Micro light-emitting device display panel and display device

Abstract

The utility model discloses a micro light-emitting device display panel and a display device. The micro light-emitting device display panel comprises a substrate, a driving circuit layer, a plurality of light-emitting devices, a first packaging layer, a plurality of retaining walls, a second packaging layer, an optical film layer and a color resistance layer, specifically, the driving circuit layer is arranged on the substrate, the light-emitting devices are arranged on the driving circuit layer, and every two adjacent light-emitting devices are arranged at intervals. The first packaging layer is arranged on the driving circuit layer; the retaining wall is arranged on the surface, away from the substrate, of the first packaging layer, the reflectivity of the retaining wall is not lower than 70%, and in the top view of the micro light-emitting device display panel, the retaining wall is located between two adjacent light-emitting devices; the second packaging layer is arranged on one surface, far away from the substrate, of the first packaging layer; the optical film layer is arranged on the second packaging layer; the color resistance layer is arranged on the film layer where the first packaging layer is located.

Description

Technical Field

[0001] This application relates to the field of display technologies, and particularly to a micro-light-emitting device display panel and a display device. Background Art

[0002] Micro LED display panels have technical advantages such as high brightness, high transmittance, and high contrast, and have received increasing attention in recent years. Compared with OLED display panels, the light-emitting devices of Micro LED display panels have more advantages in terms of brightness and transmittance. Compared with Mini LED display panels, Micro LED display panels have the advantages of high resolution and close-range application scenarios. Since the light-emitting pattern of the LED chips in Micro LED display panels is close to the Lambertian pattern, the light output in the forward direction of the Micro LED display panel is reduced, resulting in a decrease in the brightness in the forward viewing direction of the Micro LED display panel. Summary of the Utility Model

[0003] Embodiments of this application provide a micro-light-emitting device display panel and a display device to improve the problem of reduced brightness in the forward viewing direction of the micro-light-emitting device display panel.

[0004] In a first aspect, embodiments of this application provide a micro-light-emitting device display panel and a display device, including:

[0005] A substrate;

[0006] A driving circuit layer, which is disposed on the substrate;

[0007] Multiple light-emitting devices, which are disposed on the driving circuit layer, and adjacent two of the light-emitting devices are spaced apart;

[0008] A first encapsulation layer, which is disposed on the driving circuit layer and covers the light-emitting devices;

[0009] Multiple barriers, which are disposed on a surface of the first encapsulation layer away from the substrate, and the reflectivity of the barriers is not less than 70%. In a top view of the micro-light-emitting device display panel, the barriers are located between adjacent two of the light-emitting devices;

[0010] A second encapsulation layer, which is disposed on a surface of the first encapsulation layer away from the substrate;

[0011] A color resist layer, which is disposed on a side of the first encapsulation layer away from the substrate.

[0012] Further, the color resist layer is disposed on a surface of the second encapsulation layer away from the substrate. In a top view of the micro-light-emitting device display panel, the color resist with a red color covers the light-emitting device with a red light color, the color resist with a blue color covers the light-emitting device with a blue light color, and the color resist with a green color covers the light-emitting device with a green light color.

[0013] Further, the micro-light-emitting device display panel further includes an optical film layer. The optical film layer is disposed on the second encapsulation layer, and the color resist layer is located on a surface of the optical film layer away from the substrate. In a top view of the micro-light-emitting device display panel, the color resist with a red color covers the light-emitting device with a red light color, the color resist with a blue color covers the light-emitting device with a blue light color, and the color resist with a green color covers the light-emitting device with a green light color.

[0014] Further, the color resist with a red color is located on a sidewall of the barrier rib adjacent to the light-emitting device with a red light color, the color resist with a blue color is located on a sidewall of the barrier rib adjacent to the light-emitting device with a blue light color, and the color resist with a green color is located on a sidewall of the barrier rib adjacent to the light-emitting device with a green light color.

[0015] Further, the micro-light-emitting device display panel further includes a first black matrix. The first black matrix is disposed on a surface of the second encapsulation layer away from the substrate, and the first black matrix covers the barrier rib.

[0016] Further, in a top view of the micro-light-emitting device display panel, the color resist layer covers the barrier rib.

[0017] Further, the optical film layer includes a microlens film layer. The microlens film layer includes a plurality of microlens portions. In a top view of the micro-light-emitting device display panel, the microlens portions cover the color resist.

[0018] Further, a width of a side of the barrier rib away from the substrate is smaller than a width of a side of the barrier rib close to the substrate.

[0019] Further, the micro-light-emitting device display panel further includes a blackening layer. The blackening layer covers the driving circuit layer.

[0020] In a second aspect, an embodiment of the present application provides a display device. The display device includes the micro-light-emitting device display panel described above.

[0021] Advantages of the present application:

[0022] The present application provides a micro-light-emitting device display panel and a display device. By providing a barrier rib on a surface of the first encapsulation layer away from the substrate, and arranging the barrier rib between two adjacent light-emitting devices, and the reflectivity of the barrier rib is not less than 70%, the barrier rib can reflect the light of the light-emitting device, so that most of the light of the light-emitting device can be converged, increasing the light output in the front view direction of the micro-light-emitting device display panel, thereby improving the brightness in the front view direction of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic diagram of the first micro-light-emitting device display panel of the present application;

[0024] Figure 2 Figure 1 is the optical path schematic diagram of the micro-light-emitting device display panel shown;

[0025] Figure 3 is a schematic diagram of the second micro-light-emitting device display panel of the present application;

[0026] Figure 4 Figure 3 is the optical path schematic diagram of the micro-light-emitting device display panel shown;

[0027] Figure 5 is a schematic diagram of the third micro-light-emitting device display panel of the present application;

[0028] Figure 6 is a schematic diagram of the fourth micro-light-emitting device display panel of the present application;

[0029] Figure 7 is a schematic diagram of the display device of the present application.

[0030] 10 - micro-light-emitting device display panel; 100 - substrate; 200 - light-emitting device; 300 - first encapsulation layer; 400 - barrier rib; 500 - second encapsulation layer; 600 - optical film layer; 700 - color filter layer, 710 - color filter; 800 - first black matrix; 900 - second black matrix; 1000 - blackening layer; 1100 - driving circuit layer; 20 - frame. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application. The technical solutions described below are only used to explain and illustrate the idea of the present application, and should not be regarded as a limitation on the protection scope of the present application.

[0032] In addition, terms such as "first", "second" and similar words do not denote any order, quantity or importance, but are only used to distinguish different technical features. Terms such as "a plurality of" and similar words mean two or more, unless otherwise clearly defined.

[0033] Since the light emission pattern of the LED chips in the Micro LED display panel is close to the Lambertian light pattern, the light emission in the formal direction of the Micro LED display panel is reduced, resulting in a decrease in the brightness in the frontal direction of the Micro LED display panel.

[0034] The first embodiment of the present application provides a first micro-light-emitting device display panel. Refer to Figure 1 , the micro-light-emitting device display panel 10 includes a substrate 100, a driving circuit layer 1100, a plurality of light-emitting devices 200, a first encapsulation layer 300, a plurality of partition walls 400, a second encapsulation layer 500, and a color filter layer 700.

[0035] Specifically, the driving circuit layer 1100 is disposed on the substrate 100, the light-emitting devices 200 are disposed on the driving circuit layer 1100, and two adjacent light-emitting devices 200 are spaced apart; the first encapsulation layer 300 is disposed on the driving circuit layer 1100, and the first encapsulation layer 300 covers the light-emitting devices 200; the partition walls 400 are disposed on a surface of the first encapsulation layer 300 away from the substrate 100, and the reflectivity of the partition walls 400 is not less than 70%. In a top view of the micro-light-emitting device display panel 10, the partition walls 400 are located between two adjacent light-emitting devices 200; the second encapsulation layer 500 is disposed on a surface of the first encapsulation layer 300 away from the substrate 100; the color filter layer 700 is disposed on the film layer where the first encapsulation layer 300 is located.

[0036] By disposing the partition walls 400 on a surface of the first encapsulation layer 300 away from the substrate 100, setting the partition walls 400 between two adjacent light-emitting devices 200, and the reflectivity of the partition walls 400 is not less than 70%, the partition walls 400 can reflect the light of the light-emitting devices 200, so that most of the light of the light-emitting devices 200 can be converged, increasing the light emission in the frontal direction of the micro-light-emitting device display panel 10, thereby enhancing the brightness in the frontal direction of the display panel.

[0037] In this embodiment, the partition walls 400 surround the light-emitting devices 200.

[0038] In this embodiment, a plurality of partition walls 400 are spaced apart.

[0039] In this embodiment, the color filter layer 700 is located on a surface of the second encapsulation layer 500 away from the substrate 100. In a top view of the micro-light-emitting device display panel 10, the color filter 710 with a red color covers the light-emitting device 200 with a red light color, the color filter 710 with a blue color covers the light-emitting device 200 with a blue light color, and the color filter 710 with a green color covers the light-emitting device 200 with a green light color. By setting the color filter layer 700 on a surface of the second encapsulation layer 500 away from the substrate 100, setting the color filter 710 with a red color to cover the light-emitting device 200 with a red light color, the color filter 710 with a blue color to cover the light-emitting device 200 with a blue light color, and the color filter 710 with a green color to cover the light-emitting device 200 with a green light color; the color filter 710 can block ambient light to reduce the reflectivity of the light-emitting side of the display panel, thereby reducing the influence of ambient light on the display screen of the display panel.

[0040] In this embodiment, the refractive index of the first encapsulation layer 300 is the same as that of the second encapsulation layer 500.

[0041] In this embodiment, the reflectivity of the barrier wall 400 is 80%, 81%, 82%, 85%.

[0042] In this embodiment, the micro-light-emitting device display panel 10 further includes a first black matrix 800. The first black matrix 800 is disposed on a surface of the second encapsulation layer 500 away from the substrate 100, and the first black matrix 800 covers the barrier wall 400. By disposing the first black matrix 800 on a surface of the second encapsulation layer 500 away from the substrate 100 and covering the barrier wall 400 with the first black matrix 800, the first black matrix 800 can block ambient light and prevent ambient light from being reflected from the top surface of the barrier wall 400, thereby further reducing the reflectivity of the light-emitting side of the display panel and further reducing the influence of ambient light on the display screen of the display panel.

[0043] In this embodiment, the micro-light-emitting device display panel 10 further includes an optical film layer 600. The optical film layer 600 covers the color filter layer 700.

[0044] In this embodiment, the optical film layer 600 covers the first black matrix 800.

[0045] In this embodiment, the width of the side of the barrier wall 400 away from the substrate 100 is smaller than the width of the side of the barrier wall 400 close to the substrate 100.

[0046] In this embodiment, the barrier wall 400 is trapezoidal.

[0047] In this embodiment, the width of the side of the retaining wall 400 away from the substrate 100 is 5 μm - 15 μm, and the width of the side of the retaining wall 400 close to the substrate 100 is 10 μm - 20 μm. Preferably, the width of the side away from the substrate 100 is 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, and the width of the side of the retaining wall 400 close to the substrate 100 is 10 μm, 11 μm, 12 μm, 13 μm, 15 μm, 18 μm, 20 μm.

[0048] In this embodiment, the material of the retaining wall 400 includes at least one of silicon dioxide and aluminum oxide.

[0049] In this embodiment, the micro-light-emitting device display panel 10 further includes a blackening layer 1000, and the blackening layer 1000 covers the driving circuit layer 1100. By providing the blackening layer 1000 and setting the blackening layer 1000 to cover the driving circuit layer 1100, the blackening layer 1000 can reduce the reflectivity of the substrate 100, thereby further reducing the reflectivity on the light-emitting side of the display panel, and further reducing the influence of ambient light on the display screen of the display panel.

[0050] During operation, referring to Figure 2 , since the retaining wall 400 is a trapezoidal structure, according to the principle of geometric optics, the light emitted from the light-emitting device 200 at a larger angle will be converted into light emitted at a smaller angle after being incident on the retaining wall 400. Since the retaining wall 400 has a high reflectivity, the light energy loss caused by the retaining wall 400 during the light angle conversion process is small, and the light efficiency is improved in the front view direction of the micro-light-emitting device display panel 10; in terms of the anti-reflection effect, after the ambient light is incident on the color filter layer 700, due to the absorption of the specific color filter 710, the ambient light will be converted into light of a single color when entering the lower retaining wall 400, and when exiting, it will pass through the color filter layer 700 again. If the ambient light is incident on the upper position of the retaining wall 400, most of the light cannot pass through the first black matrix 800 to reach the top surface of the retaining wall 400 due to the shielding of the first black matrix 800, thereby greatly reducing the reflectivity of the micro-light-emitting device display panel 10.

[0051] The second embodiment of the present application provides a second micro-light-emitting device display panel. Referring to Figure 3 , the micro-light-emitting device display panel 10 includes a substrate 100, a driving circuit layer 1100, a plurality of light-emitting devices 200, a first encapsulation layer 300, a plurality of retaining walls 400, a second encapsulation layer 500, an optical film layer 600, and a color filter layer 700.

[0052] Specifically, the driving circuit layer 1100 is disposed on the substrate 100, the light-emitting device 200 is disposed on the driving circuit layer 1100, and two adjacent light-emitting devices 200 are spaced apart; the first encapsulation layer 300 is disposed on the driving circuit layer 1100, and the first encapsulation layer 300 covers the light-emitting device 200; the light barrier 400 is disposed on a surface of the first encapsulation layer 300 away from the substrate 100, and the reflectivity of the light barrier 400 is not less than 70%. In a top view of the micro light-emitting device display panel 10, the light barrier 400 is located between two adjacent light-emitting devices 200; the second encapsulation layer 500 is disposed on a surface of the first encapsulation layer 300 away from the substrate 100; the color filter layer 700 is disposed on the film layer where the first encapsulation layer 300 is located.

[0053] In this embodiment, the micro light-emitting device display panel 10 further includes an optical film layer 600. The optical film layer 600 is disposed on the second encapsulation layer 500. The color filter layer 700 is located on a surface of the optical film layer 600 away from the substrate 100. In a top view of the micro light-emitting device display panel 10, the color filter 710 with a red color covers the light-emitting device 200 with a red light color, the color filter 710 with a blue color covers the light-emitting device 200 with a blue light color, and the color filter 710 with a green color covers the light-emitting device 200 with a green light color. By disposing the color filter layer 700 on a surface of the optical film layer 600 away from the substrate 100, and setting the color filter 710 with a red color to cover the light-emitting device 200 with a red light color, the color filter 710 with a blue color to cover the light-emitting device 200 with a blue light color, and the color filter 710 with a green color to cover the light-emitting device 200 with a green light color; the color filter 710 can block ambient light to reduce the reflectivity of the light-emitting side of the display panel, thereby reducing the influence of ambient light on the display image of the display panel.

[0054] In this embodiment, the refractive index of the first encapsulation layer 300 is the same as that of the second encapsulation layer 500.

[0055] In this embodiment, the reflectivity of the light barrier 400 is 80%, 81%, 82%, 85%.

[0056] In this embodiment, the micro light-emitting device display panel 10 further includes a first black matrix 800. The first black matrix 800 is disposed on a surface of the second encapsulation layer 500 away from the substrate 100, and the first black matrix 800 covers the light barrier 400. By disposing the first black matrix 800 between the second encapsulation layer 500 and the optical film layer 600, and the first black matrix 800 covers the light barrier 400, the first black matrix 800 can block ambient light to prevent ambient light from irradiating the top surface of the light barrier 400 to generate reflection, thereby further reducing the reflectivity of the light-emitting side of the display panel, and further reducing the influence of ambient light on the display image of the display panel.

[0057] In this embodiment, the width of the side of the retaining wall 400 away from the substrate 100 is smaller than the width of the side of the retaining wall 400 close to the substrate 100.

[0058] In this embodiment, the retaining wall 400 is trapezoidal.

[0059] In this embodiment, the width of the side of the retaining wall 400 away from the substrate 100 is 5 μm - 15 μm, and the width of the side of the retaining wall 400 close to the substrate 100 is 10 μm - 20 μm. Preferably, the width of the side away from the substrate 100 is 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, and the width of the side of the retaining wall 400 close to the substrate 100 is 10 μm, 11 μm, 12 μm, 13 μm, 15 μm, 18 μm, 20 μm.

[0060] In this embodiment, the material of the retaining wall 400 includes at least one of silicon dioxide and aluminum oxide.

[0061] In this embodiment, the micro-light-emitting device display panel 10 further includes a blackening layer 1000, and the blackening layer 1000 covers the driving circuit layer 1100. By providing the blackening layer 1000 and setting the blackening layer 1000 to cover the driving circuit layer 1100, the blackening layer 1000 can reduce the reflectivity of the substrate 100, thereby further reducing the reflectivity on the light-emitting side of the display panel, and further reducing the influence of ambient light on the display picture of the display panel.

[0062] In this embodiment, the optical film layer 600 includes a microlens film layer, the microlens film layer includes a plurality of microlens portions, and in a top view of the micro-light-emitting device display panel 10, the microlens portions cover the color resist 710.

[0063] During operation, referring to Figure 4 , since the retaining wall 400 has a trapezoidal structure, according to the principles of geometric optics, the light emitted at a larger angle from the light-emitting device 200 will be converted into light emitted at a smaller angle after being incident on the retaining wall 400. Since the retaining wall 400 has a high reflectivity, the light energy loss caused by the retaining wall 400 during the light angle conversion process is small, and the light efficiency is improved in the front view direction of the micro-light-emitting device display panel 10; in terms of the anti-reflection effect, after ambient light is incident on the color filter layer 700, due to the absorption of the specific color resist 710, the ambient light will be converted into light of a single color when entering the microlens film layer. After passing through the optical waveguide and scattering in the microlens layer, part of the light of the single color will be absorbed by other color resists 710. After that, when another part of the light of the single color is emitted, it will pass through the color filter layer 700 again. If the ambient light is incident on the position above the retaining wall 400, due to the shielding of the first black matrix 800, most of the light cannot pass through the first black matrix 800 to reach the top surface of the retaining wall 400, so that the reflectivity of the micro-light-emitting device display panel 10 can be greatly reduced.

[0064] The third embodiment of the present application provides a third micro-light-emitting device display panel. The third embodiment is similar to the first embodiment. The difference between the third embodiment and the first embodiment is as follows: Refer to Figure 5 , in the top view of the micro-light-emitting device display panel 10, the color resist layer 700 covers the partition wall 400.

[0065] In this embodiment, the micro-light-emitting device display panel 10 further includes a second black matrix 900. The second black matrix 900 is disposed between the driving circuit layer 1100 and the first encapsulation layer 300. By providing that the light-emitting device 200 display panel further includes a second black matrix 900 and disposing the second black matrix 900 between the driving circuit layer 1100 and the first encapsulation layer 300, the second black matrix 900 can block the light irradiated onto the substrate 100, avoiding the reflection of the light on the substrate 100, thereby further reducing the reflectivity of the light-emitting side of the display panel, and further reducing the influence of the ambient light on the display screen of the display panel; at the same time, since the second black matrix 900 is located between the driving circuit layer 1100 and the first encapsulation layer 300, it can also avoid the loss of the light efficiency of the micro-light-emitting device display panel 10 caused by the alignment process deviation during the manufacturing of the second black matrix 900.

[0066] In this embodiment, the micro-light-emitting device display panel 10 further includes an optical film layer 600. The optical film layer 600 covers the color resist layer 700.

[0067] In this embodiment, the first encapsulation layer 300 covers the light-emitting device 200.

[0068] In this embodiment, the top surface of the first encapsulation layer 300 is flush with the top surface of the light-emitting device 200.

[0069] In this embodiment, the refractive index of the first encapsulation layer 300 is the same as that of the second encapsulation layer 500.

[0070] In this embodiment, the reflectivity of the partition wall 400 is 80%, 81%, 82%, 85%.

[0071] In this embodiment, the width of the side of the partition wall 400 away from the substrate 100 is smaller than the width of the side of the partition wall 400 close to the substrate 100.

[0072] In this embodiment, the partition wall 400 is trapezoidal.

[0073] In this embodiment, the width of the side of the retaining wall 400 away from the substrate 100 is 5 μm - 15 μm, and the width of the side of the retaining wall 400 close to the substrate 100 is 10 μm - 20 μm. Preferably, the width of the side away from the substrate 100 is 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, and the width of the side of the retaining wall 400 close to the substrate 100 is 10 μm, 11 μm, 12 μm, 13 μm, 15 μm, 18 μm, 20 μm.

[0074] In this embodiment, the material of the retaining wall 400 includes at least one of silicon dioxide and aluminum oxide.

[0075] During operation, since the retaining wall 400 has a trapezoidal structure, according to the principle of geometric optics, the light emitted from the light-emitting device 200 at a larger angle is converted into light emitted at a smaller angle after being incident on the retaining wall 400. Since the retaining wall 400 has a high reflectivity, the light energy loss caused by the retaining wall 400 during the light angle conversion process is small, and the light efficiency is improved in the front view direction of the micro-light-emitting device display panel 10; in terms of the anti-reflection effect, after the ambient light is incident on the color filter layer 700, due to the absorption of the specific color filter 710, the ambient light will be converted into light of a single color when entering the lower retaining wall 400, and when exiting, it will pass through the color filter layer 700 again. If the ambient light is incident on the position above the retaining wall 400, since only light of a single color can pass through the color filter layer 700, most of the light cannot pass through the color filter layer 700 to reach the top surface of the retaining wall 400, thereby significantly reducing the reflectivity of the micro-light-emitting device display panel 10.

[0076] The fourth embodiment of the present application provides a fourth type of micro-light-emitting device display panel. Refer to Figure 6 , the micro-light-emitting device display panel 10 includes a substrate 100, a driving circuit layer 1100, a plurality of light-emitting devices 200, a first encapsulation layer 300, a plurality of retaining walls 400, a second encapsulation layer 500, and a color filter layer 700.

[0077] Specifically, the driving circuit layer 1100 is disposed on the substrate 100, the light-emitting devices 200 are disposed on the driving circuit layer 1100, and two adjacent light-emitting devices 200 are spaced apart; the first encapsulation layer 300 is disposed on the driving circuit layer 1100, and the first encapsulation layer 300 covers the light-emitting devices 200; the retaining walls 400 are disposed on a surface of the first encapsulation layer 300 away from the substrate 100, and the reflectivity of the retaining walls 400 is not less than 70%. In the top view of the micro-light-emitting device display panel 10, the retaining walls 400 are located between two adjacent light-emitting devices 200; the second encapsulation layer 500 is disposed on a surface of the first encapsulation layer 300 away from the substrate 100; the color filter layer 700 is disposed on the film layer where the first encapsulation layer 300 is located.

[0078] In this embodiment, the color filter 710 with a red color is located on the sidewall of the barrier rib 400 adjacent to the light-emitting device 200 with a red light color, the color filter 710 with a blue color is located on the sidewall of the barrier rib 400 adjacent to the light-emitting device 200 with a blue light color, and the color filter 710 with a green color is located on the sidewall of the barrier rib 400 adjacent to the light-emitting device 200 with a green light color. By disposing the color filter 710 with a red color on the sidewall of the barrier rib 400 adjacent to the light-emitting device 200 with a red light color, the color filter 710 with a blue color on the sidewall of the barrier rib 400 adjacent to the light-emitting device 200 with a blue light color, and the color filter 710 with a green color on the sidewall of the barrier rib 400 adjacent to the light-emitting device 200 with a green light color, the color filter 710 can block ambient light to reduce the reflectivity of the light-emitting side of the display panel, thereby reducing the influence of ambient light on the display screen of the display panel.

[0079] In this embodiment, the first encapsulation layer 300 covers the light-emitting device 200.

[0080] In this embodiment, the top surface of the first encapsulation layer 300 is flush with the top surface of the light-emitting device 200.

[0081] In this embodiment, the refractive index of the first encapsulation layer 300 is the same as that of the second encapsulation layer 500.

[0082] In this embodiment, the reflectivity of the barrier rib 400 is 80%, 81%, 82%, 85%.

[0083] In this embodiment, the micro light-emitting device display panel 10 further includes a first black matrix 800. The first black matrix 800 is disposed between the second encapsulation layer 500 and the optical film layer 600, and the first black matrix 800 covers the barrier rib 400. By disposing the first black matrix 800 between the second encapsulation layer 500 and the optical film layer 600 and covering the barrier rib 400 with the first black matrix 800, the first black matrix 800 can block ambient light and prevent ambient light from being reflected from the top surface of the barrier rib 400, thereby further reducing the reflectivity of the light-emitting side of the display panel and further reducing the influence of ambient light on the display screen of the display panel.

[0084] In this embodiment, the display panel further includes an optical film layer 600, and the optical film layer 600 covers the first black matrix 800.

[0085] In this embodiment, the width of the side of the barrier rib 400 away from the substrate 100 is smaller than the width of the side of the barrier rib 400 close to the substrate 100.

[0086] In this embodiment, the retaining wall 400 is trapezoidal.

[0087] In this embodiment, the width of the side of the retaining wall 400 away from the substrate 100 is 5 μm - 15 μm, and the width of the side of the retaining wall 400 close to the substrate 100 is 10 μm - 20 μm. Preferably, the width of the side away from the substrate 100 is 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, and the width of the side of the retaining wall 400 close to the substrate 100 is 10 μm, 11 μm, 12 μm, 13 μm, 15 μm, 18 μm, 20 μm.

[0088] In this embodiment, the material of the retaining wall 400 includes at least one of silicon dioxide and aluminum oxide.

[0089] In this embodiment, the micro-light-emitting device display panel 10 further includes a blackening layer 1000, and the blackening layer 1000 covers the driving circuit layer 1100. By providing the blackening layer 1000 and setting the blackening layer 1000 to cover the driving circuit layer 1100, the blackening layer 1000 can reduce the reflectivity of the substrate 100, thereby further reducing the reflectivity of the light-emitting side of the display panel, and further reducing the influence of ambient light on the display screen of the display panel.

[0090] During operation, the light generated by the micro-light-emitting device 200 does not pass through the color filter 710, and the light efficiency is improved in the front view direction of the micro-light-emitting device display panel 10; in terms of the anti-reflection effect, after the ambient light is incident on the color filter layer 700, due to the absorption of the specific color filter 710, the ambient light will turn into light of a single color on the side wall of the lower retaining wall 400, and when it exits, it will pass through the color filter layer 700 again. If the ambient light is incident on the position above the retaining wall 400, most of the light cannot pass through the first black matrix 800 to reach the surface of the retaining wall 400 due to the blocking of the first black matrix 800, so that the reflectivity of the micro-light-emitting device display panel 10 can be greatly reduced.

[0091] The fifth embodiment of the present application provides a display device. Refer to Figure 7 , the display device includes the micro-light-emitting device display panel 10 described above, and the display device further includes a frame 20, and the micro-light-emitting device display panel 10 is disposed on the frame 20.

[0092] The above has described the specific embodiments of the present application in detail. The above-described embodiments disclosed in the present application are only the preferred embodiments of the present application. For those of ordinary skill in the art, many variations and improvements can be made without departing from the concept of the present application. These variations and improvements all fall within the protection scope defined by the claims of the present application.

Claims

1. A micro-light emitting device display panel, characterized in that: include: substrate; A driving circuit layer, wherein the driving circuit layer is disposed on the substrate; A plurality of light emitting devices, wherein the light emitting devices are arranged on the driving circuit layer, and two adjacent light emitting devices are arranged at intervals; a first encapsulation layer, wherein the first encapsulation layer is disposed on the driving circuit layer and covers the light emitting device; A plurality of retaining walls, wherein the retaining walls are arranged on a surface of the first encapsulation layer away from the substrate, and the reflectivity of the retaining walls is not less than 70%, and in a top view of the micro-light-emitting device display panel, the retaining walls are located between two adjacent light-emitting devices; A second packaging layer, the second packaging layer is disposed on a surface of the first packaging layer away from the substrate; A color resist layer is provided on a side of the first encapsulation layer away from the substrate.

2. The micro-light emitting device display panel according to claim 1, characterized in that: The colored color resist layer is arranged on a surface of the second packaging layer away from the substrate. In the top view of the micro-light-emitting device display panel, the red color resist covers the light-emitting device with red light color, the blue color resist covers the light-emitting device with blue light color, and the green color resist covers the light-emitting device with green light color.

3. The micro-light emitting device display panel according to claim 1, characterized in that: The micro-light-emitting device display panel also includes an optical film layer, which is arranged on the second packaging layer. The color resist layer is located on a surface of the optical film layer away from the substrate. In the top view of the micro-light-emitting device display panel, the red color resist covers the light-emitting device with red light color, the blue color resist covers the light-emitting device with blue light color, and the green color resist covers the light-emitting device with green light color.

4. The micro-light emitting device display panel according to claim 1, characterized in that: The red color resist is located on the side wall of the baffle wall adjacent to the light emitting device whose light color is red, the blue color resist is located on the side wall of the baffle wall adjacent to the light emitting device whose light color is blue, and the green color resist is located on the side wall of the baffle wall adjacent to the light emitting device whose light color is green.

5. The micro-light emitting device display panel according to any one of claims 1 to 4, characterized in that: The micro-light emitting device display panel further includes a first black matrix, which is disposed on a surface of the second encapsulation layer away from the substrate, and covers the retaining wall.

6. The micro-light emitting device display panel according to claim 2, characterized in that: In the top view of the micro-light emitting device display panel, the color resist layer covers the retaining wall.

7. The micro-light emitting device display panel according to claim 3, characterized in that: The optical film layer includes a microlens film layer, and the microlens film layer includes a plurality of microlens parts. In a top view of the micro-light-emitting device display panel, the microlens parts cover the color resist.

8. The micro-light emitting device display panel according to claim 1, characterized in that: The width of the side of the blocking wall away from the substrate is smaller than the width of the side of the blocking wall close to the substrate.

9. The micro-light emitting device display panel according to claim 1, characterized in that: The micro-light emitting device display panel further includes a blackening layer, and the blackening layer covers the driving circuit layer.

10. A display device, characterized in that: The display device comprises the micro-light emitting device display panel according to any one of claims 1 to 9.

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