Optionally, the display module further includes:

[0012] A flexible circuit board is connected to the binding area and is located on a surface of the supporting layer facing away from the display area.

[0013] Optionally, the support layer includes a first bonding area and a second bonding area, and after the bending area is bent, the first bonding area is located within the coverage of the orthographic projection of the flexible circuit board and the binding area, and the second bonding area is the area of ​​the support layer excluding the first bonding area;

[0014] One side surface of the second bonding area facing away from the display area is located between one side surface of the bonding area facing the display area and one side surface of the bonding area facing away from the display area.

[0015] Optionally, the display module further includes: a fixing member for fixing the flexible circuit board and the support layer.

[0016] Optionally, the fixing member includes a first part and a second part. The width of the first part is greater than the width of the second part. The first part is located on a side of the flexible circuit board facing away from the support layer, and the second part penetrates through the flexible circuit board and extends into the support layer;

[0017] The width directions of the first part and the second part are parallel, and the width direction is perpendicular to the arrangement direction from the first part to the second part.

[0018] Optionally, the flexible circuit board includes a coding area, and a plurality of the fixing members are spaced apart from the coding area in the flexible circuit board.

[0019] Optionally, the width range of the second part is 0.2 mm to 0.4 mm;

[0020] Along the arrangement direction from the first part to the second part, the height range of the second part is 0.5 mm to 1 mm.

[0021] Optionally, the surface roughness of the second part is greater than the surface roughness of the first part.

[0022] Optionally, the display module further includes: a first protective layer, a second protective layer, and a third protective layer;

[0023] After the bending area is bent, the first protective layer is located between the display area and the support layer, the second protective layer is located between the bonding area and the support layer; the third protective layer is located between the bending area and the second bonding area of the support layer;

[0024] Wherein, both the first protective layer and the second protective layer are in contact with the support layer.

[0025] The present application further provides a display device including the display module as described above.

[0026] In the display module provided by the present application, the support layer is located on the side of the display area facing away from the cover plate and is integrally formed; wherein, at least part of the bending area is located in the support layer, and the bonding area is located on the side of the support layer facing away from the display area. Thus, at least the following beneficial technical effects can be brought: The integrally formed support layer can cover the opposite bending surfaces of the bending area of the display panel, avoiding the formation of gaps between the support layer and the bending area. Therefore, when an external force acts on the bending area, the support layer can better protect the bending area extending into the support layer, and the support layer can buffer the external force and then act on the bending area, so that the ability of the bending area to resist deformation under the action of the external force is enhanced. Therefore, the reliability of the display module is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the provided drawings.

[0028] In addition, it should be noted that, for the sake of convenience of description, only the parts related to the present disclosure are shown in the drawings. The accompanying drawings forming a part of this application are used to provide a further understanding of the present application. The schematic embodiments and descriptions in the present application are used to explain the present application and do not constitute an improper limitation of the present application. In the drawings:

[0029] Figures 1 to 4 is a schematic structural diagram of the display module preparation process in the related art;

[0030] Figure 5 is a schematic structural diagram of the display module provided by an embodiment of the present application;

[0031] Figure 6 is Figure 5 an enlarged view of the areas of wireframe C and wireframe D;

[0032] Figure 7 shows a schematic structural diagram of the fixing member in the display module provided by an embodiment of the present application;

[0033] Figure 8 shows a top view of the display module provided by an embodiment of the present application;

[0034] Figure 9 shows a flowchart of the preparation method of the display module provided by an embodiment of the present application;

[0035] Figures 10 to 17 is a schematic structural diagram of the display module preparation process provided by an embodiment of the present application.

[0036] Reference numerals: cover plate 101, first surface 1011, display panel 102, display area 1021, bending area 1022, bonding area 1023, first surface 10233 of the bonding area, second surface 10232 of the bonding area, flexible circuit board 103, optical adhesive 104, polarizer 105; first protective layer 10211, second protective layer 10231, adhesive layer 113a, support layer 113, first bonding area 1131, second bonding area 1132, first support layer 107, second support layer 108, glue layer 109, back glue 110 of the flexible circuit board, gap 111 in the bending area, covering layer 112, fixing member 114, first part 1141, second part 1142, lower mold 115, lower mold buffer layer 1151, lower mold body 1152, upper mold 116, first buffer layer 1161 of the upper mold, upper mold body 1162, second buffer layer 1163 of the upper mold. Detailed implementation manners

[0037] In related technologies, the preparation method of a display module includes: Refer to Figure 1 , provide a cover plate 101 and a display panel 102, the first surface 1011 of the cover plate 101 is recessed toward the display panel 102, the display panel 102 includes a display area 1021, a bending area 1022 and a bonding area 1023, the bending area 1022 is respectively connected to the display area 1021 and the bonding area 1023, the display area 1021 extends along a part of the first surface 1011, the bonding area 1023 is connected to a flexible circuit board 103, and a protective layer 112 is provided on a bending surface of the bending area 1022 on a side away from the support structure. Prepare a special-shaped support structure, the special-shaped support structure includes a first support layer 107 and a second support layer 108. Exemplarily, the material of the first support layer 107 is reticular glue, and the material of the second support layer 108 is silica gel; Refer to Figure 2 , place the prepared support structure on a side of the display area 1021 away from the cover plate 101; then, with reference to Figure 3 and Figure 4 , Figure 3 is a schematic diagram based on Figure 2 , Figure 4 is Figure 3 an enlarged view of the dashed boxes A and B in Figure 4 the left area in Figure 3 is an enlarged view of the dashed box A in Figure 4 the right area in Figure 3 is an enlarged view of the dashed box A in Bend the bending area 1022 so that the bonding area 1023 is disposed opposite to the display area 1021, and bond the flexible circuit board 103 and the support structure and bond the bonding area 1023 and the display area 1021.

[0038] However, the reliability of the display module formed by the above method for preparing a display module is poor. Through research, it is found that the reasons are as follows:

[0039] There are dimensional errors in the processing of the first support layer 107 and the second support layer 108 of the support structure. During the process of placing the support structure on the side of the display area 1021 away from the cover plate 101, a local area of the support structure will exert a large extrusion force on the display area 1021, causing a die mark to be formed on the surface of the display panel 102. Secondly, after bending the bending area 1022, there is a large gap 111 between the support structure and the bending area 1022, and the support structure does not cover the side of the protective layer 112 away from the bending area 1022. The bending area 1022 has a weak ability to resist deformation when subjected to external forces. Therefore, the reliability of the display module is reduced. Secondly, the process of preparing a special-shaped support structure and performing precise positioning is difficult.

[0040] On this basis, the embodiments of the present application propose a display module, a method for preparing a display module, and a display device, which improve the reliability of the display module.

[0041] Next, the technical solutions of the present invention will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0042] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0043] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can also be the internal communication of two elements. It can be a wireless connection or a wired connection. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0045] Figure 5 A schematic diagram of the structure of a display module provided in accordance with an embodiment of the present application. Figure 6 for Figure 5 Enlarged view of the dashed box C and the dashed box D. Figure 6 The diagram on the left is Figure 5 The enlarged view of the dashed box C in the middle, Figure 6 The diagram of the right area is Figure 5 Enlarged view of the dashed box D in the middle.

[0046] An embodiment of the present application provides a display module, referring to Figure 5 and Figure 6 , the display module may include:

[0047] A cover plate 101 and a display panel 102, wherein a first surface 1011 of the cover plate 101 is recessed toward one side of the cover plate 101, and the first surface 1011 is a surface of the cover plate 101 close to the display panel 102;

[0048] The display panel 102 includes a display area 1021, a bending area 1022 and a binding area 1023, wherein the bending area 1022 is connected to the display area 1021 and the binding area 1023 respectively, and the orthographic projection of the display area 1021 is within the orthographic projection of the cover plate 101;

[0049] The support layer 113 is located at a side of the display area 1021 away from the cover plate 101 and is integrally formed;

[0050] The support layer 113 forms an accommodating space, the bending area 1022 is located in the accommodating space, and after the bending area is bent, the binding area 1023 is located on a side of the support layer 113 away from the display area 1021 .

[0051] In the display module provided by the embodiment of the present application, the support layer 113 is located on the side of the display area 1021 away from the cover plate 111 and is integrally formed. At least a part of the bending area 1022 is located in the support layer 113, and the bonding area 1023 is located on the surface of the support layer 113 away from the display area 1021. The integrally formed support layer 113 can cover the bending area 1022 of the display panel 102, avoiding the formation of voids between the support layer 113 and the bending area 1022. Therefore, when an external force acts on the bending area 1022, the support layer 113 provides good protection for the bending area 1022 extending into the support layer 113. After the support layer 113 buffers the external force, it acts on the bending area 1022, so that the ability of the bending area 1022 to resist deformation under the external force is enhanced. Therefore, the reliability of the display module is improved.

[0052] In one embodiment, the display module is an organic light-emitting diode (OLED) display module, such as a display module for wearable devices.

[0053] In one embodiment, referring to Figure 5 , the display module further includes: a flexible circuit board 103, which is connected to the bonding area 1023 and is located on the surface of the support layer 113 away from the display area 1021. The flexible circuit board 103 is in contact with the surface of the support layer 113 away from the display area 1021.

[0054] In a specific example, the shape of the display surface of the display area 1021 is an arc surface. The shape of the back surface of the display area 1021 opposite to the display surface is an arc surface. The display module meets the actual needs of wearable devices, such as smart watches or smart bracelets.

[0055] In one embodiment, the area of the first surface 1011 of the cover plate 101 is larger than the area of the display surface of the display area 1021, and the edge of the cover plate 101 extends beyond the edge of the display area 1021.

[0056] The cover plate 101 is a light-transmitting cover plate, so that the picture displayed in the display area 1021 can be observed from the side of the cover plate 101 away from the display area 1021. Exemplarily, the light-transmitting cover plate is a glass cover plate.

[0057] In one embodiment, the support layer 113 includes a first bonding area 1131 and a second bonding area 1132. After the bending area is bent, the first bonding area 1131 is within the orthographic projection coverage of the flexible circuit board 103 and the bonding area 1023, and the second bonding area 1132 is the area of the support layer 113 other than the first bonding area 1131;

[0058] One side surface of the second bonding area 1132 facing away from the display area 1021 is located between one side surface of the bonding area 1023 facing the display area 1021 and one side surface of the bonding area 1023 facing away from the display area 1021.

[0059] In this way, the support layer 113 exposes one side surface of the flexible circuit board 103 facing away from the display area 1021 and one side surface of the bonding area 1023 facing away from the display area 1021, without affecting the bonding of one side surface of the flexible circuit board 103 facing away from the display area 1021 to the integrated circuit chip.

[0060] In this application, through the integrally formed support layer 103, the structure of the display module can be effectively simplified.

[0061] In one embodiment, referring to Figure 5 , the display module further includes: a fixing member 114 for fixing the flexible circuit board 103 and the support layer 113. The fixing member 114 can fix the flexible circuit board 103 and the support layer 113 to prevent the flexible circuit board 103 and the support layer 113 from separating.

[0062] In one embodiment, the material of the fixing member 114 includes but is not limited to resin materials and metal materials.

[0063] Figure 7 The structural schematic diagram of the fixing member provided in the embodiment of the present invention is shown.

[0064] Referring to Figure 7 , in one embodiment, the fixing member 114 includes a first part 1141 and a second part 1142. The width of the first part 1141 is greater than the width of the second part 1142. The first part 1141 is located on one side of the flexible circuit board 103 facing away from the support layer 113, and the second part 1142 penetrates through the flexible circuit board 103 and extends into the support layer 113. Wherein, the width directions of a part of 1141 and the second part 1142 are parallel, and the width direction is perpendicular to the arrangement direction from the first part 1141 to the second part 1142.

[0065] In one embodiment, the value range of the width a of the second part 1142 can be 0.2 mm to 0.4 mm.

[0066] In one embodiment, along the arrangement direction from the first part 1141 to the second part 1142, the value range of the height h of the second part 1142 can be 0.5 mm to 1 mm.

[0067] In a specific example, the width a of the second part 1142 may take values including but not limited to 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm; the height h of the second part 1142 may take values including but not limited to 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm.

[0068] In a specific example, h ranges from 0.5 mm to 1 mm. On the one hand, it prevents the second part 1142 from contacting the display panel 102 and avoids damaging the display area 1021. On the other hand, the height of the second part 1142 is not too small to avoid insufficient contact area between the second part 1142 and the support layer 113. When the height of the second part 1142 is within the above range, it can both avoid damaging the display surface 102 and play a good fixing role for the flexible circuit board 103 and the support layer 113.

[0069] In one embodiment, the surface roughness of the second part 1142 is greater than that of the first part 1141. By setting a larger roughness for the second part 1142, the firmness of the connection between the second part 1142 and the support layer 113 can be improved, and further the stability and reliability of the fixation of the flexible circuit board 103 and the support layer 113 can be enhanced.

[0070] The number of fixing members is one or more. Figure 5 Taking the number of fixing members as two as an example, in other embodiments, one fixing member can be set, or multiple fixing members greater than or equal to three can be set.

[0071] Figure 9 The top view of the display module provided by the embodiment of the present invention is shown.

[0072] Refer to Figure 9 , in one embodiment, the surface on the side of the flexible circuit board 103 facing away from the support layer 113 includes a coding area 1031. In a specific example, the fixing member 114 avoids the coding area 1031, that is, the fixing member 114 and the coding area 1031 are arranged at intervals.

[0073] In one embodiment, referring to Figure 6 , the display module further includes: a first protective layer 10211 and a second protective layer 10231. The first protective layer 10211 is located between the display area 1021 and the support layer 113, and the second protective layer 10231 is located between the bonding area 1023 and the support layer 113. Both the first protective layer 10211 and the second protective layer 10231 are in contact with the support layer 113.

[0074] In one embodiment, the materials of the first protective layer 10211 and the second protective layer 10231 include but are not limited to aluminum oxide, silicon oxide, etc.

[0075] In one embodiment, reference Figure 6 The display module further includes a third protective layer 10221 , and the third protective layer 10221 is located between the bending area 1022 and the second bonding area 1132 .

[0076] In one embodiment, the material of the third protective layer 10221 is acrylic glue.

[0077] The bending area 1022 has a first bending surface and a second bending surface opposite to each other, and the second bending surface is connected to the back surface of the display area 1021 away from the cover plate 101. The second bending surface is in contact with the support layer 113.

[0078] In one embodiment, reference Figure 6 The display module further includes: a polarizer layer 105 located between the display area 1021 and the cover plate 101; an optical adhesive layer 104 located between the polarizer layer 105 and the cover plate 101, and the optical adhesive layer 104 has a certain overlap with the third protective layer 10221.

[0079] Another embodiment of the present application provides a display device, including the display module as described above.

[0080] In a specific example, the display device may include but is not limited to display devices such as smart watches and smart bracelets.

[0081] Another embodiment of the present invention provides a method for preparing a display module, referring to Figure 9 , the preparation method may include:

[0082] Step 910: providing a cover plate and a display panel, wherein a first surface of the cover plate is recessed toward the inside of the cover plate, the display panel comprises a display area, a bending area and a binding area, the bending area is respectively connected to the display area and the binding area, and the display area extends along a portion of the first surface;

[0083] Step 920: placing an adhesive on a side of the display area facing away from the cover plate to form an adhesive layer;

[0084] Step 930: bending the bending area so that the binding area and the display area are arranged opposite to each other, and at least a portion of the bending area is located in the adhesive layer;

[0085] Step 940: After bending the bending region, curing the adhesive layer to form a support layer.

[0086] In the method for manufacturing the display module provided in this embodiment, an adhesive is placed on the side of the display area facing away from the cover plate. Since the adhesive has a certain fluidity, the adhesive will not exert a large pressure on the display panel, avoiding uneven light and shadow effects on the display surface of the cover plate facing away from the display panel. After placing the adhesive on the side of the display area facing away from the cover plate, the bending area is bent so that the bonding area is disposed opposite to the display area, and at least a part of the bending area is located in the adhesive layer. The adhesive layer can cover the bending area to avoid forming a gap between the adhesive and the bending area. After bending the bending area, the adhesive layer is cured to form a support layer. Correspondingly, the support layer can cover the bending surface of the bending area to avoid forming a gap between the support layer and the bending area. Therefore, when an external force acts on the bending area, the support layer can provide good protection for the bending area extending into the support layer, and the support layer plays a certain buffering role on the external force, enhancing the ability of the bending area to resist deformation caused by the external force. Moreover, no large pressure is exerted on the display panel during the curing process of the adhesive layer, avoiding uneven light and shadow effects on the display surface of the cover plate facing away from the display panel, that is, avoiding the generation of mold marks. Therefore, the reliability of the display module is improved. Secondly, the process of placing the adhesive on the side of the display area facing away from the cover plate and the process of curing the adhesive (also referred to as the adhesive layer in this embodiment) are both relatively easy to implement, thus reducing the process difficulty.

[0087] The following will be described in detail with reference to Figures 10 to 17 Specifically.

[0088] Referring to Figure 10 , in step 910, a cover plate 101 and a display panel 102 are provided. The first surface 1011 of the cover plate 101 is recessed toward one side of the cover plate 101. The first surface 1011 is the surface of the cover plate 101 close to the display panel 102. The display panel 102 includes a display area 1021, a bending area 1022, and a bonding area 1023. The bending area 1022 is respectively connected to the display area 1021 and the bonding area 1023. The orthographic projection of the display area is within the orthographic projection of the cover plate.

[0089] Further, in order to improve the stability of the cover plate 101 and the display panel 102 during subsequent processing, the method for manufacturing the display module may further include: placing the cover plate 101 and the display panel 102 on a lower mold 115.

[0090] In a specific example, the lower mold 115 includes a lower mold frame 1152 and a lower mold body 1151. The hardness of the lower mold frame 1152 is greater than that of the lower mold body 1151. The material of the lower mold body 1151 is, for example, silicone, and the material of the lower mold frame 1152 is, for example, metal. The lower mold frame 1152 has a supporting function, and the lower mold body 1151 plays a role in supporting, stabilizing, and protecting the display module to ensure the stability of the position and angle during the preparation process of the display module and guarantee the quality of the display module. The lower mold frame 1152 surrounds the bottom surface and side walls of the lower mold body 1151.

[0091] In one embodiment, the method further includes connecting the bonding area 1023 with the flexible circuit board 103 before placing the adhesive 113a on the side of the display area 1021 facing away from the cover plate 101.

[0092] In the step of bending the bending area 1023, the flexible circuit board 103 is brought into contact with the surface of the adhesive layer 113a on the side facing away from the display area.

[0093] It may be: before placing the cover plate 101 and the display panel 102 on the lower mold 115, connecting the bonding area 1023 with the flexible circuit board 103 to facilitate the operation of the bonding process.

[0094] Refer to Figure 11 , in step 920, the adhesive 113a is placed on the side of the display area 1021 facing away from the cover plate 101 to form an adhesive layer.

[0095] In one embodiment, the adhesive 113a is placed on the side of the display area 1021 facing away from the cover plate 101 according to a pre-stored injection amount. Optionally, the injection amount can be calculated based on the design structure of the display module and corrected through experiments.

[0096] Specifically, the adhesive needs to meet the fluidity requirement to achieve the effect of automatic leveling after injecting the adhesive.

[0097] Since the adhesive 113a has a certain fluidity, the adhesive 113a will not cause a large pressure on the display panel 102, avoiding uneven light and shadow effects on the display surface side of the cover plate 101 facing away from the display panel 102.

[0098] In one embodiment, the adhesive 113a has thermosetting and photocuring properties; or, the adhesive 113a has photocuring and moisture-curing properties; or, the adhesive 113a has thermosetting properties; or, the adhesive 113a has moisture-curing properties.

[0099] For adhesives that can be cured in two ways, step-by-step curing of the adhesive can be achieved to further improve the stability in the process of manufacturing the display module.

[0100] Step 930: Bend the bending area 1022 so that the bonding area 1023 is disposed opposite to the display area 1021, and at least a part of the bending area 1022 is located in the adhesive layer.

[0101] Refer to Figure 12 and Figure 13 , Figure 12 For the schematic diagram based on Figure 11 , Figure 13 shows Figure 12 a partial enlarged schematic diagram of Figure 13 where the left diagram is Figure 12 an enlarged schematic diagram of the dashed box C in Figure 13 and the right diagram is Figure 12 an enlarged schematic diagram of the dashed box D in

[0102] Bend the bending area 1022 so that the bonding area 1023 is disposed opposite to the display area 1021, and at least a part of the bending area 1022 is located in the adhesive 113a.

[0103] The adhesive layer 113a includes a first bonding area 1131 and a second bonding area 1132. After the bending area is bent, the first bonding area 1131 is located between the flexible circuit board 103 and the display area 1021, and between the bonding area 1023 and the display area 1021; the second bonding area 1132 is located on the side of the flexible circuit board 103 and the bonding area 1132;

[0104] One side surface of the second bonding area 1132 facing away from the display area 1021 is located between one side surface of the bonding area 1023 facing the display area 1021 and one side surface of the bonding area 1023 facing away from the display area 1021.

[0105] Refer to Figure 13 , one side surface of the bonding area 1023 facing the display area 1021 is the first surface 10233 of the bonding area, and one side surface of the bonding area 1023 facing away from the display area 1021 is the second surface 10232 of the bonding area.

[0106] In one embodiment, referring to Figure 6 , the display module further includes: a first protective layer 10211 and a second protective layer 10231.

[0107] After bending the bending region 1022, the first protective layer 10211 is located between the display region 1021 and the support layer 113, and the second protective layer 10231 is located between the bonding region 1023 and the support layer 113. Both the first protective layer 10211 and the second protective layer 10231 are in contact with the support layer 113.

[0108] In one embodiment, the materials of the first protective layer 10211 and the second protective layer 10231 include but are not limited to alumina, silica, etc.

[0109] In one embodiment, referring to Figure 6 , the display module further includes a third protective layer 10221. After bending the bending region, the third protective layer 10221 is located between the second bonding region 1132 of the bending region 1022 and the support layer.

[0110] The adhesive 113a can cover the bending region 1022 to prevent the formation of voids between the adhesive 113a and the bending region 1022.

[0111] In one embodiment, before placing the adhesive 113a on the side of the display region 1021 facing away from the cover plate 101, the bonding region 1023 is connected to the flexible circuit board 103; in the step of bending the bending region 1022, the flexible circuit board 103 is brought into contact with the surface of the adhesive 113a facing away from the display region 1021.

[0112] In one embodiment, after bending the bending region 1022, for the adhesive 113a located on the side of the flexible circuit board 103 and the bonding region 1023, the surface of the adhesive 113a facing away from the display region 1021 is located between the surface of the bonding region 1023 facing the display region 1021 and the surface of the bonding region 1023 facing away from the display region 1021. After bending the bending region 1022, the adhesive 113a exposes the surface of the flexible circuit board 103 facing away from the display region 1021 and the surface of the bonding region 1023 facing away from the display region 1021, without affecting the subsequent bonding of the surface of the flexible circuit board 103 facing away from the display region 1021 to the integrated circuit chip. In one embodiment, the viscosity range of the adhesive 113a is 800 mPa·s to 1500 mPa·s. The adhesive 113a has good fluidity. In a specific example, the viscosity values of the adhesive can include but are not limited to 800 mPa·s, 900 mPa·s, 1000 mPa·s, 1200 mPa·s, 1500 mPa·s.

[0113] In one embodiment, the adhesive layer 113a includes: a first adhesive zone 1131 and a second adhesive zone 1132 surrounding the side portion of the first adhesive zone. After bending the bending zone 1022, the flexible circuit board 103 contacts the first adhesive zone 1131 and a part of the second adhesive zone 1132. In one embodiment, after bending the bending zone 1022, the flexible circuit board 103 is disposed opposite to the first adhesive zone 1131.

[0114] Reference Figures 14 to 17 , Figure 14 is a schematic diagram based on Figure 12 , showing a partially enlarged schematic diagram of Figure 15 wherein the left diagram of Figure 14 is an enlarged schematic diagram of the dashed box C in Figure 15 , and the right diagram of Figure 14 is an enlarged schematic diagram of the dashed box D in Figure 15 . Figure 14 is a schematic diagram based on Figure 16 is a schematic diagram based on Figure 14 . After bending the bending zone 1022, the adhesive 113a is cured to form the support layer 113. Figure 17 is a schematic diagram based on Figure 16 . During the curing process of the adhesive, no significant pressure is exerted on the display panel, avoiding uneven light and shadow effects on the side of the cover plate facing away from the display surface of the display panel, that is, avoiding the generation of mold marks.

[0115] In one embodiment, referring to

[0116] , the method further includes: Figure 17 Before placing the adhesive 113a on the side of the display area 1021 facing away from the cover plate 101, place the cover plate 101 and the display panel 102 in the lower mold 115;

[0117] After bending the bending zone, place the upper mold 116 on the side of the flexible circuit board 103 and the bonding zone 1023 facing away from the display area 1021 and close the mold with the lower mold 115.

[0118] The adhesive layer 113a includes: a first adhesive zone 1131 and a second adhesive zone 1132 surrounding the side portion of the first adhesive zone;

[0119] After bending the bending zone 1022, the flexible circuit board 103 contacts the first adhesive zone 1031 and a part of the second adhesive zone 1032, and the bonding zone 1023 is disposed opposite to a part of the second adhesive zone 1032.

[0120]

[0121] The step of curing the adhesive layer 113a includes: curing the second adhesive area 1132 before the upper mold 116 and the lower mold 115 are molded together; and curing the first adhesive area 1131 after the upper mold 116 and the lower mold 115 are molded together.

[0122] In one embodiment, the first bonding area 1131 is cured by a thermal curing process or a moisture curing process.

[0123] refer to Figure 14 and Figure 15 , the second bonding area 1132 is cured.

[0124] In one embodiment, the second adhesive region 1132 is cured by a photocuring process.

[0125] In one embodiment, after the bending area 1022 is bent, the flexible circuit board 103 is disposed opposite to the first bonding area 1131; the method further includes:

[0126] After curing the second adhesive region 1132 and before closing the upper mold 116 and the lower mold 115 , the fixing member 114 is used to fix the flexible circuit board 103 and the first adhesive region 1131 .

[0127] The second adhesive region 1132 is cured to preliminarily fix the binding region 1023 and the flexible circuit board 103, thereby improving the position stability of the binding region 1023 and the flexible circuit board 103 in subsequent processes. Figure 16 After curing the second bonding area 1132 , the fixing member 114 is used to fix the flexible circuit board 103 and the first bonding area 1131 .

[0128] Reference Figure 7 In one embodiment, the fixing member 114 includes a first portion 1141 and a second portion 1142 , and a width of the first portion 1141 is greater than a width of the second portion 1142 .

[0129] The step of fixing the flexible circuit board 103 and the first bonding area 1132 with the fixing member 114 includes: placing the first portion 1141 on a side of the flexible circuit board 103 away from the first bonding area 1131 , and passing the second portion 1142 through the flexible circuit board 103 and extending into the first bonding area 1131 .

[0130] The width directions of the first portion 1141 and the second portion 1142 are parallel, and the width direction is perpendicular to the arrangement direction from the first portion 1141 to the second portion 1142 .

[0131] In a specific example, the width a of the second portion 1142 ranges from 0.2 mm to 0.4 mm.

[0132] In one embodiment, along the arrangement direction from the first portion 1141 to the second portion 1142 , a height h of the second portion 1142 ranges from 0.5 mm to 1 mm.

[0133] In a specific example, the width a of the second part 1142 may take values ​​including but not limited to 0.2mm, 0.25mm, 0.3mm, 0.35mm, and 0.4mm; the height h of the second part 1142 may take values ​​including but not limited to 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, and 1mm.

[0134] In one embodiment, the surface roughness of the second portion 1142 is greater than the surface roughness of the first portion 1141. By providing a greater roughness for the second portion 1142, the firmness of the connection between the second portion 1142 and the subsequently formed support layer 113 can be improved.

[0135] In a specific example, the position of the fixing member 114 should avoid various components on the flexible circuit board 103 .

[0136] In one embodiment, the surface of the flexible circuit board 103 facing away from the adhesive 113a includes a coding area 1031, and the fixing member 114 avoids the coding area, that is, the fixing member 114 and the coding area are spaced apart.

[0137] It should be noted that in other embodiments, the fixing member 114 may not be provided.

[0138] refer to Figure 17 After curing the second bonding area, the upper mold 116 is placed on the side of the flexible circuit board and the binding area away from the display area and is molded together with the lower mold 115; after the upper mold 116 and the lower mold 115 are molded together, the first bonding area 1131 is cured.

[0139] In one embodiment, the first adhesive region 1131 is cured by a thermal curing process or a moisture curing process.

[0140] In one embodiment, after fixing the flexible circuit board 103 and the first bonding area 1131 with the fixing member 114, the upper mold 116 is placed on the side of the flexible circuit board and the bonding area away from the display area and is clamped with the lower mold 115.

[0141] In one embodiment, the upper mold 116 includes an upper mold body 1161, an upper mold frame 1162, and an upper mold buffer layer 1163. The hardness of the upper mold frame 1162 is greater than that of the upper mold body 1161. The upper mold body 1161 is located between the upper mold buffer layer 1163 and the upper mold frame 1162.

[0142] In a specific example, the material of the upper mold body 1161 is silica gel, the material of the upper mold buffer layer 1163 is shaped foam, and the shape of the upper mold buffer layer 1163 fits the display module for protecting the display module. The material of the upper mold frame 1162 includes metal.

[0143] After the upper mold 116 and the lower mold 115 are clamped, the display module is fully fixed, and the position changes of the various structures of the display module are reduced during the curing process of the adhesive.

[0144] In some embodiments, after the upper mold 116 and the lower mold 115 are clamped, the adhesive 113a is cured by a thermal curing process or a moisture curing process.

[0145] The support layer can cover the bending surface of the bending area to avoid forming a gap between the support layer and the bending area. Therefore, when an external force acts on the bending area, the support layer can better protect the bending area extending into the support layer. The support layer can buffer the external force and then act on the bending area, so that the ability of the bending area to resist deformation under the external force is enhanced. The process of placing the adhesive on the side of the display area away from the cover plate and the process of curing the adhesive are both relatively easy to implement, thus reducing the process difficulty.

[0146] Another embodiment of the present application further provides a method for manufacturing a display module. The difference between this embodiment and the previous embodiment is that after the upper mold and the lower mold are clamped, the adhesive is cured by a thermal curing process or a moisture curing process. After the upper mold and the lower mold are clamped, the various regions of the adhesive are cured together, simplifying the process.

[0147] In one embodiment, the adhesive has thermosetting properties; or, the adhesive has moisture curing properties.

[0148] Those skilled in the art can understand that the structures shown in this embodiment do not constitute a limitation on the system of the embodiments of the present application, and may include more or fewer modules / units than shown in the figure, or combine some modules / units, or arrange different modules / units.

[0149] Finally, it should be noted that in the description of this specification, the descriptions with reference to the terms "one embodiment", "some embodiments", "example", "one example" or "some examples", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0150] Obviously, the above embodiments are merely examples given for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. And the obvious changes or modifications derived therefrom still fall within the protection scope of the creation of the present utility model.

Claims

1. A display module, characterized in that: include: A cover plate and a display panel, wherein a first surface of the cover plate is recessed toward one side of the cover plate, and the first surface is a surface of the cover plate close to the display panel; The display panel comprises a display area, a bending area and a binding area, the bending area is connected to the display area and the binding area respectively, and the orthographic projection of the display area is within the orthographic projection of the cover plate; A supporting layer, located at a side of the display area away from the cover plate and integrally formed; The supporting layer forms an accommodating space, the bending area is located in the accommodating space, and after the bending area is bent, the binding area is located on a side of the supporting layer away from the display area.

2. The display module according to claim 1, characterized in that: Also includes: A flexible circuit board is connected to the binding area and is located on a surface of the supporting layer facing away from the display area.

3. The display module according to claim 2, characterized in that: The support layer comprises a first bonding area and a second bonding area. After the bending area is bent, the first bonding area is located within the coverage of the orthographic projection of the flexible circuit board and the binding area, and the second bonding area is the area of ​​the support layer other than the first bonding area. A side surface of the second adhesive region facing away from the display region is located between a side surface of the binding region facing the display region and a side surface of the binding region facing away from the display region.

4. The display module according to claim 2, characterized in that: The display module further includes a fixing member for fixing the flexible circuit board and the supporting layer.

5. The display module according to claim 4, characterized in that: The fixing member includes a first part and a second part, the width of the first part is greater than the width of the second part, the first part is located on a side of the flexible circuit board away from the supporting layer, and the second part penetrates the flexible circuit board and extends into the supporting layer; The width directions of the first portion and the second portion are parallel, and the width direction is perpendicular to an arrangement direction from the first portion to the second portion.

6. The display module according to claim 4, characterized in that: The flexible circuit board includes a coding area, and a plurality of the fixing members are distributed in the flexible circuit board at intervals from the coding area.

7. The display module according to claim 5, characterized in that: The width of the second portion ranges from 0.2 mm to 0.4 mm; Along the arrangement direction from the first part to the second part, the height of the second part ranges from 0.5 mm to 1 mm.

8. The display module according to claim 5, characterized in that: The surface roughness of the second portion is greater than the surface roughness of the first portion.

9. The display module according to any one of claims 1 to 8, characterized in that: The display module further includes: a first protective layer, a second protective layer and a third protective layer; After the bending area is bent, the first protective layer is located between the display area and the supporting layer, the second protective layer is located between the binding area and the supporting layer; the third protective layer is located between the bending area and the second bonding area of ​​the supporting layer; Wherein, both the first protective layer and the second protective layer are in contact with the supporting layer.

10. A display device, comprising the display module according to any one of claims 1 to 9.

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