Multi-layer FPC (Flexible Printed Circuit) easy-to-bend structure

Abstract

The utility model discloses a multilayer FPC (Flexible Printed Circuit) easy-to-bend structure, which is characterized in that a first outer-layer FPC, an inner-layer FPC and a second outer-layer FPC which are sequentially arranged from top to bottom are connected together by arranging a first adhesive layer and a second adhesive layer, so that the multilayer FPC is manufactured; the first bending area arranged on the first adhesive layer and the second bending area arranged on the second adhesive layer are hollowed out, and the first bending area and the second bending area are oppositely arranged, so that a user can easily bend the thickened and hardened multi-layer FPC, and the rebound force generated when the multi-layer FPC is bent is reduced.

Description

Technical Field

[0001] The utility model relates to the field of display screen modules, in particular to a multi-layer FPC easily bendable structure. Background Technique

[0002] FPC has the characteristics of high wiring density, light weight and thin thickness, and is widely used in products such as mobile phones, laptop computers, digital cameras, etc. However, the signal of FPC is easily interfered by external conditions. In order to avoid the interference of FPC signal, customers will require the FPC of the product to be made into three layers or multiple layers, and at the same time, a shielding film solution is added on both sides. With the increase of the number of layers of FPC, plus the shielding films on both sides, the FPC will become thick and hard, resulting in difficult bending of the FPC and a large rebound force after bending. Content of the Utility Model

[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a multi-layer FPC easily bendable structure.

[0004] The purpose of the utility model is realized by the following technical solutions:

[0005] A multi-layer FPC easily bendable structure includes: a first outer layer FPC, an inner layer FPC and a second outer layer FPC arranged in sequence from top to bottom. A first adhesive layer is arranged between the first outer layer FPC and the inner layer FPC, a second adhesive layer is arranged between the inner layer FPC and the second outer layer FPC, a first bending area is arranged on the first adhesive layer, a second bending area is arranged on the second adhesive layer, and the first bending area and the second bending area are arranged opposite to each other.

[0006] In one embodiment, the first outer layer FPC includes a first cover film, a first cover film adhesive layer, a first copper plating layer, a first copper layer and a first substrate arranged in sequence, and a first windowing area is arranged on the first cover film and the first cover film adhesive layer.

[0007] In one embodiment, the inner layer FPC includes a second cover film, a second cover film adhesive layer, a second copper layer and a second substrate arranged in sequence.

[0008] In one embodiment, a via hole is further included, and second copper plating layers are arranged on both sides of the via hole.

[0009] In one embodiment, the second outer layer FPC includes a third substrate, a third copper layer, a third copper plating layer, a third cover film adhesive layer and a third cover film arranged in sequence, and a second windowing area is arranged on the third cover film adhesive layer and the third cover film.

[0010] In one embodiment, the thicknesses of the first copper plating layer, the second copper plating layer, and the third copper plating layer are 8 μm - 20 μm.

[0011] In one embodiment, a first shielding film is provided on one side of the first covering film away from the first covering film adhesive layer, and a second shielding film is provided on the first windowing area.

[0012] In one embodiment, a third shielding film is provided on one side of the third covering film away from the third covering film adhesive layer, and a fourth shielding film is provided on the second windowing area.

[0013] In one embodiment, the first outer layer FPC, the inner layer FPC, and the second outer layer FPC are single-sided boards.

[0014] In one embodiment, a reinforcing area is provided at one end of the first shielding film, a reinforcing plate is provided on the reinforcing area, and a third adhesive layer is provided between the reinforcing plate and the first covering film.

[0015] Compared with the prior art, the present utility model has at least the following advantages:

[0016] A multi-layer FPC easy-to-bend structure of the present utility model, by providing a first adhesive layer and a second adhesive layer, enables the first outer layer FPC, the inner layer FPC, and the second outer layer FPC arranged in sequence from top to bottom to be connected together to form a multi-layer FPC. By hollowing out a first bending area provided on the first adhesive layer and a second bending area provided on the second adhesive layer, and then by arranging the first bending area and the second bending area opposite to each other, a user can easily bend the thickened and hardened multi-layer FPC, reducing the rebound force generated when bending the multi-layer FPC. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below.

[0018] Figure 1 It is a schematic diagram of a multi-layer FPC easy-to-bend structure in the present utility model.

[0019] Description of the Drawings: 100, the first outer FPC; 200, the inner FPC; 300, the second outer FPC; 400, the first adhesive layer; 500, the second adhesive layer; 410, the first bending area; 510, the second bending area; 110, the first cover film; 120, the first cover film adhesive layer; 130, the first copper plating layer; 140, the first copper layer; 150, the first substrate; 160, the first opening area; 210, the second cover film; 220, the second cover film adhesive layer; 230, the second copper layer; 240, the second substrate; 600, the via hole; 610, the second copper plating layer; 310, the third substrate; 320, the third copper layer; 330, the third copper plating layer; 340, the third cover film adhesive layer; 350, the third cover film; 360, the second opening area; 111, the first shielding film; 161, the second shielding film; 351, the third shielding film; 361, the fourth shielding film; 112, the strengthening area; 113, the reinforcing plate; 114, the third adhesive layer; Detailed Description of the Invention

[0020] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0021] Please refer to Figure 1 , a multi-layer FPC easy-to-bend structure 10, comprising: a first outer FPC 100, an inner FPC 200, and a second outer FPC 300 arranged in sequence from top to bottom. A first adhesive layer 400 is provided between the first outer FPC 100 and the inner FPC 200, and a second adhesive layer 500 is provided between the inner FPC 200 and the second outer FPC 300. A first bending area 410 is provided on the first adhesive layer 400, and a second bending area 510 is provided on the second adhesive layer 500. The first bending area 410 and the second bending area 510 are arranged opposite to each other.

[0022] It should be noted that by providing the first adhesive layer 400 and the second adhesive layer 500, the first outer FPC 100, the inner FPC 200, and the second outer FPC 300 arranged in sequence from top to bottom are connected together to form a multi-layer FPC. By hollowing out the first bending area 410 provided on the first adhesive layer 400 and the second bending area 510 provided on the second adhesive layer 500, and then arranging the first bending area 410 and the second bending area 510 opposite to each other, the user can easily bend the thick and hard multi-layer FPC, reducing the rebound force generated when bending the multi-layer FPC.

[0023] Please refer to again Figure 1, in one embodiment, the first outer-layer FPC 100 includes a first cover film 110, a first cover film adhesive layer 120, a first copper plating layer 130, a first copper layer 140, and a first substrate 150 which are arranged in sequence. A first opening area 160 is provided on the first cover film 110 and the first cover film adhesive layer 120. The first copper plating layer 130 can improve the corrosion resistance of the first outer-layer FPC 100, effectively extend the service life of the first outer-layer FPC 100, and the first copper plating layer 130 can also improve the electrical conductivity of the first outer-layer FPC 100.

[0024] Please refer to again Figure 1 , in one embodiment, the inner-layer FPC 200 includes a second cover film 210, a second cover film adhesive layer 220, a second copper layer 230, and a second substrate 240 which are arranged in sequence. The inner-layer FPC 200 is wrapped by the first outer-layer FPC 100 and the second outer-layer FPC 300, so there is no need to provide a copper plating layer, avoiding the increase in the thickness and hardness of the multi-layer FPC caused by excessive setting.

[0025] Please refer to again Figure 1 , in one embodiment, a via hole 600 is further included. Second copper plating layers 610 are provided on both sides of the via hole 600, which can enable the conduction connection of circuits on different layers inside the multi-layer FPC.

[0026] Please refer to again Figure 1 , in one embodiment, the second outer-layer FPC 300 includes a third substrate 310, a third copper layer 320, a third copper plating layer 330, a third cover film adhesive layer 340, and a third cover film 350 which are arranged in sequence. A second opening area 360 is provided on the third cover film adhesive layer 340 and the third cover film 350. The third copper plating layer 330 can improve the corrosion resistance of the second outer-layer FPC 300, effectively extend the service life of the second outer-layer FPC 300, and the third copper plating layer 330 can also improve the electrical conductivity of the second outer-layer FPC 300.

[0027] Please refer to again Figure 1 , in one embodiment, the thicknesses of the above-mentioned first copper plating layer 130, second copper plating layer 610, and third copper plating layer 330 are 8um - 20um. When the thicknesses of the first copper plating layer 130, second copper plating layer 610, and third copper plating layer 330 are less than 8um, the electrical conductivity and corrosion resistance cannot be effectively improved. When the thicknesses of the first copper plating layer 130, second copper plating layer 610, and third copper plating layer 330 are greater than 20um, it will cause an increase in the thickness and hardness of the multi-layer FPC.

[0028] Please refer to again Figure 1, in one embodiment, a first shielding film 111 is provided on one side of the first covering film 110 away from the first covering film adhesive layer 120, a second shielding film 161 is provided on the first opening area 160, a third shielding film 351 is provided on one side of the third covering film 350 away from the third covering film adhesive layer 340, and a fourth shielding film 361 is provided on the second opening area 360. The shielding film can effectively reduce the influence of electromagnetic interference on the multi-layer FPC circuit and ensure the stability of the circuit.

[0029] Please refer to again Figure 1 , in one embodiment, the first outer layer FPC 100, the inner layer FPC 200 and the second outer layer FPC 300 are single-sided boards. The structure of the single-sided board is relatively simple, which can reduce the manufacturing cost of the multi-layer FPC.

[0030] Please refer to again Figure 1 , in one embodiment, one end of the first shielding film 111 is provided with a strengthening area 112, a strengthening plate 113 is provided on the strengthening area 112, and a third adhesive layer 114 is provided between the strengthening plate 113 and the first covering film 110. Providing the strengthening plate 113 on the strengthening area 112 can make the connection between the FPC and other components more stable, and the third adhesive layer 114 can make the strengthening plate 113 connected to the first covering film 110.

[0031] The above embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.

Claims

1. A multi-layer FPC easy-bending structure, characterized in that: include: A first outer layer FPC, an inner layer FPC and a second outer layer FPC are arranged in sequence from top to bottom, a first adhesive layer is arranged between the first outer layer FPC and the inner layer FPC, a second adhesive layer is arranged between the inner layer FPC and the second outer layer FPC, a first bending zone is arranged on the first adhesive layer, a second bending zone is arranged on the second adhesive layer, and the first bending zone and the second bending zone are arranged opposite to each other.

2. The multi-layer FPC easy-bending structure according to claim 1, characterized in that: The first outer layer FPC includes a first covering film, a first covering film adhesive layer, a first copper plating layer, a first copper layer and a first substrate which are arranged in sequence, and a first window area is arranged on the first covering film and the first covering film adhesive layer.

3. The multi-layer FPC easy-bending structure according to claim 1, characterized in that: The inner layer FPC includes a second covering film, a second covering film adhesive layer, a second copper layer and a second substrate which are arranged in sequence.

4. The multi-layer FPC easy-bending structure according to claim 2, characterized in that: A via hole is also included, and a second copper plating layer is disposed on both sides of the via hole.

5. The multi-layer FPC easy-bending structure according to claim 4, characterized in that: The second outer layer FPC includes a third substrate, a third copper layer, a third copper plating layer, a third cover film adhesive layer and a third cover film which are arranged in sequence, and a second window area is arranged on the third cover film adhesive layer and the third cover film.

6. The multi-layer FPC easy-bending structure according to claim 5, characterized in that: The thickness of the first copper plating layer, the second copper plating layer and the third copper plating layer is 8um-20um.

7. The multi-layer FPC easy-bending structure according to claim 2, characterized in that: A first shielding film is arranged on a side of the first covering film away from the adhesive layer of the first covering film, and a second shielding film is arranged on the first window area.

8. The multi-layer FPC easy-bending structure according to claim 5, characterized in that: A third shielding film is arranged on a side of the third covering film away from the adhesive layer of the third covering film, and a fourth shielding film is arranged on the second window area.

9. The multi-layer FPC easy-bending structure according to claim 1, characterized in that: The first outer layer FPC, the inner layer FPC and the second outer layer FPC are single-layer panels.

10. The multi-layer FPC easy-bending structure according to claim 7, characterized in that: A reinforcement area is arranged at one end of the first shielding film, a reinforcement plate is arranged on the reinforcement area, and a third adhesive layer is arranged between the reinforcement plate and the first covering film.

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