LED lamp chip packaging structure

Abstract

The utility model discloses an LED lamp chip packaging structure in the technical field of LED lamps, a cathode contact is arranged on the right side of the top of a support, the top of an anode contact and the top of the cathode contact are jointly connected with an LED chip, conducting layers matched with the anode contact and the cathode contact are arranged on the left side and the right side of the bottom of the LED chip respectively, and the conducting layers are connected with the anode contact and the cathode contact respectively. A clamping block is arranged in the center of the bottom of each conductive layer; when the LED chip is placed on the top of the support, the clamping blocks arranged at the bottoms of the conducting layers on the left side and the right side of the bottom of the LED chip can be clamped into the clamping grooves in the corresponding positions, and therefore the fixing effect can be achieved during welding, and the displacement phenomenon during welding is avoided; the heat absorption plates are attached to the left side and the right side of the bottom of the LED chip respectively, when the LED chip works, the heat absorption plates can guide heat into the heat conduction plate and transmit the heat to the heat conduction plate, then heat dissipation processing is carried out on the LED chip through the heat dissipation fins, heat dissipation protection can be effectively carried out on the LED chip, and therefore the service life of the LED chip is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lamps, and specifically relates to an LED lamp chip packaging structure. Background Technique

[0002] With the rapid development of technology, LED lamps have gradually become one of the mainstream lighting methods. The LED lamp chip is one of the important components of the LED lamp. When the LED lamp chip is packaged, the LED chip is fixed on the base by die bonding and soldering. However, the existing LED lamp chip packaging structure still has some disadvantages. For example, when performing packaging soldering, it does not have a fixing function, resulting in displacement during soldering, which may cause a short-circuit phenomenon. After connecting to the base, that is, the bracket, it also does not have a heat dissipation protection function, which will affect the service life of the LED chip. Therefore, we propose an LED lamp chip packaging structure. Content of the Utility Model

[0003] The purpose of the utility model is to provide an LED lamp chip packaging structure to solve the problems raised in the above background technique.

[0004] To achieve the above purpose, the utility model provides the following technical solution:

[0005] An LED lamp chip packaging structure includes a bracket. On the left side of the top of the bracket, there is a positive contact head, and on the right side of the top of the bracket, there is a negative contact head. The top of the positive contact head and the negative contact head are jointly connected with an LED chip. On the left and right sides of the bottom of the LED chip, there are conductive layers respectively matching the positive contact head and the negative contact head. At the center of the bottom of the conductive layer, there are clamping blocks respectively. At the center of the top of the positive contact head and the negative contact head, there are clamping grooves respectively matching the clamping blocks. Vertically arranged at the center of the top of the bracket is a partition board. On the top of the partition board, there is an insulating contact layer. The insulating contact layer is attached to the center of the bottom of the LED chip. On the left and right sides of the bottom of the LED chip, there are heat absorption plates respectively attached. The heat absorption plates are located inside the conductive layers. At the bottom of the heat absorption plates, there are heat conduction plates respectively. At the bottom of the heat conduction plates, there are heat dissipation fins evenly arranged respectively. On the left and right sides of the bottom of the heat conduction plates, there are fixing rods respectively. The bottoms of the fixing rods are fixedly connected to the bottom of the inner cavity of the bracket.

[0006] Further: Vertically arranged on the top of the insulating contact layer are grooves, and on the left and right sides of the top of the insulating contact layer, there are arc-shaped contact surfaces respectively.

[0007] Further: On the left and right sides of the insulating contact layer, there are hard rubber layers adhesively arranged respectively. The length of the hard rubber layer from top to bottom is less than the length of the insulating contact layer from top to bottom.

[0008] Furthermore: The bottoms of the fixing rods are fixedly welded to the bottom of the inner cavity of the bracket, and the angles between the fixing rods and the bracket are all set to ninety degrees.

[0009] Furthermore: The clamping blocks are made of metal, and solder paste layers are provided at the bottoms of the clamping blocks and the conductive layers.

[0010] Furthermore: A silica gel heat conducting sheet is provided on the top of the heat absorbing plate, and the angles between the heat absorbing plate and the fixing rods are all set to ninety degrees.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0012] In this LED chip packaging structure, when the LED chip is placed on the top of the bracket, the clamping blocks provided at the bottoms of the conductive layers on the left and right sides of the bottom of the LED chip will be stuck into the corresponding slots (the slots at the tops of the positive contact head and the negative contact head), so that it can play a fixing effect during welding, thereby avoiding the phenomenon of displacement during welding; on the left and right sides of the bottom of the LED chip, heat absorbing plates are respectively attached. When the LED chip is working, the heat absorbing plates will conduct and transfer the heat to the heat conducting plate, and then the LED chip is cooled by the heat dissipation fins. In this way, the LED chip can be effectively cooled and protected, thereby extending its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic structural diagram of the present utility model;

[0014] Figure 2 is a schematic structural diagram of the insulating contact layer of the present utility model.

[0015] In the figure: 1. Bracket; 2. Positive contact head; 3. Negative contact head; 4. LED chip; 5. Conductive layer; 6. Clamping block; 7. Slot; 8. Partition; 9. Insulating contact layer; 10. Groove; 11. Arc-shaped contact surface; 12. Hard rubber layer; 13. Heat absorbing plate; 14. Heat conducting plate; 15. Heat dissipation fin; 16. Fixing rod. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0017] Embodiment 1:

[0018] Please refer to Figure 1-2, the present utility model provides a technical solution: an LED lamp chip packaging structure, including a bracket 1. On the left side of the top of the bracket 1, there is a positive contact head 2. On the right side of the top of the bracket 1, there is a negative contact head 3. At the top of the positive contact head 2 and the negative contact head 3, an LED chip 4 is jointly connected. On the left and right sides of the bottom of the LED chip 4, there are conductive layers 5 that match the positive contact head 2 and the negative contact head 3 respectively. When packaging the LED lamp chip, the left and right sides of the bottom of the LED chip 4 are respectively connected to the positive contact head 2 and the negative contact head 3 through the conductive layers 5. At the center of the bottom of the conductive layer 5, there are clamping blocks 6. At the center of the top of the positive contact head 2 and the negative contact head 3, there are clamping grooves 7 that match the clamping blocks 6. Through the cooperation of the clamping blocks 6 and the clamping grooves 7, the connection stability between the LED chip 4 and the positive contact head 2 and the negative contact head 3 can be increased, avoiding displacement during welding and thus preventing short - circuit phenomena. Vertically arranged at the center of the top of the bracket 1 is a partition 8. On the top of the partition 8, there is an insulating contact layer 9. The insulating contact layer 9 is attached to the center of the bottom of the LED chip 4. Through the partition 8 and the insulating contact layer 9, the positive contact head 2 and the negative contact head 3 can be separated during welding, thus preventing solder from splashing between the positive and negative electrodes, which may cause short - circuit of the backlight beads. On the left and right sides of the bottom of the LED chip 4, there are heat - absorbing plates 13 attached. The heat - absorbing plates 13 are located inside the conductive layers 5. At the bottom of the heat - absorbing plates 13, there are heat - conducting plates 14. At the bottom of the heat - conducting plates 14, there are heat - dissipating fins 15 evenly arranged. On the left and right sides of the bottom of the heat - conducting plates 14, there are fixing rods 16. The bottoms of the fixing rods 16 are fixedly connected to the bottom of the inner cavity of the bracket 1. When the LED chip 4 is working, the heat - absorbing plates 13 will absorb the heat on the LED chip 4, and then through the cooperation of the heat - conducting plates 14 and the heat - dissipating fins 15, the heat - dissipation effect is achieved.

[0019] Among them, preferably, a groove 10 is longitudinally arranged on the top of the insulating contact layer 9. On the left and right sides of the top of the insulating contact layer 9, there are arc - shaped contact surfaces 11. Such a setting can increase the insulation protection effect and achieve a double - insulation effect to prevent solder from splashing between the positive and negative electrodes.

[0020] Preferably, hard rubber layers 12 are adhesively arranged on the left and right sides of the insulating contact layer 9. The length of the hard rubber layer 12 from top to bottom is less than the length of the insulating contact layer 9 from top to bottom. The hard rubber layer 12 can strengthen the insulating contact layer 9 and prevent the insulating contact layer 9 from deforming after welding, thus affecting the insulation effect.

[0021] Preferably, the bottoms of the fixing rods 16 are fixedly welded to the bottom of the inner cavity of the bracket 1. The angles between the fixing rods 16 and the bracket 1 are all set to ninety degrees. Such a setting can increase the connection stability between the fixing rods 16 and the bracket 1.

[0022] Example 2:

[0023] Referring to Figure 1-2 , what is different from the first embodiment in this embodiment is that the clamping block 6 is set as a metal clamping block, and solder paste layers are provided at the bottom of both the clamping block 6 and the bottom of the conductive layer 5; a silica gel heat conduction sheet is provided on the top of the heat absorption plate 13, and the silica gel heat conduction sheet can increase the heat conduction effect, thereby increasing the heat dissipation efficiency. The angles between the heat absorption plate 13 and the fixing rods 16 are all set to ninety degrees. Such a setting can make the top of the heat absorption plate 13 fully fit the bottom of the LED chip 4.

[0024] The electrical appliances mentioned in this article are all connected to an external power supply through wires.

[0025] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An LED lamp chip packaging structure, including a bracket (1), characterized in that: On the left side of the top of the bracket (1), a positive contact head (2) is provided. On the right side of the top of the bracket (1), a negative contact head (3) is provided. The top of the positive contact head (2) and the negative contact head (3) are jointly connected with an LED chip (4). On the left and right sides of the bottom of the LED chip (4), conductive layers (5) matching the positive contact head (2) and the negative contact head (3) are respectively provided. At the center of the bottom of the conductive layer (5), a clamping block (6) is provided. At the center of the top of the positive contact head (2) and the negative contact head (3), a clamping groove (7) matching the clamping block (6) is provided. Vertically at the center of the top of the bracket (1), a partition plate (8) is provided. On the top of the partition plate (8), an insulating contact layer (9) is provided. The insulating contact layer (9) is attached to the center of the bottom of the LED chip (4). On the left and right sides of the bottom of the LED chip (4), heat absorption plates (13) are respectively attached. The heat absorption plates (13) are located inside the conductive layer (5). At the bottom of the heat absorption plates (13), heat conduction plates (14) are provided. At the bottom of the heat conduction plates (14), heat dissipation fins (15) are evenly provided. On the left and right sides of the bottom of the heat conduction plates (14), fixing rods (16) are provided. The bottoms of the fixing rods (16) are fixedly connected to the top of the bracket (1).

2. The LED chip packaging structure according to claim 1, characterized in that: Vertically on the top of the insulating contact layer (9), a groove (10) is provided. On the left and right sides of the top of the insulating contact layer (9), arc-shaped contact surfaces (11) are provided.

3. The LED chip packaging structure according to claim 1, wherein: On the left and right sides of the insulating contact layer (9), hard rubber layers (12) are adhesively provided. The length of the hard rubber layer (12) from top to bottom is less than the length of the insulating contact layer (9) from top to bottom.

4. A kind of LED lamp chip packaging structure according to claim 1, characterized in that: The bottoms of the fixing rods (16) are fixedly welded to the top of the bracket (1). The included angles between the fixing rods (16) and the bracket (1) are all set to ninety degrees.

5. A LED chip packaging structure according to claim 1, characterized in that: The clamping block (6) is set as a metal clamping block. Solder paste layers are provided at the bottom of the clamping block (6) and the bottom of the conductive layer (5).

6. The LED chip packaging structure according to claim 1, wherein: On the top of the heat absorption plate (13), a silica gel heat conduction sheet is provided. The included angles between the heat absorption plate (13) and the fixing rods (16) are all set to ninety degrees.

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