Silicon wafer cutting fluid spraying device
By designing a silicon wafer cutting liquid spraying device, the guide plate distance is adjusted by the coordination between the two-way screw and the carriage to ensure that the cutting liquid is guided to the small-sized silicon wafer, the problem of difficulty in guiding the cutting liquid in the prior art is solved, and a wider scope of application and higher resource utilization efficiency are achieved.
Patent Information
- Application Number
- CN202421570969.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-04
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-07-04
AI Technical Summary
When existing diamond wire cutting machines spray and cut silicon rods, it is difficult to adapt to silicon wafers of different sizes, resulting in the inability to effectively guide the cutting fluid to the silicon wafer, resulting in excessive temperature and insufficient cutting results.
A silicon wafer cutting liquid spraying device is designed. Through the cooperation between the bidirectional screw and the carriage, the distance between the first guide plate and the second guide plate is adjusted to ensure that the cutting liquid can be effectively guided to the small-sized silicon wafer. At the same time, a collection box and a cutting port are provided to facilitate the collection and reuse of the cutting liquid, and to disperse the cutting liquid more evenly through the grooves.
The device can adapt to silicon wafers of different sizes, improves the guidance efficiency of cutting fluid, reduces the cutting temperature, reduces the generation of waste wafers, and improves the utilization efficiency of resources.
Smart Images
Figure CN222972523U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer cutting, in particular to a silicon wafer cutting fluid spraying device. Background Art
[0002] The diamond wire cutting machine adopts the way of unidirectional circulation or reciprocating circulation movement of the diamond wire, so that a relative grinding movement is formed between the diamond wire and the object to be cut, thereby achieving the purpose of cutting.
[0003] The existing diamond wire cutting machine can usually only cut silicon wafers of one size when spraying and cutting silicon rods. When encountering smaller-sized silicon wafers, the distance between the deflector of the spraying device and the silicon wafer may be too large, resulting in the cutting fluid not being guided onto the silicon wafer. This will cause the temperature to be too high during cutting, and then the cut silicon wafers will not meet the standards, resulting in the generation of waste wafers. Summary of the Utility Model
[0004] The purpose of the utility model is to solve the deficiencies in the prior art and propose a silicon wafer cutting fluid spraying device.
[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:
[0006] The silicon wafer cutting fluid spraying device includes a bottom plate and a silicon wafer cutting machine body. Two slide rails are fixedly connected to the upper surface of the bottom plate. Two slide frames are movably connected between the two slide rails. A bidirectional lead screw is movably connected between the two slide frames. A spraying frame is fixedly connected to the top of the slide frame. A water outlet is opened on one side of the spraying frame. One side of the bottom of the water outlet is fixedly connected with a first deflector. A plurality of water outlets are opened on one side of the first deflector. A second deflector is fixedly connected to the outer wall of one side of the spraying frame, and the second deflector is located at the bottom of the first deflector. A groove is opened on the top of the second deflector.
[0007] As a further scheme of the utility model, a fixed block is fixedly connected to the upper surface of the bottom plate, and a collection box is fixedly connected to the top of the fixed block.
[0008] As a further scheme of the utility model, a blanking port is opened at the bottom of the collection box, and a blanking pipe is installed in the blanking port.
[0009] As a further scheme of the utility model, the first deflector and the second deflector are located above the collection box.
[0010] As a further scheme of the utility model, a water pipe is fixedly connected and communicated to the top of the spraying frame.
[0011] As a further scheme of the utility model, a knob is fixedly connected to one end of the bidirectional lead screw.
[0012] As a further solution of the present utility model, the silicon wafer cutting machine body includes a cutting assembly and a silicon rod connection assembly.
[0013] The beneficial effects of the present utility model are as follows:
[0014] 1. By the cooperative use of the bidirectional lead screw and the carriage, the distance between the first guide plate and the second guide plate is adjusted, facilitating the guiding of the cutting fluid onto small-sized silicon wafers, making the device more widely applicable and improving the flexibility of the device.
[0015] 2. Through the setting of the collection box, it is convenient to centrally collect the used cutting fluid and discharge it centrally through the discharge port, facilitating subsequent reuse and improving the resource utilization of the device.
[0016] 3. Through the setting of the groove, when the cutting fluid entering the second guide plate is full, it flows out concentratedly along the inclined surface of the second guide plate, making the cutting fluid more evenly dispersed and improving the use effect of the device. Description of the Drawings
[0017] Figure 1 It is a front-side three-dimensional structural schematic diagram of the silicon wafer cutting fluid spraying device proposed by the present utility model;
[0018] Figure 2 It is a sectional structural schematic diagram of the collection box of the silicon wafer cutting fluid spraying device proposed by the present utility model;
[0019] Figure 3 It is an enlarged structural schematic diagram of part A of the silicon wafer cutting fluid spraying device proposed by the present utility model.
[0020] In the figure: 1, bottom plate; 2, fixing block; 3, collection box; 4, silicon wafer cutting machine body; 5, water pipe; 6, carriage; 7, knob; 8, bidirectional lead screw; 9, discharge port; 10, slide rail; 12, spraying frame; 13, water outlet; 14, water drain port; 15, first guide plate; 16, second guide plate; 17, groove. Specific Embodiments
[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. The described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, other embodiments obtained by those of ordinary skill in the art without creative efforts all belong to the scope of protection of the present utility model.
[0022] Refer to Figures 1-3, a silicon wafer cutting fluid spraying device, comprising a bottom plate 1 and a silicon wafer cutting machine body 4. Two slide rails 10 are fixedly mounted on the upper surface of the bottom plate 1 by bolts. Two slide frames 6 are slidably connected between the two slide rails 10. A bidirectional lead screw 8 is threadedly connected between the two slide frames 6. A spraying frame 12 is fixedly mounted on the top of the slide frame 6 by bolts. An outlet 13 is formed on one side of the spraying frame 12. One side of the bottom of the outlet 13 is fixedly mounted with a first guide plate 15 by bolts. External cutting fluid enters the interior of the spraying frame 12, so that the cutting fluid flows out through the outlet 13 onto the first guide plate 15. A part of the cutting fluid directly flows downward along the inclined surface of the first guide plate 15 onto the silicon wafer. A plurality of water outlets 14 are formed on one side of the first guide plate 15. A second guide plate 16 is fixedly mounted on the outer wall of one side of the spraying frame 12 by bolts. Rotate the bidirectional lead screw 8 to drive the slide frames 6 to move towards the middle along the slide rails 10 respectively, so that the distance between the two spraying frames 12 is reduced, and further the distance between the first guide plate 15 and the second guide plate 16 is adjusted, facilitating the guiding of the cutting fluid onto the small-sized silicon wafer. And the second guide plate 16 is located at the bottom of the first guide plate 15. A groove 17 is formed on the top of the second guide plate 16. Another part of the cutting fluid flows into the second guide plate 16 through the water outlets 14, so that the cutting fluid is first stored in the groove 17, and after being filled and overflowing, it flows onto the silicon wafer along the inclined surface of the second guide plate 16.
[0023] In the present utility model, it should be noted that a fixing block 2 is fixedly mounted on the upper surface of the bottom plate 1 by bolts. A collection box 3 is fixedly mounted on the top of the fixing block 2 by bolts. A blanking port 9 is formed at the bottom of the collection box 3. A blanking pipe is installed in the blanking port 9. The first guide plate 15 and the second guide plate 16 guide the cutting fluid onto the silicon wafer, and then the cutting fluid drops into the collection box 3 and is discharged through the blanking port 9, facilitating the collection of the used cutting fluid. The first guide plate 15 and the second guide plate 16 are located above the collection box 3. A water pipe 5 is fixedly connected and communicated at the top of the spraying frame 12. One end of the bidirectional lead screw 8 is fixedly mounted with a knob 7 by bolts. The silicon wafer cutting machine body 4 includes a cutting assembly and a silicon rod connecting assembly. The connecting assembly includes an electric telescopic rod. The electric telescopic rod is fixed on one side of the mounting plate of the silicon wafer cutting machine body 4. The extending end of the electric telescopic rod is fixed with a dovetail iron, and a crystal holder is provided at the bottom of the dovetail iron.
[0024] Working principle: First, connect the water pipe 5 to an external cutting fluid container so that the external cutting fluid enters the inside of the spraying rack 12 through the water pipe 5. Then, the cutting fluid flows out through the water outlet 13 onto the first guide plate 15. Part of the cutting fluid directly flows downward along the inclined surface of the first guide plate 15 onto the silicon wafer, and the other part of the cutting fluid flows into the second guide plate 16 through the water outlet 14. The cutting fluid is first stored in the groove 17 and, after being full and overflowing, flows along the inclined surface of the second guide plate 16 onto the silicon wafer. When it is necessary to reduce the distance between the carriage 6, rotate the knob 7 to drive the carriage 6 to move towards the middle along the slide rail 10 by the bidirectional lead screw 8, thereby reducing the distance between the two spraying racks 12, and further adjusting the distance between the first guide plate 15 and the second guide plate 16, facilitating the guiding of the cutting fluid onto the small-sized silicon wafer.
[0025] In addition, the terms "mounted", "set", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, components, or parts. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific circumstances.
Claims
1. A silicon wafer cutting liquid spraying device, comprising a base plate (1) and a silicon wafer cutting machine body (4), characterized in that: The upper surface of the bottom plate (1) is fixedly connected to two slide rails (10), two slide frames (6) are movably connected between the two slide rails (10), a bidirectional screw rod (8) is movably connected between the two slide frames (6), a spray frame (12) is fixedly connected to the top of the slide frame (6), a water outlet (13) is provided on one side of the spray frame (12), a first guide plate (15) is fixedly connected to one side of the bottom of the water outlet (13), a plurality of water outlets (14) are provided on one side of the first guide plate (15), a second guide plate (16) is fixedly connected to one side of the outer wall of the spray frame (12), the second guide plate (16) is located at the bottom of the first guide plate (15), and a groove (17) is provided on the top of the second guide plate (16).
2. The silicon wafer cutting liquid spraying device according to claim 1, characterized in that: A fixing block (2) is fixedly connected to the upper surface of the bottom plate (1), and a collecting box (3) is fixedly connected to the top of the fixing block (2).
3. The silicon wafer cutting liquid spraying device according to claim 2, characterized in that: The bottom of the collecting box (3) is provided with a discharge port (9), and a discharge pipe is installed in the discharge port (9).
4. The silicon wafer cutting liquid spraying device according to claim 1, characterized in that: The first guide plate (15) and the second guide plate (16) are located above the collection box (3).
5. The silicon wafer cutting liquid spraying device according to claim 1, characterized in that: The top of the spraying frame (12) is connected and fixed with a water pipe (5).
6. The silicon wafer cutting liquid spraying device according to claim 1, characterized in that: One end of the bidirectional screw rod (8) is fixedly connected to a knob (7).
7. The silicon wafer cutting liquid spraying device according to claim 1, characterized in that: The silicon wafer cutting machine body (4) comprises a cutting component and a silicon rod connecting component.