Refrigeration device

Abstract

The embodiment of the utility model discloses a refrigerating device which comprises a shell, a refrigerating unit and a control unit. The refrigeration assembly comprises a cold end and a hot end; the heat dissipation assembly is arranged in the shell; the heat dissipation assembly comprises a heat exchange piece which is in heat conduction connection with the hot end; the liquid pipeline is communicated with the heat exchange piece, and heat dissipation liquid is contained in the liquid pipeline; the heat dissipation piece is provided with a liquid flow channel, the liquid flow channel communicates with the liquid pipeline, a heat dissipation air channel is formed in the heat dissipation piece to allow airflow to pass through, and the liquid pipeline is in heat conduction connection with the heat dissipation air channel; the power part is communicated with the liquid pipeline; and the heat dissipation fan is used for generating air flow in the heat dissipation air channel and taking away heat in the heat dissipation air channel. According to the refrigerating device provided by the embodiment of the invention, by arranging the liquid pipeline and the heat dissipation piece provided with the liquid flow channel and the heat dissipation air channel, on one hand, rapid heat dissipation can be achieved through high specific heat capacity of liquid, and the heat dissipation efficiency of the heat dissipation liquid can be improved by arranging the liquid flow channel and the heat dissipation air channel in the heat dissipation piece.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor temperature regulation, in particular to a refrigeration device. Background Art

[0002] With the development of technology, thermoelectric coolers (TECs) are increasingly applied to the field of temperature regulation technology. For example, a thermoelectric cooler can be installed in a portable fan to transfer cold to users or cool the air flow to blow out cold air. A thermoelectric cooler usually has a cold end at one end and a hot end at the opposite end, with thermocouple pairs arranged in the middle. When the thermoelectric cooler works, a large amount of heat is generated at the hot end based on the Peltier principle. Therefore, some means are needed to dissipate the heat at the hot end to ensure the normal operation of the thermoelectric cooler.

[0003] Currently, most of them directly attach a heat sink to the hot end of the thermoelectric cooler, and then blow air on the heat sink through a cooling fan to take away the heat on it. However, the heat sink is relatively large in size. Directly attaching the heat sink to the thermoelectric cooler will result in inflexible installation of the thermoelectric cooler, unreasonable internal layout of the portable fan, and low heat dissipation efficiency when attaching the heat sink to the thermoelectric cooler. Summary of the Utility Model

[0004] In view of at least some of the problems and defects in the prior art, embodiments of the present utility model disclose a refrigeration device to solve the problems of inflexible installation and low heat dissipation efficiency caused by attaching a heat sink to a thermoelectric cooler in the prior art.

[0005] Specifically, a refrigeration device provided by an embodiment of the present utility model includes: a housing; a refrigeration component disposed in the housing, the refrigeration component including a cold end and a hot end, the cold end being used to provide cold for refrigeration; a heat dissipation component disposed in the housing; the heat dissipation component including: a heat exchange member thermally conduction-connected to the hot end; a liquid pipeline communicating with the heat exchange member, with a heat dissipation liquid in the liquid pipeline; a heat dissipation member provided with a liquid flow channel, the liquid flow channel communicating with the liquid pipeline, the heat dissipation member forming a heat dissipation air duct for air to pass through, the liquid pipeline being thermally conduction-connected to the heat dissipation air duct; a power member communicating with the liquid pipeline for driving the heat dissipation liquid to flow through the heat exchange member and the heat dissipation member in sequence and circulate; a cooling fan disposed in the housing, the cooling fan being used to generate an air flow in the heat dissipation air duct and take away the heat in the heat dissipation air duct.

[0006] In an embodiment of the present utility model, a heat dissipation cavity is provided in the heat exchange member, and a liquid flow inlet and a liquid flow outlet communicating with the heat dissipation cavity are further provided on the heat exchange member, and the liquid flow inlet and the liquid flow outlet are respectively communicated with the liquid pipeline.

[0007] In one embodiment of the present utility model, the heat exchange member is provided with a heat conduction member thermally connected to the hot end. One side surface of the heat exchange member facing the hot end is recessed inward to form a groove, and the heat conduction member is attached to the surface of the groove and closes the groove to form the heat dissipation cavity.

[0008] In one embodiment of the present utility model, the heat dissipation member further includes heat dissipation fins, and the heat dissipation air duct is formed on the heat dissipation fins.

[0009] In one embodiment of the present utility model, the heat dissipation fins include a plurality of heat dissipation fins connected in sequence. There is a bending structure between two adjacent heat dissipation fins, and two adjacent heat dissipation fins, the bending structure, and the liquid flow channel together form a gas channel, and a plurality of the gas channels together form the heat dissipation air duct.

[0010] In one embodiment of the present utility model, the heat dissipation fins are continuously bent in the reverse direction to form a plurality of the bending structures, and the bending structures include a first bending structure and a second bending structure located on opposite sides.

[0011] In one embodiment of the present utility model, the liquid flow channel includes a first flow channel and a second flow channel that communicate with each other. The first flow channel and the second flow channel are arranged at intervals, and the heat dissipation air duct is located between the first flow channel and the second flow channel.

[0012] In one embodiment of the present utility model, the flat tube structure includes a first flat tube and a second flat tube arranged at intervals. The first flat tube forms the first flow channel, and the second flat tube forms the second flow channel.

[0013] In one embodiment of the present utility model, the liquid flow channel is bent to form the first flat tube, the second flat tube, and a bending connection part located between the first flat tube and the second flat tube, and the first flat tube and the second flat tube are connected through the bending connection part.

[0014] In one embodiment of the present utility model, the liquid flow channel further includes a cover body flow channel and a bottom shell flow channel. The cover body flow channel and the bottom shell flow channel are located on opposite sides. The cover body flow channel communicates with one end of the first flow channel and the second flow channel, and the bottom shell flow channel communicates with the other end of the first flow channel and the second flow channel.

[0015] As can be seen from the above, the above technical features of the present utility model may have one or more of the following beneficial effects: The refrigeration device provided in this embodiment, by providing a liquid pipeline and a heat dissipation member having a liquid flow channel and a heat dissipation air duct, on the one hand, can achieve rapid heat dissipation through the high specific heat capacity of the liquid, and the arrangement of the liquid flow channel and the heat dissipation air duct in the heat dissipation member can improve the heat dissipation efficiency of the heat dissipation liquid. On the other hand, the liquid pipeline is more flexible than the existing solution of directly attaching the heat sink to the semiconductor refrigeration chip, thereby providing a more flexible internal layout for the refrigeration device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0017] Figure 1 Structural schematic diagram of the refrigeration device provided by the first embodiment of the present utility model.

[0018] Figure 2 For Figure 1 Exploded structural schematic diagram of the refrigeration device.

[0019] Figure 3 For Figure 2 Structural schematic diagram of the heat dissipation member in

[0020] Figure 4 For Figure 3 Structural schematic diagram of the connection flow channel and the heat sink in

[0021] Figure 5 For Figure 4 Partial enlarged schematic diagram of part A in

[0022] Figure 6 For Figure 4 Another perspective schematic diagram of

[0023] Figure 7 For Figure 3 Structural schematic diagram of the cover body flow channel in

[0024] Figure 8 For Figure 1 Another exploded structural schematic diagram of the refrigeration device in

[0025] Description of the reference numerals:

[0026] 10 - Refrigeration device;

[0027] 100 - Housing; 101 - Heat dissipation air outlet; 102 - Refrigeration air outlet; 110 - Middle wearing part; 120 - Wearing arm; 130 - Wearing space;

[0028] 200 - Refrigeration assembly; 210 - Refrigeration part; 211 - First refrigeration part; 212 - Second refrigeration part; 220 - Heat conduction part; 221 - First heat conduction part; 222 - Second heat conduction part; 230 - Heat conduction fan;

[0029] 300 - Heat dissipation assembly; 310 - Heat exchange part; 311 - First heat exchange part; 312 - Second heat exchange part; 320 - Liquid pipeline; 330 - Heat dissipation part; 331 - Liquid flow channel; 3311 - Cover body flow channel; 3312 - Water inlet channel; 3313 - Water outlet channel; 3314 - Connection flow channel; 3315 - First flow channel; 3316 - Second flow channel; 3317 - Water inlet; 3318 - Water outlet; 3319 - Bottom shell flow channel; 332 - Heat dissipation air duct; 3321 - Gas channel; 3322 - First gas channel; 3323 - Second gas channel; 335 - Heat sink; 3351 - Heat dissipation fins; 3352 - Bending structure; 3353 - First bending structure; 3354 - Second bending structure; 3358 - Window structure; 340 - Heat dissipation fan; 350 - Power part. Detailed implementation manners

[0030] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions of the present utility model will be clearly and completely described below in conjunction with specific embodiments of the present utility model and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0031] It should be noted that the directional terms mentioned in the embodiments of the present utility model, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., are only references to the directions in the attached drawings. Therefore, the directional terms used are for explaining and understanding the present utility model, rather than for limiting the present utility model. For the sake of understanding and convenience of description, the dimensions and thicknesses of each component shown in the drawings are arbitrarily shown, but the present utility model is not limited thereto.

[0032] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element can be directly on the other element or intervening elements may also be present. Additionally, in the specification, unless expressly described to the contrary, the word "comprising" will be understood to mean including the element but not excluding any other elements. Further, in the specification, "on" means located above or below the target element and does not mean necessarily located on the top above based on gravity.

[0033] The following will describe in detail some embodiments of the present utility model in conjunction with the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0034] As Figure 1 shown, an embodiment of the present utility model provides a refrigeration device 10. The refrigeration device 10 provided in the embodiment of the present utility model can be, for example, a portable fan (such as a neck fan, a waist fan, or a hand-held fan, etc.) or a fever-reducing patch. Of course, the refrigeration device 10 is not limited to the above specific production equipment. When the refrigeration device 10 is a fever-reducing patch, it can be attached to the user's skin, for example, to cool the user's skin; when the refrigeration device 10 is a portable fan, it can blow cold air for the user, for example, to cool the user.

[0035] Specifically, referring to Figure 1 and Figure 2 , the refrigeration device 10 includes, for example: a housing 100, a refrigeration component 200, and a heat dissipation component 300. Among them, an accommodation space is provided inside the housing 100, and the refrigeration component 200 and the heat dissipation component 300 are provided in the accommodation space inside the housing 100, for example. The refrigeration component 200 includes, for example, a cold end and a hot end, and the cold end is used to provide cold energy to achieve refrigeration. The heat dissipation component 300 includes, for example, a heat exchange member 310, a liquid pipeline 320, and a heat dissipation member 330. The heat exchange member 310 is thermally conductively connected to the hot end, the liquid pipeline 320 communicates with the heat exchange member 310, a liquid flow channel 331 is provided inside the heat dissipation member 330, and the liquid flow channel 331 communicates with the liquid pipeline 320. Among them, there is, for example, a heat dissipation liquid that can circulate in the liquid pipeline 320, and the heat dissipation liquid flows through the heat exchange member 310 to dissipate heat from the hot end. A heat dissipation air duct 332 is formed inside the heat dissipation member 330, the liquid flow channel 331 surrounds the heat dissipation air duct 332, and the internal air flow passes through the heat dissipation air duct 332 to take away the heat of the heat dissipation liquid.

[0036] Further, referring to Figure 2, the refrigeration assembly 200 includes, for example, a refrigerating element 210 and a heat conducting element 220. The refrigerating element 210 includes a cold end and a hot end, and the heat conducting element 220 is thermally conductively connected to the cold end. For example, the refrigerating element 210 is a thermoelectric cooler. The thermoelectric cooler can achieve refrigeration at the cold end and heat release at the hot end based on the Peltier principle. Its working principle and specific structure can refer to the relevant technical solutions in the prior art and will not be elaborated here. The heat conducting element 220 is, for example, a metal heat conducting element, such as a heat conducting aluminum sheet. The heat conducting element 220 can also be, for example, heat conducting silica gel, and the present application does not limit this.

[0037] The heat dissipation assembly 300 also includes, for example, a power element 350. The power element 350 is connected to the liquid pipeline 320, and the heat dissipation liquid flows through the power element 350. The power element 350 is used to provide power for the heat dissipation liquid so that the heat dissipation liquid can circulate in the liquid pipeline 320 and flow through the heat exchange element 310, the heat dissipation element 330, and the power element 350. The power element 350 is, for example, a water pump or other power devices capable of providing the power for the circulation of the heat dissipation liquid, and the present application does not specifically limit this.

[0038] Further, referring again to Figure 2 , the heat dissipation assembly 300 also includes, for example, a heat dissipation fan 340. The heat dissipation fan 340 is disposed inside the housing 100 and at one end of the heat dissipation element 330. The heat dissipation air duct 332 communicates with the air inlet side of the heat dissipation fan 340. A heat dissipation air outlet 101 is provided on the housing 100. The internal air flow enters the heat dissipation fan 340 through the heat dissipation air duct 332 and is discharged from the heat dissipation air outlet 101 to cool the heat dissipation liquid in the heat dissipation element 330. The heat dissipation fan 340 is, for example, a centrifugal fan. The air flow passing through the heat dissipation element 330 is, for example, sucked into the heat dissipation fan 340 and discharged from the heat dissipation air outlet 101 through the heat dissipation fan 340. The present application does not specifically limit this.

[0039] For example, the heat exchange element 310, the heat dissipation element 330, the heat dissipation fan 340, and the power element 350 are arranged in sequence along a first direction. The first direction is, for example, Figure 2 the x direction in. By reasonably arranging the positional relationship among the heat exchange element 310, the heat dissipation element 330, the heat dissipation fan 340, and the power element 350, the space utilization rate of the internal accommodation space of the housing 100 is improved. The power element 350, the heat dissipation end 330, the heat exchange element 310, and the liquid pipeline 320 together form a closed loop. It should be noted that the liquid pipeline 320 is, for example, provided with a multi-way joint, so that it can, for example, have multiple ports to be respectively connected to the heat exchange element 310, the heat dissipation element 330, and the power element 340.

[0040] For example, the heat exchanger 310 mentioned above is, for example, a hollow metal structure, or it can be said that a heat dissipation cavity is provided in the heat exchanger 310, and the heat dissipation cavity is connected to the liquid pipeline 320, so that the heat dissipation liquid in the liquid pipeline 320 can flow into the heat dissipation cavity of the heat exchanger 310. The heat exchanger 310 is, for example, attached to the hot end, so that heat exchange can occur with the hot end, and then the hot end is cooled by the heat dissipation liquid and the heat of the heating end is taken away. The heat dissipation liquid is, for example, water, and of course, the heat dissipation liquid can also be other liquids with high specific heat capacity, such as coolant, and the present application does not impose specific restrictions on this. The high specific heat capacity of the heat dissipation liquid can be used to absorb the heat in the hot end, thereby dissipating the heat from the hot end.

[0041] Furthermore, the heat exchanger 310 is also provided with a liquid inlet and a liquid outlet connected to the heat dissipation cavity for the inflow and discharge of liquid, and the liquid inlet and the liquid outlet are respectively connected to the liquid pipeline. In order to facilitate the heat transfer with the refrigeration element 210, the heat exchanger 310 is provided with a thermal conductive element, and the thermal conductive element is thermally connected to the hot end. Among them, the surface of the heat exchanger 310 on one side facing the hot end is inwardly recessed to form a groove, and the thermal conductive element is attached to the surface of the groove and closes the groove to form a heat dissipation cavity. The side of the thermal conductive element facing the heat dissipation cavity is in contact with the liquid, and the side of the thermal conductive element facing away from the heat dissipation cavity is thermally connected to the hot end. The liquid inlet and the liquid outlet are respectively connected to the side walls of the groove.

[0042] The refrigeration device provided in this embodiment can achieve rapid heat dissipation through the high specific heat capacity of the liquid by arranging a liquid pipeline and a heat sink having a liquid flow channel and a heat dissipation air duct. In addition, the liquid flow channel and the heat dissipation air duct arranged in the heat sink can improve the heat dissipation efficiency of the heat dissipation liquid. On the other hand, the liquid pipeline is more flexible than the solution of directly attaching the heat sink and the semiconductor refrigeration plate in the prior art, thereby providing a more flexible internal layout for the refrigeration device.

[0043] Further, see Figure 3 The heat sink 330 includes, for example, a heat sink 335, and the heat sink 335 forms a heat dissipation air channel 332. The heat sink 335 is thermally connected to the liquid flow channel 331, and the liquid flow channel 331 surrounds the heat sink 335. The heat sink 335 is provided to improve the heat dissipation efficiency of the heat dissipating liquid in the liquid flow channel 331.

[0044] For details, see Figure 3 , Figure 4 and Figure 5, the heat sink 335 includes a plurality of heat dissipation fins 3351 connected in sequence. There is a bending structure 3352 between two adjacent heat dissipation fins 3351. The two adjacent heat dissipation fins 3351, the bending structure 3352, and the liquid flow channel 331 together form a gas channel 3321. A plurality of the gas channels 3321 together form the heat dissipation air duct 332. By providing a plurality of heat dissipation fins and a plurality of gas channels, the area of heat exchange with the air flow is increased, thereby improving the heat dissipation efficiency.

[0045] See again Figure 4 and Figure 5 , the heat sink 355 is continuously bent in the reverse direction and forms a plurality of bending structures 3352. The bending structure 3352 includes a first bending structure 3353 and a second bending structure 3354 located on opposite sides. Two adjacent bending structures 3352 are respectively the first bending structure 3353 and the second bending structure 3354. The first bending structure 3353 bends in the direction above the heat dissipation member 330, and the second bending structure 3354 bends in the direction below the heat dissipation member 330; in this way, the heat sink 335 can contact the upper and lower liquid flow channels through the bending structure, increasing the contact area between the heat dissipation liquid in the liquid flow channel and the internal air flow. The internal air flow can pass through a plurality of gas channels, and also increases the contact area between the internal air flow and the heat sink, thereby increasing the heat exchange rate between the internal air flow and the heat dissipation liquid.

[0046] See Figure 6 , for example, the heat dissipation fin 3351 has a window structure 3358. A through hole is provided in the heat dissipation fin 3351. The window structure 3351 is connected to the side wall of the through hole and is inclined along the air duct to form a flow disturbing member. The window structure 3358 is distributed along the length direction of the air duct, for example. By providing the window structure as a flow disturbing member, the boundary layer of the air flow on the heat dissipation fin 3351 can be destroyed to increase the heat exchange efficiency with the internal air flow.

[0047] Continuing from the above, see Figure 3 , the liquid flow channel 331 is, for example, a flat tube. The surface temperature of the flat tube is uniform. Using a flat tube can increase the contact area between the heat dissipation liquid and the connecting flow channel 331, thereby increasing the heat exchange efficiency between the heat dissipation liquid and the outside, that is, it can improve the heat dissipation efficiency of the heat dissipation liquid. The flat tube structure is thermally conductively connected to opposite sides of the heat sink 335 respectively. By arranging the flat tube structure on both sides of the heat sink 335 respectively, the heat conduction area between the connecting flow channel 331 and the heat sink 335 is increased, thereby improving the heat dissipation efficiency.

[0048] The flat tube structure is also provided with a plurality of pipelines. The liquid flows through the plurality of pipelines of the flat tube structure in the liquid flow channel 331. The plurality of pipelines can increase the liquid turbulence, thereby increasing the contact area between the liquid and the pipe wall, and thus enhancing the heat transfer. And the liquid can enter from different pipelines, avoiding accumulation at one position, and making it evenly dissipate heat in different pipelines.

[0049] The flat tube structure of the liquid flow channel 331 includes a first flat tube and a second flat tube arranged at intervals. The first flat tube forms a first flow channel 3315, and the second flat tube forms a second flow channel 3316. The liquid flow channel 331 includes at least one first flow channel 3315 and at least one second flow channel 3316. The flow direction of the heat-dissipating liquid in the first flow channel 3315 is opposite to the flow direction in the second flow channel 3316, so that the liquid finally returns in the heat-dissipating member 330. The number of the heat-dissipating fins 335 is at least one. For example, the number of the first flow channel 3315 and the second flow channel 3316 is two, and the number of the heat-dissipating fins 335 is three and is clamped between the flow channels, thereby increasing the heat-dissipating area to improve the heat-dissipating efficiency.

[0050] In a specific embodiment, refer to Figure 7 , including a cover body flow channel 3311 and a connecting flow channel 3314. The cover body flow channel 3311 is communicated with the connecting flow channel 3314. The cover body flow channel 3311 and the bottom shell flow channel 3314 are located on opposite sides. The cover body flow channel 3311 communicates with one end of the first flow channel 3315 and the second flow channel 3316. The bottom shell flow channel 3314 communicates with the other end of the first flow channel 3315 and the second flow channel 3316. The liquid enters the first flow channel 3315 from the cover body flow channel 3311. After flowing into the bottom shell flow channel 3314, it then flows back into the cover body flow channel 3311 from the second flow channel 3316.

[0051] Among them, a water inlet 3317 and a water outlet 3318 are respectively arranged on two opposite sides of the cover body flow channel 3311. An inlet channel 3312 and an outlet channel 3313 are provided in the cover body flow channel 3311. The inlet channel 3312 and the outlet channel 3313 are separated from each other. For example, a partition is provided on the cover body flow channel 3311, and the partition is used to separate the inlet channel 3312 and the outlet channel 3313. The inlet channel 3312 is communicated with the water inlet 3317, the outlet channel 3313 is communicated with the water outlet 3318, and the water inlet 3317 and the water outlet 3318 are respectively communicated with the liquid pipeline 320. The heat dissipation liquid enters the inlet channel 3312 through the water inlet 3317, and after flowing through the connecting flow channel 3314, flows out through the outlet channel 3313 from the water outlet 3318. In addition, the first flow channel 3315 is communicated with the inlet channel 3312, and the second flow channel 3316 is communicated with the outlet channel 3317. Through the reasonable setting and division of the liquid flow channel 331 in the heat dissipation member 330, the flow direction of the heat dissipation liquid in the heat dissipation member 330 is reasonably guided, so as to improve the efficiency of heat exchange between the heat dissipation liquid and the outside as much as possible, and further improve the heat dissipation efficiency of the heat dissipation liquid.

[0052] Specifically, the heat dissipation liquid enters the heat dissipation member 330 through the water inlet 3317, enters the inlet channel 3312, flows through the first flow channel 3315, then flows to the second flow channel 3316, and then flows to the outlet channel 3313, so as to flow out of the heat dissipation member 330 through the water outlet 3322 and enter the liquid pipeline 320. The water inlet 3317 and the water outlet 3318 are arranged on both sides of the cover body flow channel 3311 to facilitate their connection with the liquid pipeline 320.

[0053] For example, one end of the first flow channel 3315 far from the cover body flow channel 3311 is communicated with one end of the second flow channel 3316 far from the cover body flow channel 3311, that is, the connecting flow channel 3314 is, for example, a "U"-shaped flat tube; or, see Figure 3 , the liquid flow channel 331 further includes a bottom shell flow channel 3319, the connecting flow channel 3314 is communicated between the cover body flow channel 3311 and the bottom shell flow channel 3319, and the heat dissipation liquid can flow from the first flow channel 3315 to the bottom shell flow channel 3319 and then flow to the second flow channel 3316.

[0054] In a specific embodiment, see again Figure 1 , the housing 100 includes a middle wearing part 110 and wearing arms 120 connected to both ends of the middle wearing part. The middle wearing part 110 and the wearing arms 120 jointly form a wearing space 130. See Figure 1 and Figure 8, the heat conduction member 220 includes a first heat conduction member 221, the refrigeration member 210 includes a first refrigeration member 211, and the first heat conduction member 221 is thermally conductively connected to the cold end of the first refrigeration member 211. Among them, the first heat conduction member 221 is disposed on the middle wearing portion 110 and exposed outside the middle wearing portion 110, or the first heat conduction member 221 is disposed on the middle wearing portion 110 and the side of the first heat conduction member 221 away from the first refrigeration member 211 faces the wearing space 130. The heat exchange member 310 includes a first heat exchange member 311, the first heat exchange member 311 is connected to the liquid pipeline 320 in communication, and the heat dissipation liquid flows through the first heat exchange member 311. The first heat exchange member 311 is thermally conductively connected to the hot end of the first refrigeration member 211. In this way, the first heat conduction member 221 is used to attach to the user's skin to cool the user, for example.

[0055] In another specific embodiment, referring again to Figure 1 and Figure 8 , a refrigeration air outlet 102 and an air inlet 103 are provided on the housing 100. The refrigeration member 210 includes a second refrigeration member 212, the heat conduction member 220 includes a second heat conduction member 222, and the second heat conduction member 222 is thermally conductively connected to the cold end of the second refrigeration member 212. The refrigeration assembly 200 further includes a heat conduction fan 230. Among them, the heat conduction fan 230 is used to generate an air flow that flows through the second heat conduction member 222 and is discharged outside the housing 100 through the refrigeration air outlet 102. The heat exchange member 310 further includes a second heat exchange member 312, the second heat exchange member 312 is connected to the liquid pipeline 320 in communication, and the heat dissipation liquid flows through the second heat exchange member 312. The second heat exchange member 312 is thermally conductively connected to the hot end of the second refrigeration member 212. In this way, the air blown by the heat conduction fan 230 is cooled by the second heat conduction member 222 and blown out of the housing through the refrigeration air outlet 102 to cool the user. It should be noted that the number of the second refrigeration member 212, the second heat conduction member 222, and the second heat exchange member 312 can be multiple, for example. By reasonably arranging the above components, multiple refrigeration chips can be used for refrigeration and multiple heat conduction fans can blow air, so as to improve the refrigeration efficiency of the refrigeration device 10.

[0056] For example, the second refrigeration member 212, the second heat conduction member 222, and the second heat exchange member 312 are disposed in the wearing arm 120, preferably, the second refrigeration member 212, the second heat conduction member 222, and the second heat exchange member 312 are disposed in both wearing arms 120, so as to improve the refrigeration efficiency of the refrigeration device 10. In an alternative embodiment, the second refrigeration member 212, the second heat conduction member 222, and the second heat exchange member 312 can also be disposed in the middle wearing portion 110, for example. The present application does not limit this.

[0057] The refrigeration device provided in this embodiment, by arranging a liquid pipeline and a heat dissipation component with a liquid flow channel and a heat dissipation air duct, on the one hand, can achieve rapid heat dissipation through the high specific heat capacity of the liquid, and arranging the liquid flow channel and the heat dissipation air duct in the heat dissipation component can improve the heat dissipation efficiency of the heat dissipation liquid. On the other hand, the liquid pipeline is more flexible than the prior art solution of directly attaching the heat sink to the semiconductor refrigeration chip, so that a more flexible internal layout can be provided for the refrigeration device.

[0058] It can be understood that the foregoing various embodiments are only exemplary descriptions of the present utility model. On the premise that the technical features do not conflict, the structures do not contradict, and the invention purpose of the present utility model is not violated, the technical solutions of the various embodiments can be arbitrarily combined and used in combination.

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than to limit them; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing various embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present utility model.

Claims

1. A refrigeration device, characterized in that: include: case; A refrigeration component is arranged in the shell, the refrigeration component includes a cold end and a hot end, and the cold end is used to provide coldness to achieve refrigeration; A heat dissipation component is disposed in the housing; The heat dissipation component comprises: A heat exchange element, thermally connected to the hot end; A liquid pipeline, connected to the heat exchange element, wherein the liquid pipeline contains heat dissipation liquid; The heat sink is provided with a liquid flow channel, the liquid flow channel is connected to the liquid pipeline, the heat sink is formed with a heat dissipation air channel for air flow to pass through, and the liquid pipeline is connected to the heat dissipation air channel through thermal conduction; A power element, connected to the liquid pipeline, used to drive the heat dissipation liquid to flow through the heat exchange element and the heat dissipation element in sequence and circulate; A heat dissipation fan is arranged in the housing, and is used to generate airflow in the heat dissipation air duct and take away the heat in the heat dissipation air duct.

2. The refrigeration device according to claim 1, characterized in that A heat dissipation cavity is provided in the heat exchange element, and a liquid inlet and a liquid outlet communicated with the heat dissipation cavity are also provided on the heat exchange element, and the liquid inlet and the liquid outlet are communicated with the liquid pipeline respectively.

3. The refrigeration device as claimed in claim 2, characterized in that The heat exchanger is provided with a thermal conductive member connected to the hot end through thermal conduction. A surface of the heat exchanger facing the hot end is inwardly recessed to form a groove. The thermal conductive member is attached to the groove surface and closes the groove to form the heat dissipation cavity.

4. The refrigeration device according to claim 1, characterized in that The heat sink also includes a heat sink, and the heat dissipation duct is formed on the heat sink.

5. The refrigeration device according to claim 4, characterized in that The heat sink includes a plurality of heat dissipation fins connected in sequence, a bending structure is provided between two adjacent heat dissipation fins, the two adjacent heat dissipation fins, the bending structure, and the liquid flow channel together form a gas channel, and the plurality of gas channels together form the heat dissipation air channel.

6. The refrigeration device according to claim 5, characterized in that The heat sink is continuously bent in reverse to form a plurality of the bent structures, and the bent structures include a first bent structure and a second bent structure located at two opposite sides.

7. The refrigeration device according to any one of claims 1 to 6, characterized in that: The liquid flow channel includes a first flow channel and a second flow channel that are interconnected. The first flow channel and the second flow channel are spaced apart from each other, and the heat dissipation air channel is located between the first flow channel and the second flow channel.

8. The refrigeration device according to claim 7, characterized in that The liquid flow channel is a flat tube structure, and the flat tube structure includes a first flat tube and a second flat tube that are spaced apart. The first flat tube forms the first flow channel, and the second flat tube forms the second flow channel.

9. The refrigeration device according to claim 8, characterized in that The liquid flow channel is bent to form the first flat tube, the second flat tube and a bent connection portion located between the first flat tube and the second flat tube, and the first flat tube and the second flat tube are connected through the bent connection portion.

10. The refrigeration device according to claim 7, characterized in that The liquid flow channel also includes a cover flow channel and a bottom shell flow channel, the cover flow channel and the bottom shell flow channel are located on opposite sides, the cover flow channel connects one end of the first flow channel and the second flow channel, and the bottom shell flow channel connects the other end of the first flow channel and the second flow channel.

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