Foam adsorption and lamination mechanism for earphone upper cover

Abstract

The utility model relates to an earphone upper cover foam adsorption fitting mechanism which comprises a seat plate, a rotating cylinder is fixedly connected to the seat plate, a guide rail and a blocking seat are fixedly connected to a rotating table of the rotating cylinder, a sliding block is connected to the guide rail in a sliding mode, a plurality of mounting holes are formed in the sliding block, a base is detachably connected to the sliding block, and the blocking seat is fixedly connected to the base. A pressure sensor is fixedly connected to the blocking seat, a spring is arranged between the base and the pressure sensor, a vacuum adsorption head is detachably connected to the lower end of the base, a profiling face is arranged at the lower end of the vacuum adsorption head, and an adsorption hole is formed in the profiling face of the vacuum adsorption head. The device has the beneficial effects that the device can adapt to high-quality laminating treatment of foam and earphone upper covers and can be adjusted according to products of different specifications, meanwhile, a high-degree-of-freedom manipulator is not needed, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the field of headphone production and processing equipment, and particularly relates to a sponge adsorption and fitting mechanism for a headphone upper cover. Background Art

[0002] The headphone upper cover and the sponge are parts that make up a headphone. In headphone production, the headphone upper cover needs to be pasted with a sponge for assembly. The headphone upper cover is a special-shaped plastic shell, and the sponge needs to be attached to the inner curved surface of the headphone upper cover. To ensure the quality of the sponge attachment, it is necessary to control the horizontal angle during assembly.

[0003] At present, it is generally difficult for a manipulator to cooperate with a vacuum suction head to adapt to the high-quality attachment treatment of the sponge, and it is inconvenient to adjust according to actual processing needs. If a manipulator with a higher degree of freedom is used, it is not only difficult to avoid positions in space in equipment with a very high degree of headphone automation integration, but also the production cost will be greatly increased. Therefore, a sponge adsorption and fitting mechanism for a headphone upper cover is needed. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a sponge adsorption and fitting mechanism for a headphone upper cover, which can adapt to the high-quality fitting treatment of the sponge and the headphone upper cover, can be adjusted according to different specifications of products, and does not need to use a manipulator with a high degree of freedom, thus reducing the production cost.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A sponge adsorption and fitting mechanism for a headphone upper cover, including a seat plate, a rotary cylinder is fixedly connected to the seat plate, a guide rail and a stop seat are fixedly connected to the rotating table of the rotary cylinder, a slider is slidably connected to the guide rail, a plurality of mounting holes are provided on the slider, a base is detachably connected to the slider, a pressure sensor is fixedly connected to the stop seat, a spring is provided between the base and the pressure sensor, a vacuum suction head is detachably connected to the lower end of the base, a profiling surface is provided at the lower end of the vacuum suction head, and adsorption holes are provided on the profiling surface of the vacuum suction head.

[0006] Further, a plurality of photoelectric sensors are detachably mounted on the seat plate, and a light shielding sheet is fixedly connected to the rotating table of the rotary cylinder.

[0007] Further, a convex block is provided at one end of the rotating table of the rotary cylinder, and two buffers are detachably connected to the seat plate on both sides of the convex block.

[0008] Further, a positioning rod is provided at the lower end of the base, and a positioning hole is provided at the upper end of the vacuum suction head.

[0009] The beneficial effects of the present utility model are as follows: By the combined use of a rotary cylinder, a guide rail, a slider, a retaining seat, a base, a pressure sensor, and a vacuum suction head, it can adapt to the high-quality fitting process of the foam and the upper cover of the earphone, and can be adjusted according to products of different specifications. At the same time, there is no need to use a high-degree-of-freedom manipulator, reducing production costs. Brief Description of the Drawings

[0010] Figure 1 It is a first perspective schematic diagram of a foam adsorption and fitting mechanism for the upper cover of an earphone of the present utility model.

[0011] Figure 2 It is a second perspective schematic diagram of a foam adsorption and fitting mechanism for the upper cover of an earphone of the present utility model.

[0012] Figure 3 It is a second perspective schematic diagram of a foam adsorption and fitting mechanism for the upper cover of an earphone of the present utility model.

[0013] In the figure: 1, seat plate; 2, rotary cylinder; 201, convex block; 3, guide rail; 301, slider; 4, retaining seat; 5, base; 6, pressure sensor; 7, spring; 8, vacuum suction head; 801, adsorption hole; 9, photoelectric sensor; 10, light shielding sheet; 11, buffer. Detailed Embodiment

[0014] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the following further elaborates on the present utility model in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0015] Refer to Figures 1-3 A foam adsorption and fitting mechanism for the upper cover of an earphone shown, including a seat plate 1, a rotary cylinder 2 is fixedly connected to the seat plate 1, a guide rail 3 and a retaining seat 4 are fixedly connected to the rotating table of the rotary cylinder 2, a slider 301 is slidably connected to the guide rail 3, a plurality of mounting holes are provided on the slider 301, a base 5 is detachably connected to the slider 301, a pressure sensor 6 is fixedly connected to the retaining seat 4, a spring 7 is provided between the base 5 and the pressure sensor 6, a vacuum suction head 8 is detachably connected to the lower end of the base 5, a profiling surface is provided at the lower end of the vacuum suction head 8, and adsorption holes 801 are provided on the profiling surface of the vacuum suction head 8.

[0016] A plurality of photoelectric sensors 9 are detachably provided on the seat plate 1, a light shielding sheet 10 is fixedly connected to the rotating table of the rotary cylinder 2, and the cooperation between the light shielding sheet 10 and the photoelectric sensors 9 can further control the rotation action of the rotating table of the rotary cylinder 2, improving the processing quality.

[0017] One end of the rotating table of the rotating cylinder 2 is provided with a convex block 201. Two buffers 11 are detachably connected to the seat plate 1 on both sides of the convex block 201. The buffers 11 can limit the stroke of the rotating table of the rotating cylinder 2, prevent the deviation during the adsorption of the foam due to excessive rotation, and prevent damage to the upper cover of the earphone.

[0018] A positioning rod is provided at the lower end of the base 5, and a positioning hole is provided at the upper end of the vacuum suction head 8, which is convenient for installing the vacuum suction head 8.

[0019] The working principle of the present invention is as follows: When the present invention is in use, the seat plate 1 can be installed at the output end of an external manipulator. When taking materials, first, the rotating cylinder drives the vacuum suction head 8 to rotate and tilt. The vacuum suction head 8 rotates to the foam feeding station, and the external feeding mechanism transports the foam to the adsorption hole 802. After the vacuum suction head 8 adsorbs the foam, then the external manipulator drives the vacuum suction head 8 to the attachment station. At this time, the upper shell of the earphone is loaded in the external carrier, and the rotating cylinder 2 drives the vacuum suction head 8 to reset, and the foam can be attached to the inner curved surface of the upper shell of the earphone during the rotation process.

[0020] The above embodiments are used to further illustrate the present invention, but do not limit the present invention to these specific embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention shall be understood to be within the protection scope of the present invention.

Claims

1. A foam adsorption and bonding mechanism for an earphone cover, characterized in that: The invention comprises a seat plate (1), the seat plate (1) being fixedly connected to a rotary cylinder (2), a guide rail (3) and a stop seat (4) being fixedly connected to a rotating platform of the rotary cylinder (2), a slider (301) being slidably connected to the guide rail (3), a plurality of mounting holes being provided on the slider (301), a base (5) being detachably connected to the slider (301), a pressure sensor (6) being fixedly connected to the stop seat (4), a spring (7) being provided between the base (5) and the pressure sensor (6), a vacuum adsorption head (8) being detachably connected to the lower end of the base (5), a contouring surface being provided at the lower end of the vacuum adsorption head (8), and adsorption holes (801) being provided on the contouring surface of the vacuum adsorption head (8).

2. The headphone upper cover foam adsorption and bonding mechanism according to claim 1, characterized in that: A plurality of photoelectric sensors (9) are detachably mounted on the seat plate (1), and a light shielding sheet (10) is fixedly connected to the rotating platform of the rotary cylinder (2).

3. The headphone upper cover foam adsorption and bonding mechanism according to claim 1, characterized in that: A convex block (201) is provided at one end of the rotating platform of the rotary cylinder (2), and two buffers (11) are detachably connected to the base plate (1) on both sides of the convex block (201).

4. The headphone cover foam adsorption and bonding mechanism according to claim 1, characterized in that: A positioning rod is provided at the lower end of the base (5), and a positioning hole is provided at the upper end of the vacuum adsorption head (8).

Images