Adsorption structure and semiconductor packaging equipment

Abstract

The utility model discloses an adsorption structure and semiconductor packaging equipment, and relates to the semiconductor packaging technology field, the adsorption structure comprises a pedestal and a suction nozzle, the pedestal is provided with an adsorption pipe in a penetrating manner, one end of the adsorption pipe far away from the pedestal is used for connecting a vacuum generator, the pedestal is provided with an adjustable deformation plate, and the suction nozzle is arranged on the deformation plate and is communicated with the adsorption pipe. An adsorption surface is formed on one side, back to the base, of the suction nozzle, a protection groove is formed in the adsorption surface, the protection groove is used for avoiding a waveguide structure of a chip, the adsorption surface further comprises a plurality of adsorption holes, and the adsorption holes are uniformly distributed in two sides of the protection groove; according to the technical scheme provided by the utility model, when chip adsorption operation is carried out, the chip is placed on the sample table, so that the protection groove in the center of the suction nozzle is aligned with the waveguide structure on the chip, and when the adsorption surface is in contact with the surface of the chip, the waveguide structure is positioned in the protection groove and cannot be in contact with the adsorption surface; the waveguide structure can be effectively prevented from being extruded by the suction nozzle, and the chip is protected.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, and particularly relates to an adsorption structure and a semiconductor packaging device. Background Technique

[0002] Chip flip-chip soldering is an efficient semiconductor packaging technology. It realizes the electrical connection between the chip and the circuit board by placing the active surface of the chip downward and using tiny solder balls (usually tin balls) to interconnect with the substrate. The advantages of this technology are higher I / O density, shorter signal transmission path, lower power consumption, and better thermal management performance. The flip-chip soldering process involves precise chip placement, optical alignment, thermal cycle soldering, and strict quality inspection. It is widely used in high-performance computing, mobile devices, high-speed communication, automotive electronics and other fields, and is one of the key technologies indispensable in modern microelectronics packaging.

[0003] In the current optoelectronic packaging technology, the flip-chip soldering technology is widely used due to its high efficiency and high reliability. Especially in the packaging process of inp modulator chips, extremely high requirements are imposed on the nozzle, and it is necessary to ensure the stability and accuracy of the chip during adsorption, movement, and soldering.

[0004] In the related technology, a precision structure for directional transmission of optical signals, commonly known as a waveguide, is provided on the plane of the chip facing the nozzle. However, due to the tiny size and usually thin waveguide wall of the waveguide, the waveguide is extremely fragile and easily damaged under external force. The nozzle is extremely likely to cause compression to the waveguide in the center of the chip during the adsorption process, resulting in chip damage. Summary of the Utility Model

[0005] The main purpose of the utility model is to propose an adsorption structure and a semiconductor packaging device, aiming to provide an adsorption structure that can protect the waveguide structure in the center of the chip.

[0006] To achieve the above object, the adsorption structure proposed by the utility model includes:

[0007] A base, an adsorption tube is passed through the base, one end of the adsorption tube away from the base is used to connect a vacuum generator, and the base is provided with an adjustable deformation plate; and

[0008] A nozzle, the nozzle is arranged on the deformation plate and communicates with the adsorption tube, an adsorption surface is formed on the side of the nozzle facing away from the base, a protection groove is formed on the adsorption surface, the protection groove is used to avoid the waveguide structure of the chip, and the adsorption surface further includes a plurality of adsorption holes, and the plurality of adsorption holes are uniformly arranged on both sides of the protection groove.

[0009] In one embodiment, the suction nozzle is formed with a negative pressure chamber which is respectively communicated with the adsorption tube and a plurality of the adsorption holes, and the negative pressure chamber gradually contracts from one end of the adsorption tube to one end of the adsorption holes.

[0010] In one embodiment, the width of the protection groove is D, and D≥0.1mm.

[0011] In one embodiment, the adsorption structure further includes an adjusting member which is movably arranged on the base, one end of the adjusting member abuts against the deformation plate, and the adjusting member can approach or depart from the deformation plate.

[0012] In one embodiment, the base is provided with a threaded hole, the adjusting member is an adjusting bolt which is screwed in the threaded hole, the adjusting bolt includes a nut and an abutting end, and the abutting end abuts against the deformation plate.

[0013] In one embodiment, the base is formed with an installation notch, the threaded hole is arranged on the bottom surface of the installation notch, and the nut is located in the installation notch.

[0014] In one embodiment, the base is formed with an installation groove, the deformation plate is arranged on one side of the installation groove, the adsorption structure further includes a clamping portion which includes being located in the installation groove and respectively connecting the base and the deformation plate, and the suction nozzle is arranged in the installation groove.

[0015] In one embodiment, both the base and the deformation plate are provided with fixing blocks, an installation rod is arranged between the two fixing blocks, and the clamping portion is arranged on the installation rod.

[0016] In one embodiment, the adsorption surface is provided with an elastic buffer layer which is used for contacting with the chip.

[0017] The present utility model further provides a semiconductor packaging device, including an adsorption structure, and the adsorption structure includes:

[0018] A base, an adsorption tube is penetrated through the base, one end of the adsorption tube away from the base is used for connecting a vacuum generator, and the base is provided with an adjustable deformation plate; and

[0019] A suction nozzle which is arranged on the deformation plate and communicated with the adsorption tube, an adsorption surface is formed on a side of the suction nozzle facing away from the base, a protection groove is formed on the adsorption surface for avoiding the waveguide structure of the chip, and the adsorption surface further includes a plurality of adsorption holes which are uniformly arranged on both sides of the protection groove.

[0020] In the technical solution of the present utility model, an adsorption structure and a semiconductor packaging device are proposed. Among them, the adsorption structure includes a base and a suction nozzle. An adsorption tube passes through the base, and one end of the adsorption tube away from the base is used to connect a vacuum generator. The base is provided with an adjustable deformation plate, and the suction nozzle is arranged on the deformation plate and communicated with the adsorption tube. An adsorption surface is formed on the side of the suction nozzle facing away from the base. A protection groove is arranged on the adsorption surface for avoiding the waveguide structure of the chip. The adsorption surface also includes a plurality of adsorption holes. When performing the chip adsorption operation, the chip is placed on the sample stage so that the protection groove at the center of the suction nozzle is aligned with the waveguide structure on the chip. When the adsorption surface contacts the chip surface, the waveguide structure will be located in the protection groove and thus will not contact the adsorption surface, effectively avoiding the waveguide structure being squeezed by the suction nozzle and protecting the chip. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0022] Figure 1 Structural schematic diagram of an embodiment of the adsorption structure provided by the present utility model;

[0023] Figure 2 Structural schematic diagram of the adsorption structure from another angle;

[0024] Figure 3 For Figure 1 Structural schematic diagram of the suction nozzle in

[0025] Figure 4 Exploded schematic diagram of the adsorption structure;

[0026] Figure 5 For Figure 4 Local enlarged view of part A in

[0027] Figure 6 Cross-sectional view of the suction nozzle.

[0028] Explanation of the reference numerals in the drawings:

[0029] 1000, adsorption structure; 1, base; 11, installation notch; 12, installation groove; 2, adsorption tube; 21, limit boss; 3, deformation plate; 4, suction nozzle; 41, protection groove; 42, adsorption hole; 43, negative pressure chamber; 5, adjustment bolt; 51, nut; 52, abutting end; 6, fixing block; 61, installation rod; 7, clamping part; 71, clamping plate.

[0030] The realization, functional features and advantages of the present utility model will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners

[0031] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0032] It should be noted that if there are directional indications (such as up, down, left, right, front, back,...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0033] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or the solution where A and B are satisfied simultaneously. In addition, the technical solutions between the embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0034] Chip flip-chip bonding is an efficient semiconductor packaging technology. It realizes the electrical connection between the chip and the circuit board by placing the active surface of the chip downward and using tiny solder balls (usually tin balls) to interconnect with the substrate. The advantages of this technology are higher I / O density, shorter signal transmission paths, lower power consumption, and better thermal management performance. The flip-chip bonding process involves precise chip placement, optical alignment, thermal cycle soldering, and strict quality inspection. It is widely used in high-performance computing, mobile devices, high-speed communication, automotive electronics and other fields, and is one of the key technologies indispensable in modern microelectronics packaging.

[0035] In current optoelectronic packaging technologies, flip-chip bonding technology is widely used due to its high efficiency and high reliability. Especially during the packaging process of inp modulator chips, extremely high requirements are imposed on the suction nozzles, and it is necessary to ensure the stability and precision of the chips during the processes of adsorption, movement, and welding.

[0036] In related technologies, a precise structure for directional optical signal transmission, commonly known as a waveguide, is provided on the plane of the chip facing the suction nozzle. However, due to the tiny size of the waveguide and usually thin waveguide walls, the waveguide is extremely fragile and easily damaged under external forces. During the adsorption process, the suction nozzle is very likely to cause compression to the waveguide at the center of the chip, resulting in chip damage.

[0037] To solve the above problems, the present utility model proposes an adsorption structure, aiming to provide an adsorption structure that can protect the waveguide structure at the center of the chip. Figures 1 to 6 The structural schematic diagram of an embodiment provided by the adsorption structure of the present utility model.

[0038] Please refer to Figures 1 to 6 As shown in the figure, the present utility model proposes an adsorption structure 1000, which includes a base 1 and a suction nozzle 4. An adsorption tube 2 is passed through the base 1. One end of the adsorption tube 2 away from the base 1 is used to connect a vacuum generator. The base 1 is provided with an adjustable deformation plate 3. The suction nozzle 4 is arranged on the deformation plate 3 and communicates with the adsorption tube 2. An adsorption surface is formed on the side of the suction nozzle 4 facing away from the base 1. A protection groove 41 is formed on the adsorption surface. The protection groove 41 is used to avoid the waveguide structure of the chip. The adsorption surface further includes a plurality of adsorption holes 42, and the plurality of adsorption holes 42 are uniformly arranged on both sides of the protection groove 41.

[0039] In the technical solution of the present utility model, an adsorption structure 1000 and a semiconductor packaging device are proposed. Among them, the adsorption structure 1000 includes a base 1 and a suction nozzle 4. An adsorption tube 2 is passed through the base 1. One end of the adsorption tube 2 away from the base 1 is used to connect a vacuum generator. The base 1 is provided with an adjustable deformation plate 3. The suction nozzle 4 is arranged on the deformation plate 3 and communicates with the adsorption tube 2. An adsorption surface is formed on the side of the suction nozzle 4 facing away from the base 1. A protection groove 41 is provided on the adsorption surface. The protection groove 41 is used to avoid the waveguide structure of the chip. The adsorption surface further includes a plurality of adsorption holes 42. When performing the chip adsorption operation, the chip is placed on the sample stage, so that the protection groove 41 at the center of the suction nozzle 4 is aligned with the waveguide structure on the chip. When the adsorption surface contacts the chip surface, the waveguide structure will be located in the protection groove 41, so that it will not contact the adsorption surface, and it can effectively avoid the waveguide structure from being squeezed by the suction nozzle 4, thereby protecting the chip.

[0040] It should be noted that the widths of the waveguide structures in the chip can vary greatly, depending on their applications and designs. The width of the waveguide is usually on the order of micrometers (μm), and the specific value can range from several hundred nanometers (nm) to dozens of micrometers (μm). Generally, the size is below 100 μm, that is, below 0.1 mm. Therefore, in the technical solution of the present utility model, the width of the protection groove 41 is greater than or equal to 0.1 mm, so as to ensure that the suction nozzle 4 can well adapt to the protection of waveguide structures with different widths when sucking chips of different specifications. This design provides sufficient space to adapt to various waveguide structures with widths less than 100 μm, ensuring that the waveguide will not be pressed or damaged by the suction nozzle 4 during the process of sucking chips of different specifications, protecting the integrity and functionality of the waveguide. Secondly, this flexibility reduces the dependence on specific waveguide sizes, allowing the same suction nozzle 4 to be used for sucking multiple types of chips, improving the versatility and economy of the tool. In addition, this design also simplifies the programming and operation of the automated equipment, because there is no need to adjust or replace different suction nozzles 4 for each waveguide size, thereby improving the production efficiency and reducing the maintenance cost. Finally, this design of the protection groove 41 also helps to maintain the high yield and performance of the chip, because it reduces the risk of damage to the sensitive waveguide structure that may occur during handling.

[0041] This device is mainly used in the flip-chip bonding process of chips. Before flip-chip bonding, the adsorption tube 2 is inserted into the flip-chip bonder and connected to the internal vacuum generator. When inserted to the maximum depth, the limit boss 21 abuts against the mounting seat of the flip-chip bonder to achieve limitation.

[0042] In an embodiment of the present utility model, the suction nozzle 4 is provided with a plurality of adsorption holes 42. Specifically, please further refer to Figure 5 , there are a total of 13 adsorption holes 42. Six adsorption holes 42 are respectively arranged on both sides of the protection groove 41, and another adsorption hole 42 is located at the center of the suction nozzle 4. In order to keep the negative pressure generated by each adsorption hole 42 consistent, so that the chip can be uniformly pressed, the suction nozzle 4 is formed with a negative pressure cavity 43. Specifically, please further refer to Figure 6, the negative pressure chamber 43 is respectively connected to the adsorption tube 2 and a plurality of adsorption holes 42. The existence of the negative pressure chamber 43 ensures the uniform distribution of pressure during the chip adsorption process, avoiding chip damage or deformation caused by uneven pressure, especially for those chips with fine structures or fragile components. Secondly, the uniform negative pressure helps to improve the adsorption stability and reliability, ensuring that the chip will not fall off due to insufficient adsorption during handling. In addition, this design simplifies the structure of the adsorption system because a shared negative pressure source can be used, reducing the need for multiple independent vacuum generators, thereby reducing system complexity and cost. Finally, this nozzle 4 design with uniform negative pressure also improves the flexibility and adaptability of the automated equipment, enabling it to handle chips of different sizes and shapes, enhancing the versatility and efficiency of the production process. The negative pressure chamber 43 gradually shrinks from one end of the adsorption tube 2 to one end of the adsorption holes 42, so as to adapt to the outer surface area of the chip.

[0043] Furthermore, the flatness of the nozzle 4 of this device can be adjusted. Specifically, the adsorption structure 1000 includes an adjusting member. Specifically, please refer further to Figure 1 and Figure 3 , the adjusting member is movably arranged on the base 1, and one end of the adjusting member abuts against the deformation plate 3. It should be noted that the adjusting member can be a bolt or a push rod with multi-stage adjustment function. The present utility model does not limit this. In an embodiment of the present utility model, the adjusting member is a bolt. The adjusting bolt 5 is screwed into the threaded hole. The adjusting bolt 5 includes a nut 51 and an abutting end 52. The abutting end 52 abuts against the deformation plate 3. By turning the adjusting bolt 5 with a screwdriver or other special tools, the adjusting bolt 5 is raised or lowered, so that the deformation plate 3 deforms, and then the inclination angle of the nozzle 4 is adjusted to ensure the flatness of the nozzle 4.

[0044] To facilitate the operator to turn the adjusting bolt 5, the base 1 is formed with an installation notch 11. Specifically, please refer further to Figure 1 , the threaded hole is arranged on the bottom surface of the installation notch 11, and the nut 51 is located in the installation notch 11.

[0045] To install the nozzle 4, the base 1 is provided with an installation groove 12 facing downwards. The installation groove 12 is U-shaped. The deformation plate 3 is arranged on one side of the installation groove 12. The adsorption structure 1000 further includes a clamping portion 7. The clamping portion 7 includes being located in the installation groove 12 and respectively connecting the base 1 and the deformation plate 3. The nozzle 4 is arranged in the installation groove 12. The base 1 and the deformation plate 3 are both provided with fixing blocks 6. An installation rod 61 is arranged between the two fixing blocks 6. The clamping portion 7 is arranged on the installation rod 61. In another embodiment of the present utility model, the adsorption surface is provided with an elastic buffer layer, such as a silicone layer or a rubber layer, etc. When the nozzle 4 adsorbs the chip, the elastic buffer layer of the nozzle 4 contacts the chip, thereby preventing the chip surface from being scratched.

[0046] The present utility model further provides a semiconductor packaging device, which includes an adsorption structure 1000. The specific structure of the adsorption structure 1000 refers to the above embodiments. Since this semiconductor packaging device adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated here one by one.

[0047] The above description is only an exemplary embodiment of the present utility model, and does not limit the patent scope of the present utility model. Any equivalent structural transformation made under the technical concept of the present utility model by using the content of the specification and drawings of the present utility model, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present utility model.

Claims

1. An adsorption structure, characterized in that: include: A base, wherein the base is provided with an adsorption tube, an end of the adsorption tube away from the base is used to connect to a vacuum generator, and the base is provided with an adjustable deformation plate; and A suction nozzle is arranged on the deformable plate and connected to the suction tube, a suction surface is formed on the side of the suction nozzle facing away from the base, a protective groove is formed on the suction surface, and the protective groove is used to avoid the waveguide structure of the chip. The adsorption surface also includes a plurality of adsorption holes, and the plurality of adsorption holes are evenly distributed on both sides of the protective groove.

2. The adsorption structure according to claim 1, characterized in that: The suction nozzle is formed with a negative pressure cavity, which is connected to the suction tube and the plurality of suction holes respectively, and the negative pressure cavity gradually shrinks from one end of the suction tube to one end of the suction hole.

3. The adsorption structure according to claim 2, characterized in that: The width of the protection groove is D, and D≥0.1 mm.

4. The adsorption structure according to any one of claims 1 to 3, characterized in that: The adsorption structure further comprises an adjusting member, which is movably arranged on the base, one end of which is in contact with the deformation plate, and the adjusting member can be moved closer to or farther from the deformation plate.

5. The adsorption structure according to claim 4, characterized in that: The base is provided with a threaded hole, the adjusting member is an adjusting bolt, the adjusting bolt is screwed into the threaded hole, the adjusting bolt comprises a nut and an abutting end, and the abutting end abuts against the deformation plate.

6. The adsorption structure according to claim 5, characterized in that: The base is formed with a mounting notch, the threaded hole is arranged on the bottom surface of the mounting notch, and the nut is located in the mounting notch.

7. The adsorption structure according to any one of claims 1 to 3, characterized in that: The base is formed with a mounting groove, the deformation plate is arranged on one side of the mounting groove, the adsorption structure also includes a clamping part, the clamping part includes a part located in the mounting groove and respectively connected to the base and the deformation plate, and the suction nozzle is arranged in the mounting groove.

8. The adsorption structure according to claim 7, characterized in that: The base and the deformable plate are both provided with fixing blocks, a mounting rod is provided between the two fixing blocks, and the clamping portion is provided on the mounting rod.

9. The adsorption structure according to any one of claims 1 to 3, characterized in that: The adsorption surface is provided with an elastic buffer layer, and the elastic buffer layer is used for contacting with the chip.

10. A semiconductor packaging device, characterized in that: The invention comprises the adsorption structure according to any one of claims 1 to 9.

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