Convenient-to-install cooling sheet applied to mobile phone mainboard

Abstract

The utility model discloses a convenient-to-install heat dissipation sheet applied to a mobile phone mainboard, which comprises a silica gel protective film, a graphite heat dissipation assembly, a PET original film, a transparent protective film, a first release film and a second release film, an installation groove is arranged in the silica gel protective film, the graphite heat dissipation assembly is connected above the silica gel protective film through colloid, and the graphite heat dissipation assembly is connected above the transparent protective film through colloid. The front side and the rear side of the graphite heat dissipation assembly are each provided with a PET original film, the PET original films are connected with a silica gel protection film through colloid, the upper portions of the PET original films are connected with a transparent protection film through colloid, and the lower portion of the silica gel protection film is connected with a first release film in an adhering mode. According to the heat dissipation sheet convenient to install and applied to the mobile phone mainboard, the graphite heat dissipation assembly can be rapidly installed in the middle of the silica gel protective film, installation and combination are convenient, the heat conduction influence of the graphite adhesive layer is reduced, the better heat dissipation effect is achieved, the use amount of manufacturing materials of the second release film is reduced, and material consumption is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of mobile phone mainboards, in particular to a heat dissipation sheet material which is easy to install and applied to mobile phone mainboards. Background Art

[0002] The mobile phone motherboard is an important part of the mobile phone. In order to improve the performance of the mobile phone, a heat sink is installed on the mobile phone motherboard so that the components on the mobile phone motherboard can quickly dissipate heat and extend the service life of the mobile phone. The heat sink is mainly made of graphite material;

[0003] The Chinese utility model patent with the authorization announcement number CN210381721U discloses a heat dissipation sheet material applied to mobile phone motherboards, including a silicone protective film, a graphite heat dissipation component, a PET original film, a transparent protective film, a first release film and a second release film. The silicone protective film is provided with a middle setting area and two side setting areas; the graphite heat dissipation component is provided in the middle setting area, and the center line of the graphite heat dissipation component coincides with the center line of the silicone protective film; there are two PET original films, and the two PET original films are respectively provided in the two side setting areas; the transparent protective film is provided on the graphite heat dissipation component and covers the PET original film; the first release film is provided at the bottom end of the silicone protective film; the second release film is provided at the bottom end of the first release film. The heat dissipation sheet material of the present application is not only simple in structure, but also easy to install. As long as the second release film is removed, the heat dissipation sheet material can be installed and set; at the same time, through the provision of the graphite heat dissipation component, the heat generated on the mobile phone motherboard can be quickly dissipated, ensuring the overall heat dissipation effect of the mobile phone;

[0004] However, the existing heat dissipation sheets applied to mobile phone motherboards are not convenient for quickly installing the graphite heat dissipation component in the middle of the silicone protective film during assembly and installation. The first graphite sheet is connected to the second graphite sheet by gluing the graphite adhesive layer, but the graphite adhesive layer covers the gap between the first graphite sheet and the second graphite sheet. A better heat dissipation effect cannot be achieved by simply reducing the thickness of the graphite adhesive layer. When the heat dissipation sheet is installed on the mobile phone motherboard, the second release film needs to be peeled off. The second release film is not used on the mobile phone motherboard, but the area of ​​the existing second release film is much larger than that of the first release film, which increases material consumption. Therefore, we propose a heat dissipation sheet applied to mobile phone motherboards that is easy to install in order to solve the above-mentioned problems. Utility Model Content

[0005] The purpose of the present utility model is to provide a heat dissipation sheet for a mobile phone motherboard that is convenient for installation, so as to solve the problems in the above-mentioned background technology. For the existing heat dissipation sheet for a mobile phone motherboard, during combined installation, it is not convenient to quickly install the graphite heat dissipation component in the middle of the silicone protective film. The first graphite sheet is adhesively connected to the second graphite sheet through a graphite adhesive layer, but the graphite adhesive layer fills the gap between the first graphite sheet and the second graphite sheet. Only by reducing the thickness of the graphite adhesive layer, a better heat dissipation effect cannot be achieved. When installing the heat dissipation sheet on the mobile phone motherboard, the second release film needs to be peeled off. The second release film is not used on the mobile phone motherboard, but the area of the existing second release film is much larger than that of the first release film, increasing the material consumption problem.

[0006] To achieve the above purpose, the present utility model provides the following technical solution: A heat dissipation sheet for a mobile phone motherboard that is convenient for installation, including a silicone protective film, a graphite heat dissipation component, a PET original film, a transparent protective film, a first release film, and a second release film:

[0007] An installation groove is provided inside the silicone protective film. The graphite heat dissipation component is connected above the silicone protective film through a colloid, and PET original films are arranged on both the front and rear sides of the graphite heat dissipation component. The PET original film is connected to the silicone protective film through a colloid, and a transparent protective film is connected above the PET original film through a colloid;

[0008] The first release film is adhesively connected below the silicone protective film, and the second release film is adhesively connected below the first release film.

[0009] Preferably, the graphite heat dissipation component includes a first graphite sheet, a graphite installation strip, a graphite adhesive layer, a second graphite sheet, and a complementary graphite sheet.

[0010] Preferably, the first graphite sheet and the graphite installation strip form an integral structure, and the thickness dimension of the graphite installation strip is equal to the depth dimension of the installation groove.

[0011] Preferably, the center line of the graphite installation strip coincides with the center line of the first graphite sheet.

[0012] Preferably, the first graphite sheet is adhesively connected to the second graphite sheet through a graphite adhesive layer, and the graphite adhesive layer is in a frame structure.

[0013] Preferably, the second graphite sheet and the complementary graphite sheet form an integral structure.

[0014] Preferably, the left end cross-section of the second release film is in a "concave" shape structure, and the thickness dimension of the second release film is smaller than the thickness dimension of the first release film.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows: The heat sink sheet for mobile phone motherboard that is easy to install can quickly install the graphite heat dissipation component in the middle of the silicone protective film, facilitating installation and combination, reducing the heat conduction influence of the graphite adhesive layer, achieving a better heat dissipation effect, reducing the material consumption of the second release film, and reducing material waste.

[0016] 1. An installation groove is provided in the middle of the silicone protective film, and a graphite installation strip is integrally connected to the middle of the first graphite sheet. During combination, the graphite installation strip is inserted into the interior of the installation groove, and thus the graphite heat dissipation component can be quickly installed in the middle of the silicone protective film, facilitating installation and combination.

[0017] 2. The first graphite sheet is connected to the second graphite sheet through a graphite adhesive layer with a frame structure, reducing the contact area between the graphite adhesive layer and the first graphite sheet and the second graphite sheet, and reducing the heat conduction influence of the graphite adhesive layer.

[0018] 3. The left end cross-section of the second release film has a "concave" shape structure, and the thickness dimension of the second release film is smaller than the thickness dimension of the first release film. By changing the second release film in terms of thickness and shape, the material consumption for manufacturing the second release film is reduced, and material waste is decreased. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic exploded view of the present utility model;

[0020] Figure 2 is a schematic axonometric view of the present utility model;

[0021] Figure 3 is a schematic bottom-up exploded view of the graphite heat dissipation component of the present utility model;

[0022] Figure 4 is a schematic view of the connection structure between the silicone protective film and the first graphite sheet of the present utility model;

[0023] Figure 5 is a schematic view of the connection structure between the PET base film and the silicone protective film of the present utility model.

[0024] In the figure: 1, silicone protective film; 2, installation groove; 3, graphite heat dissipation component; 301, first graphite sheet; 302, graphite installation strip; 303, graphite adhesive layer; 304, second graphite sheet; 305, supplementary graphite sheet; 4, PET base film; 5, transparent protective film; 6, first release film; 7, second release film. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0026] Embodiment 1: Please refer to Figures 1 - 5 , for the existing heat sink sheet applied to the mobile phone motherboard, during the combined installation, it is not convenient to quickly install the graphite heat dissipation component 3 in the middle of the silicone protective film 1. To solve this technical problem, the following technical content is disclosed in this embodiment;

[0027] A heat sink sheet applied to the mobile phone motherboard that is convenient for installation, including a silicone protective film 1, a graphite heat dissipation component 3, a PET original film 4, a transparent protective film 5, a first release film 6 and a second release film 7. An installation groove 2 is provided inside the silicone protective film 1. The graphite heat dissipation component 3 is connected above the silicone protective film 1 through a colloid. PET original films 4 are arranged on both the front and rear sides of the graphite heat dissipation component 3. The PET original films 4 are connected to the silicone protective film 1 through a colloid. A transparent protective film 5 is connected above the PET original films 4 through a colloid. The graphite heat dissipation component 3 includes a first graphite sheet 301, a graphite installation strip 302, a graphite adhesive layer 303, a second graphite sheet 304 and a complementary graphite sheet 305. The first graphite sheet 301 and the graphite installation strip 302 form an integral structure, and the thickness dimension of the graphite installation strip 302 is equal to the depth dimension of the installation groove 2. The center line of the graphite installation strip 302 coincides with the center line of the first graphite sheet 301. The first graphite sheet 301 is adhesively connected to the second graphite sheet 304 through the graphite adhesive layer 303;

[0028] Since the installation groove 2 is provided in the middle position of the silicone protective film 1 and the graphite installation strip 302 is integrally installed in the middle position of the first graphite sheet 301, during the combination, the graphite installation strip 302 is snapped into the inside of the installation groove 2, and then the graphite heat dissipation component 3 can be installed in the middle position of the silicone protective film 1, which is convenient for quickly installing the silicone protective film 1 and the graphite heat dissipation component 3;

[0029] Embodiment 2: The technical content disclosed in this embodiment is a further improvement based on the above Embodiment 1. The first graphite sheet 301 is adhesively connected to the second graphite sheet 304 through the graphite adhesive layer 303, but the graphite adhesive layer 303 fills the gap between the first graphite sheet 301 and the second graphite sheet 304. Only by reducing the thickness of the graphite adhesive layer 303, a better heat dissipation effect cannot be achieved. To further solve this technical problem, the following technical content is disclosed in this embodiment, as shown in Figure 1 and Figure 3 shown;

[0030] The graphite adhesive layer 303 is in a frame structure, and the second graphite sheet 304 and the complementary graphite sheet 305 form an integral structure;

[0031] By pasting the second graphite sheet 304 and the first graphite sheet 301 with the frame-structured graphite adhesive layer 303, the second graphite sheet 304 and the first graphite sheet 301 can be comprehensively connected, and the usage area of the graphite adhesive layer 303 can be reduced. The complementary graphite sheet 305 on the second graphite sheet 304 is in large-area contact with the first graphite sheet 301, achieving a better heat dissipation effect;

[0032] Embodiment 3: Please refer to Figures 1 - 5 , for the existing heat sink sheet applied to the mobile phone motherboard, when installing the heat sink sheet on the mobile phone motherboard, it is necessary to remove the second release film 7. The second release film 7 is not used on the mobile phone motherboard, but the area of the existing second release film 7 is much larger than that of the first release film 6, increasing the material consumption. To solve this technical problem, the following technical content is disclosed in this embodiment;

[0033] A first release film 6 is adhesively connected below the silica gel protective film 1, and a second release film 7 is adhesively connected below the first release film 6. The left end cross-section of the second release film 7 is in a "concave" shape structure, and the thickness dimension of the second release film 7 is smaller than the thickness dimension of the first release film 6;

[0034] Reduce the material consumption of the second release film 7 by reducing the thickness of the second release film 7 and changing the shape of the second release film 7, and reduce the material consumption;

[0035] The above completes a series of operations of the heat sink sheet applied to the mobile phone motherboard that is easy to install. The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0036] The standard parts used in the present utility model can all be purchased from the market. The special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part all adopt conventional means such as bolts, rivets, and welding that are mature in the prior art. The machines, parts, and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be elaborated here.

[0037] Although the present utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A heat dissipation sheet material for mobile phone motherboards that is easy to install, comprising a silicone protective film (1), a graphite heat dissipation component (3), a PET original film (4), a transparent protective film (5), a first release film (6) and a second release film (7), characterized in that: The silicone protective film (1) has an installation groove (2) formed inside, the upper part of the silicone protective film (1) is connected to a graphite heat dissipation component (3) via a colloid, and PET original films (4) are provided on both the front and rear sides of the graphite heat dissipation component (3), the PET original film (4) is connected to the silicone protective film (1) via a colloid, and the upper part of the PET original film (4) is connected to a transparent protective film (5) via a colloid; A first release film (6) is bonded and connected below the silicone protective film (1), and a second release film (7) is bonded and connected below the first release film (6).

2. The heat dissipation sheet material for mobile phone motherboard that is easy to install according to claim 1 is characterized in that: The graphite heat dissipation component (3) comprises a first graphite sheet (301), a graphite mounting strip (302), a graphite adhesive layer (303), a second graphite sheet (304) and a complementary graphite sheet (305).

3. The heat dissipation sheet material for mobile phone motherboard that is easy to install according to claim 2 is characterized in that: The first graphite sheet (301) and the graphite mounting strip (302) form an integrated structure, and the thickness dimension of the graphite mounting strip (302) is equal to the depth dimension of the mounting groove (2).

4. The heat dissipation sheet material for mobile phone motherboard that is easy to install according to claim 2 is characterized in that: The center line of the graphite mounting strip (302) coincides with the center line of the first graphite sheet (301).

5. The heat dissipation sheet material for mobile phone motherboard that is easy to install according to claim 2, characterized in that: The first graphite sheet (301) is bonded and connected to the second graphite sheet (304) via a graphite adhesive layer (303), and the graphite adhesive layer (303) is in a frame-shaped structure.

6. The heat dissipation sheet material for mobile phone motherboard that is easy to install according to claim 2, characterized in that: The second graphite sheet (304) and the complementary graphite sheet (305) form an integrated structure.

7. The heat dissipation sheet material for mobile phone motherboard that is easy to install according to claim 1, characterized in that: The cross section of the left end of the second release film (7) presents a "concave"-shaped structure, and the thickness of the second release film (7) is smaller than the thickness of the first release film (6).

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