Automatic microelectronic component chip installer

Abstract

The utility model relates to the technical field of electronic component chips, in particular to an automatic microelectronic component chip installer. The device comprises a vacuum suction cup and a connecting plate fixedly connected with the surface of the vacuum suction cup, two fixing columns are fixedly connected to the inner wall of the connecting plate, a connecting column is arranged below the two fixing columns, four sliding rods are fixedly connected to the bottoms of the fixing columns at equal intervals, and a sliding groove is formed in the top of the connecting column; the surfaces of the four sliding rods slide on the inner walls of the sliding grooves in a matched mode. According to the utility model, when the vacuum chuck works to adsorb the chip to an installation position, the connecting column moves upwards along with the lamination of the chip, so that the chip is ensured not to be separated from the connecting column, and when the vacuum chuck stops working, the connecting column moves downwards, so that the chip moves vertically and is fixed on the installation position; therefore, the chip is prevented from deviating from the target position due to inertia.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component chips, and more specifically, to an automatic microelectronic component chip installer. Background Art

[0002] The automatic microelectronic component chip installer relies on advanced automation technologies, including sensors, actuators, control systems, etc., to achieve automatic control and operation of the chip installation process. Understanding the characteristics and manufacturing processes of microelectronic chips is the key to designing the automatic installer, which includes understanding the chip size, shape, material, and surface characteristics to ensure that the installer can operate the chip accurately and reliably, etc.

[0003] The existing automatic microelectronic component chip installer uses a vacuum chuck to pick up the chip and place it at a specified position when installing the chip. When the vacuum chuck adsorbs the chip to the installation position, the vacuum pump will stop working. When the vacuum pump stops sucking air, the chip may continue to move due to inertia, resulting in deviation from the target position, and then the chip may not fall into the specified position. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the above-mentioned drawbacks and provide an automatic microelectronic component chip installer;

[0005] To achieve the above purpose, the utility model provides an automatic microelectronic component chip installer, which includes a vacuum chuck and a connecting plate fixedly connected to the surface of the vacuum chuck. Two fixing columns are fixedly connected to the inner wall of the connecting plate. A connecting column is arranged below the two fixing columns, where:

[0006] Four sliding rods are fixedly connected to the bottom of the fixing column at equal intervals. A sliding groove is formed at the top of the connecting column, and the surfaces of the four sliding rods are slidably fitted on the inner wall of the sliding groove.

[0007] As a further improvement of the technical solution, an elastic member is fixedly connected between the fixing column and the connecting column. The elastic member is located inside the four sliding rods and is used to prevent the sliding rods from detaching from the inner wall of the sliding groove when moving.

[0008] As a further improvement of the technical solution, a support column is fixedly connected to the bottom of the fixing column, and the support column is located at the central position inside the elastic member.

[0009] As a further improvement of the technical solution, a friction pad is fixedly connected to the bottom of the connecting column. A plurality of raised dots are provided on the contact surface between the friction pad and the chip, so as to increase the friction force between the chip and the contact surface of the friction pad.

[0010] As a further improvement of the technical solution, a vacuum pump frame is fixedly connected to the top of the vacuum chuck. A vacuum pump connected to the vacuum chuck is provided inside the vacuum pump frame, and the connecting plate is located below the vacuum pump frame.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0012] In the automatic microelectronic component chip installer, when the chip is adsorbed to the installation position by the operation of the vacuum chuck, the connecting column moves upward along with the fitting of the chip, ensuring that the chip will not break away from the connecting column. When the vacuum chuck stops working, the connecting column will move downward, enabling the chip to move vertically and be fixed at the installation position, thereby preventing the chip from deviating from the target position due to inertia. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic structural diagram of Embodiment 1 of the present utility model;

[0014] Figure 2 It is a schematic structural diagram of the friction pad of the present utility model;

[0015] Figure 3 For the present utility model Figure 2 Schematic structural diagram of part A;

[0016] The meanings of the various reference numerals in the figure are as follows:

[0017] Vacuum pump frame; 11, Vacuum chuck;

[0018] Connecting plate; 21, Fixed column; 210, Slide bar; 211, Elastic member; 212, Support column;

[0019] Connecting column; 31, Chute; 32, Friction pad. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model. Embodiment

[0021] Please refer to Figures 1 - 3As shown, this embodiment provides an automatic microelectronic component chip mounter, including a vacuum suction cup 11, and a connecting plate 2 fixedly connected to the surface of the vacuum suction cup 11. The automatic microelectronic component chip mounter uses a vacuum suction cup when installing the chip to pick up the chip and place it in a specified position. When the vacuum suction cup adsorbs the chip to the installation position, the vacuum pump will stop working. When the vacuum pump stops sucking air, the chip may continue to move due to inertia, resulting in deviation from the target position. At this time, the chip will fail to fall into the specified position. Therefore, two fixing columns 21 are fixedly connected to the inner wall of the connecting plate 2, and a connecting column 3 is provided below the two fixing columns 21, wherein:

[0022] Four slide bars 210 are evenly distributed and fixedly connected to the bottom of the fixed column 21. A slide groove 31 is provided on the top of the connecting column 3. The surfaces of the four slide bars 210 are adapted to slide on the inner wall of the slide groove 31. The chip is fixed by the vacuum suction cup 11. At this time, the connecting column 3 is attached to the surface of the chip. Since the vacuum suction cup 11 adsorbs the chip to its surface, the chip will squeeze the connecting column 3. At this time, the slide bar 210 will move on the inner wall of the slide groove 31, so that the connecting column 3 can keep moving up and down horizontally. At this time, the bottom of the connecting column 3 and the bottom of the vacuum suction cup 11 are on the same horizontal line.

[0023] The improvement of this embodiment is that:

[0024] Considering that the automatic microelectronic component chip installer uses a vacuum suction cup when installing the chip, which is used to pick up the chip and place it in the specified position. When the vacuum suction cup adsorbs the chip to the installation position, the vacuum pump will stop working. When the vacuum pump stops sucking air, the chip may continue to move due to inertia, resulting in deviation from the target position. At this time, the chip will fail to fall into the specified position. Therefore, when the vacuum suction cup 11 works to adsorb the chip to the installation position, the connecting column 3 moves upward with the chip's adhesion to ensure that the chip will not detach from the connecting column 3. When the vacuum suction cup 11 stops working, the connecting column 3 will move downward, causing the chip to move vertically and be fixed in the installation position, thereby preventing the chip from deviating from the target position due to inertia.

[0025] In order to ensure that the fixing column 21 and the connecting column 3 can be fixed, and the sliding rod 210 will not separate from the inner wall of the sliding groove 31 when sliding on the inner wall of the sliding groove 31, an elastic member 211 is fixedly connected between the fixing column 21 and the connecting column 3. The elastic member 211 is located inside the four sliding rods 210. The elastic member 211 is used to prevent the sliding rod 210 from separating from the sliding groove 31 when moving on the inner wall of the sliding groove 31. The fixing column 21 and the connecting column 3 are connected and fixed by the elastic member 211. At this time, when the connecting column 3 moves, the sliding rod 210 can slide on the inner wall of the sliding groove 31.

[0026] In order to keep the elastic member 211 in a horizontal and vertical state when it deforms and enable the sliding rod 210 to move on the inner wall of the chute 31, the bottom of the fixed column 21 is fixedly connected with a support column 212. The support column 212 is located at the central position inside the elastic member 211. When the elastic member 211 is squeezed, since the support column 212 is located at the central position inside the elastic member 211, the elastic member 211 will fit on the surface of the support column 212 when being squeezed, thus maintaining a horizontal and vertical state.

[0027] In order to enable the connecting column 3 to fix the chip in a proper position when the vacuum chuck 11 stops working, the bottom of the connecting column 3 is fixedly connected with a friction pad 32. The contact surface between the friction pad 32 and the chip is provided with a plurality of raised dots for increasing the friction force between the chip and the contact surface of the friction pad 32. When the vacuum chuck 11 stops working, the chip will fall. At this time, the friction pad 32 fixed at the bottom of the connecting column 3 will fit on the surface of the chip and move downward as the chip falls. Since there are two friction pads 32 which are symmetrically located at the center of the top of the chip, due to the characteristics of the elastic member 211 when the chip moves downward, the friction pad 32 can quickly fix the chip in a proper position, preventing the chip from falling to other positions due to inertia.

[0028] In order to enable the vacuum chuck 11 to adsorb the chip and prevent it from falling when moving the position, the top of the vacuum chuck 11 is fixedly connected with a vacuum pump frame 1. A vacuum pump connected to the vacuum chuck 11 is provided inside the vacuum pump frame 1. The connecting plate 2 is located below the vacuum pump frame 1. The vacuum pump inside the vacuum pump frame 1 can enable the vacuum chuck 11 to adsorb the chip on the surface of the vacuum chuck 11 and move the chip.

[0029] When the automatic microelectronic component chip installer of the present utility model is specifically used, the vacuum pump inside the vacuum pump frame 1 works to enable the vacuum chuck 11 to adsorb the chip to the position where it needs to be installed. Since the chip is adsorbed on the surface of the vacuum chuck 11, at this time, the friction pad 32 located at the top of the chip will move upward as the chip fits. Since the upward movement of the connecting column 3 will enable the sliding rod 210 to move on the inner wall of the chute 31, the elastic member 211 will contract. At this time, the vacuum pump inside the vacuum pump frame 1 will stop working, and then the chip will be separated from the vacuum chuck 11. Then, due to the characteristics of the elastic member 211, the connecting column 3 located at the top of the chip will move downward, and at this time, the friction pad 32 will also move the chip attached to its bottom downward to install the chip in a proper position.

[0030] The basic principle, main features and advantages of the present utility model have been shown and described above. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only the preferred examples of the present utility model and are not used to limit the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. An automatic microelectronic component chip mounter, comprising a vacuum suction cup (11) and a connecting plate (2) fixedly connected to the surface of the vacuum suction cup (11), characterized in that: Two fixing columns (21) are fixedly connected to the inner wall of the connecting plate (2), and a connecting column (3) is provided below the two fixing columns (21), wherein: Four sliding rods (210) are fixedly connected to the bottom of the fixed column (21) at equal distances, and a sliding groove (31) is provided on the top of the connecting column (3). The surfaces of the four sliding rods (210) are adapted to slide on the inner wall of the sliding groove (31).

2. The automatic microelectronic component chip mounter according to claim 1, characterized in that: An elastic member (211) is fixedly connected between the fixed column (21) and the connecting column (3). The elastic member (211) is located inside the four sliding rods (210). The elastic member (211) is used to prevent the sliding rod (210) from falling off the sliding groove (31) when moving on the inner wall of the sliding groove (31).

3. The automatic microelectronic component chip mounter according to claim 2, characterized in that: A support column (212) is fixedly connected to the bottom of the fixed column (21), and the support column (212) is located at a central position inside the elastic member (211).

4. The automatic microelectronic component chip mounter according to claim 1, characterized in that: A friction pad (32) is fixedly connected to the bottom of the connection column (3), and a plurality of raised small dots are provided on the contact surface between the friction pad (32) and the chip, so as to increase the friction force between the contact surface between the chip and the friction pad (32).

5. The automatic microelectronic component chip mounter according to claim 1, characterized in that: The top of the vacuum suction cup (11) is fixedly connected to a vacuum pump frame (1), a vacuum pump connected to the vacuum suction cup (11) is provided inside the vacuum pump frame (1), and the connecting plate (2) is located below the vacuum pump frame (1).

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