Traceless burning jig based on memory module

Abstract

The utility model discloses a traceless burning jig based on a memory module, and relates to the technical field of storage burning equipment, the traceless burning jig comprises a memory module bearing mechanism comprising a supporting plate, a guide rail and a memory module limiting tray, the guide rail is fixedly arranged on the top surface of the supporting plate; the memory module limiting tray is in sliding connection with the guide rail; the burning mechanism comprises a burner, a first PCB (Printed Circuit Board), a second PCB and a test pin; the burner and the first PCB are both located at the top of the memory module bearing mechanism, and the second PCB is located at the bottom of the memory module bearing mechanism; the tail of each test needle is fixed on the first PCB and the second PCB, the needle head of each test needle faces the memory module bearing mechanism, the needle head of each test needle is circular, and the test needles corresponding to each golden finger of the memory module are distributed in a double-needle staggered manner; and the lifting assembly is mounted at the bottom of the memory module bearing mechanism. The utility model has the beneficial effects that the memory module can be protected, and the user experience can be optimized.

Description

Technical Field

[0001] The utility model relates to the technical field of storage and burning equipment, and more specifically, to a traceless burning fixture based on a memory module. Background Art

[0002] Memory modules are mainly applied to thin and light device terminals such as laptop computers and tablet computers, as well as network hardware such as routers and NAS devices.

[0003] SPD is an erasable eeprom on the memory module, which records many important information of the memory, such as parameters of the memory chip and module manufacturers, operating frequency, operating voltage, speed, capacity, voltage, row and column address bandwidth, etc.

[0004] SPD information is generally written into the eeprom chip by the memory module manufacturer according to the actual performance of the memory chip before leaving the factory. There are two traditional memory module burning methods, horizontal plugging and vertical plugging, but both of these methods use connectors, and the connectors are all PIN feet, but actually only 7 - 8 PIN feet are needed for burning SPD. Usually, the gold fingers of the memory module include section A and section B. Plugging and unplugging will cause scratches on the gold fingers of the memory module, affecting the appearance. Since the PIN feet for burning SPD are concentrated in section B, some manufacturers also cut off section A of the connector and only retain section B, which can only partially reduce the wear and scratches of the gold fingers and cannot completely eliminate them. Summary of the Utility Model

[0005] In order to overcome the deficiencies of the prior art, the utility model provides a traceless burning fixture based on a memory module, which solves the problem that the gold fingers of the memory module are easily damaged during the plugging and unplugging of burning SPD for the current memory module, thereby protecting the memory module and optimizing the user experience.

[0006] The technical solution adopted by the utility model to solve its technical problems is: a traceless burning fixture based on a memory module, which is improved in that the traceless burning fixture based on a memory module includes:

[0007] A memory module supporting mechanism, including a tray, a guide rail, and a memory module limiting tray. The guide rail is fixedly installed on the top surface of the tray; the memory module limiting tray is slidably connected to the guide rail;

[0008] The programming mechanism includes a programmer, a first PCB circuit board, a second PCB circuit board, and test pins; the first PCB circuit board is connected between the programmer and the second PCB circuit board, and both the programmer and the first PCB circuit board are located on the top of the memory module supporting mechanism, while the second PCB board is located at the bottom of the memory module supporting mechanism; the tails of the test pins are fixed on the first PCB board and the second PCB board, the needle tips face the memory module supporting mechanism, and the needle tips of the test pins are circular, and the test pins corresponding to the respective gold fingers of the memory module are distributed in a staggered manner with two pins.

[0009] The lifting assembly is installed at the bottom of the memory module supporting mechanism and is used to drive the memory module supporting mechanism to reciprocate in the vertical direction.

[0010] In the above structure, the memory module supporting mechanism further includes a memory module protection plate, and the memory module protection plate is hinged to the top of one end of the inner mold module limiting tray close to the programming mechanism.

[0011] In the above structure, a number of first pin holes are provided on the memory module protection plate, the distribution positions of the first pin holes are adapted to the test pins fixed on the first PCB board, and the size of the first pin holes is slightly larger than the size of the test pins.

[0012] In the above structure, a number of second pin holes are provided on the tray, the distribution positions of the second pin holes are adapted to the test pins fixed on the second PCB board, and the size of the second pin holes is slightly larger than the size of the test pins.

[0013] In the above structure, the traceless programming fixture further includes a support assembly, and the support assembly includes a support bottom plate, a first support side plate, a second support side plate, a support frame, and a support block; the first support side plate and the second support side plate are both perpendicular to the support bottom plate, the first support side plate is close to the bottom of the tray, and the second support side plate is close to one end of the memory module supporting mechanism close to the programming mechanism; the support frame is fixedly installed on the top of the second support side plate; the support block is fixedly installed on the support bottom plate and is located at the bottom of the programming mechanism.

[0014] In the above structure, the lifting assembly includes a lifting limit bearing, a movable shaft, a guide rod, a handle, a movable plate, a pulley, and a lifting structural member; the lifting limit bearing is fixedly installed on one side of the first support side plate close to the programming mechanism; one end of the movable shaft is fixedly connected to the bottom of the tray, and the other end is slidably connected to the lifting limit bearing; the guide rod is perpendicular to the support bottom plate and is located on both sides of the support block; one end of the handle is fixedly connected to the lifting structural member and is rotatably connected to the support block; the movable plate is slidably connected to the guide rod; the pulley is installed on one side of the movable plate and is in contact with the inclined surface of the lifting structural member.

[0015] In the above structure, the programming mechanism further includes a first test pin fixing plate and a second test pin fixing plate; the first test pin fixing plate is fixedly installed at the middle position of the test pins fixed on the first PCB board and is close to the bottom of the support frame; the second test pin fixing plate is fixedly installed at the middle position of the test pins fixed on the second PCB board and is close to the top of the movable plate.

[0016] In the above structure, the programming mechanism further includes a test pin protection plate, which is fixedly installed on one side, and the test pin protection plate is sleeved on the needle heads of the test pins fixed on the first PCB board.

[0017] In the above structure, the test pin protection plate is provided with a third pin hole, the needle heads of the test pins fixed on the first PCB board are inserted into the third pin hole, and the distribution position of the third pin hole is adapted to the test pins fixed on the first PCB board, and the size of the third pin hole is slightly larger than the size of the test pins.

[0018] In the above structure, the programming mechanism further includes a first elastic return device and a second elastic return device; the first elastic return device and the second elastic return device are fixedly installed on the outer side of the guide rod, and the end of the first elastic return device is fixedly installed at the bottom of the support plate, and the end of the second elastic return device is fixedly installed at the top of the test pin protection plate.

[0019] The beneficial effects of the present utility model are as follows: The memory module limiting tray loaded with the memory module is moved to the end of the support plate close to the programming mechanism through the guide rail; the height of the memory module supporting mechanism is adjusted through the lifting assembly, so that the test pins installed on the first PCB board are in contact with the gold fingers at the top of the memory module, and the test pins installed on the second PCB board are in contact with the gold fingers at the bottom of the memory module, and the needle heads of the test pins are circular. At this time, the memory module starts to program the SPD. After the programming is completed, the height of the memory module supporting structure is adjusted through the lifting assembly again, so that all the test pins are separated from the gold fingers of the memory module. The memory module limiting tray is pulled out through the guide rail and a new memory module is replaced to enter the next round of operation; during this process, the test pins only have a vertical stroke to ensure that no horizontal scratches are generated during the programming process; and the needle heads of the test pins are circular to avoid generating puncture marks on the gold fingers of the memory module during the programming process; thus, both the memory module can be protected and the user experience can be optimized. Description of the Drawings

[0020] Figure 1 is a schematic diagram of the overall structure of a traceless programming fixture for a memory module according to the present utility model Figure 1 ;

[0021] Figure 2 is a schematic diagram of the overall structure of a traceless programming fixture for a memory module according to the present utility model Figure 2 . Detailed implementation mode

[0022] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0023] The concept, specific structure and technical effects of the present utility model will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings, so as to fully understand the purpose, features and effects of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, other embodiments obtained by those skilled in the art without creative work all fall within the scope of protection of the present utility model. In addition, all connection / connection relationships involved in the patent do not simply refer to the direct connection of components, but refer to the more optimal connection structure that can be formed by adding or reducing connection accessories according to the specific implementation situation. Each technical feature in the creation of the present utility model can be combined interactively without mutual contradiction or conflict.

[0024] Refer to Figure 1 and Figure 2 As shown, the present utility model discloses a traceless burning fixture based on a memory module. The traceless burning fixture based on the memory module includes:

[0025] A memory module supporting mechanism, including a pallet 4, a guide rail 3 and a memory module limiting tray 2. The guide rail 3 is fixedly installed on the top surface of the pallet 4; the memory module limiting tray 2 is slidably connected to the guide rail 3;

[0026] A burning mechanism, including a burner 12, a first PCB circuit board, a second PCB circuit board and test pins 15; the first PCB circuit board is connected between the burner 12 and the second PCB circuit board, and both the burner 12 and the first PCB circuit board are located on the top of the memory module supporting mechanism, and the second PCB board 14 is located at the bottom of the memory module supporting mechanism; the tails of the test pins 15 are fixed on the first PCB board 13 and the second PCB board 14, the needle tips face the memory module supporting mechanism, and the needle tips of the test pins 15 are circular, and the test pins 15 corresponding to each gold finger of the memory module 1 are distributed in a double-needle staggered manner;

[0027] A lifting assembly is installed at the bottom of the memory module supporting mechanism and is used to drive the memory module supporting mechanism to make reciprocating motions in the vertical direction.

[0028] It should be noted that in this embodiment, the memory module supporting mechanism is used to load the memory module 1 and move the position of the memory module 1; specifically, the memory module supporting mechanism includes a pallet 4, a guide rail 3, and a memory module limiting tray 2. Among them, the memory modules 1 are arranged in an array and fixed in the memory module limiting tray 2. The guide rail 3 is fixedly installed on the top surface of the pallet 4, and the memory module limiting tray 2 is slidably connected to the guide rail 3 to realize the movement of the position of the memory module 1 on the pallet 4. In addition, the size of the memory module limiting tray 2 is set to be adapted to the memory module 1 actually to be applied. Such a size setting belongs to the common technical means of those skilled in the art and will not be specifically limited here; the programming mechanism is used to program the SPD into the memory module 1. Specifically, the programming mechanism includes a programmer 12, a first PCB circuit board, a second PCB circuit board, and test pins 15. The programmer 12 is a dedicated hardware device used to read and write data in the memory module 1. During the SPD programming process, the programmer 12 is connected to the memory module 1 to read the data in the memory module 1 or write new data into the memory module 1 through a programming interface; the first PCB circuit board and the second PCB circuit board are used to provide interfaces adapted to the test pins 15 and provide a circuit structure capable of realizing the electrical connection between the test pins 15 and the programmer 12; the test pins 15 are used to contact the gold fingers of the memory module 1 to provide a perfect data reading and writing channel for the SPD programming process; the lifting assembly is used to adjust the height of the memory module supporting mechanism to control the test pins 15 to move away from or close to the memory module 1. Specifically, before programming the SPD, the memory module supporting mechanism is driven by the lifting assembly to rise until the test pins 15 are in full contact with the gold fingers of the memory module 1; after the SPD programming is completed, the memory module supporting mechanism is driven by the lifting assembly to descend so that the gold fingers of the memory module 1 are completely separated from the test pins 15; when specifically implementing the present invention, the memory module supporting mechanism moves the memory module limiting tray 2 loaded with the memory module 1 to the end of the pallet 4 close to the programming mechanism through the guide rail 3; the height of the memory module supporting mechanism is adjusted by the lifting assembly so that the test pins 15 installed on the first PCB board 13 are in contact with the gold fingers at the top of the memory module 1, and the test pins 15 installed on the second PCB board 14 are in contact with the gold fingers at the bottom of the memory module 1, and the tips of the test pins 15 are circular. At this time, the memory module 1 starts to program the SPD. After the programming is completed, the height of the memory module 1 supporting structure is adjusted by the lifting assembly again so that all the test pins 15 are separated from the gold fingers of the memory module 1. The memory module limiting tray 2 is pulled out through the guide rail 3 and a new memory module 1 is replaced to enter the next operation; during this process, the test pins 15 only have a vertical stroke to ensure that no horizontal scratches are generated during the programming process; and the tips of the test pins 15 are circular to avoid generating prick marks on the gold fingers of the memory module 1 during the programming process; thus, both the memory module 1 can be protected and the user experience can be optimized.

[0029] Continue to refer to Figure 1 As shown, the memory module supporting mechanism further includes a memory module 1 guard plate, and the memory module 1 guard plate is hinged to the top of one end of the inner mold module limiting tray close to the burning mechanism.

[0030] It should be noted that in this embodiment, when burning the SPD of the memory module 1, the memory template guard plate is covered on the memory module 1 to prevent the memory module 1 from being damaged during the burning of the SPD.

[0031] A number of first pinholes are provided on the memory module 1 guard plate, and the distribution positions of the first pinholes are adapted to the test pins 15 fixed on the first PCB board 13, and the size of the first pinholes is slightly larger than the size of the test pins 15.

[0032] It should be noted that in this embodiment, the design of the first pinholes is to enable the test pins 15 fixed on the first PCB board 13 to pass through the first pinholes and contact the gold fingers of the memory module 1 during the process of burning the SPD; the design of the size of the first pinholes is slightly larger than the size of the test pins 15 to prevent the test pins 15 from passing through the first pinholes and causing pin collision, thereby playing a protective role for the test pins 15 fixed on the first PCB board 13.

[0033] A number of second pinholes are provided on the pallet 4, and the distribution positions of the second pinholes are adapted to the test pins 15 fixed on the second PCB board 14, and the size of the second pinholes is slightly larger than the size of the test pins 15.

[0034] It should be noted that in this embodiment, the design of the second pinholes is to enable the test pins 15 fixed on the second PCB board 14 to pass through the second pinholes and contact the gold fingers of the memory module 1 during the process of burning the SPD; the design of the size of the second pinholes is slightly larger than the size of the test pins 15 to prevent the test pins 15 from passing through the second pinholes and causing pin collision, thereby playing a protective role for the test pins 15 fixed on the second PCB board 14; in addition, when the burning of the SPD is completed or the burning fixture is not working, the needles of the test pins 15 fixed on the second PCB board 14 are placed in the second pinholes, which also plays a protective role for the test pins 15 fixed on the second PCB board 14.

[0035] Continue to refer to Figure 1As shown, the traceless burning fixture further includes a support assembly, which includes a support bottom plate 16, a first support side plate 17, a second support side plate 18, a support frame 19, and a support block; the first support side plate 17 and the second support side plate 18 are both perpendicular to the support bottom plate 16, and the first support side plate 17 is close to the bottom of the pallet 4, and the second support side plate 18 is close to one end of the memory module supporting mechanism close to the burning mechanism; the support frame 19 is fixedly installed on the top of the second support side plate 18; the support block is fixedly installed on the support bottom plate 16 and is located at the bottom of the burning mechanism.

[0036] It should be noted that in this embodiment, the support assembly provides a stable support foundation for the entire traceless burning fixture to ensure the accuracy and reliability during the SPD burning process; specifically, the support bottom plate 16 serves as the foundation of the entire support structure, providing a solid bottom surface to ensure that the device is not prone to displacement or tilt during operation; the first support side plate 17 is close to the bottom of the pallet 4 to provide support for the pallet 4 to ensure that the pallet 4 can maintain a stable position during the burning process; the second support side plate 18 is used to support the support frame 19; the support frame 19 is used to provide an installation space for the first PCB board 13, the cable, and the burner 12 in the burning mechanism; the support block is used to facilitate the installation of the lifting assembly.

[0037] Continue to refer to Figure 1 As shown, the lifting assembly includes a lifting limit bearing 5, a movable shaft 6, a guide rod 7, a handle 10, a movable plate 8, a pulley 9, and a lifting structural member 11; the lifting limit bearing 5 is fixedly installed on one side of the first support side plate 17 close to the burning mechanism; one end of the movable shaft 6 is fixedly connected to the bottom of the pallet 4, and the other end is slidably connected to the lifting limit bearing 5; the guide rod 7 is perpendicular to the support bottom plate 16 and is located on both sides of the support block; one end of the handle 10 is fixedly connected to the lifting structural member 11 and is rotatably connected to the support block; the movable plate 8 is slidably connected to the guide rod 7; the pulley 9 is installed on one side of the movable plate 8 and is in contact with the inclined surface of the lifting structural member 11.

[0038] It should be noted that in this embodiment, one end of the handle 10 is fixedly connected to the lifting structural member 11, and the other end is rotatably connected to the support block. The design of the handle 10 enables the operator to conveniently control the movement of the lifting structural member 11. By rotating the handle 10, the lifting structural member 11 is driven to rotate; the lifting structural member 11 is approximately wedge-shaped; the guide rod 7 is vertically installed on the support bottom plate 16 and is located on both sides of the support block, playing a guiding role to ensure the stability of the movable plate 8 during the lifting process and prevent it from tilting or shifting; the movable plate 8 is designed to move up and down under the guidance of the guide rod 7; the pulley 9 is installed on one side of the movable plate 8 and is in contact with the inclined surface of the lifting structural member 11. When the handle 10 rotates, the pulley 9 rotates along the inclined surface of the lifting structural member 11, and the contact point with the pulley 9 changes, so as to drive the height of the movable plate 8 to change, realizing the adjustment of the height of the movable plate 8; the lifting limit bearing 5 is fixedly installed on the first support side plate 17, playing a role in restricting the moving range of the lifting assembly to ensure that the equipment will not exceed the predetermined height or position during the lifting process; one end of the movable shaft 6 is fixedly connected to the bottom of the support plate 4, and the other end is slidably connected to the lifting limit bearing 5. The design of the movable shaft 6 allows the support plate 4 to move up and down under the guidance of the lifting limit bearing 5, realizing the adjustment of the height of the side of the support plate 4 away from the lifting structural member 11 following the rotation of the handle 10.

[0039] Continue to refer to Figure 1 As shown, the programming mechanism further includes a first test pin fixing plate 21 and a second test pin fixing plate 22; the first test pin fixing plate 21 is fixedly installed at the middle position of the test pins 15 fixed on the first PCB board 13 and is close to the bottom of the support frame 19; the second test pin fixing plate 22 is fixedly installed at the middle position of the test pins 15 fixed on the second PCB board 14 and is close to the top of the movable plate 8.

[0040] It should be noted that in this embodiment, both the first test pin fixing plate 21 and the second test pin fixing plate 22 are to ensure the firm installation of the test pins 15 and their reliability during the SPD programming process.

[0041] Continue to refer to Figure 1 As shown, the programming mechanism further includes a test pin guard plate 20. The test pin guard plate 20 is fixedly installed on one side, and the test pin guard plate 20 is sleeved on the needle heads of the test pins 15 fixed on the first PCB board 13.

[0042] It should be noted that in this embodiment, the test pin guard plate 20 is designed to protect the test pins 15 fixed on the first PCB board 13 from damage when the SPD programming is completed or the programming fixture is not working.

[0043] A third pin hole is provided on the test pin guard plate 20, and the needle tip of the test pin 15 fixed to the first PCB board 13 is inserted into the third pin hole. The distribution position of the third pin hole is adapted to the test pin 15 fixed on the first PCB board 13, and the size of the third pin hole is slightly larger than the size of the test pin 15.

[0044] It should be noted that in this embodiment, the design of the third pin hole is to enable the test pin 15 fixed on the first PCB board to pass through the third pin hole and then through the first pin hole to contact the gold finger of the memory module 1 during the SPD programming process; the design of the size of the third pin hole being slightly larger than the size of the test pin 15 is to prevent the test pin 15 from colliding with other pins when passing through the third pin hole, thereby protecting the test pin 15 fixed on the second PCB board 14.

[0045] Continue to refer to Figure 1 As shown, the programming mechanism further includes a first elastic return device 23 and a second elastic return device 24; the first elastic return device 23 and the second elastic return device 24 are fixedly installed on the outer side of the guide rod 7, and the end of the first elastic return device 23 is fixedly installed at the bottom of the support plate 4, and the end of the second elastic return device 24 is fixedly installed at the top of the test pin guard plate 20.

[0046] It should be noted that in this embodiment, the first elastic device 23 is designed such that when burning the SPD, the needle tip of the test pin 15 fixed to the first PCB board 13 is exposed from the third pinhole and contacts the gold fingers of the memory module 1, and after the SPD burning is completed, the needle tip of the test pin 15 fixed to the first PCB board 13 automatically rebounds into the third pinhole; the second elastic device 24 is designed such that when burning the SPD, the needle tip of the test pin 15 fixed to the second PCB board 14 is exposed from the second pinhole and contacts the gold fingers of the memory module 1, and after the SPD burning is completed, the needle tip of the test pin 15 fixed to the second PCB board 14 automatically rebounds into the second pinhole; when specifically implementing the present utility model, when it is necessary to burn the SPD of the memory module 1, the lifting assembly is used to raise the driving memory module supporting mechanism, and the springs at the ends of the first elastic device 23 and the second elastic device 24 are compressed, so that the needle tip of the test pin 15 fixed to the first PCB board 13 is exposed from the third pinhole and passes through the first pinhole to contact the gold fingers of the memory module 1, and the needle tip of the test pin 15 fixed to the second PCB board 14 is exposed from the second pinhole and contacts the gold fingers of the memory module 1. At this time, the burner 12 burns the SPD of the memory module 1. After the SPD burning is completed, the lifting assembly lowers the driving memory module supporting mechanism. At this time, the springs at the ends of the first elastic device 23 and the second elastic device 24 are both released, so that the needle tip of the test pin 15 fixed to the first PCB board 13 automatically rebounds into the third pinhole; the needle tip of the test pin 15 fixed to the second PCB board 14 automatically rebounds into the second pinhole. In this process, the automation of the exposure and retraction of the needle tip of the test pin 15 is realized. This kind of automation design reduces the risk of misoperation during the operation process, thereby helping to achieve high-quality and high-efficiency burning operations and at the same time extending the service life of the equipment.

[0047] The above is a specific description of the preferred embodiment of the present utility model, but the present utility model is not limited to the above embodiment. Those skilled in the art can make various equivalent deformations or substitutions without departing from the spirit of the present utility model, and these equivalent deformations or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A traceless burning fixture based on a memory module, characterized in that: The memory module-based traceless burning fixture includes: The memory module supporting mechanism comprises a support plate, a guide rail and a memory module limiting tray, wherein the guide rail is fixedly mounted on the top surface of the support plate; the memory module limiting tray is slidably connected to the guide rail; The burning mechanism comprises a burner, a first PCB circuit board, a second PCB circuit board and a test needle; the first PCB circuit board is connected between the burner and the second PCB circuit board, and the burner and the first PCB circuit board are both located at the top of the memory module supporting mechanism, and the second PCB board is located at the bottom of the memory module supporting mechanism; the needle tail of the test needle is fixed on the first PCB board and the second PCB board, the needle head faces the memory module supporting mechanism, and the needle head of the test needle is round, and the test needles corresponding to the gold fingers of the memory module are staggered in double needles; The lifting assembly is installed at the bottom of the memory module supporting mechanism and is used to drive the memory module supporting mechanism to perform reciprocating motion in the vertical direction.

2. According to claim 1, a memory module-based traceless burning fixture is characterized in that: The memory module supporting mechanism also includes a memory module guard plate, and the memory module guard plate is hinged to the top of one end of the inner mold module limiting tray close to the burning mechanism.

3. The memory module-based traceless burning fixture according to claim 2, characterized in that: The memory module guard plate is provided with a plurality of first pinholes, the distribution positions of the first pinholes are adapted to the test pins fixed on the first PCB board, and the size of the first pinholes is slightly larger than the size of the test pins.

4. The memory module-based traceless burning fixture according to claim 1, characterized in that: A plurality of second pinholes are arranged on the support plate, and the distribution positions of the second pinholes are matched with the test pins fixed on the second PCB board, and the size of the second pinholes is slightly larger than the size of the test pins.

5. The memory module-based traceless burning fixture according to claim 1, characterized in that: The traceless burning fixture also includes a supporting component, which includes a supporting base plate, a first supporting side plate, a second supporting side plate, a supporting frame and a supporting block; the first supporting side plate and the second supporting side plate are both vertically arranged on the supporting base plate, and the first supporting side plate is close to the bottom of the support plate, and the second supporting side plate is close to one end of the memory module supporting mechanism close to the burning mechanism; the supporting frame is fixedly installed on the top of the second supporting side plate; the supporting block is fixedly installed on the supporting base plate and is located at the bottom of the burning mechanism.

6. The memory module-based traceless burning fixture according to claim 5, characterized in that: The lifting assembly includes a lifting limit bearing, a movable shaft, a guide rod, a handle, a movable plate, a pulley and a lifting structure; the lifting limit bearing is fixedly installed on the side of the first support side plate close to the burning mechanism; one end of the movable shaft is fixedly connected to the bottom of the support plate, and the other end is slidably connected to the lifting limit bearing; the guide rod is vertically arranged on the support bottom plate and is located on both sides of the support block; one end of the handle is fixedly connected to the lifting structure and is rotatably connected to the support block; the movable plate is slidably connected to the guide rod; the pulley is installed on one side of the movable plate and contacts with the inclined surface of the lifting structure.

7. The memory module-based traceless burning fixture according to claim 6, characterized in that: The burning mechanism also includes a first test needle fixing plate and a second test needle fixing plate; the first test needle fixing plate is fixedly installed at the middle position of the test needle fixed on the first PCB board and is close to the bottom of the support frame; the second test needle fixing plate is fixedly installed at the middle position of the test needle fixed on the second PCB board and is close to the top of the movable plate.

8. The memory module-based traceless burning fixture according to claim 6, characterized in that: The burning mechanism also includes a test needle guard plate, which is fixedly installed on one side and sleeved on the needle head of the test needle fixed on the first PCB board.

9. The memory module-based traceless burning fixture according to claim 8, characterized in that: A third pinhole is provided on the test needle guard plate, and the needle head of the test needle fixed on the first PCB board is inserted into the third pinhole. The distribution position of the third pinhole is adapted to the test needle fixed on the first PCB board, and the size of the third pinhole is slightly larger than that of the test needle.

10. The memory module-based traceless burning fixture according to claim 9, characterized in that: The burning mechanism also includes a first rebound device and a second rebound device; the first rebound device and the second rebound device are fixedly installed on the outer side of the guide rod, and the end of the first rebound device is fixedly installed on the bottom of the support plate, and the end of the second rebound device is fixedly installed on the top of the test needle guard plate.

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