Testing device of sensing chip
By designing a sensing chip test device, the problem that traditional test fixtures cannot be tested in batches is solved, and efficient and accurate sensing chip detection is achieved, which is suitable for batch testing of magnetic sensing chips.
Patent Information
- Application Number
- CN202421932095.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-09
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-08-09
AI Technical Summary
Traditional sensing chip test fixtures cannot be tested in batches under the same environmental stress conditions, the test efficiency is low, the sensitivity output accuracy is poor, and the operator's skills are high, and it is prone to errors.
A sensing chip testing device is designed, including a printed circuit fixture substrate, a plug-in motherboard test base and a communication interface. The plug-in motherboard test base is equipped with multiple plug-in interfaces. The pins of the plug-in sensor chip to be tested are connected to the communication interface through the wiring in the printed circuit fixture substrate, supporting the simultaneous detection of multiple chips, and data is collected uniformly through an external test system.
It realizes batch detection of multiple sensing chips under the same environmental conditions, improves detection efficiency and accuracy of experimental data, and is suitable for batch testing of magnetic sensing chips.
Smart Images
Figure CN223065446U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of device detection, and particularly relates to a test device for a sensing chip. Background Art
[0002] During the design and production process of sensing chips, it is necessary to quickly collect the high and low temperature performance and monitor the reliability of each batch of products to ensure the stable quality of the products leaving the factory.
[0003] At present, the test fixture used by relevant enterprises of sensing chips in finished product testing is a single-chip test fixture, which has low test efficiency, poor sensitivity output accuracy, high requirements for the quality of test personnel and is prone to errors, and cannot complete the environmental test and batch test of products under the same conditions. Summary of the Utility Model
[0004] In view of this, the utility model provides a test device for a sensing chip to solve the problem that the traditional test tooling for sensing chips cannot perform batch testing on sensing chips under the same environmental stress conditions.
[0005] The utility model provides a test device for a sensing chip, and the device includes:
[0006] A test fixture, including a printed circuit fixture substrate, at least one plug-in header test socket and a communication interface. The plug-in header test socket is provided with a plurality of plug-in interfaces for plugging in plug-in type sensing chips to be tested. The pins of the plug-in type sensing chips to be tested plugged into the plug-in interfaces are connected to the communication interface through the wiring in the printed circuit fixture substrate, and the communication interface is used to connect to an external test system.
[0007] The test device for a sensing chip provided by the embodiment of the utility model sets a plug-in header test socket in the test fixture and a plurality of plug-in interfaces on the plug-in header test socket, so that multiple plug-in type sensing chips can be detected simultaneously, enabling multiple plug-in type sensing chips to complete batch testing under the same environmental conditions, and the external test system collects data uniformly, which not only improves the detection efficiency of the sensing chips but also ensures the accuracy of experimental data.
[0008] In an optional embodiment, the device further includes:
[0009] A magnetic field generator, including a Helmholtz coil and a fixture fixing platform, and the fixture fixing platform is used to fix the test fixture.
[0010] The test device for the sensing chip provided by the embodiment of the present utility model can be used as a test tool for the magnetic sensing chip, so that multiple plug-in sensing chips can complete batch testing under the same magnetic field conditions, and the external test system uniformly collects data to efficiently obtain the test results of the magnetic sensing chip and improve the test accuracy.
[0011] In an alternative embodiment, the plug-in female header test socket includes:
[0012] The female header is used for plugging the plug-in sensing chip to be tested;
[0013] The alignment rod is used for aligning the plug-in sensing chip to be tested plugged on the female header;
[0014] The alignment buckle is movably connected to the alignment rod. By moving the alignment buckle up and down, the alignment rod is pressed down or lifted, and it is used to detachably fix the alignment rod on the female header.
[0015] The test device for the sensing chip provided by the embodiment of the present utility model aligns the plug-in sensing chips plugged on the female header through the setting of the alignment rod and the alignment buckle and makes them in the same plane to ensure that each plug-in sensing chip to be tested is located on the plane perpendicular to the magnetic field direction.
[0016] In an alternative embodiment, the device further includes:
[0017] The chip-on-board test module is detachably connected to the plug-in female header test socket. The chip-on-board test module includes a chip-on-board product test socket for fixing the chip-on-board sensing chip to be tested.
[0018] The test device for the sensing chip provided by the embodiment of the present utility model can realize that the same test fixture is compatible with different chip package types by setting the chip-on-board test module, that is, it can be compatible with the testing of both plug-in and chip-on-board sensing chips at the same time, expanding the application range of the sensing chip test device.
[0019] In an alternative embodiment, the chip-on-board test module further includes:
[0020] The bent-pin header is fixedly connected to the chip-on-board product test socket. The bent-pin header is set to a preset bending angle, and an interface is provided on the bent-pin header, and the interface is adapted to the plug-in and unplug interface of the plug-in female header test socket.
[0021] The test device for the sensing chip provided by the embodiment of the present utility model rotates the chip-on-board product test socket 90° through the welding design of the bent-pin header to ensure that each chip-on-board sensing chip is at a preset angle, and the layout interface of the bent-pin header is adapted to the plug-in and unplug interface of the plug-in female header test socket, and it can be plugged on the plug-in female header test socket through the bent-pin header.
[0022] In an alternative embodiment, the patch test module further includes:
[0023] A printed circuit support board, fixedly connected to the bent-pin header and the patch product test socket respectively, and the patch product test socket is electrically connected to the bent-pin header through the wiring inside the printed circuit support board.
[0024] For the test device of the sensing chip provided by the embodiment of the present utility model, the patch product test socket is fixedly connected to the printed circuit support board, and the pins are connected to the bent-pin header through the internal wiring of the printed circuit support board, so as to form a test path from the patch-type sensing chip to the patch test socket, to the printed circuit support board, to the bent-pin header, to the plug-in female header test socket, and finally to the printed circuit fixture substrate, and is connected to an external test system through the communication interface.
[0025] In an alternative embodiment, the plug-in female header test socket is made of polyetheretherketone material.
[0026] For the test device of the sensing chip provided by the embodiment of the present utility model, both the plug-in female header test socket and the patch product test socket are made of polyetheretherketone material. Polyetheretherketone is an engineering plastic with excellent properties such as high temperature resistance, small thermal expansion coefficient, easy processing, and high mechanical strength. This makes the sensing chip under test placed in the high and low temperature test chamber stable in position and not easily deflected in the magnetic field, and the deformation characteristics of this material improve the test accuracy. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0028] Figure 1 is a schematic structural diagram of a test fixture according to an embodiment of the present utility model;
[0029] Figure 2 is a schematic structural diagram of a magnetic field generator according to an embodiment of the present utility model;
[0030] Figure 3 is a schematic structural diagram of a plug-in female header test socket according to an embodiment of the present utility model;
[0031] Figure 4 is a schematic structural diagram of another plug-in female header test socket according to an embodiment of the present utility model;
[0032] Figure 5It is a schematic flowchart of a method for testing a sensing chip to be tested by a testing device for a sensing chip according to an embodiment of the present invention. Detailed implementation manners
[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0034] During the production process of sensing chips, to ensure product quality, high and low temperature performance and reliability tests need to be performed on each batch of products. However, current testing jigs are mostly single-chip testing fixtures, which have many limitations, such as low testing efficiency, insufficient sensitivity output accuracy, and high requirements for operator skills, and are prone to errors. Therefore, these fixtures cannot meet the need for batch environmental testing under a unified magnetic field condition.
[0035] In this embodiment, a testing device for a sensing chip is provided. The device includes:
[0036] A testing fixture, including a printed circuit fixture substrate, at least one plug-in header test socket, and a communication interface. The plug-in header test socket is provided with a plurality of plug-in interfaces for plugging in plug-in type sensing chips to be tested. The pins of the plug-in type sensing chips to be tested plugged into the plug-in interfaces are connected to the communication interface through the wiring in the printed circuit fixture substrate, and the communication interface is used to connect to an external testing system.
[0037] Please refer to Figure 1 , the testing fixture, including a printed circuit fixture substrate (i.e., a PCB fixture substrate) 1, at least one plug-in header test socket 2, and a communication interface 3. The plug-in header test socket 2 is provided with a plurality of plug-in interfaces for plugging in plug-in type sensing chips to be tested. The pins of the plug-in type sensing chips to be tested plugged into the plug-in interfaces are connected to the communication interface 3 through the wiring in the printed circuit fixture substrate 1, and the communication interface 3 is used to connect to an external testing system. This enables batch detection of multiple plug-in type sensing chips simultaneously under the same environmental stress conditions, improving the detection efficiency of the sensing chips.
[0038] In some alternative implementation manners, the device further includes:
[0039] A magnetic field generator, including a Helmholtz coil and a fixture fixing platform, where the fixture fixing platform is used to fix the testing fixture.
[0040] Please refer toFigure 2 , a magnetic field generator, comprising a Helmholtz coil 11 and a fixture fixing platform 12. The test fixture is fixed on the fixture fixing platform 12 through the positioning holes 7 provided on the fixture fixing platform 12 and the printed circuit fixture substrate 1. The magnetic field generator is used to generate a uniform magnetic field, and the test fixture is fixed on the fixture fixing platform 12 through the printed circuit fixture substrate 1, so that each sensor chip to be tested can be perpendicular to the magnetic field lines. The plug-in type sensor chip is plugged into the pluggable female header test socket 2 through a pluggable interface. The pins of the pluggable female header test socket 2 are connected to the communication interface 3 through the wiring on the printed circuit fixture substrate 1, and the communication interface 3 is further connected to an external test system, enabling multiple plug-in type sensor chips to complete batch testing under the same magnetic field conditions and realizing the real-time acquisition of experimental data by the external test system, which not only improves the detection efficiency but also ensures the accuracy of the experimental data.
[0041] In some alternative embodiments, the pluggable female header test socket 2 includes:
[0042] A female header 8 for plugging in the plug-in type sensor chip to be tested;
[0043] An alignment rod 9 for aligning the plug-in type sensor chips to be tested plugged on the female header 8;
[0044] An alignment buckle 10, which is movably connected to the alignment rod 9. By moving the alignment buckle 10 up and down, the alignment rod 9 is pressed down or lifted, and is used to fix the alignment rod 9 on the female header 8.
[0045] As Figure 3 shown, each plug-in type sensor chip can be plugged into the pluggable female header test socket 2 through the pluggable interface. However, due to the setting of the pluggable interface, it cannot ensure that each plug-in type sensor chip is on the same plane, that is, it cannot ensure that the magnetic field lines perpendicularly and uniformly pass through each plug-in type sensor chip. Therefore, by moving the alignment buckle 10 upward, the alignment rod 9 movably connected to the alignment buckle 10 will correspondingly lift upward. As Figure 4 shown, at this time, under the restraint of the alignment rod 9, each plug-in type sensor chip is on the same horizontal plane. Then, move the alignment buckle 10 downward to make the alignment rod 9 return to its original position, which is convenient for the sensor device to be inserted again for batch chip testing.
[0046] In some alternative embodiments, the device further includes:
[0047] A chip-on-board test module, which is detachably connected to the pluggable female header test socket 2. The chip-on-board test module includes a chip-on-board product test socket 4 for fixing the chip-on-board sensor chip to be tested.
[0048] As Figure 1As shown, the test fixture in the test device further includes a patch test module, enabling the test device to be compatible with batch detection of both plug-in sensing chips and patch sensing chips. Among them, the patch product test socket 4 is used to clamp the patch sensing chips and adjust the angle so that each patch sensing chip is at a preset angle required for testing.
[0049] In some alternative embodiments, the patch test module further includes:
[0050] The bent-pin header 6 is fixedly connected to the patch product test socket 4. The bent-pin header is set at a preset bending angle, and there are interfaces on the bent-pin header, which are adapted to the plug-and-unplug interfaces of the plug-in header test socket 2.
[0051] The patch product test socket 4 is placed by rotating 90° through the welding design of the bent-pin header 6. There are layout interfaces on the bent-pin header, which are adapted to the plug-and-unplug interfaces on the plug-in header test socket 2. Therefore, the patch test module can be plugged into the plug-in header test socket 2 through the bent-pin header 6, and in the same way as the test process of the plug-in sensing chip, it is connected to the external test system through the communication interface 3 provided on the plug-in header test socket 2.
[0052] In some alternative embodiments, the patch test module further includes:
[0053] The printed circuit support board 5 is fixedly connected to both the bent-pin header 6 and the patch product test socket 4 respectively. The patch product test socket 4 is electrically connected to the bent-pin header through the wiring inside the printed circuit support board 5.
[0054] As Figure 1 shown, the patch test module further includes a printed circuit support board 5. There is a printed circuit board inside the printed circuit support board 5, which is connected to the patch product test socket 4 and the bent-pin header 6 through wiring, and then connected to the external test system through the plug-in header test socket 2 and the communication interface 3, forming a test path for the patch sensing chip. The printed circuit support board 5 is non-removably connected to both the bent-pin header 6 and the patch product test socket 4 respectively. When only testing the plug-in sensing chips in the test fixture, the patch test module composed of the printed circuit support board 5, the bent-pin header 6 and the patch product test socket 4 can be removed from the printed circuit fixture substrate 1, and only the plug-in header test socket 2 and the communication interface 3 are left, and the test of the plug-in sensing chips can still be completed independently.
[0055] In some alternative embodiments, the plug-in header test socket 2 is made of polyether ether ketone material.
[0056] Considering that the pin header test socket 2 and the surface mount product test socket 4 serve as the mounting carriers for the sensing chips, they need to be resistant to high temperatures and have a small coefficient of thermal expansion when detecting different temperatures and humidities. Therefore, both are made of polyether ether ketone material, so that the sensing chips to be tested placed in the high and low temperature test chamber can maintain a stable position on the test fixture and are not easily deflected. Therefore, the deformation characteristics of this material improve the test accuracy.
[0057] In some alternative embodiments, a preset number of positioning holes are provided on both the fixture fixing platform and the printed circuit fixture substrate 1, and the test fixture is installed on the fixture fixing platform through the preset number of positioning holes.
[0058] As Figure 1 shown, a preset number of positioning holes 7 are provided on the printed circuit fixture substrate 1. As Figure 2 shown, a preset number of positioning holes 7 are also provided on the fixture fixing platform 12 in the magnetic field generator. The number of positioning holes 7 on the printed circuit fixture substrate 1 is equal to the number of positioning holes 7 on the fixture fixing platform, and both are used to fix the test fixture on the fixture fixing platform so that the pin header test socket 2 is parallel to the Helmholtz coil 11. In this way, the magnetic field lines can perpendicularly pass through each sensing chip to be tested, so that the magnitude of the peripheral magnetic field where each sensing chip is located is the same and the direction is consistent, so as to ensure the test accuracy and efficiency.
[0059] As Figure 5 shown, the method for testing the sensing chip to be tested using the above-mentioned test device for sensing chips is as follows:
[0060] Step S101, insert the plug-in type sensing chip to be tested into the pin header test socket on the test fixture; specifically, insert the plug-in type sensing chip to be tested into the plug and unplug interface on the pin header test socket.
[0061] Step S102, connect the communication interface to an external test system.
[0062] Specifically, the external test system includes a host computer.
[0063] Furthermore, the external test system can batch collect and save test data.
[0064] Step S103, place the sensing chip test device in the environmental chamber.
[0065] Step S104, adjust the temperature and humidity parameters in the environmental chamber for detection, and output the test results by the external test system.
[0066] Specifically, by adjusting the temperature and humidity parameters in the environmental chamber, the batch performance evaluation of the plug-in type sensing chip to be tested under different temperature and humidity stress conditions is completed.
[0067] As shown Figure 1 shown, insert the plug-in sensing chip to be tested into the plug-in interface on the female header test socket 2, so that the plug-in sensing chip to be tested on the female header test socket 2 is perpendicular to the printed circuit fixture substrate 1. At this time, the plug-in sensing chip to be tested forms a test path from the female header test socket 2 to the printed circuit fixture substrate 1 to the communication interface 3.
[0068] In some optional usage modes, the female header test socket 2 includes a female header 8, an alignment rod 9 and an alignment buckle 10. The method for testing the sensing chip to be tested includes:
[0069] Insert multiple plug-in sensing chips onto the female header 8;
[0070] Adjust the alignment rod 9 through the alignment buckle 10 so that multiple plug-in sensing chips are on the same plane.
[0071] As shown Figure 3 and Figure 4 shown, adjust the alignment buckle 10 to press down or lift the alignment rod 9. When the alignment rod 9 is pressed down, the plug-in sensing chips to be tested inserted on the female header will be constrained on the same horizontal plane, so that each plug-in sensing chip to be tested is perpendicular to the printed circuit fixture substrate 1, so as to ensure that each sensing chip on the test fixture is at the preset angle required for testing.
[0072] In some optional usage modes, the test device further includes a chip-on-board test module. The chip-on-board test module further includes a chip-on-board product test socket 4, a printed circuit support board 5, and bent pin headers 6. The chip-on-board product test socket 4 and the bent pin headers 6 are fixedly connected to the printed circuit support board 5. The chip-on-board product test socket 4 is electrically connected to the bent pin headers 6 through the wiring in the printed circuit support board 5. The bent pin headers 6 have a preset bending angle, and interfaces are provided on the bent pin headers, and the interfaces are adapted to the plug-in interfaces of the female header test socket 2;
[0073] The method for testing the sensing chip to be tested further includes:
[0074] Fix the chip-on-board sensing chip to the chip-on-board product test socket 4;
[0075] Insert the interfaces on the bent pin headers into the plug-in interfaces of the female test socket, and the external test system connected to the communication interface outputs the test results.
[0076] Mount multiple chip-on-board sensing chips on the chip-on-board product test socket 4. The pins of the chip-on-board product test socket 4 are connected to the bent pin headers 6 through the printed circuit support board 5, and are inserted into the female header test socket 2 through the bent pin headers 6, and are connected to the external test system through the communication interface 3 to output the test results under different temperature and humidity conditions.
[0077] In some optional usage modes, the test device further includes a magnetic field generator, and the method for testing the sensing chip to be tested further includes:
[0078] Fix the test fixture on the fixture fixing platform.
[0079] Specifically, keep the plug-in female test socket parallel to the Helmholtz coil, and fix each sensing chip on the same horizontal plane under the action of the plug-in female alignment rod, so that the plug-in sensing chip to be tested is perpendicular to the magnetic field, ensuring that the magnetic force lines perpendicularly pass through each sensing chip, and completing the batch testing of the magnetic sensing chips under the same magnetic field conditions.
[0080] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations fall within the scope defined by the appended claims.
Claims
1. A test device for a sensing chip, characterized in that The device includes: A test fixture, comprising a printed circuit fixture substrate, at least one plug-in female test socket and a communication interface. The plug-in female test socket is provided with a plurality of plug-and-play interfaces for plugging in plug-in type sensing chips to be tested. The pins of the plug-in type sensing chips to be tested plugged into the plug-and-play interfaces are connected to the communication interface through the wiring in the printed circuit fixture substrate, and the communication interface is used to connect to an external test system.
2. The device according to claim 1, characterized in that, The device further includes: A magnetic field generator, comprising a Helmholtz coil and a fixture fixing platform for fixing the test fixture.
3. The device according to claim 2, characterized in that The plug-in female test socket includes: A female header for plugging in the plug-in type sensing chips to be tested; An alignment rod for aligning the plug-in type sensing chips to be tested plugged on the female header; An alignment buckle movably connected to the alignment rod. By moving the alignment buckle up and down, the alignment rod is pressed down or lifted, and is used to fix the alignment rod on the female header.
4. The device according to claim 1, characterized in that, The device further includes: A chip-on-board test module detachably connected to the plug-in female test socket. The chip-on-board test module includes a chip-on-board product test socket for fixing chip-on-board type sensing chips to be tested.
5. The device according to claim 4, characterized in that, The chip-on-board test module further includes: Bent pin headers fixedly connected to the chip-on-board product test socket. The bent pin headers are set at a preset bending angle and are provided with interfaces adapted to the plug-and-play interfaces of the plug-in female test socket.
6. The device according to claim 5, characterized in that, The chip-on-board test module further includes: A printed circuit support board fixedly connected to the bent pin headers and the chip-on-board product test socket respectively. The chip-on-board product test socket is electrically connected to the bent pin headers through the wiring in the printed circuit support board.
7. The device according to claim 1 or 2, characterized in that, The plug-in female test socket is made of polyetheretherketone material.