Connecting structure of FPC (Flexible Printed Circuit)
By setting the PI sheet and copper layer at the connection end of the FPC and using a double-sided adhesive layer to bond to the external housing, the problems of high FPC binding design cost, complex process and poor versatility in the prior art are solved, and a low-cost, simple process and high-versatility FPC connection structure is realized.
Patent Information
- Application Number
- CN202420643158.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-03-29
AI Technical Summary
In the prior art, the FPC binding design of large-size SENSOR requires synchronous replacement, resulting in high cost, complex process and poor versatility.
The connection structure between FPC and the double-sided adhesive layer is adopted. The connection end of the FPC is equipped with a PI sheet and a copper layer. The PI sheet and the copper layer are bonded. The double-sided adhesive layer is attached to the side of the PI sheet away from the copper layer. The FPC is bonded to the external case through the double-sided adhesive layer.
No need to bind FPC, reduces costs, simplifies processes, improves versatility, and is suitable for all FPCs connected to external housings, greatly improving the competitiveness of the product.
Smart Images
Figure CN222996750U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of FPC, and particularly to a connection structure of an FPC. Background Art
[0002] In the prior art, large-size sensors are now manufactured individually. For large-size products, the binding design of the FPC on the product needs to be synchronously replaced, which requires workers to re-design and manufacture the binding of the FPC, resulting in high costs, complex processes, and poor versatility. Content of the Utility Model
[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a connection structure of an FPC.
[0004] The purpose of the utility model is achieved through the following technical solutions:
[0005] A connection structure of an FPC includes: an FPC and a double-sided adhesive layer; a PI film and a copper layer are arranged at the connection end of the FPC, the PI film and the copper layer are attached to each other, both sides of the double-sided adhesive layer have adhesiveness, the double-sided adhesive layer is attached to the side of the PI film away from the copper layer, and the FPC is bonded to an external casing through the double-sided adhesive layer.
[0006] In one embodiment, the height of the double-sided adhesive layer is higher than the height of the PI film.
[0007] In one embodiment, the thickness of the double-sided adhesive layer is not greater than 0.05 mm.
[0008] In one embodiment, alignment holes are arranged on both sides of the FPC.
[0009] In one embodiment, a fixing glue block is applied at the connection part of the FPC and the external casing.
[0010] In one embodiment, the fixing glue block is waterproof glue or UV glue.
[0011] In one embodiment, a component area is arranged on the FPC, and a reinforcing plate is arranged on the back of the FPC in the component area.
[0012] In one embodiment, the sum of the thicknesses of the PI film and the copper layer is 0.7 mm.
[0013] In one embodiment, a first step is arranged at the connection part of the FPC and the PI film, and the double-sided adhesive layer is arranged on the first step.
[0014] In one of the embodiments, a second step is provided at the connection of the FPC and the copper layer, and the second step is used for silk screening.
[0015] Compared with the prior art, the present utility model has at least the following advantages:
[0016] The connection structure of the FPC of the present utility model is provided with an FPC and a double-sided adhesive layer. The connection end of the FPC is provided with a PI film and a copper layer, and the PI film and the copper layer are attached. Both sides of the double-sided adhesive layer have strong adhesiveness, eliminating the process of binding the FPC. The double-sided adhesive layer is attached to the side of the PI film away from the copper layer, and the FPC is bonded to the external casing through the double-sided adhesive layer. Compared with the prior art, the FPC does not need to be bound, has low cost and simple process, is applicable to all FPCs connected to the external casing, has strong versatility, and greatly improves the competitiveness of the product. Description of the Drawings
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below.
[0018] Figure 1 It is a schematic side view of the connection structure of the FPC in an embodiment of the present utility model;
[0019] Figure 2 It is a schematic diagram of the connection structure of the FPC in an embodiment of the present utility model.
[0020] Reference Numerals:
[0021] FPC10, double-sided adhesive layer 11, copper layer 13, alignment hole 14, component area 15, external casing 20, fixing glue block 21, second step 22. Detailed Embodiments
[0022] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings.
[0023] The present application provides a connection structure of an FPC10. Please refer to Figure 1 and Figure 2, including an FPC 10 and a double-sided adhesive layer 11. A PI film and a copper layer 13 are provided at the connecting end of the FPC 10. The PI film and the copper layer 13 are exposed on the outside, and the PI film and the copper layer 13 are arranged in a fitting manner. Both sides of the double-sided adhesive layer 11 have strong adhesiveness, so as to reliably fix the FPC 10 on the external casing 20, eliminating the process of binding the FPC 10. The double-sided adhesive layer 11 is attached to the side of the PI film away from the copper layer 13. The FPC 10 is bonded to the external casing 20 through the double-sided adhesive layer 11. Compared with the prior art, the FPC 10 does not need to be bound and is directly bonded to the external casing 20 through the double-sided adhesive layer 11, with low cost and simple process. It is applicable to all connections of the FPC 10 to the external casing 20, has strong versatility, and greatly improves the competitiveness of the product.
[0024] It should be noted that the FPC 10 is mainly made of two layers of PI layers and a copper layer 13. The copper layer 13 is embedded between the two PI layers. The copper layer 13 is electrically connected to the copper-clad circuit inside the FPC 10, and the PI film is integrally arranged with the PI layer in the FPC 10.
[0025] In an embodiment, a first step is provided at the connection of the FPC 10 and the PI film. The double-sided adhesive layer 11 is arranged on the first step, so that the connection surface between the double-sided adhesive layer 11 and the FPC 10 is flat. When the FPC 10 is connected to the external casing 20 through the double-sided adhesive layer 11, the bottom surface of the FPC 10 can fully abut against the external casing 20, avoiding hollowing between the FPC 10 and the external casing 20 and preventing the FPC 10 from breaking during production due to its soft texture. Preferably, the thickness of the double-sided adhesive layer 11 is not greater than 0.05 mm. Further, the height of the double-sided adhesive layer 11 is higher than the height of the PI film. The height range of the double-sided adhesive layer 11 higher than the PI film is 0.2 mm to 0.3 mm, so as to facilitate AG screen printing, ensure the screen printing effect, and prevent faults or unclear character screen printing. Preferably, the height of the double-sided adhesive layer 11 higher than the PI film is 0.3 mm. Still further, when the double-sided adhesive layer 11 is bonded to the external casing 20, the double-sided adhesive layer 11 is 0.2 mm to 0.3 mm away from the edge of the external casing 20.
[0026] In an embodiment, please refer to Figure 2, alignment holes 14 are provided on both sides of the FPC 10. Specifically, the alignment holes 14 are provided at the top of the FPC 10. The alignment holes 14 are sleeved on the external housing 20, which has the effect of positioning the FPC 10 to facilitate fixing the FPC 10 on the external housing 20. Further, considering the subsequent silk-screening process and the installation of the double-sided adhesive layer 11, the sum of the thicknesses of the PI film and the copper layer 13 is 0.7 mm. After the FPC 10 is connected to the external housing 20, AG silk-screening and scribing are performed on the FPC 10, and the AG thickness is controlled between 0.12 mm and 0.15 mm to avoid being too thin to cover the step difference and being too thick and prone to brittleness. After the AG is cured, a fixing glue block 21 is applied at the connection between the FPC 10 and the external housing 20. The fixing glue block 21 is used to fix the FPC 10, reduce the stress between the FPC 10 and the external housing 20, prevent the FPC 10 from cracking at the mating separation of the external housing 20, and improve the yield rate during the production process. Preferably, the fixing glue block 21 is a waterproof glue or a UV glue.
[0027] In another embodiment, please refer to Figure 2 , a component area 15 is provided on the FPC 10. However, since the FPC 10 has a small hardness and the board is soft, it is difficult to support too many components soldered on the FPC 10. Therefore, a reinforcing plate is provided on the back of the component area 15 of the FPC 10 to support the component area 15. The reinforcing plate is a board with a higher hardness, such as a PCB sheet, a steel sheet, etc. In addition, a second step 22 is provided at the connection between the FPC 10 and the copper layer 13. The second step 22 is used for silk-screening, so that the surface after silk-screening is flush with the surface of the FPC 10 in terms of thickness to facilitate subsequent installation.
[0028] The above-described embodiments merely represent several implementation manners of the present utility model. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several deformations and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the present utility model patent shall be subject to the appended claims.
Claims
1. A connection structure of an FPC, characterized in that: include: FPC and double-sided adhesive layer; The connecting end of the FPC is provided with a PI sheet and a copper layer, the PI sheet and the copper layer are bonded together, both sides of the double-sided adhesive layer are sticky, the double-sided adhesive layer is attached to the side of the PI sheet away from the copper layer, and the FPC is bonded to the external casing through the double-sided adhesive layer.
2. The FPC connection structure according to claim 1, characterized in that: The height of the double-sided adhesive layer is higher than the height of the PI sheet.
3. The FPC connection structure according to claim 1, characterized in that: The thickness of the double-sided adhesive layer is no more than 0.05 mm.
4. The FPC connection structure according to claim 1, characterized in that: Alignment holes are arranged on both sides of the FPC.
5. The FPC connection structure according to claim 1, characterized in that: A fixing rubber block is coated at the connection between the FPC and the external housing.
6. The FPC connection structure according to claim 5, characterized in that: The fixing glue block is waterproof glue or UV glue.
7. The FPC connection structure according to claim 1, characterized in that: A component area is arranged on the FPC, and a reinforcing plate is arranged on the back side of the component area.
8. The FPC connection structure according to claim 1, characterized in that: The sum of the thickness of the PI sheet and the copper layer is 0.7 mm.
9. The FPC connection structure according to claim 1, characterized in that: The FPC is provided with a first step at a connection position with the PI sheet, and the double-sided adhesive layer is provided on the first step.
10. The FPC connection structure according to claim 1, characterized in that: The FPC is provided with a second step at a connection with the copper layer, and the second step is used for silk screen printing.