End plate for generating power by using semiconductor temperature difference

Abstract

The utility model relates to the technical field of semiconductor thermoelectric power generation, in particular to an end plate utilizing semiconductor thermoelectric power generation, which comprises an end plate body, a mounting groove is arranged at the center of the end plate body, and an air inlet pipe and an air outlet seat are respectively and fixedly arranged at the top of the end plate body. Waste heat energy enters a box body through an input pipe and is conveyed into a connecting pipe through an output pipe, first fan blades do work in the output direction of the waste heat energy, so that the first fan blades rotate to drive a rotating shaft and second fan blades to rotate, and the second fan blades rotate to generate pressure difference; external air enters the copper cooling fin through the air inlet pipe for heat exchange, air flow enters the connecting pipe through the air outlet seat and the air outlet pipe and is discharged through the air outlet holes, heat dissipation is conducted on the cold end of the semiconductor thermoelectric power generation piece, and heat is provided for the hot end of the semiconductor thermoelectric power generation piece in cooperation with waste heat energy. Therefore, the utilization efficiency of waste heat energy can be improved, and extra electric energy consumption is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor thermoelectric power generation, in particular to an end plate for semiconductor thermoelectric power generation. Background Technique

[0002] With the growing global demand for sustainable energy solutions, energy recovery and reuse technologies have become a research hotspot. Among many technologies, thermoelectric power generation technology has gradually received wide attention due to its unique advantages, such as no need for external energy input and directly generating electric energy using temperature difference.

[0003] Semiconductor thermoelectric power generation technology utilizes the Seebeck effect to form a temperature difference between the hot end and the cold end of a semiconductor power generation chip, thereby generating electric energy. The greater the temperature difference between the hot end and the cold end of the semiconductor thermoelectric power generation sheet, the higher the conversion efficiency of power generation.

[0004] Under the current technical background, although the heat source of the hot end of the semiconductor thermoelectric power generation sheet has various sources, such as being able to recover the waste heat of industrial waste gas and wastewater, in the process of realizing thermoelectric power generation between the hot end and the cold end, the heat dissipation device usually needs to rely on the power supply of an external power source. This approach not only increases additional power consumption but also reduces the overall energy utilization efficiency. Content of the Utility Model

[0005] The purpose of the utility model is to provide an end plate for semiconductor thermoelectric power generation, which has the characteristic of improving energy reuse.

[0006] To achieve the above purpose, the utility model provides the following technical solution: An end plate for semiconductor thermoelectric power generation, including an end plate body, an installation groove is opened at the center of the end plate body, an air inlet pipe and an air outlet seat are respectively fixedly installed at the top of the end plate body, a copper heat dissipation plate is fixedly installed inside the installation groove, the bottom of the copper heat dissipation plate has copper heat dissipation fins for heat dissipation, the top of the copper heat dissipation plate has a plurality of semiconductor thermoelectric power generation chips for power generation, a box body is fixedly installed on the upper surface of the copper heat dissipation plate, an air outlet pipe is fixedly installed at the top of the air outlet seat, a connecting pipe is fixedly installed at one end of the air outlet pipe away from the air outlet seat, a rotating shaft is rotatably installed inside the connecting pipe, a first fan blade is fixedly installed at the top end of the rotating shaft, a second fan blade is fixedly installed at the low end of the rotating shaft, an output pipe is fixedly installed on the outer side of the connecting pipe, and air outlet holes are opened on the outer side of the connecting pipe.

[0007] To facilitate air flow, as an optimization of the end plate for semiconductor thermoelectric power generation of the utility model, a first communication pipeline and a second communication pipeline are respectively opened inside the installation groove, the air inlet pipe is communicated with the installation groove through the first communication pipeline, and the air outlet seat is communicated with the installation groove through the second communication pipeline.

[0008] For facilitating heat conduction, as an optimization of the end plate using semiconductor thermoelectric power generation of the present utility model, the upper surface of the copper heat dissipation plate is connected to the lower surface of the semiconductor thermoelectric power generation chip through high thermal conductivity silica gel, and the upper surface of the semiconductor thermoelectric power generation chip is connected to the lower surface of the box body through high thermal conductivity silica gel.

[0009] For facilitating the utilization of waste heat energy, as an optimization of the end plate using semiconductor thermoelectric power generation of the present utility model, an input pipe is fixedly installed on the left side of the box body, and the top of the box body is fixedly connected to an output pipe.

[0010] For facilitating air flow, as an optimization of the end plate using semiconductor thermoelectric power generation of the present utility model, the output port position of the output pipe is located below the first fan blade, and the output direction of the output pipe points to the lower part of the first fan blade.

[0011] For facilitating transmission, as an optimization of the end plate using semiconductor thermoelectric power generation of the present utility model, a fixed block is fixedly installed inside the connecting pipe, the rotating shaft penetrates through the center of the fixed block, and the rotating shaft is rotatably installed with the fixed block.

[0012] For facilitating exhaust, as an optimization of the end plate using semiconductor thermoelectric power generation of the present utility model, the fixed block is located above the air outlet hole, and the second fan blade is located below the air outlet hole.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] The waste heat energy enters the box body through the input pipe and is then transported into the connecting pipe through the output pipe. The waste heat energy output direction does work on the first fan blade, causing the first fan blade to rotate and drive the rotating shaft and the second fan blade to rotate. The rotation of the second fan blade generates a pressure difference, allowing external air to enter through the air inlet pipe for heat exchange with the copper heat dissipation fin. The air flow enters the connecting pipe through the air outlet seat and the air outlet pipe and is discharged through the air outlet hole. The rotation of the second fan blade due to the discharge of waste heat energy can evacuate the cavity formed by the copper heat dissipation plate and the installation groove, enabling air to conduct heat exchange with the copper heat dissipation fin and dissipating heat from the cold end of the semiconductor thermoelectric power generation chip. In combination with the waste heat energy providing heat to the hot end of the semiconductor thermoelectric power generation chip, the utilization efficiency of the waste heat energy can be improved, avoiding additional power consumption, making full use of the waste heat energy, and achieving secondary reuse. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Stereo structure diagram of the present utility model;

[0016] Figure 2 Partial structure diagram of the present utility model;

[0017] Figure 3 Structural diagram of the copper heat dissipation plate of the present utility model;

[0018] Figure 4 Partial sectional structural diagram of the present utility model;

[0019] Figure 5 Partial exploded structural diagram of the present utility model.

[0020] In the figure: 1, end plate body; 2, installation groove; 3, first communication pipe; 4, air inlet pipe; 5, second communication pipe; 6, air outlet seat; 7, air outlet pipe; 8, connecting pipe; 9, input pipe; 10, box body; 11, output pipe; 12, copper heat dissipation plate; 13, air outlet hole; 14, semiconductor thermoelectric generator; 15, copper heat dissipation fin; 16, fixing block; 17, rotating shaft; 18, first fan blade; 19, second fan blade. Specific embodiments

[0021] Please refer to Figures 1 to 5 , an end plate using semiconductor thermoelectric power generation, including an end plate body 1, an installation groove 2 is provided at the center of the end plate body 1, an air inlet pipe 4 and an air outlet seat 6 are respectively fixedly installed at the top of the end plate body 1, a copper heat dissipation plate 12 is fixedly installed inside the installation groove 2, a copper heat dissipation fin 15 for heat dissipation is provided at the bottom of the copper heat dissipation plate 12, a plurality of semiconductor thermoelectric generators 14 for power generation are provided at the top of the copper heat dissipation plate 12, a box body 10 is fixedly installed on the upper surface of the copper heat dissipation plate 12, an air outlet pipe 7 is fixedly installed at the top of the air outlet seat 6, a connecting pipe 8 is fixedly installed at one end of the air outlet pipe 7 away from the air outlet seat 6, a rotating shaft 17 is rotatably installed inside the connecting pipe 8, a first fan blade 18 is fixedly installed at the top end of the rotating shaft 17, a second fan blade 19 is fixedly installed at the low end of the rotating shaft 17, an output pipe 11 is fixedly installed on the outer side of the connecting pipe 8, and an air outlet hole 13 is provided on the outer side of the connecting pipe 8.

[0022] In this embodiment: a copper heat dissipation fin 15 for heat dissipation is provided at the bottom of the copper heat dissipation plate 12, and a plurality of semiconductor thermoelectric generators 14 for power generation are provided at the top of the copper heat dissipation plate 12, which is convenient for the copper heat dissipation fin 15 to dissipate heat from the cold end of the semiconductor thermoelectric generator 14, and the box body 10 is used to heat the hot end of the semiconductor thermoelectric generator 14, so that a temperature difference is generated between the hot end and the cold end of the semiconductor thermoelectric generator 14, which is convenient for thermoelectric power generation. A rotating shaft 17 is rotatably installed inside the connecting pipe 8, a first fan blade 18 is fixedly installed at the top end of the rotating shaft 17, and a second fan blade 19 is fixedly installed at the low end of the rotating shaft 17. The rotation of the first fan blade 18 drives the rotating shaft 17 and the second fan blade 19 to rotate through the discharge of waste heat energy, and the cavity formed by the copper heat dissipation plate 12 and the installation groove 2 can be evacuated, so that the air exchanges heat with the copper heat dissipation fin 15 to dissipate heat from the cold end of the semiconductor thermoelectric generator 14.

[0023] As a technical optimization solution of the present utility model, a first communication pipe 3 and a second communication pipe 5 are respectively opened on the inner side of the installation groove 2. The air inlet pipe 4 is communicated with the installation groove 2 through the first communication pipe 3, and the air outlet seat 6 is communicated with the installation groove 2 through the second communication pipe 5.

[0024] In this embodiment: The air inlet pipe 4 is communicated with the installation groove 2 through the first communication pipe 3, and the air outlet seat 6 is communicated with the installation groove 2 through the second communication pipe 5, which is convenient for external air to enter the cavity formed by the copper heat dissipation plate 12 and the installation groove 2 through the air inlet pipe 4 and the first communication pipe 3, and then discharge the air through the second communication pipe 5 and the air outlet seat 6.

[0025] As a technical optimization solution of the present utility model, the upper surface of the copper heat dissipation plate 12 is connected to the lower surface of the semiconductor thermoelectric generator 14 through high thermal conductivity silica gel, and the upper surface of the semiconductor thermoelectric generator 14 is connected to the lower surface of the box body 10 through high thermal conductivity silica gel.

[0026] In this embodiment: Using high thermal conductivity silica gel as a medium can improve the heat transfer and is beneficial to the heat conduction operation.

[0027] As a technical optimization solution of the present utility model, an input pipe 9 is fixedly installed on the left side of the box body 10, and the top of the box body 10 is fixedly connected to an output pipe 11.

[0028] In this embodiment: The input pipe 9 can be used to input gaseous or liquid waste heat energy into the box body 10, and the output pipe 11 can be used to discharge gaseous or liquid waste heat energy, which is convenient for continuous input of waste heat energy, ensuring the stability of the heat source and facilitating the use of thermoelectric power generation.

[0029] As a technical optimization solution of the present utility model, the output port position of the output pipe 11 is located below the first fan blade 18, and the output direction of the output pipe 11 points to the lower part of the first fan blade 18.

[0030] In this embodiment: The output direction of the output pipe 11 points to the lower part of the first fan blade 18, which is convenient for the waste heat energy output through the output pipe 11 to flow to the first fan blade 18, do work on the first fan blade 18, and cause the first fan blade 18 to rotate.

[0031] As a technical optimization solution of the present utility model, a fixing block 16 is fixedly installed inside the connecting pipe 8. The rotating shaft 17 passes through the center of the fixing block 16, and the rotating shaft 17 is rotatably installed with the fixing block 16; the fixing block 16 is located above the air outlet hole 13, and the second fan blade 19 is located below the air outlet hole 13.

[0032] In this embodiment: As shown in the figure, the rotating shaft 17 passes through the center of the fixed block 16, facilitating the rotation of the first fan blade 18 to drive the rotation of the rotating shaft 17 and the second fan blade 19. The second fan blade 19 rotates to discharge air through the air outlet hole 13.

[0033] Working principle: The waste heat energy is input into the box body 10 through the input pipe 9. The box body 10 provides heat for the hot end of the semiconductor thermoelectric generator 14. The waste heat energy in the box body 10 is output into the connecting pipe 8 through the output pipe 11. The output direction of the output pipe 11 does work on the first fan blade 18, so that the first fan blade 18 rotates to drive the rotation of the rotating shaft 17 and the second fan blade 19. The second fan blade 19 rotates to pump air from the cavity formed by the copper heat dissipation plate 12 and the installation groove 2, so that external air enters the cavity through the air inlet pipe 4 and the first communication pipe 3. The flowing air exchanges heat with the copper heat dissipation fins 15 to dissipate heat from the copper heat dissipation plate 12, so that the cold end of the semiconductor thermoelectric generator 14 is cooled. The temperature difference between the hot end and the cold end of the semiconductor thermoelectric generator 14 is formed to continue the power generation operation, so as to make full reuse of the waste heat energy.

[0034] All the standard parts used in the present utility model can be purchased from the market. The special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part all adopt conventional means such as riveting and welding that are mature in the prior art. The machines, parts and equipment all adopt conventional models in the prior art. In addition, the circuit connection adopts the conventional connection method in the prior art, which will not be elaborated here. The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art. All the electrical equipment in the present utility model is powered by an external power supply.

[0035] The above is only a preferred embodiment of the present utility model, and it is not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. An end plate for generating electricity using semiconductor temperature difference, characterized in that: The invention comprises an end plate body (1), wherein a mounting groove (2) is provided at the center of the end plate body (1), an air inlet pipe (4) and an air outlet seat (6) are fixedly installed on the top of the end plate body (1), a copper heat sink (12) is fixedly installed on the inner side of the mounting groove (2), a copper heat sink (15) for heat dissipation is provided at the bottom of the copper heat sink (12), a plurality of semiconductor temperature difference power generation sheets (14) for power generation are provided at the top of the copper heat sink (12), and a box (16) is fixedly installed on the upper surface of the copper heat sink (12). 10), an air outlet pipe (7) is fixedly mounted on the top of the air outlet seat (6), a connecting pipe (8) is fixedly mounted on one end of the air outlet pipe (7) away from the air outlet seat (6), a rotating shaft (17) is rotatably mounted on the inner side of the connecting pipe (8), a first fan blade (18) is fixedly mounted on the top end of the rotating shaft (17), a second fan blade (19) is fixedly mounted on the lower end of the rotating shaft (17), an output pipe (11) is fixedly mounted on the outer side of the connecting pipe (8), and an air outlet hole (13) is opened on the outer side of the connecting pipe (8).

2. The end plate for generating electricity using semiconductor temperature difference according to claim 1, characterized in that: A first communicating pipe (3) and a second communicating pipe (5) are respectively provided on the inner side of the installation groove (2); the air inlet pipe (4) is connected to the installation groove (2) through the first communicating pipe (3); and the air outlet seat (6) is connected to the installation groove (2) through the second communicating pipe (5).

3. The end plate for generating electricity using semiconductor temperature difference according to claim 1, characterized in that: The upper surface of the copper heat sink (12) is connected to the lower surface of the semiconductor thermoelectric power generation sheet (14) via high thermal conductivity silicone rubber, and the upper surface of the semiconductor thermoelectric power generation sheet (14) is connected to the lower surface of the box (10) via high thermal conductivity silicone rubber.

4. The end plate for generating electricity using semiconductor temperature difference according to claim 1, characterized in that: An input pipe (9) is fixedly installed on the left side of the box body (10), and the top of the box body (10) is fixedly connected to the output pipe (11).

5. The end plate for generating electricity using semiconductor temperature difference according to claim 1, characterized in that: The output port of the output pipe (11) is located below the first fan blade (18), and the output direction of the output pipe (11) points to below the first fan blade (18).

6. The end plate for generating electricity using semiconductor temperature difference according to claim 1, characterized in that: A fixed block (16) is fixedly installed on the inner side of the connecting pipe (8), the rotating shaft (17) passes through the center of the fixed block (16), and the rotating shaft (17) and the fixed block (16) are rotatably installed.

7. The end plate for generating electricity using semiconductor temperature difference according to claim 6, characterized in that: The fixing block (16) is located above the air outlet (13), and the second fan blade (19) is located below the air outlet (13).

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