Antenna assembly structure and antenna device

By opening a riveting groove and threading port on the reflector plate and microstrip lines, and riveting buried copper blocks and welding conductive solder blocks, the problem of additional nickel plating in the prior art is solved, and the effect of simplifying assembly and reducing costs is achieved.

CN222980782UActive Publication Date: 2025-06-13HUIZHOU SPEED WIRELESS TECH CO LTD
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Patent Information

Application Number
CN202422079484.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-26
Publication Date
2025-06-13
Estimated Expiration
2034-08-26

AI Technical Summary

Technical Problem

The existing antenna assembly structure requires additional nickel plating during the soldering process, which increases manufacturing costs and waste of nickel.

Method used

By opening a riveting groove and threading port on the reflector plate and microstrip wire, respectively, and welding conductive solder blocks on the exposed part of the cable, the electrical connection between the cable and the reflector plate and microstrip wire is achieved, avoiding the need for additional nickel plating.

Benefits of technology

The assembly process of antenna assembly structure is simplified, assembly costs are reduced, and the waste of nickel is avoided, while ensuring the stability of electrical connections.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model provides an antenna assembly structure and an antenna device. The first embedded copper block is riveted in the first riveting groove, and the first embedded copper block is provided with a third threading port. The second embedded copper block is riveted in the second riveting groove, and the second embedded copper block is provided with a fourth threading port. One end of the cable is provided with an exposed part, and the exposed part sequentially penetrates through the third threading opening, the first threading opening, the second threading opening and the fourth threading opening. The first conductive soldering tin block is welded to the face, away from the first riveting groove, of the first embedded copper block, and the first conductive soldering tin block wraps one end of the exposed part. The second conductive soldering tin block is welded to the face, away from the second riveting groove, of the second embedded copper block, and the second conductive soldering tin block wraps the other end of the exposed part.
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Description

Technical Field

[0001] The present disclosure relates to the field of wireless communication, and in particular, to an antenna assembly structure and an antenna device. Background Art

[0002] With the rapid development of wireless communication technology, the construction of signal transmission base stations has also increased accordingly. The signal transmission base stations transmit or receive signals through antennas, that is, the signal transmission base stations transmit information with the mobile terminal through antennas.

[0003] For traditional antennas, the cables penetrate between the reflector and the microstrip line respectively, and then the cables are fixed on the reflector and the microstrip line respectively by tin plating, so that the cables are electrically connected to the reflector and the microstrip line respectively. The microstrip line and the reflector are aluminum circuit boards themselves. Radio frequency signals are diffused through electromagnetic coupling between the microstrip line and the reflector. At the same time, the antenna can also receive radio frequency signals, realizing the wireless communication function.

[0004] However, since both the microstrip line and the reflector are aluminum plates, and it is difficult to solder on the surface of the aluminum plates, nickel plating needs to be carried out before soldering, which can increase the solder joints of the aluminum plates. However, the actual soldering area is only the area where the cables penetrate. However, whether it is electroless nickel plating or electroplating nickel plating, the whole plate needs to be nickel plated, which will undoubtedly increase the manufacturing cost of the antenna and cause waste of nickel. Summary of the Utility Model

[0005] The purpose of the present disclosure is to overcome the deficiencies in the prior art and provide an antenna assembly structure and an antenna device that do not require additional nickel plating.

[0006] The purpose of the present disclosure is achieved by the following technical solutions:

[0007] An antenna assembly structure includes a reflector and a microstrip line. The reflector and the microstrip line are spaced apart by fasteners. The antenna assembly structure further includes a first buried copper block, a second buried copper block, a cable, a first conductive solder block and a second conductive solder block;

[0008] The reflector is provided with a first riveting groove, and a first wire passing opening is provided at the bottom of the first riveting groove;

[0009] The microstrip line is provided with a second riveting groove, and a second wire passing opening is provided at the bottom of the second riveting groove;

[0010] The first buried copper block is riveted in the first riveting groove, and a third wire passing opening is provided in the first buried copper block;

[0011] The second buried copper block is riveted in the second riveting groove, and a fourth wire passing opening is provided in the second buried copper block;

[0012] One end of the cable is provided with an exposed part, and the exposed part sequentially penetrates through the third wire passing port, the first wire passing port, the second wire passing port, and the fourth wire passing port;

[0013] The first conductive solder block is welded to a surface of the first buried copper block facing away from the first riveting groove, and the first conductive solder block covers one end of the exposed part;

[0014] The second conductive solder block is welded to a surface of the second buried copper block facing away from the second riveting groove, and the second conductive solder block covers the other end of the exposed part.

[0015] In one embodiment, the first buried copper block is formed with a first limiting ring groove, and the first limiting ring groove is used for the first buried copper block to be clamped with the reflector when being riveted to the first riveting groove.

[0016] In one embodiment, the second buried copper block is formed with a second limiting ring groove, and the second limiting ring groove is used for the second buried copper block to be clamped with the microstrip line when being riveted to the second riveting groove.

[0017] In one embodiment, a plurality of first serrated portions are formed at the peripheral edge of one end of the first buried copper block at intervals, and a first riveting card slot is formed between two adjacent first serrated portions, and the first riveting card slot is used for the first buried copper block to be clamped with the reflector when being riveted to the first riveting groove.

[0018] In one embodiment, a plurality of second serrated portions are formed at the peripheral edge of one end of the second buried copper block at intervals, and a second riveting card slot is formed between two adjacent second serrated portions, and the second riveting card slot is used for the second buried copper block to be clamped with the microstrip line when being riveted to the second riveting groove.

[0019] In one embodiment, the other end of the cable is provided with a connection terminal, and the connection terminal is used for connecting with a baseband unit.

[0020] In one embodiment, the first wire passing port, the second wire passing port, the third wire passing port, and the fourth wire passing port are coaxially arranged.

[0021] In one embodiment, the reflector is provided with a plurality of buffer through holes, and the plurality of buffer through holes are arranged at intervals around the periphery of the first riveting groove.

[0022] In one embodiment, the antenna assembly structure further includes a radiation sheet, and the radiation sheet is respectively arranged at intervals with the reflector and the microstrip line through the fasteners.

[0023] An antenna device includes the antenna assembly structure according to any one of the above embodiments.

[0024] Compared with the prior art, the present invention has at least the following advantages:

[0025] 1. A first rivet groove is provided on the reflective plate, and a first threading opening is provided at the bottom of the first rivet groove. The first buried copper block is riveted in the first rivet groove and a third threading opening is provided on the first buried copper block, so that the exposed part of the cable can pass through the first threading opening and the third threading opening, and the first buried copper block can provide a soldering point for the first conductive solder block, so that the first conductive solder block can be welded on a side of the first buried copper block away from the first rivet groove, so that the cable and the first buried copper block can be fixed, and the cable and the reflective plate can be electrically connected through the first buried copper block and the first conductive solder block.

[0026] 2. A second rivet groove is provided on the microstrip line, and a second threading opening is provided at the bottom of the second rivet groove. The second buried copper block is riveted in the second rivet groove and a fourth threading opening is provided on the second buried copper block, so that the exposed part of the cable can pass through the second threading opening and the fourth threading opening, and the second buried copper block can provide a soldering point for the second conductive solder block, so that the second conductive solder block can be welded to the side of the second buried copper block away from the second rivet groove, so that the cable and the second buried copper block can be fixed, and the cable and the microstrip line can be electrically connected through the second buried copper block and the second conductive solder block.

[0027] 3. By adding the first buried copper block and the second buried copper block, solder joints are provided for the reflector and the microstrip line, so that the reflector and the microstrip line can be electrically connected to the cable without additional nickel plating. This can effectively simplify the assembly process of the antenna assembly structure, while also reducing the assembly cost of the antenna assembly structure and avoiding waste of nickel. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 This is a schematic diagram of the structure of an antenna assembly structure before soldering in one embodiment;

[0030] Figure 2 for Figure 1 The schematic diagram of the local structure of the antenna assembly structure before soldering is shown;

[0031] Figure 3 for Figure 1 A schematic structural diagram of the antenna assembly structure from another perspective before soldering;

[0032] Figure 4 The Figure 3 partial structural schematic diagram of the antenna assembly structure shown before soldering;

[0033] Figure 5 is the partial structural cross-sectional view of the antenna assembly structure after soldering;

[0034] Figure 6 is the structural cross-sectional view of the reflector and microstrip line of the antenna assembly structure after riveting;

[0035] Figure 7 is Figure 4 the partial structural schematic diagram of the antenna assembly structure shown;

[0036] Figure 8 is Figure 2 the partial structural schematic diagram of the antenna assembly structure shown;

[0037] Figure 9 is Figure 1 the partial structural schematic diagram of the antenna assembly structure shown;

[0038] Figure 10 is the physical diagram of the antenna assembly structure after soldering. Specific Embodiments

[0039] For ease of understanding of the present disclosure, the present disclosure will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present disclosure are shown in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the disclosure of the present disclosure can be understood more thoroughly and comprehensively.

[0040] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this disclosure belongs. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0042] The present disclosure provides an antenna assembly structure including a reflector and a microstrip line. The reflector and the microstrip line are spaced apart by fasteners. The antenna assembly structure further includes a first buried copper block, a second buried copper block, a cable, a first conductive solder block, and a second conductive solder block. The reflector is provided with a first riveting groove, and a first wire passing opening is provided at the bottom of the first riveting groove. The microstrip line is provided with a second riveting groove, and a second wire passing opening is provided at the bottom of the second riveting groove. The first buried copper block is riveted in the first riveting groove, and a third wire passing opening is provided in the first buried copper block. The second buried copper block is riveted in the second riveting groove, and a fourth wire passing opening is provided in the second buried copper block. One end of the cable is provided with an exposed portion, and the exposed portion sequentially passes through the third wire passing opening, the first wire passing opening, the second wire passing opening, and the fourth wire passing opening. The first conductive solder block is welded to a surface of the first buried copper block facing away from the first riveting groove, and the first conductive solder block covers one end of the exposed portion. The second conductive solder block is welded to a surface of the second buried copper block facing away from the second riveting groove, and the second conductive solder block covers the other end of the exposed portion.

[0043] Please refer to Figures 1 to 8 , for a better understanding of the antenna assembly structure 10 of the present disclosure, the following further explanatory description is made on the antenna assembly structure 10:

[0044] An antenna assembly structure 10 of an embodiment includes a reflector 100 and a microstrip line 200. The reflector 100 and the microstrip line 200 are spaced apart by fasteners. The antenna assembly structure 10 further includes a first buried copper block 300, a second buried copper block 400, a cable 500, a first conductive solder block 600, and a second conductive solder block 700. The reflector 100 is provided with a first riveting groove 101, and a first wire passing opening 102 is provided at the bottom of the first riveting groove 101. The microstrip line 200 is provided with a second riveting groove 201, and a second wire passing opening 202 is provided at the bottom of the second riveting groove 201. The first buried copper block 300 is riveted in the first riveting groove 101, and a third wire passing opening 301 is provided in the first buried copper block 300. The second buried copper block 400 is riveted in the second riveting groove 201, and a fourth wire passing opening 401 is provided in the second buried copper block 400. One end of the cable 500 is provided with an exposed portion 510, and the exposed portion 510 sequentially passes through the third wire passing opening 301, the first wire passing opening 102, the second wire passing opening 202, and the fourth wire passing opening 401. The first conductive solder block 600 is welded to a surface of the first buried copper block 300 facing away from the first riveting groove 101, and the first conductive solder block 600 covers one end of the exposed portion 510. The second conductive solder block 700 is welded to a surface of the second buried copper block 400 facing away from the second riveting groove 201, and the second conductive solder block 700 covers the other end of the exposed portion 510.

[0045] In this embodiment, by providing the first riveting groove 101 on the reflector 100, and providing the first wire passing opening 102 at the bottom of the first riveting groove 101, and riveting the first buried copper block 300 in the first riveting groove 101 and providing the third wire passing opening 301 in the first buried copper block 300, the exposed portion 510 of the cable 500 can pass through the first wire passing opening 102 and the third wire passing opening 301, and the first buried copper block 300 can provide a soldering point for the first conductive solder block 600, so that the first conductive solder block 600 can be welded to a surface of the first buried copper block 300 facing away from the first riveting groove 101. In this way, the cable 500 and the first buried copper block 300 can be fixed, and the cable 500 and the reflector 100 can be electrically connected through the first buried copper block 300 and the first conductive solder block 600.

[0046] Similarly, by providing a second riveting groove 201 on the microstrip line 200, and a second wire passing opening 202 is provided at the bottom of the second riveting groove 201, the second buried copper block 400 is riveted in the second riveting groove 201 and the second buried copper block 400 is provided with a fourth wire passing opening 401, so that the exposed portion 510 of the cable 500 can penetrate through the second wire passing opening 202 and the fourth wire passing opening 401, and the second buried copper block 400 can provide a soldering point for the second conductive solder block 700, so that the second conductive solder block 700 can be soldered on the side of the second buried copper block 400 facing away from the second riveting groove 201. In this way, the cable 500 and the second buried copper block 400 can be fixed, and the cable 500 and the microstrip line 200 can be electrically connected through the second buried copper block 400 and the second conductive solder block 700.

[0047] Furthermore, by adding the first buried copper block 300 and the second buried copper block 400, soldering points are provided for the reflector 100 and the microstrip line 200, so that the reflector 100 and the microstrip line 200 can be electrically connected to the cable 500 without additional nickel plating. In this way, the assembly process of the antenna assembly structure 10 can be effectively simplified, and at the same time, the assembly cost of the antenna assembly structure 10 can be reduced, and the waste of nickel can be avoided.

[0048] It should be noted that the exposed portion 510 is a metal wire core, so that the cable 500 can be electrically connected to the reflector 100 through the first buried copper block 300 and the first conductive solder block 600, and at the same time, the cable 500 can also be electrically connected to the microstrip line 200 through the second buried copper block 400 and the second conductive solder block 700.

[0049] Such as Figure 5 and Figure 7 As shown in, in one embodiment, the first buried copper block 300 is formed with a first limiting ring groove 302, and the first limiting ring groove 302 is used for the first buried copper block 300 to be clamped with the reflector 100 when the first buried copper block 300 is riveted in the first riveting groove 101. It can be understood that a circular groove with a diameter smaller than the outer diameter of one end of the first buried copper block 300 is drilled on the reflector 100 first, and then the center point of the first buried copper block 300 is aligned with the center point of the riveting groove and pressed in by a pressing machine, so that the circular groove forms a first riveting groove 101 after riveting, and the first buried copper block 300 is riveted in the reflector 100. At the same time, the first limiting ring groove 302 of the first buried copper block 300 can be clamped with the reflector 100, further improving the fixing effect of the first buried copper block 300.

[0050] Such as Figure 5 and Figure 8As shown, in one embodiment, the second buried copper block 400 is formed with a second limiting annular groove 402, and the second limiting annular groove 402 is used for the second buried copper block 400 to be clamped with the microstrip line 200 when the second buried copper block 400 is riveted to the second riveting groove 201. It can be understood that a circular groove with a diameter smaller than the outer diameter of one end of the second buried copper block 400 is first drilled on the microstrip line 200, and then the center point of the second buried copper block 400 is aligned with the center point of the riveting groove and pressed in by a press, so that the circular groove forms the second riveting groove 201 after riveting, and the second buried copper block 400 is riveted inside the microstrip line 200. At the same time, the second limiting annular groove 402 of the second buried copper block 400 can be clamped with the microstrip line 200, further improving the fixing effect of the second buried copper block 400.

[0051] As Figure 4 and Figure 7 As shown, in one embodiment, a plurality of first serrated portions 310 are formed at intervals on the peripheral edge of one end of the first buried copper block 300, and a first riveting clamping groove 303 is formed between two adjacent first serrated portions 310. The first riveting clamping groove 303 is used for the first buried copper block 300 to be clamped with the reflector 100 when the first buried copper block 300 is riveted to the first riveting groove 101. It can be understood that since the first buried copper block 300 is riveted to the first riveting groove 101, the first buried copper block 300 has a first limiting annular groove 302 clamped with the reflector 100 in the longitudinal direction, but there is no good limit in the transverse direction, resulting in the rotation of the first buried copper block 300 when the first conductive solder block 600 is welded. By forming a plurality of first serrated portions 310 at intervals on the peripheral edge of one end of the first buried copper block 300, and a first riveting clamping groove 303 is formed between two adjacent first serrated portions 310, when the first buried copper block 300 is riveted to the first riveting groove 101, the reflector 100 can be clamped in the first riveting clamping groove 303, which can limit the first buried copper block 300 and prevent the first buried copper block 300 from rotating, improving the welding accuracy and stability of the first conductive solder block 600.

[0052] As Figure 2 and Figure 8As shown, in one embodiment, a plurality of second serrated portions 410 are formed at intervals on the peripheral edge of one end of the second buried copper block 400. A second riveting slot 403 is formed between two adjacent second serrated portions 410. The second riveting slot 403 is used for the second buried copper block 400 to be clamped with the microstrip line 200 when the second buried copper block 400 is riveted to the second riveting groove 201. It can be understood that since the second buried copper block 400 is riveted to the second riveting groove 201, the second buried copper block 400 has a second limiting ring groove 402 for clamping with the microstrip line 200 in the longitudinal direction, but there is no good limit in the transverse direction, resulting in the rotation of the second buried copper block 400 when the second conductive solder block 700 is welded. By forming a plurality of second serrated portions 410 at intervals on the peripheral edge of one end of the second buried copper block 400, and a second riveting slot 403 is formed between two adjacent second serrated portions 410, when the second buried copper block 400 is riveted to the second riveting groove 201, the microstrip line 200 can be clamped in the second riveting slot 403, which can limit the second buried copper block 400 and prevent the second buried copper block 400 from rotating, improving the welding accuracy and stability of the second conductive solder block 700.

[0053] As Figure 9 shown, in one embodiment, a connection terminal 520 is provided at the other end of the cable 500. The connection terminal 520 is used to connect to the baseband unit. It can be understood that the antenna receives radio waves and converts them into digital signals, and the digital signals are transmitted to the baseband unit through the cable 500 for information processing. At the same time, the baseband unit can also convert the information to be transmitted into digital signals and send them to the antenna, and the antenna converts the digital signals into radio frequency signals and emits them, realizing the function of wireless communication.

[0054] As Figure 5 shown, in one embodiment, the first wire passing port 102, the second wire passing port 202, the third wire passing port 301 and the fourth wire passing port 401 are coaxially arranged. It can be understood that the first wire passing port 102, the second wire passing port 202, the third wire passing port 301 and the fourth wire passing port 401 are coaxially arranged, which can ensure good smoothness when the cable 500 passes through the wires. Moreover, the diameters of the first wire passing port 102 and the second wire passing port 202 are different, and the wire diameters of different regions of the exposed portion 510 at one end of the cable 500 are also different, so that the exposed portion 510 at one end of the cable 500 can be firmly fixed between the reflector 100 and the microstrip line 200 after passing through the wires, facilitating the welding of the first conductive solder block 600 and the second conductive solder block 700.

[0055] As Figure 2 and Figure 4As shown, in one embodiment, the reflector 100 is provided with a plurality of buffer through holes 103, and the plurality of buffer through holes 103 are arranged at intervals around the periphery of the first riveting groove 101. It can be understood that, since the reflector 100 is an aluminum plate, a large amount of heat will be generated when soldering the first buried copper block 300, and the heat dissipation effect of aluminum itself is good. In order to ensure that the first conductive solder block 600 can be smoothly welded to the first buried copper block 300, by providing a plurality of buffer through holes 103 in the first riveting groove 101, and the plurality of buffer through holes 103 are arranged at intervals around the periphery of the first riveting groove 101, the heat conduction effect of the aluminum plate can be slowed down, thereby reducing the heat loss of the first conductive solder block 600 during welding, and ensuring that the first conductive solder block 600 can be welded to the first buried copper block 300.

[0056] like Figure 1 As shown, in one embodiment, the antenna assembly structure 10 further includes a radiation sheet 800, and the radiation sheet 800 is spaced apart from the reflector 100 and the microstrip line 200 by the fasteners. It can be understood that the function of the radiation sheet 800 is mainly to capture and radiate electromagnetic waves, that is, the radio frequency signal generated by the electromagnetic coupling between the reflector 100 and the microstrip line 200 is radiated and diffused through the radiation sheet 800, and the electromagnetic wave can be captured at the same time.

[0057] To verify the authenticity of the antenna assembly structure disclosed in this disclosure, please refer to Figure 10 , Figure 10 This is a real picture of the antenna assembly structure after soldering, which shows that the antenna assembly structure disclosed in the present invention is real.

[0058] The present disclosure also provides an antenna device, comprising the antenna assembly structure described in any one of the above embodiments.

[0059] In this embodiment, a first rivet groove is opened on the reflective plate, and a first threading opening is opened at the bottom of the first rivet groove, the first buried copper block is riveted in the first rivet groove and a third threading opening is opened in the first buried copper block, so that the exposed part of the cable can pass through the first threading opening and the third threading opening, and the first buried copper block can provide a soldering point for the first conductive solder block, so that the first conductive solder block can be welded to the side of the first buried copper block away from the first rivet groove, so that the cable and the first buried copper block can be fixed, and the cable and the reflective plate can be electrically connected through the first buried copper block and the first conductive solder block.

[0060] Similarly, by providing a second riveting groove on the microstrip line, and a second wire passing opening is provided at the bottom of the second riveting groove, the second buried copper block is riveted in the second riveting groove and the second buried copper block is provided with a fourth wire passing opening, so that the exposed part of the cable can penetrate through the second wire passing opening and the fourth wire passing opening, and the second buried copper block can provide a soldering point for the second conductive solder block, so that the second conductive solder block can be soldered on the side of the second buried copper block facing away from the second riveting groove. In this way, the cable and the second buried copper block can be fixed, and the cable and the microstrip line can be electrically connected through the second buried copper block and the second conductive solder block.

[0061] Further, by adding the first buried copper block and the second buried copper block, soldering points are provided for the reflector and the microstrip line, so that the reflector and the microstrip line can be electrically connected to the cable without additional nickel plating. In this way, the assembly process of the antenna assembly structure can be effectively simplified, and at the same time, the assembly cost of the antenna device can be reduced, and the waste of nickel can be avoided.

[0062] Compared with the prior art, the present disclosure has at least the following advantages:

[0063] 1. By providing a first riveting groove on the reflector, and a first wire passing opening is provided at the bottom of the first riveting groove, the first buried copper block is riveted in the first riveting groove and the first buried copper block is provided with a third wire passing opening, so that the exposed part of the cable can penetrate through the first wire passing opening and the third wire passing opening, and the first buried copper block can provide a soldering point for the first conductive solder block, so that the first conductive solder block can be soldered on the side of the first buried copper block facing away from the first riveting groove. In this way, the cable and the first buried copper block can be fixed, and the cable and the reflector can be electrically connected through the first buried copper block and the first conductive solder block.

[0064] 2. By providing a second riveting groove on the microstrip line, and a second wire passing opening is provided at the bottom of the second riveting groove, the second buried copper block is riveted in the second riveting groove and the second buried copper block is provided with a fourth wire passing opening, so that the exposed part of the cable can penetrate through the second wire passing opening and the fourth wire passing opening, and the second buried copper block can provide a soldering point for the second conductive solder block, so that the second conductive solder block can be soldered on the side of the second buried copper block facing away from the second riveting groove. In this way, the cable and the second buried copper block can be fixed, and the cable and the microstrip line can be electrically connected through the second buried copper block and the second conductive solder block.

[0065] 3. By adding the first buried copper block and the second buried copper block, soldering points are provided for the reflector and the microstrip line, so that the reflector and the microstrip line can be electrically connected to the cable without additional nickel plating. In this way, the assembly process of the antenna assembly structure can be effectively simplified, and at the same time, the assembly cost of the antenna assembly structure can be reduced, and the waste of nickel can be avoided.

[0066] The above-described embodiments merely represent several implementation manners of the present disclosure. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the disclosed patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present disclosure, several modifications and improvements can still be made, and these all fall within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure patent shall be subject to the appended claims.

Claims

1. An antenna assembly structure, comprising a reflector and a microstrip line, wherein the reflector and the microstrip line are spaced apart by a fastener, characterized in that: The antenna assembly structure also includes a first buried copper block, a second buried copper block, a cable, a first conductive solder block and a second conductive solder block; The reflector plate is provided with a first riveting groove, and the bottom of the first riveting groove is provided with a first threading opening; The microstrip line is provided with a second riveting groove, and the bottom of the second riveting groove is provided with a second threading opening; The first buried copper block is riveted into the first riveting groove, and the first buried copper block is provided with a third threading opening; The second buried copper block is riveted into the second riveting groove, and the second buried copper block is provided with a fourth threading opening; One end of the cable is provided with an exposed portion, and the exposed portion sequentially passes through the third threading opening, the first threading opening, the second threading opening, and the fourth threading opening; The first conductive solder block is welded to a side of the first buried copper block away from the first riveting groove, and the first conductive solder block covers one end of the exposed portion; The second conductive solder block is welded to a side of the second buried copper block away from the second riveting groove, and the second conductive solder block covers the other end of the exposed portion.

2. The antenna assembly structure according to claim 1, characterized in that: The first buried copper block is formed with a first limiting ring groove, and the first limiting ring groove is used for clamping the first buried copper block with the reflector when the first buried copper block is riveted to the first riveting groove.

3. The antenna assembly structure according to claim 1, characterized in that: The second buried copper block is formed with a second limiting ring groove, and the second limiting ring groove is used for clamping with the microstrip line when the second buried copper block is riveted to the second riveting groove.

4. The antenna assembly structure according to claim 1, characterized in that: A plurality of first serrations are formed at intervals on the outer ring periphery of one end of the first buried copper block, and a first riveting groove is formed between two adjacent first serrations. The first rivet groove is used to clamp the first buried copper block with the reflector when it is riveted to the first rivet groove.

5. The antenna assembly structure according to claim 1, characterized in that: A plurality of second serrations are formed at intervals on the periphery of one end of the second buried copper block, and a second riveting groove is formed between two adjacent second serrations. The second riveting groove is used to clamp the second buried copper block to the microstrip line when the second buried copper block is riveted to the second rivet groove.

6. The antenna assembly structure according to claim 1, characterized in that: The other end of the cable is provided with a connection terminal, and the connection terminal is used to connect to the baseband unit.

7. The antenna assembly structure according to claim 1, characterized in that: The first threading opening, the second threading opening, the third threading opening and the fourth threading opening are coaxially arranged.

8. The antenna assembly structure according to claim 1, characterized in that: The reflective plate is provided with a plurality of buffer through holes, and the plurality of buffer through holes are arranged at intervals around the periphery of the first riveting groove.

9. The antenna assembly structure according to claim 1, characterized in that: The antenna assembly structure further includes a radiation plate, and the radiation plate is spaced apart from the reflection plate and the microstrip line respectively through the fasteners.

10. An antenna device, characterized in that: The invention comprises the antenna assembly structure according to any one of claims 1 to 9.