Switching FPC and PCB connecting structure capable of improving connection firmness
By setting reinforcement pads on the adapter FPC and PCB board and soldering and fixing, the problem of loose connection between the adapter FPC and PCB board is solved, improving the firmness of the connection and the accuracy of the test results.
Patent Information
- Application Number
- CN202421507642.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-06-28
AI Technical Summary
In the production of display modules, the connection between the adapted FPC and the PCB board is easily loosened or separated due to shaking, which affects the test results.
By providing a first FPC reinforcement pad and a second FPC reinforcement pad on both sides of the adapted FPC, and corresponding first PCB reinforcement pads and a second PCB reinforcement pads on the PCB board, soldering and fixing is performed to enhance the connection firmness.
It effectively avoids loosening or separation between the adapted FPC and the PCB board, improves the firmness of the connection, and thus improves the accuracy of the display module test results.
Smart Images
Figure CN222996751U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a connecting structure of a transfer FPC and a PCB board capable of improving connection firmness. Background Art
[0002] In the field of display module production, the welding and fixing of FPC (flexible circuit board) and PCB (printed circuit board) boards are involved. For example, the test board structure for display modules can be found in Figure 1 The above is a common display module test board, which is formed by connecting an adapter FPC11 to a PCB board 12. The connector at one end of the adapter FPC11 away from the PCB board 12 is snap-fitted with the display module for connection testing. Since the adapter FPC11 will shake when the connector on the adapter FPC11 is snapped with or removed from the display module, it is easy to affect the connection between the adapter FPC11 and the PCB board 12, causing the connection position between the adapter FPC11 and the PCB board 12 to become loose or separated, thereby affecting the test result of the display module.
[0003] In view of the above, a connection structure between a transfer FPC and a PCB board is proposed, which can improve the connection firmness. Utility Model Content
[0004] The utility model aims to overcome the shortcomings of the prior art and provide a connecting structure of a transfer FPC and a PCB board capable of improving the connection firmness.
[0005] The purpose of this utility model is achieved through the following technical solutions:
[0006] A connecting structure of a transfer FPC and a PCB board capable of improving connection firmness, comprising: a transfer FPC and a PCB board, wherein a first FPC reinforcement pad and a second FPC reinforcement pad are respectively arranged on both sides of the transfer FPC; a first PCB reinforcement pad and a second PCB reinforcement pad are arranged on the PCB board; when one end of the transfer FPC is connected and conducted with the PCB, the first FPC reinforcement pad is fixedly welded to the first PCB reinforcement pad, and the second FPC reinforcement pad is fixedly welded to the second PCB reinforcement pad.
[0007] In one embodiment, a first reinforcement through hole is formed on the first FPC reinforcement pad.
[0008] In one embodiment, a second reinforcement through hole is formed on the second FPC reinforcement pad.
[0009] In one embodiment, the first PCB reinforcement pad has a larger outer shape than the first FPC reinforcement pad.
[0010] In one embodiment, the second PCB reinforcement pad has a larger outer shape than the second FPC reinforcement pad.
[0011] In one embodiment, the first reinforcement through hole is a circular structure, and the second reinforcement through hole is a circular structure.
[0012] In one embodiment, the diameter of the first reinforcement through hole is 2 mm, and the diameter of the second reinforcement through hole is 2 mm.
[0013] In one embodiment, the first FPC reinforcement pad and the second FPC reinforcement pad are arranged opposite to each other.
[0014] In one of the embodiments, one end of the transfer FPC is connected to the PCB board through a connector.
[0015] In one of the embodiments, a test connector is provided at one end of the transfer FPC away from the PCB board.
[0016] Compared with the prior art, the utility model has at least the following advantages:
[0017] 1. The utility model is a connection structure of a transfer FPC and a PCB board that can improve the connection firmness. By adding a first FPC reinforcement pad and a second FPC reinforcement pad on both sides of the transfer FPC, correspondingly, a first PCB reinforcement pad and a second PCB reinforcement pad are arranged on the PCB board, and the first FPC reinforcement pad is welded and fixed to the first PCB reinforcement pad, and the second FPC reinforcement pad is welded and fixed to the second PCB reinforcement pad. In this way, the connection firmness between the transfer FPC and the PCB board can be reinforced to avoid loosening or separation between the transfer FPC and the PCB board.
[0018] 2. The utility model is a connection structure for connecting an FPC to a PCB board that can improve the connection firmness. By opening a first reinforcement through hole on the first FPC reinforcement pad, the solder paste can contact the first PCB reinforcement pad below the first FPC reinforcement pad through the first reinforcement through hole, so as to further improve the welding firmness between the first FPC reinforcement pad and the first PCB reinforcement pad; similarly, a second reinforcement through hole is opened on the second FPC reinforcement pad, so as to further improve the welding firmness between the second FPC reinforcement pad and the second PCB reinforcement pad. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0020] Figure 1 This is a schematic diagram of the structure of a common display module test board;
[0021] Figure 2 This is a schematic structural diagram of a connection structure between a transfer FPC and a PCB board capable of improving connection firmness in one embodiment of the utility model;
[0022] Figure 3 for Figure 2 A schematic diagram of the structure of the transfer FPC;
[0023] Figure 4 for Figure 2 The structural diagram of the PCB board in FIG.
[0024] Figure 5 It is a structural schematic diagram of a connection structure of a transfer FPC and a PCB board capable of improving connection firmness in another embodiment of the utility model. DETAILED DESCRIPTION
[0025] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.
[0026] See also Figure 2 , Figure 3 and Figure 4 As shown, a connection structure 10 of a transfer FPC and a PCB board capable of improving connection firmness includes: a transfer FPC 100 and a PCB board 200, wherein a first FPC reinforcement pad 110 and a second FPC reinforcement pad 120 are respectively arranged on both sides of the transfer FPC 100; a first PCB reinforcement pad 210 and a second PCB reinforcement pad 220 are arranged on the PCB board 200; when one end of the transfer FPC 100 is connected to the PCB board 200, the first FPC reinforcement pad 110 is welded and fixed to the first PCB reinforcement pad 210, and the second FPC reinforcement pad 120 is welded and fixed to the second PCB reinforcement pad 220.
[0027] It should be noted that by adding the first FPC reinforcement pad 110 and the second FPC reinforcement pad 120 on both sides of the transfer FPC 100, correspondingly, the first PCB reinforcement pad 210 and the second PCB reinforcement pad 220 are provided on the PCB board 200, and the first FPC reinforcement pad 110 is welded and fixed to the first PCB reinforcement pad 210, and the second FPC reinforcement pad 120 is welded and fixed to the second PCB reinforcement pad 220, so that the connection firmness between the transfer FPC 100 and the PCB board 200 can be reinforced to avoid loosening or separation between the transfer FPC 100 and the PCB board 200. Therefore, when the connection structure of the utility model is used as a display module test board structure, the accuracy of the display module test results can be improved. It should also be noted that all pads are copper exposed areas.
[0028] In one embodiment, a first reinforcement through hole 111 is provided on the first FPC reinforcement pad 110. By providing the first reinforcement through hole 111 on the first FPC reinforcement pad 110, the solder paste can contact the first PCB reinforcement pad 210 below the first FPC reinforcement pad 110 through the first reinforcement through hole 111, so as to further improve the welding firmness between the first FPC reinforcement pad 110 and the first PCB reinforcement pad 210, thereby further preventing the transfer FPC and the PCB board from loosening or separation.
[0029] Further, similarly, a second reinforcing through hole 121 is provided on the second FPC reinforcing pad 120, so that the solder paste can contact the second PCB reinforcing pad 220 below the second FPC reinforcing pad 120 through the second reinforcing through hole 121, so as to further improve the welding firmness between the second FPC reinforcing pad 120 and the second PCB reinforcing pad 220.
[0030] Preferably, the first PCB reinforcement pad 210 has a larger shape than the first FPC reinforcement pad 110. Thus, after the pad area is tinned, it can be ensured that the first PCB reinforcement pad 210 and the first FPC reinforcement pad 110 can be connected and fixed by the solder paste.
[0031] Similarly, the shape of the second PCB reinforcement pad 220 is larger than the shape of the second FPC reinforcement pad 120, so as to ensure that the second PCB reinforcement pad 220 and the second FPC reinforcement pad 120 can be connected and fixed by solder paste.
[0032] Preferably, the first reinforcement through hole 111 has a circular structure, and the second reinforcement through hole 121 has a circular structure.
[0033] Preferably, the diameter of the first reinforcement through hole 111 is 2 mm, and the diameter of the second reinforcement through hole 121 is 2 mm.
[0034] Preferably, the first FPC reinforcing pad 110 and the second FPC reinforcing pad 120 are arranged opposite to each other.
[0035] Preferably, one end of the transfer FPC 100 is connected to the PCB board 200 via a connector.
[0036] Preferably, a test connector 130 is provided at one end of the transfer FPC 100 away from the PCB board 200. The test connector 130 is used to connect to the display module to be tested.
[0037] In one embodiment, one end of the transfer FPC 100 is an FPC welding end, and a PCB welding portion corresponding to the FPC welding end is also provided on the PCB board 200, and the FPC welding end and the PCB welding portion are connected and conducted by welding. The transfer FPC 100 and the PCB board 200 are connected by welding, which can further ensure the firmness of the connection between the transfer FPC and the PCB board.
[0038] It should also be noted that the application scope of the present invention is not limited to the display module test board structure mentioned in the present invention, but is also applicable to a solution in which two PCB boards are connected by adding a transfer FPC. Figure 5 shown.
[0039] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A transfer FPC and PCB board connection structure capable of improving connection firmness, characterized in that: include: A transfer FPC, wherein a first FPC reinforcement pad and a second FPC reinforcement pad are respectively provided on both sides of the transfer FPC; and A PCB board, wherein a first PCB reinforcement pad and a second PCB reinforcement pad are provided on the PCB board; When one end of the transfer FPC is connected to the PCB board, the first FPC reinforcement pad is fixed to the first PCB reinforcement pad by welding, and the second FPC reinforcement pad is fixed to the second PCB reinforcement pad by welding.
2. The transfer FPC and PCB board connection structure capable of improving connection firmness according to claim 1, characterized in that: The first FPC reinforcement pad is provided with a first reinforcement through hole.
3. The transfer FPC and PCB board connection structure capable of improving connection firmness according to claim 2, characterized in that: The second FPC reinforcement pad is provided with a second reinforcement through hole.
4. The transfer FPC and PCB board connection structure capable of improving connection firmness according to claim 2 or 3, characterized in that: The first PCB reinforcement pad has a larger outer shape than the first FPC reinforcement pad.
5. The FPC-PCB board connection structure capable of improving connection firmness according to claim 4, characterized in that: The shape of the second PCB reinforcement pad is larger than the shape of the second FPC reinforcement pad.
6. The transfer FPC and PCB board connection structure capable of improving connection firmness according to claim 3, characterized in that: The first reinforcement through hole has a circular structure, and the second reinforcement through hole has a circular structure.
7. The FPC-PCB board connection structure capable of improving connection firmness according to claim 6, characterized in that: The diameter of the first reinforcement through hole is 2 mm, and the diameter of the second reinforcement through hole is 2 mm.
8. The transfer FPC and PCB board connection structure capable of improving connection firmness according to claim 1, characterized in that: The first FPC reinforcing pad is arranged opposite to the second FPC reinforcing pad.
9. The transfer FPC and PCB board connection structure capable of improving connection firmness according to claim 1, characterized in that: One end of the transfer FPC is connected to the PCB board through a connector.
10. The transfer FPC and PCB board connection structure capable of improving connection firmness according to claim 1, characterized in that: A test connector is arranged at one end of the transfer FPC away from the PCB board.