Memory bank socket

Abstract

The utility model discloses a memory bank socket, which comprises a connector insulation shell and a plurality of terminals, the connector insulation shell is provided with a long-strip-shaped slot for a memory bank to insert, the connector insulation shell is provided with a plurality of terminal grooves, the terminals are installed in the terminal grooves, and the terminals can be electrically connected with the memory bank respectively; the two sides of the connector insulating shell are provided with air ducts, air outlets communicated with the air ducts are formed in the upper portion of the connector insulating shell, air inlet pipelines are fixed to the ends, right facing the air ducts, of the connector insulating shell, the air inlet pipelines are communicated with the air ducts, and the two air inlet pipelines are communicated through a branch pipe. Wherein one air inlet pipeline is fixedly connected with an air supply pipeline, the air supply pipeline is fixedly connected with an air cylinder, and a cooling fan is installed in the air cylinder. The memory bank socket has the advantages that the memory bank can be cooled, the memory bank can be stably installed, and the memory bank socket is convenient to use.

Description

Technical Field

[0001] The utility model relates to the technical field of memory sticks, in particular to a memory stick socket. Background Art

[0002] Memory, also known as random access memory, is an internal memory that directly exchanges data with the CPU, usually as a temporary data storage medium for the operating system or other running programs.

[0003] After the computer is used for a long time, the temperature of the chassis will be very high. The heat will cause the temperature of the memory stick to rise. If the heat is not dissipated in time, the reading speed of the computer memory stick will slow down, and even cause the computer to freeze or blue screen. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by this patent application is how to provide a memory stick socket that can dissipate heat for a memory stick, stably install the memory stick, and is easy to use.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] A memory stick socket, comprising a connector insulating shell and a plurality of terminals, wherein the connector insulating shell is provided with a slot in the shape of a long strip for inserting the memory stick, and the connector insulating shell is provided with a plurality of terminal slots, wherein the terminals are installed in the terminal slots, and the terminals can be electrically connected to the memory sticks respectively;

[0007] Air ducts are arranged on both sides of the insulating shell of the connector, an air outlet connected to the air duct is opened on the top of the insulating shell of the connector, an air inlet duct is fixed to the end of the insulating shell of the connector facing the air duct, the air inlet duct is connected to the air duct, the two air inlet ducts are connected through a branch pipe, one of the air inlet ducts is fixedly connected to an air supply duct, the air supply duct is fixedly connected to a wind tube, and a cooling fan is installed in the wind tube.

[0008] In this way, when installing, the memory stick is inserted into the slot and electrically connected to the terminal, which is an existing structure. When in use, the cooling fan is powered on to drive the air flow, which passes through the air cylinder, air supply duct, air inlet duct and branch pipe to reach the air duct, and is blown out through the air outlet, thereby driving the air flow around the memory stick socket to accelerate the flow, taking away the heat around the memory stick socket, and realizing the cooling of the memory stick.

[0009] Among them, the connector insulating housing includes a first half shell and a second half shell, the first half shell and the second half shell are bonded, both sides of the first half shell and the second half shell are concave to form grooves, a sealing plate is fixed on the outer sides of the first half shell and the second outer shell, and the sealing plate and the grooves enclose the air duct. The fixed connection between the first half shell and the second half shell facilitates the installation of terminals.

[0010] Among them, the air cylinder is tapered along the direction close to the air supply pipe.

[0011] Among them, the air outlet is inclined inwards.

[0012] Among them, the air duct is communicated with the terminal slot.

[0013] In summary, the memory module socket of the present invention has the advantages of being able to dissipate heat from the memory module, stably install the memory module, and being convenient to use. Description of the Drawings

[0014] Figure 1 It is a schematic structural diagram of a memory module socket according to the present invention.

[0015] Figure 2 is Figure 1 a schematic diagram after removing the sealing plate on one side.

[0016] Figure 3 It is a cross-sectional view of a memory module socket according to the present invention. Detailed Description of the Invention

[0017] The present invention will be further described in detail below with reference to the drawings. In the description of the present invention, it should be understood that the orientation or positional relationship indicated by orientation words such as "upper, lower" and "top, bottom" is usually based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description. Without contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, so it should not be understood as a limitation to the protection scope of the present invention; the orientation words "inner, outer" refer to the inside and outside relative to the contour of each component itself.

[0018] As Figures 1-3 shown, a memory module socket includes a connector insulating housing and a plurality of terminals 1. The connector insulating housing is provided with a slot 2 in a long strip shape for inserting the memory module. A plurality of terminal slots 3 are provided on the connector insulating housing, and the terminals are installed in the terminal slots, and the terminals can be electrically connected to the memory module respectively;

[0019] On both sides of the connector insulating housing, air ducts 4 are provided. An air outlet 5 communicating with the air ducts is opened above the connector insulating housing. An air inlet pipe is fixedly provided at the end of the connector insulating housing facing the air ducts. The air inlet pipe communicates with the air ducts. The two air inlet pipes are communicated through a branch pipe 6. One of the air inlet pipes is fixedly connected with an air supply pipe 7. The air supply pipe is fixedly connected with an air cylinder 8. A cooling fan 9 is installed in the air cylinder.

[0020] In this way, during installation, the memory module is inserted into the slot and electrically connected to the terminals, which is an existing structure. During use, the cooling fan is powered on to drive the air flow. The air flow reaches the air ducts through the air cylinder, the air supply pipe, the air inlet pipe and the branch pipe, and is blown out through the air outlet, thereby driving the air flow around the memory module socket to accelerate the flow, taking away the heat around the memory module socket, and realizing the cooling of the memory module.

[0021] During implementation, the connector insulating housing includes a first half shell 11 and a second half shell 12. The first half shell and the second half shell are bonded. Grooves 14 are formed by inward concavity on both sides of the first half shell and the second half shell. A sealing plate 13 is fixedly provided on the outer sides of the first half shell and the second shell. The sealing plate and the groove enclose the air ducts. The fixed connection of the first half shell and the second half shell is convenient for installing the terminals. Through the setting of the sealing plate, it is convenient to form the air ducts.

[0022] During implementation, the air cylinder is arranged in a conical shape along the direction close to the air supply pipe. This is convenient for the air flow to better enter the air supply pipe.

[0023] During implementation, the air outlet is arranged to incline inwards. The inward inclination of the air outlet makes the air blown out from the air outlet blow towards the memory module, which can better take away the heat of the memory module and the heat around the memory module, and better realize the cooling.

[0024] During implementation, the air ducts are communicated with the terminal slots. The heat generated by the terminals can be dissipated to the air ducts. When the air flow flows in the air ducts, the heat of the terminals can be taken away to realize the cooling of the terminals.

[0025] Finally, it should be noted that those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. In this way, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A memory module socket, comprising a connector insulating housing and a plurality of terminals. The connector insulating housing is provided with a slot in a strip shape for inserting a memory module. The connector insulating housing is provided with a plurality of terminal slots, and the terminals are installed in the terminal slots. The terminals can be electrically connected to the memory module respectively; characterized in that, Air ducts are arranged on both sides of the connector insulating housing. An air outlet communicating with the air ducts is provided above the connector insulating housing. An air inlet pipe is fixedly arranged at the end of the connector insulating housing facing the air ducts. The air inlet pipe communicates with the air ducts. The two air inlet pipes are communicated through a branch pipe. One of the air inlet pipes is fixedly connected to a air supply pipe. The air supply pipe is fixedly connected to an air cylinder, and a cooling fan is installed in the air cylinder.

2. The memory module socket according to claim 1, wherein, The connector insulating housing comprises a first half shell and a second half shell. The first half shell and the second half shell are bonded. Grooves are formed by concave inward on both sides of the first half shell and the second half shell. Sealing plates are fixed on the outer sides of the first half shell and the second outer shell. The sealing plates and the grooves enclose the air ducts.

3. The memory module socket according to claim 2, characterized in that, The air cylinder is arranged in a conical shape along the direction close to the air supply pipe.

4. A memory module socket according to claim 1, characterized in that, The air outlet is arranged to incline inward.

5. A memory module socket according to claim 1, characterized in that, The air ducts are communicated with the terminal slots.

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