PCB circuit board

Abstract

The utility model discloses a printed circuit board (PCB), which relates to the technical field of circuit boards, and is characterized in that the PCB comprises a substrate, one side of the substrate is fixedly connected with a holding plate, a plurality of through grooves are arranged between the substrate and the holding plate, and a heat insulation sleeve is sleeved on the holding plate. According to the utility model, the holding plate and the heat insulation sleeve are arranged, so that in the process of heating by adopting the welding table, only the substrate needs to be placed on the welding table, the holding plate is exposed out of the welding table, after heating is finished, people can take down the substrate from the welding table by holding the holding plate, and the heat insulation sleeve has a heat insulation effect; therefore, less heat on the holding plate is conducted to the heat insulation sleeve, the temperature on the heat insulation sleeve is guaranteed to be low, people can hold the heat insulation sleeve conveniently, the epoxy resin has the advantages of being high in structural strength and long in service life, and the service life and strength of the whole base plate are guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more specifically, it relates to a PCB circuit board. Background Technique

[0002] A PCB circuit board, also known as a printed circuit board, printed wiring board or printed circuit board, is an important and indispensable component in the modern electronics industry.

[0003] In the existing PCB circuit board, it needs to be placed on a soldering station for heating during the soldering process. The use of the soldering station can ensure that the soldering material melts more evenly, thereby preventing the weld quality problems caused by uneven melting of the soldering material. This uniformity ensures the soldering accuracy and reliability. After the heating is completed, people need to take the PCB board off the soldering station. Since generally the whole PCB board is on the soldering station, people have to use tools such as tweezers to take the PCB board off the soldering station, making the removal process inconvenient.

[0004] Therefore, a new solution needs to be proposed to solve this problem. Content of the Utility Model

[0005] Aiming at the deficiencies of the existing technology, the purpose of the utility model is to provide a PCB circuit board.

[0006] The above technical purpose of the utility model is achieved through the following technical solutions: A PCB circuit board includes a substrate, one side of the substrate is fixedly connected with a holding plate, a plurality of through grooves are opened between the substrate and the holding plate, and a heat insulation sleeve is sleeved on the holding plate.

[0007] The utility model is further provided as: A plurality of through holes are opened on the holding plate, and convex points for embedding into the through holes are arranged on both the upper inner wall and the lower inner wall of the heat insulation sleeve.

[0008] The utility model is further provided as: A thickening strip is fixedly connected to the substrate and is arranged close to the holding plate, and one side of the thickening strip is flush with the side of the substrate where the holding plate is arranged.

[0009] The utility model is further provided as: The thickening strip is only arranged on one side of the substrate.

[0010] The utility model is further provided as: The thickening strip and the substrate are fixed by screws.

[0011] The utility model is further provided as: The substrate is made of epoxy resin.

[0012] In summary, the utility model has the following beneficial effects: During the process of heating with a soldering station, it is only necessary to place the substrate on the soldering station. At this time, the holding plate is exposed outside the soldering station. After heating is completed, people can remove the substrate from the soldering station by holding the holding plate. The heat insulation sleeve has a heat insulation effect, so that less heat on the holding plate is conducted to the heat insulation sleeve, thereby ensuring that the temperature on the heat insulation sleeve is relatively low and facilitating people to hold it. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic structural diagram of the utility model;

[0014] Figure 2 is a partial structural diagram of the substrate in the utility model;

[0015] Figure 3 is a schematic structural diagram of the heat insulation sleeve in the utility model.

[0016] In the figure: 1, substrate; 2, holding plate; 3, through groove; 4, heat insulation sleeve; 5, through hole; 6, bump; 7, thickened strip. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] The following combines the drawings and embodiments to describe the utility model in detail.

[0018] A PCB circuit board, as Figure 1 shown, includes a substrate 1. One side of the substrate 1 is fixedly connected with a holding plate 2. The substrate 1 and the holding plate 2 are integrally formed. A plurality of through grooves 3 are provided between the substrate 1 and the holding plate 2. A plurality of solder pads are provided on the substrate 1. A heat insulation sleeve 4 is sleeved on the holding plate 2. The heat insulation sleeve 4 is made of aerogel. All the solder pads are arranged on the substrate 1. During the process of heating with a soldering station, it is only necessary to place the substrate 1 on the soldering station. At this time, the holding plate 2 is exposed outside the soldering station. After heating is completed, people can remove the substrate 1 from the soldering station by holding the holding plate 2. The heat insulation sleeve 4 has a heat insulation effect, so that less heat on the holding plate 2 is conducted to the heat insulation sleeve 4, thereby ensuring that the temperature on the heat insulation sleeve 4 is relatively low and facilitating people to hold it. This setting enables people to take the substrate 1 without the need for additional tools. After the electronic components on the substrate 1 are all soldered, people can directly break off the holding plate 2 from the substrate 1, so that the size of the substrate 1 itself can meet the installation requirements. The arrangement of the plurality of through grooves 3 facilitates people to break off the holding plate 2. The aerogel material has good heat insulation performance and certain elasticity, thus ensuring that the heat insulation sleeve 4 has a good heat insulation effect while also being able to be sleeved and fixed on the holding plate 2.

[0019] such as Figure 2 and Figure 3As shown in the figure, a plurality of through holes 5 are formed in the holding plate 2. Protrusions 6 for embedding in the through holes 5 are provided on both the upper inner wall and the lower inner wall of the heat insulation sleeve 4. When the heat insulation sleeve 4 is sleeved on the holding plate 2, the protrusions 6 on the upper inner wall and the lower inner wall of the heat insulation sleeve 4 are respectively embedded in the through holes 5. Such a setting ensures the connection strength between the heat insulation sleeve 4 and the holding plate 2, making it difficult for the heat insulation sleeve 4 to separate from the holding plate 2. A thickening strip 7 is fixedly connected to the substrate 1 and is arranged close to the holding plate 2. One side of the thickening strip 7 is flush with the side of the substrate 1 where the holding plate 2 is arranged. The length of the thickening strip 7 is greater than the length of the holding plate 2. When people break off the holding plate 2, one hand touches the thickening strip 7 and the other hand breaks the holding plate 2, so as to break off the holding plate 2. The thickening strip 7 can protect the edge of the substrate 1, making the edge of the substrate 1 not easily damaged. The thickening strip 7 is only arranged on one side of the substrate 1. Such a setting ensures that the side of the substrate 1 without the thickening strip 7 can still maintain a relatively flat state, which is convenient for the installation and fixation of the substrate 1. The thickening strip 7 and the substrate 1 are fixed by screws. The screw fixation method is convenient for the fixed installation of the thickening strip 7 and the substrate 1. Installation holes are formed in the substrate 1, and threaded holes are formed in the thickening strip 7. The screws pass through the installation holes and are threadedly connected to the threaded holes in the thickening strip 7. The substrate 1 is made of epoxy resin. Epoxy resin has the characteristics of high structural strength and long service life, ensuring the overall service life and strength of the substrate 1.

[0020] The above is only the preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions falling within the idea of the present invention belong to the protection scope of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A PCB circuit board, characterized in that: It includes a substrate (1), on one side of which there is fixedly connected a holding plate (2). A plurality of through grooves (3) are formed between the substrate (1) and the holding plate (2), and a heat insulation sleeve (4) is sleeved on the holding plate (2).

2. The PCB circuit board according to claim 1, wherein: A plurality of through holes (5) are formed in the holding plate (2), and convex points (6) for embedding into the through holes (5) are provided on both the upper inner wall and the lower inner wall of the heat insulation sleeve (4).

3. The PCB circuit board according to claim 2, wherein: A thickening strip (7) is fixedly connected to the substrate (1) and is arranged close to the holding plate (2). One side of the thickening strip (7) is flush with the side of the substrate (1) where the holding plate (2) is arranged.

4. The PCB circuit board according to claim 3, characterized in that: The thickening strip (7) is only arranged on one side of the substrate (1).

5. The PCB circuit board according to claim 4, wherein: The thickening strip (7) and the substrate (1) are fixed by screws.

6. The PCB circuit board according to claim 5, wherein: The substrate (1) is made of epoxy resin.

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