Iron core clamp leakage current sensor system supporting simultaneous acquisition of multi-dimensional data

Abstract

The utility model discloses an iron core clamp leakage current sensor system supporting simultaneous acquisition of multi-dimensional data, and the system comprises a sensor body, the sensor body comprises an MCU module, a leakage current module, a temperature module, a humidity module and an air pressure module, the leakage current module collects a transformer iron core clamp leakage current signal and outputs the signal to the MCU module, and the temperature module is connected with the temperature module; the temperature module collects transformer environment temperature signals and outputs the transformer environment temperature signals to the MCU module, the humidity module collects transformer environment humidity signals and outputs the transformer environment humidity signals to the MCU module, and the air pressure module collects transformer environment air pressure signals and outputs the transformer environment air pressure signals to the MCU module. The MCU module performs compensation operation based on the leakage current signal, the temperature signal, the humidity signal and the air pressure signal to obtain a compensated leakage current value and outputs the compensated leakage current value, the temperature signal, the humidity signal and the air pressure signal, so that simultaneous acquisition of multi-dimensional data is realized; multi-dimensional data can be effectively utilized to carry out compensation calculation of main data, and more accurate data acquisition is realized.

Description

Technical Field

[0001] The present application relates to the technical field of leakage current sensor systems, and in particular to a core clamp leakage current sensor system that supports simultaneous multi-dimensional data collection. Background Art

[0002] The core clamp leakage current sensor system is a sensor that collects transformer core clamp leakage current data. After the sensor collects data, it outputs analog signals and digital signals. Compared with analog signal output, digital signal output has better anti-interference performance in power grid scenarios.

[0003] Most of the existing products are based on the collection of single data. In fact, after analyzing the running data, it is found that the data is not single-dimensional. Other factors in the environment will more or less affect the target collection data. For example, the common temperature has an impact on pressure. As the temperature rises, the pressure will increase, and as the temperature decreases, the pressure will decrease. For the collection of leakage current on the transformer, the working state of the transformer, the temperature, humidity, and air pressure in the environment may have an impact, or affect the collection of the final data.

[0004] Therefore, if the product can be designed as a leakage current sensor that integrates multi-dimensional and multi-factor data and collects temperature, humidity and air pressure while collecting leakage current, and at the same time reserves an expansion interface to support the access of other collection factors, the product function will be more complete and more competitive. Utility Model Content

[0005] The purpose of the present application is to provide a core clamp leakage current sensor system that supports simultaneous multi-dimensional data collection to solve the technical problems in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a core clamp leakage current sensor system that supports simultaneous multi-dimensional data acquisition, comprising: a sensor body, the sensor body comprising an MCU module, a leakage current module, a temperature module, a humidity module and an air pressure module, the leakage current module collects the transformer core clamp leakage current signal and outputs it to the MCU module, the temperature module collects the transformer ambient temperature signal and outputs it to the MCU module, the humidity module collects the transformer ambient humidity signal and outputs it to the MCU module, the air pressure module collects the transformer ambient air pressure signal and outputs it to the MCU module, the MCU module performs compensation calculations based on the leakage current signal, temperature signal, humidity signal and air pressure signal to obtain a compensated leakage current value and outputs the compensated leakage current value, temperature signal, humidity signal and air pressure signal.

[0007] The iron core clamp leakage current sensor system that supports simultaneous multi-dimensional data acquisition realizes simultaneous multi-dimensional data acquisition. It can effectively utilize multi-dimensional data for compensation calculation of master data to achieve more accurate data acquisition. Compared with the individual installation of multiple sensors, the centralized collection of multiple data occupies a smaller and more compact volume, can adapt to more installation scenarios, and solves the problem that the leakage current sensor only collects current data alone and ignores other factor data such as temperature, humidity, and air pressure, resulting in some data being misjudged as faults.

[0008] Preferably, the leakage current module is connected to the MCU module through a current-to-voltage conditioning circuit and an ADC module. The current-to-voltage conditioning circuit converts the leakage current signal into a voltage signal and sends it to the ADC module, and the ADC module converts the voltage signal into a digital signal and outputs it to the MCU module.

[0009] Preferably, the MCU module includes chip U18.1. The 5th and 6th interfaces of chip U18.1 are connected to crystal oscillator X3, and the 3rd and 4th interfaces of chip U18.1 are connected to crystal oscillator X2 to provide an accurate time reference for the microcontroller.

[0010] Preferably, the MCU module is connected to the temperature and humidity sensor and the air pressure sensor through the I2C interface to read temperature, humidity, and air pressure data.

[0011] Preferably, the MCU module outputs and reports the compensated leakage current value, temperature signal, humidity signal, and air pressure signal together through the 485 interface.

[0012] Preferably, the temperature and humidity sensor includes chip U3. A resistor R8 and a capacitor C10 are connected to the 2nd interface of chip U3. Resistor R8 and capacitor C10 are connected between the +3.3V power supply and GND for power supply filtering to reduce the influence of power supply noise on the circuit.

[0013] Preferably, the air pressure sensor includes chip U4. The 3rd interface of chip U4 is connected to the SDA data signal line, and the 4th interface of chip U4 is connected to the SCL clock signal line. The SDA data signal line and the SCL clock signal line are respectively connected to the +3.3V power supply through resistors. The 7th and 8th interfaces of chip U4 are respectively connected to capacitor C11 and capacitor C12. Capacitor C11 and capacitor C12 are connected in parallel between the +3.3V power supply and GND to play a role in power supply filtering.

[0014] Compared with the prior art, the beneficial effects of the present application are as follows: The present application realizes the simultaneous acquisition of multi-dimensional data. It can effectively utilize multi-dimensional data for the compensation calculation of master data, achieving more accurate data acquisition. Compared with the individual installation of multiple sensors, the integration of multiple data occupies a smaller and more compact volume, can adapt to more installation scenarios, and solves the problem that the leakage current sensor only collects current data alone and ignores other factor data such as temperature, humidity, and air pressure, resulting in some data being misjudged as faults. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 FIG. 6 is a front view structural schematic diagram of the iron core clamp leakage current sensor system supporting simultaneous acquisition of multi-dimensional data according to Embodiment 1 of the present application;

[0016] Figure 2 FIG. 10 is a three-dimensional structural schematic diagram of the iron core clamp leakage current sensor system supporting simultaneous acquisition of multi-dimensional data according to Embodiment 1 of the present application;

[0017] Figure 3 FIG. 14 is a circuit connection schematic diagram of the MCU module of the iron core clamp leakage current sensor system supporting simultaneous acquisition of multi-dimensional data according to Embodiment 1 of the present application;

[0018] Figure 4 FIG. 18 is a circuit connection schematic diagram of the temperature and humidity sensor of the iron core clamp leakage current sensor system supporting simultaneous acquisition of multi-dimensional data according to Embodiment 1 of the present application;

[0019] Figure 5 FIG. 22 is a circuit connection schematic diagram of the air pressure sensor of the iron core clamp leakage current sensor system supporting simultaneous acquisition of multi-dimensional data according to Embodiment 1 of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0021] Embodiment 1

[0022] As Figures 1 to 5As shown in the figure, a leakage current sensor system for the iron core clamping device that supports simultaneous acquisition of multi-dimensional data includes: a sensor body 1. The sensor body 1 includes an MCU module, a leakage current module, a temperature module, a humidity module, and a pressure module. The leakage current module collects the leakage current signal of the transformer iron core clamping device and outputs it to the MCU module. The temperature module collects the ambient temperature signal of the transformer and outputs it to the MCU module. The humidity module collects the ambient humidity signal of the transformer and outputs it to the MCU module. The pressure module collects the ambient pressure signal of the transformer and outputs it to the MCU module. The MCU module performs compensation operations based on the leakage current signal, temperature signal, humidity signal, and pressure signal to obtain the compensated leakage current value, and outputs the compensated leakage current value, temperature signal, humidity signal, and pressure signal.

[0023] In this embodiment, the temperature module and the humidity module are implemented by a temperature and humidity sensor, and the pressure module is implemented by a pressure sensor. The MCU module is connected to the temperature and humidity sensor and the pressure sensor through the I2C interface to read the temperature, humidity, and pressure data. The leakage current module is connected to the MCU module through a current-to-voltage conditioning circuit and an ADC module. The current-to-voltage conditioning circuit converts the leakage current signal into a voltage signal and sends it to the ADC module. The ADC module converts the voltage signal into a digital signal and outputs it to the MCU module. The MCU module includes a chip U18.1. The 5th and 6th interfaces of the chip U18.1 are connected to a crystal oscillator X3 with a frequency of 8 MHz. The 3rd and 4th interfaces of the chip U18.1 are connected to a crystal oscillator X2 with a frequency of 32.768 kHz. The crystal oscillator X3 with a frequency of 8 MHz is used for high-speed operation, while the crystal oscillator X2 with a frequency of 32.768 kHz is used as the clock source in the low-power mode to provide an accurate time reference for the microcontroller. The SWD interface of the chip U18.1 is a standard interface for programming and debugging the STM32 chip, and it includes two pins, SWDIO and SWCLK. The temperature and humidity sensor includes a chip U3. A resistor R8 and a capacitor C10 are connected to the 2nd interface of the chip U3. The resistor R8 and the capacitor C10 are connected between the +3.3V power supply and the GND for power supply filtering to reduce the influence of power supply noise on the circuit. The pressure sensor includes a chip U4. The 3rd interface of the chip U4 is connected to the SDA data signal line, and the 4th interface of the chip U4 is connected to the SCL clock signal line. The SDA data signal line and the SCL clock signal line are respectively connected to the +3.3V power supply through resistors. The 7th and 8th interfaces of the chip U4 are respectively connected to a capacitor C11 and a capacitor C12. The capacitor C11 and the capacitor C12 are connected in parallel between the +3.3V power supply and the GND to play a role in power supply filtering.

[0024] It will be apparent to those skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, in all respects, the embodiments should be regarded as exemplary and non-limiting. The scope of the present application is defined by the appended claims rather than the above description. Accordingly, all changes that fall within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present application. Any reference signs in the claims should not be construed as limiting the claims involved.

Claims

1. A leakage current sensor system for iron core clamping parts that supports simultaneous acquisition of multi-dimensional data, characterized in that, Comprising: A sensor body (1), the sensor body (1) includes an MCU module, a leakage current module, a temperature module, a humidity module, and a barometric pressure module. The leakage current module collects the leakage current signal of the transformer core clamp and outputs it to the MCU module. The temperature module collects the ambient temperature signal of the transformer and outputs it to the MCU module. The humidity module collects the ambient humidity signal of the transformer and outputs it to the MCU module. The barometric pressure module collects the ambient barometric pressure signal of the transformer and outputs it to the MCU module. The MCU module performs compensation operations based on the leakage current signal, temperature signal, humidity signal, and barometric pressure signal to obtain the compensated leakage current value, and outputs the compensated leakage current value, temperature signal, humidity signal, and barometric pressure signal.

2. The iron core clamp leakage current sensor system for supporting simultaneous acquisition of multi-dimensional data according to claim 1, characterized in that: The leakage current module is connected to the MCU module through a current-to-voltage conditioning circuit and an ADC module. The current-to-voltage conditioning circuit converts the leakage current signal into a voltage signal and sends it to the ADC module. The ADC module converts the voltage signal into a digital signal and outputs it to the MCU module.

3. A leakage current sensor system for iron core clamp pieces supporting simultaneous acquisition of multi-dimensional data according to claim 1, characterized in that: The MCU module includes a chip U18.

1. The 5th and 6th interfaces of the chip U18.1 are connected to the crystal oscillator X3, and the 3rd and 4th interfaces of the chip U18.1 are connected to the crystal oscillator X2 to provide an accurate time reference for the microcontroller.

4. The leakage current sensor system for the iron core clamping part supporting simultaneous acquisition of multi-dimensional data according to claim 3, wherein: The MCU module is connected to the temperature and humidity sensor and the barometric pressure sensor through the I2C interface to read the temperature, humidity, and barometric pressure data.

5. The leakage current sensor system for iron core clamping parts supporting simultaneous multi-dimensional data acquisition according to claim 3, wherein: The MCU module outputs and reports the compensated leakage current value, temperature signal, humidity signal, and barometric pressure signal together through the 485 interface.

6. The leakage current sensor system for the iron core clamping part supporting simultaneous acquisition of multi-dimensional data according to claim 4, wherein: The temperature and humidity sensor includes a chip U3. A resistor R8 and a capacitor C10 are connected to the 2nd interface of the chip U3. The resistor R8 and the capacitor C10 are connected between the +3.3V power supply and GND for power supply filtering to reduce the influence of power supply noise on the circuit.

7. The leakage current sensor system of the core clamping device supporting simultaneous acquisition of multi-dimensional data according to claim 4, wherein: The barometric pressure sensor includes a chip U4. The 3rd interface of the chip U4 is connected to the SDA data signal line, and the 4th interface of the chip U4 is connected to the SCL clock signal line. The SDA data signal line and the SCL clock signal line are respectively connected to the +3.3V power supply through resistors. The 7th and 8th interfaces of the chip U4 are respectively connected to the capacitor C11 and the capacitor C12. The capacitor C11 and the capacitor C12 are connected in parallel between the +3.3V power supply and GND, playing a role in power supply filtering.

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