Pressing device for aluminum wire bonding
By adopting an adjustable pressure jaw structure and buffer assembly in the pressing device, the problem of damage to the chip surface in the prior art is solved, and a more stable and reliable production process is achieved, reducing production costs.
Patent Information
- Application Number
- CN202420590939.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-26
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-03-26
AI Technical Summary
When the existing pressing device is pressed on the chip, due to the fixed position of the pressure claw, excessive mechanical force may cause damage to the chip surface, increasing production costs and increasing waste rate.
A pressing device for aluminum wire bonding is designed, adopting an adjustable pressing jaw structure, including a Z-shaped pressure plate and buffer assembly, such as a limiting rod, a lifting plate, a limiting disk and a spring, which absorbs pressure through the compression of the spring and adapts to chips of different sizes through the adjustment assembly.
It effectively reduces the direct impact force of the pressure claw on the chip surface, reduces the risk of mechanical force causing damage to the chip surface, improves the stability and reliability of the production process, and thus reduces production costs.
Smart Images
Figure CN222995353U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of pressing devices, in particular to a pressing device for aluminum wire bonding. Background Art
[0002] Aluminum wire bonding is a common way to connect electronic components, usually used in integrated circuit packaging. It realizes the connection between various functional units inside the chip by welding aluminum wires to the metallized areas on the chip. When performing aluminum wire bonding, a certain pressure usually needs to be applied to the chip to prevent the chip from moving.
[0003] The position of the pressing claws of the existing pressing devices is fixed. When the pressing claws press on the chip, damage to the chip surface may be caused by excessive mechanical force. Chip surface damage may lead to component failure or product quality decline, thus increasing production costs, while the scrap rate increases and after-sales service costs increase. In view of this, the utility model proposes a pressing device for aluminum wire bonding. Summary of the Utility Model
[0004] The purpose of the utility model is to address the problem in the background art that when the pressing claws press on the chip, damage to the chip surface may be caused by excessive mechanical force, thus increasing production costs, while the scrap rate increases and after-sales service costs increase, and to propose a pressing device for aluminum wire bonding.
[0005] The technical solution of the utility model: A pressing device for aluminum wire bonding includes two groups of mounting blocks. Below each of the two groups of mounting blocks, there are pressing claws for fixing the position of the chip. Each pressing claw includes multiple groups of Z-shaped pressing plates, and an anti-slip pad is further installed at the bottom of each pressing plate; Multiple groups of buffer components for relieving the pressure exerted by the pressing claws on the chip are installed on each pressing claw.
[0006] Optionally, the buffer component includes a limiting rod, a lifting plate, a limiting disc, and a spring. The two limiting rods are slidably connected in the mounting block. The lifting plate is fixedly connected to the bottom of the two limiting rods. The pressing claw is installed at the bottom of the lifting plate. The limiting disc is arranged above the mounting block and fixedly connected to the top of the limiting rod. The spring is arranged below the mounting block and sleeved on the outer circle of the limiting rod.
[0007] Optionally, it further includes a pressing mechanism for driving the pressing claws to approach the chip for fixation, and an adjusting component for adjusting the distance between the two pressing claws.
[0008] Optionally, the pressing mechanism includes a mounting plate, a push rod motor, and a fixing frame. The mounting plate is arranged above the first group of mounting blocks. The push rod motor is fixedly connected to the side of the mounting plate. The output end of the push rod motor is fixedly connected to the top of the U-shaped fixing frame. The fixing frame is fixedly connected to the top of the first group of mounting blocks.
[0009] Optionally, the pressing mechanism further includes slide bars and slide sleeves. Two groups of the slide bars are symmetrically arranged on both sides of the push rod motor and fixedly connected to the top of the fixed frame. The slide sleeves are slidably sleeved on the slide bars, and the slide sleeves are fixedly connected to the side surface of the mounting plate.
[0010] Optionally, the adjusting assembly includes a first connecting plate, a second connecting plate, and a rotating shaft. Two groups of the first connecting plates are fixedly connected to one side of the first group of mounting blocks. The second connecting plate is fixedly connected to one side of the second group of mounting blocks. The second connecting plate is arranged between the two groups of first connecting plates. The rotating shaft is fixedly connected to the second connecting plate, and the rotating shaft is rotatably connected to the two groups of first connecting plates.
[0011] Optionally, the adjusting assembly further includes a first gear, a servo motor, and a second gear. The first gear is sleeved and installed on the rotating shaft, and the first gear is arranged above the first connecting plate. The servo motor is installed on the fixed frame close to the first gear. The output end of the servo motor is fixedly connected to the second gear, and the second gear meshes with the first gear.
[0012] Optionally, the adjusting assembly further includes a limiting ring fixedly connected to the outside of the first group of mounting blocks, and the second group of mounting blocks is slidably connected to the limiting ring.
[0013] Compared with the prior art, the utility model has the following beneficial technical effects:
[0014] Through the arrangement of the spring in the utility model, when the push rod motor starts to drive the press jaw to move downward to press the chip, the spring can be compressed, absorbing part of the pressure, reducing the direct impact force of the press jaw on the chip surface, and reducing the risk of damage to the chip surface caused by mechanical force.
[0015] Furthermore, through the arrangement of the adjusting assembly, after starting the servo motor, it can drive the second group of mounting blocks to rotate, thereby adjusting the distance between the two press jaws, so as to press and fix chips of different sizes, and having a wide application range.
[0016] In summary, the utility model can effectively improve the pressing effect of the pressing device, protect the chip surface from damage, improve the stability and reliability of the production process, and thus reduce the production cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 is a perspective view of a pressing device for aluminum wire bonding;
[0018] Figure 2 is Figure 1 the schematic cross-sectional structure diagram of
[0019] Figure 3It is a schematic structural diagram of the installation block after adjustment.
[0020] Reference numerals:
[0021] 1. Installation block;
[0022] 2. Pressing jaw; 21. Pressing plate; 22. Anti-slip pad;
[0023] 3. Buffer assembly; 31. Limit rod; 32. Lifting plate; 33. Limit disc; 34. Spring;
[0024] 4. Pressing mechanism; 41. Installation plate; 42. Push rod motor; 43. Fixed frame; 44. Slide rod; 45. Slide sleeve;
[0025] 5. Adjusting assembly; 51. First connecting plate; 52. Second connecting plate; 53. Rotating shaft; 54. First gear; 55. Servo motor; 56. Second gear; 57. Limit ring. Detailed implementation mode
[0026] Next, the technical solutions of the present invention will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are some embodiments of the present invention, rather than all embodiments.
[0027] Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the present invention to be protected, but only represents the selected embodiments of the present invention.
[0028] Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present invention.
[0029] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0030] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0031] Embodiment
[0032] As Figure 1 And Figure 2 As shown, a pressing device for aluminum wire bonding proposed by the present utility model includes two groups of mounting blocks 1. Below each of the two groups of mounting blocks 1, there is a pressing claw 2 for fixing the position of the chip. The pressing claw 2 includes multiple groups of pressing plates 21 arranged in a Z shape, which are used to contact the surface of the chip when moving downward and press on the chip to position the chip. At the bottom of each group of pressing plates 21, an anti-slip pad 22 is further installed. The anti-slip pad 22 is made of rubber, which is used to increase the friction to prevent the chip from sliding and at the same time prevent the pressing plate 21 from scratching the surface of the chip.
[0033] Specifically, on each group of pressing claws 2, multiple groups of buffer components 3 for alleviating the pressure exerted by the pressing claws 2 on the chip are installed. The buffer component 3 includes a limiting rod 31, a lifting plate 32, a limiting disc 33, and a spring 34. The two limiting rods 31 are slidably connected in the mounting block 1. The lifting plate 32 is fixedly connected to the bottom of the two limiting rods 31. Through the setting of the limiting rods 31, the lifting plate 32 moves smoothly. The pressing claw 2 is installed at the bottom of the lifting plate 32 and moves synchronously with the lifting plate 32. The limiting disc 33 is arranged above the mounting block 1 and fixedly connected to the top of the limiting rod 31. The limiting rod 31 is used to prevent the lifting plate 32 and the pressing claw 2 from falling. The spring 34 is arranged below the mounting block 1 and sleeved on the outer circle of the limiting rod 31. The spring 34 is used to be compressed after the pressing claw 2 presses on the chip, absorb a part of the pressure, reduce the direct impact force of the pressing claw 2 on the surface of the chip, and reduce the risk of damage to the surface of the chip caused by mechanical force.
[0034] Further, please refer to Figure 1, the above lamination device further includes a pressing mechanism 4 for driving the pressing claws 2 to approach the chip for fixation. The pressing mechanism 4 includes a mounting plate 41, a push rod motor 42, and a fixing bracket 43. The mounting plate 41 is disposed above the first set of mounting blocks 1, and the position of the mounting plate 41 is fixed. The push rod motor 42 is fixedly connected to the side of the mounting plate 41, and the output end of the push rod motor 42 is fixedly connected to the top of the U-shaped fixing bracket 43. After the push rod motor 42 is started, it drives the fixing bracket 43 to move up and down. The fixing bracket 43 is fixedly connected to the top of the first set of mounting blocks 1. The mounting blocks 1 and the fixing bracket 43 move synchronously, and the two sets of mounting blocks 1 move up and down synchronously, thereby driving the pressing claws 2 to approach the chip for fixation. The pressing mechanism 4 further includes slide bars 44 and slide sleeves 45. The two sets of slide bars 44 are symmetrically disposed on both sides of the push rod motor 42 and are fixedly connected to the top of the fixing bracket 43. The slide bars 44 and the fixing bracket 43 move synchronously. The slide sleeve 45 is slidably sleeved on the slide bar 44. The slide sleeve 45 is fixedly connected to the side of the mounting plate 41, and the position of the slide sleeve 45 is fixed, and is used to cooperate with the slide bar 44 for limiting when the fixing bracket 43 moves.
[0035] Furthermore, as Figure 1 and Figure 3 shown, the above lamination device further includes an adjustment assembly 5 for adjusting the distance between the two sets of pressing claws 2. The adjustment assembly 5 includes a first connecting plate 51, a second connecting plate 52, and a rotating shaft 53. The two sets of first connecting plates 51 are fixedly connected to one side of the first set of mounting blocks 1. The second connecting plate 52 is fixedly connected to one side of the second set of mounting blocks 1. The second connecting plate 52 is disposed between the two sets of first connecting plates 51. The rotating shaft 53 is fixedly connected to the second connecting plate 52, and the rotating shaft 53 is rotatably connected to the two sets of first connecting plates 51, so that the two sets of mounting blocks 1 are rotatably connected together. The adjustment assembly 5 further includes a first gear 54, a servo motor 55, and a second gear 56. The first gear 54 is sleeved and installed on the rotating shaft 53, and the first gear 54 is disposed above the first connecting plate 51. The first gear 54 rotates synchronously with the rotating shaft 53. The servo motor 55 is installed on the side of the fixing bracket 43 close to the first gear 54, and the output end of the servo motor 55 is fixedly connected to the second gear 56. After the servo motor 55 is started, it drives the second gear 56 to rotate. The second gear 56 meshes with the first gear 54, and is used to drive the first gear 54 to rotate when the second gear 56 rotates, so that the second set of mounting blocks 1 rotates, and the distance between the two sets of pressing claws 2 is reduced. The adjustment assembly 5 further includes a limit ring 57 fixedly connected to the outside of the first set of mounting blocks 1, and the position of the limit ring 57 is fixed. The second set of mounting blocks 1 is slidably connected to the limit ring 57, and the limit ring 57 is used for limiting when the second set of mounting blocks 1 moves.
[0036] In this embodiment, first, the servo motor 55 is started. The servo motor 55 drives the second gear 56 to rotate and mesh with the first gear 54. Thus, the first gear 54 drives the second set of mounting blocks 1 to rotate through the second connecting plate 52. At this time, the second set of clamping jaws 2 move smoothly under the limiting action of the limiting ring 57, and at the same time drive the two sets of clamping jaws 2 to approach each other. At this time, the push rod motor 42 is started. The push rod motor 42 drives the fixing frame 43 to move downward. At the same time, the two sets of mounting blocks 1 move downward simultaneously, and the clamping jaws 2 move downward to approach the chip. When the anti-slip pad 22 contacts the chip, the mounting block 1 continues to move downward. Thus, the limiting rod 31 slides in the mounting block 1, and at the same time the spring 34 is compressed to buffer the mechanical force and prevent chip damage caused by excessive mechanical force. At the same time, the elastic force released by the spring 34 can ensure that the clamping jaws 2 clamp the chip to prevent the chip from moving, which is convenient for bonding.
[0037] The above specific embodiment is only an optional embodiment of the present invention. Based on the technical solution of the present invention and the relevant revelations of the above embodiment, those skilled in the art can make various alternative improvements and combinations to the above specific embodiment.
Claims
1. A pressing device for aluminum wire bonding, characterized in that: include: Two groups of mounting blocks (1), each of which is provided with a pressing claw (2) for fixing the position of the chip, wherein the pressing claw (2) comprises a plurality of groups of Z-shaped pressing plates (21), and a non-slip pad (22) is also provided at the bottom of each group of pressing plates (21); Each group of the pressing claws (2) is equipped with a plurality of buffer components (3) for relieving the pressure exerted by the pressing claws (2) on the chip.
2. The pressing device for aluminum wire bonding according to claim 1, characterized in that: The buffer assembly (3) comprises a limiting rod (31), a lifting plate (32), a limiting disk (33) and a spring (34); two groups of the limiting rods (31) are slidably connected to the mounting block (1); the lifting plate (32) is fixedly connected to the bottom of the two groups of limiting rods (31); the pressing claw (2) is installed at the bottom of the lifting plate (32); the limiting disk (33) is arranged above the mounting block (1) and fixedly connected to the top of the limiting rod (31); and the spring (34) is arranged below the mounting block (1) and sleeved on the outer ring of the limiting rod (31).
3. The pressing device for aluminum wire bonding according to claim 1, characterized in that: It also includes a clamping mechanism (4) for driving the pressing claws (2) to approach the chip for fixing, and an adjusting component (5) for adjusting the distance between the two groups of pressing claws (2).
4. The pressing device for aluminum wire bonding according to claim 3, characterized in that: The clamping mechanism (4) comprises a mounting plate (41), a push rod motor (42), and a fixing frame (43); the mounting plate (41) is arranged above the first group of mounting blocks (1); the push rod motor (42) is fixedly connected to the side of the mounting plate (41); the output end of the push rod motor (42) is fixedly connected to the top of a U-shaped fixing frame (43); and the fixing frame (43) is fixedly connected to the top of the first group of mounting blocks (1).
5. The pressing device for aluminum wire bonding according to claim 4, characterized in that: The clamping mechanism (4) further comprises a slide bar (44) and a slide sleeve (45). Two groups of the slide bars (44) are symmetrically arranged on both sides of the push rod motor (42) and fixedly connected to the top of the fixing frame (43). The slide sleeve (45) is slidably sleeved on the slide bar (44), and the slide sleeve (45) is fixedly connected to the side of the mounting plate (41).
6. The pressing device for aluminum wire bonding according to claim 4, characterized in that: The adjustment assembly (5) comprises a first connecting plate (51), a second connecting plate (52), and a rotating shaft (53); the two groups of the first connecting plates (51) are fixedly connected to one side of the first group of mounting blocks (1); the second connecting plates (52) are fixedly connected to one side of the second group of mounting blocks (1); the second connecting plates (52) are arranged between the two groups of the first connecting plates (51); the rotating shaft (53) is fixedly connected to the second connecting plate (52), and the rotating shaft (53) is rotatably connected to the two groups of the first connecting plates (51).
7. The pressing device for aluminum wire bonding according to claim 6, characterized in that: The adjusting assembly (5) further comprises a first gear (54), a servo motor (55), and a second gear (56); the first gear (54) is sleeved and mounted on the rotating shaft (53), and the first gear (54) is arranged above the first connecting plate (51); the servo motor (55) is mounted on a side of the fixing frame (43) close to the first gear (54); the output end of the servo motor (55) is fixedly connected to the second gear (56), and the second gear (56) is meshed with the first gear (54).
8. The pressing device for aluminum wire bonding according to claim 7, characterized in that: The adjustment assembly (5) further comprises a limiting ring (57) fixedly connected to the outside of the first group of mounting blocks (1), and the second group of mounting blocks (1) are slidably connected to the limiting ring (57).