LED support with IC and LED lamp bead

Abstract

The utility model relates to the technical field of LED supports, and discloses an LED support with an IC and an LED lamp bead, five metal pads are arranged on the support, and the five metal pads are kept in an occlusion state in a mutually staggered manner, so that the strength and the stability of the support are enhanced, and on the basis of the strength and the stability of the support are improved. Through the staggered design of the appearances of the five metal bonding pads, the distance between each bonding pad and the driving IC is kept in a close state, the wire binding length is shortened, the wire binding efficiency is improved, the wire binding cost is reduced, meanwhile, when the lamp bead is assembled, the IC fixing bonding pad where the driving IC is located is indirectly connected with the red light chip, and the reliability of the lamp bead is improved. The problem of red light damage caused by direct binding is avoided, the yield and the product performance are improved, and the problem of high cost caused by unreasonable pad layout in the prior art is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED brackets, in particular to an LED bracket with an IC and an LED lamp bead. Background Art

[0002] An LED lamp bead is a lamp bead made by using an LED light-emitting chip. The production of an LED lamp bead needs to be carried out on an LED bracket. The traditional LED bracket with a driving IC has four metal conductive pads, namely a VDD pad, a DIN pad, a GND pad and a DOUT pad. Among them, the driving IC is arranged on the GND pad. The four metal pads are simply arranged on the bracket, and their layout design results in a longer wire arc during encapsulation, a higher wire bonding cost, and a poorer bracket strength. Summary of the Utility Model

[0003] The purpose of the utility model is to provide an LED bracket with an IC and an LED lamp bead, aiming to solve the problem of high cost caused by unreasonable pad layout in the prior art.

[0004] The utility model is realized as follows. In the first aspect, the utility model provides an LED bracket with an IC, including:

[0005] A bracket body, a reflecting bowl cup, and a pad assembly;

[0006] The reflecting bowl cup is arranged on the front of the bracket body, and the pad assembly is arranged inside the reflecting bowl cup;

[0007] The pad assembly includes a VDD pad, a DOUT pad, a GND pad, an IC fixing pad, and a DIN pad, and the VDD pad, the DOUT pad, the GND pad, the IC fixing pad, and the DIN pad are in a state of being mutually engaged.

[0008] Preferably, the outer shape of the VDD pad is concave, the outer shape of the DOUT pad is L-shaped, the outer shapes of the GND pad and the DIN pad are both triangular, and the outer shape of the IC fixing pad is linear;

[0009] The VDD pad, the DOUT pad, the GND pad, the IC fixing pad, and the DIN pad are sequentially arranged inside the reflecting bowl cup in contact with the inner wall of the reflecting bowl cup;

[0010] The top end of the IC fixing pad is embedded in the concave structure of the VDD pad;

[0011] The L-shaped structure of the DOUT pad is mutually engaged with the protruding part at one end of the concave structure of the VDD pad.

[0012] Preferably, an IC setting position for setting a driving IC is provided on the IC fixing pad, and the IC setting position is set at the middle position of the IC fixing pad;

[0013] The VDD pad, the DOUT pad, the GND pad, and the DIN pad all extend to the peripheral position of the IC fixing position.

[0014] Preferably, three LED setting positions for setting LED light-emitting chips are provided on the VDD pad, and the three LED setting positions are respectively set at the protruding positions at both ends and the middle concave position of the concave structure of the VDD pad.

[0015] Preferably, one LED setting position is provided on the DOUT pad to replace one LED setting position at the protruding positions at both ends of the concave structure of the VDD pad.

[0016] Preferably, the VDD pad, the DOUT pad, the GND pad, and the DIN pad all have a metal conductive pin, and the metal conductive pin is bent and extended to the back of the reflector bowl.

[0017] In a second aspect, the present utility model provides an LED lamp bead with an IC, including: a driving IC, an LED light-emitting chip assembly, and an LED bracket with an IC as described in any one of the first aspects;

[0018] The driving IC is set on the IC fixing pad of the LED bracket;

[0019] The LED light-emitting chip assembly is set on the VDD pad of the LED bracket;

[0020] In the LED light-emitting chip assembly, there is a red light chip, and the red light chip is electrically connected to the IC fixing pad through a bonding wire. The driving IC sets the driving constant current output port for controlling the red light chip on the IC fixing pad through a bonding wire to realize the electrical connection between the red light chip and the driving IC.

[0021] Preferably, in addition to the red light chip, the LED light-emitting chip assembly further includes a blue light chip and a green light chip.

[0022] Preferably, when the outer shape of the VDD pad in the LED bracket is concave, the red light chip, the blue light chip, and the green light chip are respectively set at the protruding positions at both ends and the middle concave position of the concave structure of the VDD pad.

[0023] Preferably, when the outer shape of the VDD pad in the LED bracket is concave, the red light chip is arranged at the middle concave position of the concave structure of the VDD pad, and the blue light chip and the green light chip are respectively arranged at one end of the protruding positions at both ends of the concave structure of the VDD pad and on the DOUT pad.

[0024] The utility model provides an LED bracket with an IC and an LED lamp bead, which has the following beneficial effects:

[0025] By arranging five metal pads on the bracket and making the five metal pads keep an engaging state in an interlaced form, the strength and stability of the bracket are enhanced. On this basis, through the interlaced design of the outer shapes of the five metal pads, the distances between the pads and the driving IC are kept close, the wire bonding length is shortened, the wire bonding efficiency is improved, the wire bonding cost is reduced. At the same time, when assembling the lamp bead, the IC fixing pad where the driving IC is located is used for indirect connection with the red light chip, avoiding the problem of red light damage caused by direct bonding, improving the yield and product performance, and solving the problem of high cost caused by unreasonable pad layout in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic structural diagram of an LED lamp bead with an IC provided by an embodiment of the utility model;

[0027] Figure 2 is a schematic structural diagram of a pad assembly of an LED bracket with an IC provided by an embodiment of the utility model;

[0028] Figure 3 is a schematic back structure diagram of an LED bracket with an IC provided by an embodiment of the utility model;

[0029] Figure 4 is a schematic structural diagram of another form of an LED lamp bead with an IC provided by an embodiment of the utility model.

[0030] Reference numerals: 1 - bracket main body, 2 - reflecting bowl cup, 3 - pad assembly, 31 - VDD pad, 32 - DOUT pad, 33 - GND pad, 34 - IC fixing pad, 35 - DIN pad, 4 - metal conductive pin, 5 - driving IC, 6 - LED light emitting assembly, 61 - red light chip, 62 - blue light chip, 63 - green light chip. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0032] The implementation of the present utility model will be described in detail below in conjunction with specific embodiments.

[0033] Refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 As shown, a preferred embodiment is provided by the present utility model.

[0034] In a first aspect, the present utility model provides an LED bracket with an IC, including: a bracket body 1, a reflecting bowl 2, and a pad assembly 3.

[0035] Specifically, the reflecting bowl 2 is disposed on the front surface of the bracket body 1, and the pad assembly 3 is disposed inside the reflecting bowl 2.

[0036] More specifically, the reflecting bowl 2 refers to a structural design in an LED lamp bead or a light source assembly, which is used to enhance the reflection and concentration of light.

[0037] More specifically, the main functions of the reflecting bowl 2 include: enhancing brightness: the reflecting bowl 2 reflects and concentrates the light emitted by the LED light-emitting chip through its internal reflecting surface, increasing the brightness and output efficiency of the light; light focusing: the shape design of the reflecting bowl 2 can help concentrate the light in a specific direction, reduce the scattering of light, and improve the utilization rate of light; improving the light-emitting effect: by optimizing the reflecting curved surface design of the reflecting bowl 2, a uniform light distribution can be achieved, avoiding light spots or dark areas, thereby improving the overall light-emitting effect.

[0038] More specifically, the characteristics of the reflecting bowl 2 include: bowl-shaped design: the reflecting bowl 2 is usually a bowl-shaped structure, and the internal surface is made of a smooth or coated reflective material to reflect light to the greatest extent; reflective material: the inside of the reflecting bowl 2 may be coated with a material with a high reflectivity, such as a metal coating or a high-reflectivity plastic material, to improve the light reflection efficiency; position: the reflecting bowl 2 is usually located around or directly above the LED light-emitting chip to ensure that the light emitted by the chip can be effectively reflected and utilized.

[0039] More specifically, the pad assembly 3 includes a VDD pad 31, a DOUT pad 32, a GND pad 33, an IC fixing pad 34, and a DIN pad 35, and the VDD pad 31, the DOUT pad 32, the GND pad 33, the IC fixing pad 34, and the DIN pad 35 are in a state of being mutually engaged.

[0040] More specifically, the VDD pad 31 is a power input port for connecting to the positive terminal of a power supply (usually +5V, +12V or other specified voltages). It provides the operating voltage for the driving IC 5 and the light-emitting chip in the LED lamp bead and is the power source for the entire circuit. The DOUT pad 32 is a signal output port for outputting control signals to the next LED lamp bead or other devices. Usually, when LED lamp beads with ICs are used in series, the DOUT pad 32 is connected to the DIN pad 35 of the next LED to achieve continuous signal transmission. The GND pad 33 is a ground connection point for connecting to the negative terminal of the power supply. It is the reference point for the entire circuit, ensuring that current can form a loop and providing electrical stability and safety. The IC fixing pad 34 is mainly used to physically fix the position of the integrated circuit (IC), ensuring that the IC is firmly attached to the substrate of the LED lamp bead. Sometimes, this pad may also play the role of electrical connection, especially in cases where additional circuit connections or grounding are required. The DIN pad 35 is a signal input port for receiving control signals from an external controller or the previous LED lamp bead. This pad transmits the signal to the driving IC 5, and the driving IC 5 then controls the brightness, color or other light-emitting characteristics of the LED lamp bead according to the signal.

[0041] It can be understood that by designing the pads in the pad assembly 3 to be in an interlocking posture, the connection stability between the pads can be increased, thereby increasing the structural strength of the bracket.

[0042] Furthermore, the interlocking pads mean that the shapes of the pads are different from each other and the pads are in an interleaved form with each other. This results in a position on the IC fixing pad 34 that is close to the positions of all the pads. By setting the driving IC 5 at this position, the distances between the driving IC 5 and all the pads can be kept in a close state, thereby shortening the wire bonding length between the driving IC 5 and all the pads and reducing the wire bonding cost by optimizing the pad structure.

[0043] The present utility model provides an LED bracket with an IC, having the following beneficial effects:

[0044] In the present utility model, by providing five metal pads on the bracket and keeping the five metal pads in an interlocking state in an interleaved form, the strength and stability of the bracket are enhanced. On this basis, through the interleaved design of the outer shapes of the five metal pads, the distances between each pad and the driving IC 5 are kept in a close state, shortening the wire bonding length, improving the wire bonding efficiency, reducing the wire bonding cost. At the same time, when assembling the lamp beads, the IC fixing pad 34 where the driving IC 5 is located is indirectly connected to the red light chip 61, avoiding the problem of red light damage caused by direct bonding, improving the yield rate and product performance, and solving the problem of high cost caused by unreasonable pad layout in the prior art.

[0045] Preferably, the outer shape of the VDD pad 31 is concave, the outer shape of the DOUT pad 32 is L-shaped, the outer shapes of the GND pad 33 and the DIN pad 35 are both triangular, and the outer shape of the IC fixing pad 34 is linear.

[0046] Specifically, the VDD pad 31, the DOUT pad 32, the GND pad 33, the IC fixing pad 34, and the DIN pad 35 are sequentially arranged inside the reflecting bowl cup 2 by fitting to the inner wall of the reflecting bowl cup 2; the top end of the IC fixing pad 34 is embedded in the concave structure of the VDD pad 31; the L-shaped structure of the DOUT pad 32 and the protruding part at one end of the concave structure of the VDD pad 31 are engaged with each other.

[0047] More specifically, the reflecting bowl cup 2 presents a circular structure. Therefore, the VDD pad 31, the DOUT pad 32, the GND pad 33, the IC fixing pad 34, and the DIN pad 35 arranged inside the reflecting bowl cup 2 are sequentially arranged around this circular structure, forming a circular arrangement with the head and tail connected.

[0048] More specifically, the DOUT pad 32 and the DIN pad 35 respectively correspond to the protruding parts at both ends of the concave structure of the VDD pad 31, and the IC fixing pad 34 is embedded in the concave part of the concave structure of the VDD pad 31.

[0049] More specifically, the pads are engaged with each other in a staggered form with different outer shapes, so that the connection of each pad is more stable.

[0050] Preferably, the IC fixing pad 34 has an IC setting position for setting the driving IC 5, and the IC setting position is set at the middle position of the IC fixing pad 34.

[0051] Specifically, the VDD pad 31, the DOUT pad 32, the GND pad 33, and the DIN pad 35 all extend to the peripheral side position of the IC fixing position.

[0052] It can be understood that since the VDD pad 31, the DOUT pad 32, the GND pad 33, and the DIN pad 35 all extend to the peripheral side position of the IC fixing position, this makes the positions of the VDD pad 31, the DOUT pad 32, the GND pad 33, and the DIN pad 35 and the IC fixing position all in a close state. When the driving IC 5 is set at the IC fixing position and the wiring is set for the driving IC 5 and each pad, the wiring between the driving IC 5 and each pad will be shorter than the wiring in the traditional design, thereby achieving the effect of reducing the wire bonding cost.

[0053] Preferably, there are three LED setting positions for setting LED light-emitting chips on the VDD pad 31, and the three LED setting positions are respectively set at the protruding positions at both ends and the middle concave position of the concave structure of the VDD pad 31.

[0054] Specifically, the outer shape of the VDD pad 31 presents a concave structure, having two protruding positions on both sides and a middle concave position, and the IC fixing pad 34 with a long strip shape is embedded in the middle concave position of the VDD pad 31.

[0055] Based on the above-mentioned outer shape design, LED setting positions for setting LED light-emitting chips are set at the protruding positions at both ends and the middle concave position of the VDD pad 31, so that the distance between the LED light-emitting chip and the fixed IC arranged on the IC fixing pad 34 remains close.

[0056] Preferably, there is one LED setting position on the DOUT pad 32 to replace one LED setting position at the protruding positions at both ends of the concave structure of the VDD pad 31.

[0057] Specifically, in another embodiment provided by the present invention, one LED setting position at the protruding positions at both ends of the VDD pad 31 is transferred to the DOUT pad 32 to obtain another LED layout design.

[0058] It should be noted that the layout design provided in the present invention has flexibility and can be adjusted accordingly according to actual needs.

[0059] Preferably, the VDD pad 31, the DOUT pad 32, the GND pad 33 and the DIN pad 35 all have a metal conductive pin 4, and the metal conductive pin 4 is bent and extended to the back of the reflector cup 2.

[0060] Specifically, the function of the metal conductive pin 4 is to enhance the fixing degree of the pad and the stability of the pad structure.

[0061] Preferably, the IC fixing pad 34 has a metal conductive pin 4, and the metal conductive pin 4 is bent and extended to the back of the reflector cup 2.

[0062] Specifically, the IC fixing pad 34 can also be provided with pins extending to the back. Since the IC fixing pad 34 is only used for setting the IC and connecting the driving IC 5 and the red light chip 61, the bent pins led out from the IC fixing pad 34 can also be cut off without specifically leading out pins.

[0063] In the second aspect, the present invention provides an LED lamp bead with an IC, including: a driving IC 5, an LED light-emitting chip assembly 6 and the LED bracket with an IC according to any one of the first aspect.

[0064] Specifically, the driving IC 5 is disposed on the IC fixing pad 34 of the LED bracket; the LED light-emitting chip assembly 6 is disposed on the VDD pad 31 of the LED bracket; in the LED light-emitting chip assembly 6, there is a red light chip 61, and the red light chip 61 is electrically connected to the IC fixing pad 34 through a bonding gold wire. The driving IC 5 sets the driving constant current output port for controlling the red light chip 61 on the IC fixing pad 34 through a bonding gold wire to achieve the electrical connection between the red light chip 61 and the driving IC 5.

[0065] Specifically, the LED light-emitting chip assembly 6 is composed of several LED light-emitting chips. Usually, it can be composed of three LED light-emitting chips. Among these LED light-emitting chips, there is a red light chip 61. This red light chip 61 is not directly electrically connected to the driving IC 5, but is electrically connected to the IC fixing pad 34. The driving sets the driving constant current output port for controlling the red light chip 61 on the IC fixing pad 34 through a bonding gold wire to achieve the electrical connection between the red light chip 61 and the driving IC 5.

[0066] It should be noted that in the traditional design, the wire arc from the driving IC 5 bonded to the red light chip 61 is likely to damage the red light during the second soldering, affecting the reliable performance of the product. In this design, the red light chip 61 and the driving IC 5 are indirectly connected through the IC fixing pad 34, avoiding the situation of red light damage caused by direct bonding, and improving the product yield and the performance of the product.

[0067] Preferably, in addition to the red light chip 61, the LED light-emitting chip assembly 6 further includes a blue light chip 62 and a green light chip 63.

[0068] Specifically, one combination form of the LED light-emitting chip assembly 6 is the red light chip 61, the blue light chip 62, and the green light chip 63.

[0069] Preferably, when the outer shape of the VDD pad 31 in the LED bracket is concave, the red light chip 61, the blue light chip 62, and the green light chip 63 are respectively disposed at the protruding positions at both ends and the middle concave position of the concave structure of the VDD pad 31.

[0070] It can be understood that through this design form, the LED wire bonding length is shortened, improving the wire bonding efficiency and reducing the wire cost at the same time.

[0071] Preferably, when the outer shape of the VDD pad 31 in the LED bracket is concave, the red light chip 61 is disposed at the middle concave position of the concave structure of the VDD pad 31, and the blue light chip 62 and the green light chip 63 are respectively disposed at one end of the protruding positions at both ends of the concave structure of the VDD pad 31 and on the DOUT pad 32.

[0072] Specifically, compared with the previous design solution, in this design solution, the chip on one of the protruding positions at both ends of the concave structure of the VDD pad 31 is arranged on the DOUT pad 32, thereby forming a different layout. The wiring solution provided by the present utility model has a certain degree of flexibility.

[0073] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. An LED bracket with IC, characterized in that: include: Bracket body, reflective bowl, and welding pad assembly; The reflective bowl is arranged on the front side of the bracket body, and the pad assembly is arranged inside the reflective bowl; The pad assembly includes a VDD pad, a DOUT pad, a GND pad, an IC fixing pad and a DIN pad, and the VDD pad, the DOUT pad, the GND pad, the IC fixing pad and the DIN pad are in a state of interlocking with each other.

2. The LED bracket with IC as claimed in claim 1, characterized in that: The VDD pad has a concave shape, the DOUT pad has an L-shape, the GND pad and the DIN pad both have a triangular shape, and the IC fixing pad has a straight shape; The VDD pad, the DOUT pad, the GND pad, the IC fixing pad and the DIN pad are attached to the inner wall of the reflective bowl and are sequentially arranged inside the reflective bowl; The top end of the IC fixing pad is embedded in the concave structure of the VDD pad; The L-shaped structure of the DOUT pad and a protruding portion of one end of the concave structure of the VDD pad are engaged with each other.

3. The LED bracket with IC as claimed in claim 1, characterized in that: The IC fixing pad has an IC setting position for setting the driver IC, and the IC setting position is arranged in the middle of the IC fixing pad; The VDD pad, the DOUT pad, the GND pad, and the DIN pad all extend to the peripheral side of the IC fixing position.

4. The LED bracket with IC as claimed in claim 3, characterized in that: The VDD pad has three LED setting positions for setting the LED light-emitting chip, and the three LED setting positions are respectively arranged at the protruding positions at both ends and the concave position in the middle of the concave structure of the VDD pad.

5. The LED bracket with IC as claimed in claim 4, characterized in that: One LED setting position is disposed on the DOUT pad to replace one LED setting position disposed at the protruding positions at both ends of the concave structure of the VDD pad.

6. The LED bracket with IC as claimed in claim 1, characterized in that: The VDD pad, the DOUT pad, the GND pad and the DIN pad each have a metal conductive pin, and the metal conductive pin is bent and extended to the back side of the reflective bowl.

7. An LED lamp bead with IC, characterized in that: include: A driver IC, an LED light-emitting chip assembly, and an LED bracket with IC as described in any one of claims 1 to 6; The driver IC is arranged on the IC fixing pad of the LED bracket; The LED light emitting chip assembly is arranged on the VDD pad of the LED bracket; The LED light-emitting chip assembly is provided with a red light chip, and the red light chip is electrically connected to the IC fixing pad by binding gold wires. The driving IC sets a driving constant current output port for controlling the red light chip on the IC fixing pad by binding gold wires to realize the electrical connection between the red light chip and the driving IC.

8. The LED bracket with IC as claimed in claim 7, characterized in that: The LED light emitting chip assembly includes a blue light chip and a green light chip in addition to a red light chip.

9. The LED bracket with IC as claimed in claim 8, characterized in that: When the VDD pad in the LED bracket has a concave shape, the red light chip, the blue light chip and the green light chip are respectively arranged at the protruding positions at both ends and the concave position in the middle of the concave structure of the VDD pad.

10. The LED bracket with IC as claimed in claim 8, characterized in that: When the shape of the VDD pad in the LED bracket is concave, the red light chip is arranged at the middle recessed position of the concave structure of the VDD pad, and the blue light chip and the green light chip are respectively arranged at one end of the protruding positions at both ends of the concave structure of the VDD pad and on the DOUT pad.

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