Packaging assembly

Abstract

The utility model discloses a packaging assembly, which comprises a first cover body, a second cover body and a connecting plate, the first cover body comprises a first box dam; the second cover body comprises a second box dam, and the second box dam and the first box dam are oppositely arranged; the connecting plate is arranged between the first cover body and the second cover body; wherein at least one of the first box dam, the second box dam and the connecting plate is provided with a concave groove, and the connecting plate is connected with the first box dam and / or the second box dam in the concave groove in a matched mode. And the connecting plate is hermetically connected with the first box dam and / or the second box dam at the sunken groove through a connecting layer. The packaging assembly is used for improving the sealing performance of the packaging assembly and simplifying the technological process of the packaging assembly.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a packaging component. Background Art

[0002] A packaging component is a device for packaging a chip. The packaging component generally includes upper and lower covers and a connecting plate located between the upper and lower covers. The chip can be placed between the cover and the connecting plate. After the chip is placed in the packaging component, the dam structures of the upper and lower covers are hermetically fixed to the connecting plate to achieve the packaging of the chip.

[0003] In the existing packaging component, generally, solder sheets are placed between the dam structure of the upper cover and the connecting plate and between the dam structure of the lower cover and the connecting plate, and then the packaging component is placed in a reflow oven for heating to weld and fix the upper and lower covers to the connecting plate. Since the contact surfaces between the upper and lower covers and the connecting plate are all flat surfaces, if there are problems such as unevenness on the contact surfaces between the upper and lower covers and the connecting plate, it will affect the sealing performance after welding of the upper and lower covers to the connecting plate, and cause water vapor to easily enter the interior of the packaging component to corrode the chip.

[0004] To improve the sealing performance between the upper and lower covers and the connecting plate, after the existing packaging component is welded by passing through a reflow oven for the upper and lower covers and the connecting plate, a brazing will be carried out again to improve the airtightness of the packaging component. This form of double welding and sealing makes the process flow of the packaging component more complex and also increases the manufacturing cost. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a packaging component for improving the sealing performance of the packaging component and simplifying the process flow of the packaging component.

[0006] The purpose of the utility model is achieved by adopting the following technical solutions:

[0007] A packaging component, comprising:

[0008] A first cover, including a first dam;

[0009] A second cover, including a second dam, the second dam being disposed opposite to the first dam;

[0010] A connecting plate, disposed between the first cover and the second cover;

[0011] Wherein, at least one of the first dam, the second dam and the connecting plate is provided with a recessed groove, the connecting plate forms a fitting connection with the first dam and / or the second dam in the recessed groove, and the connecting plate and the first dam and / or the second dam are hermetically connected through a connection layer at the recessed groove.

[0012] Preferably, a corner of the first dam and the second dam facing the inside of the encapsulation assembly is missing and respectively forms a first recessed groove. The first recessed groove of the first dam and the first recessed groove of the second dam together form a chamber, and the chamber fits with the end of the connection plate. Wherein, the connection layer is disposed on the surface of the end of the connection plate and / or the bottom wall forming the first recessed groove.

[0013] Preferably, a connection layer is disposed between the opposite end faces of the first dam and the second dam, and / or the connection layer is disposed on the side wall forming the first recessed groove.

[0014] Preferably, a first protruding portion is formed on the end face of the first dam facing the second dam, and a second recessed groove that fits with the first protruding portion is formed on the end face of the second dam facing the first dam.

[0015] Or, a second recessed groove is formed on the end face of the first dam facing the second dam, and a first protruding portion that fits with the second recessed groove is formed on the end face of the second dam facing the first dam.

[0016] Wherein, the first protruding portion and the second recessed groove are hermetically connected through the connection layer.

[0017] Preferably, the connection layer is disposed on the wall forming the second recessed groove or the outer surface of the first protruding portion.

[0018] A flat portion that is flat with respect to the first protruding portion and / or the second recessed groove is further formed on the opposite end faces of the first dam and / or the second dam. The connection layer is disposed on the flat portion of the end face of the first dam facing the second dam and / or the flat portion of the end face of the second dam facing the first dam.

[0019] Preferably, the connection plate is provided with a second protruding portion protruding towards the first dam and / or the second dam, and the first dam and / or the second dam are provided with a third recessed groove for fitting with the second protruding portion.

[0020] Or, the connection plate is provided with a third recessed groove recessed away from the first dam and / or the second dam, and the first dam and / or the second dam are provided with a second protruding portion for fitting with the third recessed groove.

[0021] Wherein, the second protruding portion and the third recessed groove are hermetically connected through the connection layer.

[0022] Preferably, the connection layer is disposed on the wall forming the third recessed groove or the outer surface of the second protruding portion.

[0023] The end face of the first dam and / or the second dam facing the connecting plate further forms a flat portion that is flat with respect to the second protrusion and / or the third recess, and the flat portion of the end face of the first dam facing the connecting plate and / or the flat portion of the end face of the second dam facing the connecting plate are hermetically connected to the connecting plate through the connecting layer.

[0024] Preferably, multiple second protrusions or multiple third recesses are provided on at least one side of the connecting plate, and the multiple second protrusions or multiple third recesses on the same side of the connecting plate are spaced apart along a direction perpendicular to the thickness direction of the encapsulation component.

[0025] Preferably, the first cover body includes a first substrate, the second cover body includes a second substrate, and circuit layers are respectively provided on the surfaces of the first substrate, the second substrate, and the connecting plate; the first dam and the second dam respectively enclose a receiving space for accommodating a chip, and the chip is used for electrical connection with the circuit layer of at least one of the first substrate, the second substrate, and the connecting plate.

[0026] Preferably, the connecting layer at least includes a gold-tin alloy layer, the first dam and the second dam are respectively metal dams, and the connecting layer is plated on at least one of the first dam and the second dam; or, the connecting plate includes a metal layer, and the connecting layer is plated on the metal layer.

[0027] Compared with the prior art, the beneficial effects of the present utility model at least include:

[0028] By providing a recess and performing a hermetic connection through the connecting layer at the recess, the first dam and / or the second dam, the connecting plate, and the connecting layer form a fitting connection at the recess, and a bending structure can be formed at the connection between the connecting plate and the first dam and / or the second dam. The connection of the bending structure can block the entry of water vapor, thereby improving the sealing performance after the connection between the connecting plate and the first dam and the second dam; there is no need to perform operations such as soldering, which simplifies the process flow of the encapsulation component and can reduce the manufacturing cost of the encapsulation component. Description of the Drawings

[0029] Figure 1 is an exploded schematic view of the encapsulation component according to Embodiment 1 of the present utility model;

[0030] Figure 2 is a schematic structural view of the encapsulation component according to Embodiment 1 of the present utility model;

[0031] Figure 3 is another exploded schematic view of the encapsulation component according to Embodiment 1 of the present utility model;

[0032] Figure 4It is a schematic structural diagram of another encapsulation component according to Embodiment 1 of the present utility model;

[0033] Figure 5 It is an exploded schematic diagram of another encapsulation component according to Embodiment 1 of the present utility model;

[0034] Figure 6 It is a schematic structural diagram of another encapsulation component according to Embodiment 1 of the present utility model;

[0035] Figure 7 It is an exploded schematic diagram of another encapsulation component according to Embodiment 1 of the present utility model;

[0036] Figure 8 It is a schematic structural diagram of another encapsulation component according to Embodiment 1 of the present utility model;

[0037] Figure 9 It is an exploded schematic diagram of an encapsulation component according to Embodiment 2 of the present utility model;

[0038] Figure 10 It is an exploded schematic diagram of another encapsulation component according to Embodiment 2 of the present utility model;

[0039] Figure 11 It is a schematic structural diagram of an encapsulation component according to Embodiment 2 of the present utility model;

[0040] Figure 12 It is an exploded schematic diagram of another encapsulation component according to Embodiment 2 of the present utility model;

[0041] Figure 13 It is an exploded schematic diagram of another encapsulation component according to Embodiment 2 of the present utility model;

[0042] Figure 14 It is a schematic structural diagram of another encapsulation component and another encapsulation component according to Embodiment 2 of the present utility model.

[0043] In the figure: 1. First cover body; 11. First dam; 111. First recessed groove; 1111. Bottom wall; 1112. Side wall; 112. Flattened portion; 113. First protruding portion; 12. First substrate; 2. Second cover body; 21. Second dam; 211. Second recessed groove; 212. Third recessed groove; 22. Second substrate; 23. Accommodation space; 3. Connecting plate; 31. Second protruding portion; 4. Connecting layer. Detailed implementation manners

[0044] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this utility model will be more complete and comprehensive, and will fully convey the concept of the example embodiments to those skilled in the art. Like reference numerals in the figures denote like or similar structures, and thus their repetitive description will be omitted.

[0045] The words expressing positions and directions described in this utility model are all illustrated by taking the accompanying drawings as examples, but can be changed according to needs, and all the changes made are included in the protection scope of this utility model.

[0046] Embodiment 1

[0047] As Figure 1 shown, this utility model provides a packaging component, including a first cover body 1, a second cover body 2, a connecting plate 3, and a connecting layer 4 for connecting the connecting plate 3 with the first cover body 1 and / or the second cover body 2.

[0048] The first cover body 1 may include a first substrate 12 and a first dam 11. The first dam 11 may surround and form an accommodating space 23 for accommodating a chip. The first dam 11 may specifically be a metal dam. The first substrate 12 and the first dam 11 are stacked and fixed to each other along the thickness direction of the packaging component. At least one of the two opposite surfaces of the first substrate 12 along its thickness direction is provided with a circuit layer. Specifically, circuit layers are respectively provided on the two opposite surfaces of the first substrate 12 along its thickness direction. Among them, the circuit layer includes a plurality of electrically connected lines, and the circuit layer can be used to connect with a chip or other electronic components.

[0049] The second cover body 2 may include a second substrate 22 and a second dam 21. The second dam 21 is disposed opposite to the first dam 11, and the second dam 21 may surround and form an accommodating space 23 for accommodating a chip. The second dam 21 may specifically be a metal dam. The second substrate 22 and the second dam 21 are stacked and fixed to each other along the thickness direction of the packaging component. At least one of the two opposite surfaces of the second substrate 22 along its thickness direction is provided with a circuit layer. Specifically, circuit layers are respectively provided on the two opposite surfaces of the second substrate 22 along its thickness direction.

[0050] The connecting plate 3 is disposed between the first cover body 1 and the second cover body 2, and the first cover body 1, the connecting plate 3, and the second cover body 2 can be stacked in the thickness direction of the encapsulation component. The connecting plate 3 may include a metal layer and a circuit layer. The circuit layer may be disposed on at least one of two opposite surfaces of the connecting plate 3 in its thickness direction. Specifically, the circuit layer is disposed on two opposite surfaces of the connecting plate 3 in its thickness direction. Among them, the circuit layer and the metal layer are separately disposed, and in order to insulate and separate the circuit layer from the metal layer, an insulating layer is disposed between the circuit layer and the metal layer. The circuit layer and the metal layer are insulated and separated by the insulating layer, and the insulating layer covers the circuit layer and exposes the pads to be soldered. After the chip is installed in the accommodation space 23 surrounded by the first dam 11 and / or the second dam 21, the chip can be electrically connected to the circuit layer of at least one of the first substrate 12, the second substrate 22, and the connecting plate 3.

[0051] The connecting plate 3 and the first dam 11 and / or the second dam 21 are hermetically connected through a connecting layer 4 at the recessed groove. The connecting layer 4 can be disposed between the connecting plate 3 and the first cover body 1, between the connecting plate 3 and the second cover body 2, and between the first cover body 1 and the second cover body 2, so that the connecting plate 3 can be hermetically connected to the first cover body 1 and the second cover body 2 through the connecting layer 4, and the encapsulation component forms a sealed state. Among them, the connecting layer 4 can be a welding layer, specifically a gold-tin alloy layer. Compared with the solder sheet in the prior art, which will melt and deform under the heating state and is prone to unstable connection, the gold-tin alloy layer will not melt and will not deform under the heating state, further increasing the connection stability between the first cover body 1 and / or the second cover body 2 and the connecting plate 3. The connecting layer 4 can be plated on at least one of the first cover body 1, the second cover body 2, and the connecting plate 3. After the first cover body 1, the connecting plate 3, and the second cover body 2 are stacked, the first cover body 1, the connecting plate 3, and the second cover body 2 can be welded through the connecting layer 4 to achieve relative fixation and sealing. Among them, by using a plating process to dispose the connecting layer 4 on at least one of the first cover body 1, the second cover body 2, and the connecting plate 3, it is convenient to control the setting position of the connecting layer 4, so that the connecting layer 4 can be more accurately formed at the connection between the connecting plate 3, the first cover body 1, and the second cover body 2.

[0052] When the connecting layer 4 needs to be plated on the first cover body 1, the connecting layer 4 can be plated on the first dam 11 in the first cover body 1. When the connecting layer 4 needs to be plated on the second cover body 2, the connecting layer 4 can be plated on the second dam 21 in the second cover body 2. When the connecting layer 4 needs to be plated on the connecting plate 3, the connecting layer 4 can be plated on the metal layer in the connecting plate 3.

[0053] To improve the sealing performance of the encapsulated component after encapsulation, at least one of the first dam 11, the second dam 21, and the connecting plate 3 may be provided with a recessed groove, and the connecting plate 3 may be anastomosed and connected with the first dam 11 and / or the second dam 21 at the recessed groove. Wherein, a connecting layer 4 may be provided at the recessed groove so that the connecting layer 4 can be used to weld and fix the connecting plate 3, the first dam 11, and the second dam 21 that are anastomosed at the recessed groove and achieve sealing. By providing the recessed groove and performing a sealing connection at the recessed groove through the connecting layer 4, the first dam 11 and / or the second dam 21, the connecting plate 3, and the connecting layer 4 form an anastomosed connection at the recessed groove, and a bent structure can be formed at the connection between the connecting plate 3 and the first dam 11 and the second dam 21. The connection of the bent structure can block water vapor from entering the accommodation space 23, prevent the water vapor from corroding the chip, and thus improve the sealing performance after the connection between the connecting plate 3 and the first dam 11 and the second dam 21. After the connecting plate 3 is hermetically connected to the first dam 11 and the second dam 21 through the connecting layer 4 at the recessed groove, the sealing performance of the encapsulated component can meet the requirements, and there is no need to perform operations such as brazing, which simplifies the process flow of the encapsulated component and can reduce the manufacturing cost of the encapsulated component.

[0054] Referring to Figures 1 to 8 , in some specific embodiments, a corner of the first dam 11 and the second dam 21 facing the inside of the encapsulated component is missing and respectively forms a first recessed groove 111. The first recessed groove 111 of the first dam 11 and the first recessed groove 111 of the second dam 21 together form a chamber. For example, when the connecting plate 3 is a rectangular plate body, a corner of the first dam 11 facing the second dam 21 and facing the inside of the encapsulated component is missing and forms an L-shaped first recessed groove 111; a corner of the second dam 21 facing the first dam 11 and facing the inside of the encapsulated component is missing and forms an L-shaped first recessed groove 111. When the first dam 11 and the second dam 21 are arranged opposite to each other, the first recessed groove 111 of the first dam 11 communicates with the first recessed groove 111 of the second dam 21 and forms a chamber opening towards the inside of the encapsulated component. This chamber can be used to adapt to the end of the connecting plate 3 so that the end of the connecting plate 3 can be arranged in this chamber and anastomosed and connected with the first dam 11 and the second dam 21 at this chamber; at this time, the opposite end faces of the first dam 11 and the second dam 21 can be attached. Among them, the first recessed groove 111 is not limited to an L shape. When the end of the connecting plate 3 is of other shapes, the shape of the first recessed groove 111 can be correspondingly adjusted so that the chamber formed by the two first recessed grooves 111 can remain adapted to the end of the connecting plate 3.

[0055] Referring to Figure 1 and Figure 3, a connection layer 4 may be pre - provided on the surface of the end of the connection plate 3. Specifically, connection layers 4 are respectively pre - provided on the opposite surfaces of the end of the connection plate 3 along its thickness direction, and one of the opposite surfaces of the end of the connection plate 3 along its thickness direction faces the first recess 111 of the first dam 11, and the other faces the first recess 111 of the second dam 21. When the end of the connection plate 3 is located in the chamber, the connection plate 3 can be hermetically and fixedly connected by welding the connection layer 4 on the surface of the connection plate 3 to the bottom wall 1111 forming the first recess 111. Specifically, the connection layer 4 on the surface of the connection plate 3 facing the first dam 11 is used to connect to the bottom wall 1111 forming the first recess 111 in the first dam 11, and the connection layer 4 on the surface of the connection plate 3 facing the second dam 21 is used to connect to the bottom wall 1111 forming the first recess 111 in the second dam 21. Among them, the bottom wall 1111 forming the first recess 111 is a wall parallel to the surface of the connection plate 3.

[0056] In addition, referring to Figure 5 , in other embodiments, the connection layer 4 may also be pre - provided on the bottom wall 1111 forming the first recess 111. For example, the bottom walls 1111 forming the first recess 111 in the first dam 11 and the second dam 21 are respectively pre - provided with the connection layer 4, so that when the end of the connection plate 3 is anastomosed and connected to the first dam 11 and the second dam 21 at the chamber, it can be hermetically connected through the connection layer 4. Or, the connection layer 4 can be pre - provided on the end of the connection plate 3 and the bottom wall 1111 forming the first recess 111 at the same time.

[0057] Referring to Figure 5 , in some specific embodiments, to increase the area of the hermetic connection of the encapsulation component, the side wall 1112 of the first recess 111 may also be pre - provided with the connection layer 4. When the connection plate 3 is anastomosed and connected to the first dam 11 and the second dam 21 at the chamber, the side surface of the connection plate 3 and the side wall 1112 of the first recess 111 are hermetically connected through the connection layer 4 to increase the area of the hermetic connection part of the encapsulation component, thereby improving the hermetic performance of the encapsulation component. Among them, the side surface of the connection plate 3 is parallel to the thickness direction of the connection plate 3 and perpendicular to the surface of the connection plate 3, and the side wall 1112 of the first recess 111 is parallel to the side surface of the connection plate 3.

[0058] In addition, referring to Figures 3 to 6, a connecting layer 4 may be provided between the end faces of the first dam 11 and the second dam 21 facing each other. For example, a connecting layer 4 is pre - provided on the end face of the first dam 11 facing the second dam 21, or a connecting layer 4 is pre - provided on the end face of the second dam 21 facing the first dam 11. When the first dam 11 and the second dam 21 are connected, the first dam 11 and the second dam 21 can be indirectly abutted through the connecting layer 4, and the opposite surfaces of the first dam 11 and the second dam 21 can form a sealed connection through the connecting layer 4, thereby increasing the area of the sealed connection part of the encapsulation component and further improving the sealing performance of the encapsulation component.

[0059] Referring to Figure 7 and Figure 8 , as a preferred embodiment, a part of the end face of the first dam 11 facing the second dam 21 may protrude towards the second dam 21 to form a first protrusion 113. The end face of the first dam 11 facing the second dam 21 also forms a flat part 112 which is flatly arranged relative to the first protrusion 113, that is, the non - protruding part of the end face of the first dam 11 facing the second dam 21 forms the flat part 112 of the first dam 11. And, a part of the end face of the second dam 21 facing the first dam 11 may be recessed away from the first dam 11 to form a second recessed groove 211 that fits with the first protrusion 113. The end face of the second dam 21 facing the first dam 11 also forms a flat part 112 which is flatly arranged relative to the second recessed groove 211, that is, the non - recessed part of the end face of the second dam 21 facing the first dam 11 forms the flat part 112 of the second dam 21. When the first dam 11 and the second dam 21 are connected, the first protrusion 113 of the first dam 11 is received in the second recessed groove 211 of the second dam 21, and a connecting layer 4 may be provided in the second recessed groove 211 so that the first protrusion 113 and the wall forming the second recessed groove 211 can be further sealed and connected through the connecting layer 4. At this time, the flat part 112 of the end face of the first dam 11 facing the second dam 21 and the flat part 112 of the end face of the second dam 21 facing the first dam 11 can be mutually attached. Among them, the connecting layer 4 may be pre - provided on the wall forming the second recessed groove 211 or pre - formed on the outer surface of the first protrusion 113.

[0060] To further improve the sealing effect, a connecting layer 4 may also be provided on the flat portion 112 of the end face of the first dam 11 facing the second dam 21, or a connecting layer 4 is provided on the flat portion 112 of the end face of the second dam 21 facing the first dam 11, or connecting layers 4 are respectively provided on the flat portion 112 of the end face of the first dam 11 facing the second dam 21 and the flat portion 112 of the end face of the second dam 21 facing the first dam 11. When the first dam 11 is connected to the second dam 21, the first convex portion 113 and the wall forming the second concave groove 211 can be hermetically connected through the connecting layer 4, and the flat portion 112 of the end face of the first dam 11 facing the second dam 21 and the flat portion 112 of the end face of the second dam 21 facing the first dam 11 are hermetically connected through the connecting layer 4, thereby effectively improving the sealing performance of the encapsulation component.

[0061] Embodiment 2

[0062] As Figures 9 to 14 shown, the encapsulation component of this embodiment is basically the same as that of Embodiment 1, the difference being that the mating structure of the connecting plate 3 with the first dam 11 and the second dam 21 and the setting mode of the connecting layer 4 are different.

[0063] Referring to Figures 9 to 11 , in this embodiment, the connecting plate 3 may be provided with a second convex portion 31 protruding towards the first dam 11. A part of the end face of the first dam 11 facing the connecting plate 3 may be recessed away from the connecting plate 3 to form a third concave groove 212. The end face of the first dam 11 facing the connecting plate 3 further forms a flat portion 112 that is flatly arranged relative to the third concave groove 212, that is, the non-recessed part of the end face of the first dam 11 facing the connecting plate 3 forms the flat portion 112. The second convex portion 31 of the connecting plate 3 may be mated with the third concave groove 212 of the first dam 11. A connecting layer 4 may be provided in the third concave groove 212. When the connecting plate 3 is connected to the first dam 11, the second convex portion 31 of the connecting plate 3 is received in the third concave groove 212 of the first dam 11, and the second convex portion 31 and the wall forming the third concave groove 212 are hermetically connected through the connecting layer 4. Among them, referring to Figure 10 and Figure 13 , the wall forming the third concave groove 212 may be pre-coated with the connecting layer 4, or, referring to Figure 9 and Figure 12, a connecting layer 4 can be pre-coated on the surface of the second protrusion 31 so that when the second protrusion 31 is received in the third concave groove 212, the second protrusion 31 can be connected to the wall forming the third concave groove 212 through the connecting layer 4 located in the third concave groove 212. It should be noted that in other embodiments, the second protrusion 31 can be provided on the first dam 11, the third concave groove 212 can be provided on the connecting plate 3, and the second protrusion 31 of the first dam 11 is hermetically connected to the wall forming the third concave groove 212 through the connecting layer 4.

[0064] In addition, when the connecting plate 3 is connected to the first dam 11, the flat portion 112 of the end face of the first dam 11 facing the connecting plate 3 can also be hermetically connected to the connecting plate 3 through the connecting layer 4. Specifically, the flat portion 112 of the end face of the first dam 11 facing the connecting plate 3 can be pre-coated with the connecting layer 4, or a portion of the connecting plate 3 located below the flat portion 112 of the first dam 11 in the stacking direction can be pre-coated with the connecting layer 4. When the first dam 11 is connected to the connecting plate 3, the second protrusion 31 is hermetically connected to the wall forming the third concave groove 212 through the connecting layer 4, and the flat portion 112 of the end face of the first dam 11 facing the connecting plate 3 and the connecting plate 3 are hermetically connected through the connecting layer 4. Wherein, the stacking direction is the direction in which the first cover plate 1, the connecting plate 3 and the second cover plate 2 are stacked.

[0065] The connecting plate 3 can also be provided with a second protrusion 31 protruding towards the second dam 21. A part of the end face of the second dam 21 facing the connecting plate 3 can be recessed away from the connecting plate 3 to form a third concave groove 212. The end face of the second dam 21 facing the connecting plate 3 also forms a flat portion 112 that is flatly arranged relative to the third concave groove 212, that is, the non-recessed part of the end face of the second dam 21 facing the connecting plate 3 forms the flat portion 112. The second protrusion 31 of the connecting plate 3 can be fitted with the third concave groove 212 of the second dam 21. A connecting layer 4 can be provided in the third concave groove 212. When the connecting plate 3 is connected to the second dam 21, the second protrusion 31 of the connecting plate 3 is received in the third concave groove 212 of the second dam 21, and the second protrusion 31 is hermetically connected to the wall forming the third concave groove 212 through the connecting layer 4. Wherein, the wall forming the third concave groove 212 can be pre-coated with the connecting layer 4, or the surface of the second protrusion 31 can be pre-coated with the connecting layer 4 so that when the second protrusion 31 is received in the third concave groove 212, the second protrusion 31 can be connected to the wall forming the third concave groove 212 through the connecting layer 4 located in the third concave groove 212. It should be noted that in other embodiments, the second protrusion 31 can be provided on the second dam 21, the third concave groove 212 can be provided on the connecting plate 3, and the second protrusion 31 of the second dam 21 is hermetically connected to the wall forming the third concave groove 212 through the connecting layer 4.

[0066] In addition, when the connecting plate 3 is connected to the second dam 21, the flat portion 112 of the end face of the second dam 21 facing the connecting plate 3 can also be hermetically connected to the connecting plate 3 through the connecting layer 4. Specifically, the flat portion 112 of the end face of the second dam 21 facing the connecting plate 3 can be pre-coated with the connecting layer 4, or a portion of the connecting plate 3 located above the flat portion 112 of the second dam 21 in the stacking direction can be pre-coated with the connecting layer 4. When the second dam 21 is connected to the connecting plate 3, the second convex portion 31 and the wall forming the third concave groove 212 are hermetically connected through the connecting layer 4, and the flat portion 112 of the end face of the second dam 21 facing the connecting plate 3 and the connecting plate 3 are hermetically connected through the connecting layer 4.

[0067] Referring to Figures 12 to 14 , as a preferred embodiment, multiple second convex portions 31 or multiple third concave grooves 212 are provided on at least one side of the connecting plate 3. Specifically, multiple second convex portions 31 or multiple third concave grooves 212 can be provided on opposite sides of the connecting plate 3 in its thickness direction. For example, when multiple second convex portions 31 are provided on the side of the connecting plate 3 facing the first dam 11, multiple third concave grooves 212 can be provided on the first dam 11, and each third concave groove 212 of the first dam 11 is adapted to one second convex portion 31 in the connecting plate 3. When multiple second convex portions 31 are provided on the side of the connecting plate 3 facing the second dam 21, multiple third concave grooves 212 can be provided on the second dam 21, and each third concave groove 212 of the second dam 21 is adapted to one second convex portion 31 in the connecting plate 3. Among them, each second convex portion 31 and the wall forming the corresponding third concave groove 212 are hermetically connected through the connecting layer 4 respectively; multiple second convex portions 31 and / or multiple third concave grooves 212 on the same side of the connecting plate 3 are arranged at intervals in a direction perpendicular to the thickness direction of the encapsulation component.

[0068] By providing multiple second convex portions 31 or multiple third concave grooves 212 on one side of the connecting plate 3, multiple bending paths can be formed at the connection between the connecting plate 3 and the first dam 11 and / or the second dam 21, effectively blocking water vapor from entering the accommodating space 23, preventing the water vapor from corroding the chip, and thus improving the sealing performance of the encapsulation component.

[0069] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention without departing from the principles and purposes of the present invention, and all these changes should fall within the protection scope of the claims of the present invention.

Claims

1. A packaging component, characterized in that: include: A first cover body (1) comprising a first dam (11); A second cover body (2) comprises a second dam (21), wherein the second dam (21) is arranged opposite to the first dam (11); A connecting plate (3) is arranged between the first cover body (1) and the second cover body (2); At least one of the first dam (11), the second dam (21) and the connecting plate (3) is provided with a recessed groove, the connecting plate (3) and the first dam (11) and / or the second dam (21) form a matching connection at the recessed groove, and the connecting plate (3) and the first dam (11) and / or the second dam (21) are sealed at the recessed groove via a connecting layer (4).

2. The packaging assembly according to claim 1, characterized in that: The first dam (11) and the second dam (21) are notched at a corner facing the interior of the packaging component and respectively form a first recessed groove (111); the first recessed groove (111) of the first dam (11) and the first recessed groove (111) of the second dam (21) together form a chamber, and the chamber is consistent with the end of the connecting plate (3); wherein the connecting layer (4) is provided on the surface of the end of the connecting plate (3) and / or the bottom wall (1111) forming the first recessed groove (111).

3. The packaging assembly according to claim 2, characterized in that: A connection layer (4) is provided between the end surfaces of the first dam (11) and the second dam (21) that are opposite to each other, and / or the side wall (1112) forming the first recessed groove (111) is provided with the connection layer (4).

4. The packaging assembly according to claim 2, characterized in that: A first convex portion (113) is formed on the end surface of the first dam (11) facing the second dam (21), and a second concave groove (211) matching the first convex portion (113) is formed on the end surface of the second dam (21) facing the first dam (11); Or, a second concave groove (211) is formed on the end surface of the first dam (11) facing the second dam (21), and a first convex portion (113) matching the second concave groove (211) is formed on the end surface of the second dam (21) facing the first dam (11); Wherein, the first protruding portion (113) and the second recessed groove (211) are sealed and connected via the connecting layer (4).

5. The packaging assembly according to claim 4, characterized in that: The connecting layer (4) is arranged on a wall forming the second recessed groove (211) or on an outer surface of the first protruding portion (113); The end surfaces of the first dam (11) and / or the second dam (21) facing each other also form a flat portion (112) arranged flatly relative to the first protruding portion (113) and / or the second recessed groove (211), and the connecting layer (4) is arranged on the flat portion (112) of the end surface of the first dam (11) facing the second dam (21) and / or the flat portion (112) of the end surface of the second dam (21) facing the first dam (11).

6. The packaging assembly according to claim 1, characterized in that: The connecting plate (3) is provided with a second protruding portion (31) protruding toward the first dam (11) and / or the second dam (21), and the first dam (11) and / or the second dam (21) is provided with a third recessed groove (212) for matching with the second protruding portion (31); Alternatively, the connecting plate (3) is provided with a third recessed groove (212) recessed away from the first dam (11) and / or the second dam (21), and the first dam (11) and / or the second dam (21) is provided with a second protruding portion (31) for matching with the third recessed groove (212); Wherein, the second protruding portion (31) and the third recessed groove (212) are sealed and connected via the connecting layer (4).

7. The packaging assembly according to claim 6, characterized in that: The connecting layer (4) is arranged on a wall forming the third recessed groove (212) or on an outer surface of the second raised portion (31); The end surface of the first dam (11) and / or the second dam (21) facing the connecting plate (3) also forms a flat portion (112) arranged flatly relative to the second protruding portion (31) and / or the third recessed groove (212); the flat portion (112) of the end surface of the first dam (11) facing the connecting plate (3) and / or the flat portion (112) of the end surface of the second dam (21) facing the connecting plate (3) are sealedly connected to the connecting plate (3) via the connecting layer (4).

8. The packaging assembly according to claim 6, characterized in that: At least one side of the connecting plate (3) is provided with a plurality of second protrusions (31) or a plurality of third recessed grooves (212); the plurality of second protrusions (31) or the plurality of third recessed grooves (212) located on the same side of the connecting plate (3) are arranged at intervals along a direction perpendicular to the thickness of the packaging component.

9. The packaging assembly according to claim 1, characterized in that: The first cover body (1) comprises a first substrate (12), the second cover body (2) comprises a second substrate (22), and the surfaces of the first substrate (12), the second substrate (22) and the connecting plate (3) are respectively provided with circuit layers; the first dam (11) and the second dam (21) are respectively provided to form a receiving space (23) for accommodating a chip, and the chip is used to be electrically connected to the circuit layer of at least one of the first substrate (12), the second substrate (22) and the connecting plate (3).

10. The packaging assembly according to claim 1, characterized in that: The connecting layer (4) comprises at least a gold-tin alloy layer, the first dam (11) and the second dam (21) are respectively metal dams, and the connecting layer (4) is plated on at least one of the first dam (11) and the second dam (21); or, the connecting plate (3) comprises a metal layer, and the connecting layer (4) is plated on the metal layer.

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