Water-cooling heat dissipation beauty instrument
The water-cooled beauty instrument addresses heat dissipation limitations by using a cooling box with coolant and metal elements to enhance thermal storage, ensuring prolonged usage and easy coolant replacement.
Patent Information
- Application Number
- CN202422083921.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-08-27
AI Technical Summary
The existing beauty instruments lack heat dissipation capabilities, resulting in limited use time and the quality of metal heat storage parts is inconvenient for use.
The water-cooled form of cooling chamber and coolant is adopted, combined with heat dissipation fins and temperature guide parts, to improve the heat dissipation ability and use the high specific heat capacity of the coolant to extend the use time.
It improves heat dissipation ability, extends the service time of the beauty instrument, and further extends the service life by changing the coolant.
Smart Images
Figure CN223095703U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of beauty instruments, in particular to a water-cooled beauty instrument with heat dissipation function. Background Art
[0002] Currently, in the design of beauty instruments, thermoelectric coolers are usually used for site care. When the thermoelectric cooler is working, it will generate a large amount of heat, which needs to be discharged from the body in time. In terms of heat dissipation, there are active heat dissipation and passive heat dissipation currently. Taking passive heat dissipation as an example, the existing heat dissipation design is that the thermoelectric cooler is directly connected to the metal heat storage part, and the heat is collected through the heat exchange between the metal heat storage part and the thermoelectric cooler. In this way, the usage time of the beauty instrument is limited by the heat storage capacity of the metal heat storage part. However, the metal heat storage part itself has a relatively large mass, and the product has a large usage mass, which is inconvenient. Moreover, its specific heat capacity is relatively small compared with some coolants, and the heat storage capacity is weak. Content of the Utility Model
[0003] The technical problem to be solved by the utility model is to provide a water-cooled beauty instrument with heat dissipation function, which can improve the heat dissipation capacity and extend the usage time of the body.
[0004] In order to solve the above technical problem, the technical solution adopted by the utility model is: a water-cooled beauty instrument with heat dissipation function, including a care head, a thermoelectric cooler and a heat dissipation component. The thermoelectric cooler is arranged on the care head. The heat dissipation component includes a cooling box and a coolant. The cooling box is arranged in the care head. One end of the cooling box is provided with a temperature guiding part that abuts against the thermoelectric cooler, and the cooling box is filled with the coolant.
[0005] Further, heat dissipation fins are arranged on the inner part of the cooling box corresponding to the end abutting against the thermoelectric cooler.
[0006] Further, the temperature guiding part is a metal part.
[0007] Further, the temperature guiding part is a part of the cooling box, and the cooling box is a metal box body.
[0008] Further, a slot is arranged in the care head. One end of the cooling box far away from the thermoelectric cooler is provided with a plugging protrusion, and the plugging protrusion is plugged in the slot.
[0009] Further, it further includes a circuit component, the circuit component is arranged in the slot, and the circuit component is electrically connected with the thermoelectric cooler.
[0010] Further, a temperature sensing component connected with the cooling box is arranged on the circuit component.
[0011] Further, the cooling box includes a box body and a bottom cover. The box body is provided with an opening at one end away from the semiconductor refrigeration sheet, and the bottom cover is locked to the box body to block the opening; a sealing ring is provided between the box body and the bottom cover.
[0012] Further, it further includes a heat and cold conductor and a fixing bracket; an opening is provided on the nursing head, the heat and cold conductor is arranged at the opening of the nursing head, the fixing bracket is arranged inside the nursing head, the heat and cold conductor is locked to the fixing bracket, and the fixing bracket is locked to the cooling box; the semiconductor refrigeration sheet is clamped between the heat and cold conductor and the cooling box.
[0013] The beneficial effect of the present utility model is that a large amount of heat is generated when the semiconductor refrigeration sheet works. This design adopts the water-cooling form of the cooling box and the coolant arranged in the nursing head to improve its heat storage capacity during use. Compared with the traditional metal heat storage, it has a large heat storage capacity and can ensure the long-term use of the body; the coolant can be replaced according to the use duration of the body, and a coolant with a larger specific heat capacity is adopted, which can further extend the use duration. Description of the Drawings
[0014] Figure 1 It is a schematic structural diagram of the water-cooled beauty instrument according to the specific embodiment of the present utility model;
[0015] Figure 2 It is a cross-sectional view of the water-cooled beauty instrument according to the specific embodiment of the present utility model.
[0016] Label Description:
[0017] 1. Nursing head; 11. Slot; 2. Semiconductor refrigeration sheet; 3. Cooling box; 31. Heat dissipation fins; 32. Insertion protrusion; 33. Box body; 34. Bottom cover; 35. Sealing ring; 4. Heat and cold conductor; 5. Fixing bracket; 6. Circuit component. Specific Embodiment
[0018] To describe in detail the technical content, the achieved purpose and the effects of the present utility model, the following is described in conjunction with the embodiments and with reference to the drawings.
[0019] Please refer to Figures 1 to 2 , a water-cooled beauty instrument, including a nursing head 1, a semiconductor refrigeration sheet 2 and a heat dissipation component. The nursing head 1 is provided with a semiconductor refrigeration sheet 2. The heat dissipation component includes a cooling box 3 and a coolant. The cooling box 3 is arranged inside the nursing head 1. One end of the cooling box 3 is provided with a temperature conduction member that abuts against the semiconductor refrigeration sheet 2, and the cooling box 3 is filled with a coolant.
[0020] As can be seen from the above description, the beneficial effects of the present utility model are as follows: When the semiconductor refrigeration sheet 2 works, a large amount of heat is generated. The present design adopts the water-cooling form of the cooling box 3 and the coolant provided in the nursing head 1 to improve its heat storage capacity during use. Compared with traditional metal heat storage, it has a large heat storage capacity and can ensure the long-term use of the body; the coolant can be replaced according to the usage duration of the body, and by using a coolant with a larger specific heat capacity, the usage duration can be further extended.
[0021] Further, heat dissipation fins 31 are provided at one end of the cooling box 3 corresponding to the end in contact with the semiconductor refrigeration sheet 2.
[0022] As can be seen from the above description, by adopting the design of the cooling box 3 with the built-in heat dissipation fins 31, the heat dissipation capacity is improved, ensuring that the working heat of the semiconductor refrigeration sheet 2 can be quickly conducted to the inside of the cooling box 3.
[0023] Further, the heat conducting member is a metal member.
[0024] As can be seen from the above description, a metal member with good heat conduction performance is adopted as the heat conducting member between the semiconductor refrigeration sheet 2 and the cooling box 3.
[0025] Further, the heat conducting member is a part of the cooling box 3, and the cooling box 3 is a metal box body.
[0026] As can be seen from the above description, by directly adopting a metal box body for the cooling box 3, on the one hand, it can ensure the rapid heat exchange with the semiconductor refrigeration sheet 2, and on the other hand, the cooling box 3 itself can also be used as a heat storage structure to increase the heat storage capacity of the heat dissipation component and extend the usage duration of the body.
[0027] Further, a slot 11 is provided in the nursing head 1, and a plugging protrusion 32 is provided at one end of the cooling box 3 away from the semiconductor refrigeration sheet 2, and the plugging protrusion 32 is inserted into the slot 11.
[0028] As can be seen from the above description, by using the cooperation of the slot 11 in the nursing head 1 and the plugging protrusion 32 of the cooling box 3, the rapid plugging assembly of the cooling box 3 is realized.
[0029] Further, a circuit component 6 is further included, and the circuit component 6 is arranged in the slot 11 and is electrically connected to the semiconductor refrigeration sheet 2.
[0030] As can be seen from the above description, the relevant circuit component 6 is arranged by using the space of the slot 11, and the installation space is reasonably planned.
[0031] Further, a temperature sensing component connected to the cooling box 3 is provided on the circuit component 6.
[0032] As described above, the temperature sensing component is provided to ensure that the semiconductor refrigeration chip 2 operates normally within the allowable heat storage range of the cooling box 3. However, if the temperature at the cooling box 3 is higher than the preset value, the operation of the semiconductor refrigeration chip 2 will be stopped to avoid overheating and damage to the body.
[0033] Further, the cooling box 3 includes a box body 33 and a bottom cover 34. The box body 33 is provided with an opening at one end away from the semiconductor refrigeration chip 2, and the bottom cover 34 is locked to the box body 33 to block the opening; a sealing ring 35 is provided between the box body 33 and the bottom cover 34.
[0034] As described above, the cooling box 3 can be filled with coolant inside by opening the bottom cover 34. The design of the sealing ring 35 between the box body 33 and the bottom cover 34 improves the sealing performance of the cooling box 3 and avoids coolant leakage.
[0035] Further, it also includes a heat and cold conductor 4 and a fixing bracket 5; an opening is provided on the nursing head 1, the heat and cold conductor 4 is arranged at the opening of the nursing head 1, the fixing bracket 5 is arranged inside the nursing head 1, the heat and cold conductor 4 is locked to the fixing bracket 5, and the fixing bracket 5 is locked to the cooling box 3; the semiconductor refrigeration chip 2 is clamped between the heat and cold conductor 4 and the cooling box 3.
[0036] As described above, the heat and cold conductor 4 is a component that directly contacts the nursing part. It is fixed to the cooling box 3 by being locked to the fixing bracket 5, and the semiconductor refrigeration chip 2 is clamped and fixed between the heat and cold conductor 4 and the cooling box 3; during operation, the semiconductor refrigeration chip 2 provides cold-end refrigeration for the heat and cold conductor 4, and the cooling box 3 dissipates heat from the hot end of the semiconductor refrigeration chip 2.
[0037] Refer to Figures 1 to 2 , Embodiment 1 of the present utility model is:
[0038] As Figures 1 to 2 shown, the water-cooled heat dissipation beauty instrument of this embodiment includes a nursing head 1, a heat and cold conductor 4, a semiconductor refrigeration chip 2, a fixing bracket 5, a heat dissipation component, and a circuit component 6.
[0039] An opening is provided at the upper end of the nursing head 1, a heat and cold conductor 4 is provided at the opening, a semiconductor refrigeration chip 2 and a heat dissipation component are sequentially arranged inside the nursing head 1 from top to bottom. The heat dissipation component includes a cooling box 3 and a coolant. One end of the cooling box 3 is provided with a temperature guiding member that abuts against the semiconductor refrigeration chip 2, and the cooling box 3 is filled with a coolant; the semiconductor refrigeration chip 2 is clamped between the heat and cold conductor 4 and the cooling box 3; the heat and cold conductor 4 is simultaneously locked to the fixing bracket 5, and the fixing bracket 5 is locked and fixed to the cooling box 3.
[0040] Inside the lower end of the nursing head 1, there is a slot 11. At one end of the cooling box 3 away from the semiconductor refrigeration sheet 2, there is a plugging protrusion 32, and the plugging protrusion 32 is inserted into the slot 11. The circuit component 6 is also correspondingly arranged in the slot 11, and the plugging protrusion 32 of the cooling box 3 closes the slot 11 to limit and fix it. The circuit component 6 is electrically connected to the semiconductor refrigeration sheet 2. A temperature sensing component connected to the cooling box 3 is arranged on the circuit component 6.
[0041] The cooling box 3 includes a box body 33 and a bottom cover 34. The box body 33 has an opening at one end away from the semiconductor refrigeration sheet 2, and the bottom cover 34 is locked to the box body 33 to block the opening; a sealing ring 35 is arranged between the box body 33 and the bottom cover 34.
[0042] On one end of the box body 33 close to the semiconductor refrigeration sheet 2, there are heat dissipation fins 31. Correspondingly, on one end of the box body 33 close to the semiconductor refrigeration sheet 2, there is a metal heat conduction part. Optionally, the metal heat conduction part is a part of the box body 33, and the box body 33 is made of metal as a whole.
[0043] When the nursing head 1 works, it needs to be plugged into the main body. At this time, at the lower end of the nursing head 1 corresponding to the circuit component 6, there is a corresponding pin structure for electrical connection. At the same time, the lower end of the nursing head 1 is concave with a positioning groove for cooperating with the positioning protrusion arranged on the main body. At the same time, relevant circuit components 6 are also arranged in the positioning groove.
[0044] In summary, for the water-cooled beauty instrument provided by the present utility model, a large amount of heat is generated when the semiconductor refrigeration sheet works. This design adopts the water-cooled form of the cooling box and the coolant arranged inside the nursing head to improve the heat storage capacity during use. Compared with the traditional metal heat storage, its heat storage capacity is large, which can ensure the long-term use of the machine body; the coolant can be replaced according to the use duration of the machine body, and a coolant with a larger specific heat capacity is adopted, which can further extend the use duration.
[0045] The above are only the embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. All equivalent transformations made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied in related technical fields, are similarly included in the patent protection scope of the present utility model.
Claims
1. A water-cooled beauty device for heat dissipation, characterized in that It includes a care head, a semiconductor refrigeration chip and a heat dissipation component. A semiconductor refrigeration chip is provided on the care head. The heat dissipation component includes a cooling box and a coolant. The cooling box is arranged inside the care head. One end of the cooling box is provided with a temperature conducting member that abuts against the semiconductor refrigeration chip. The cooling box is filled with the coolant.
2. The water-cooled beauty device according to claim 1, characterized in that, Heat dissipation fins are provided at one end inside the cooling box corresponding to the end that abuts against the semiconductor refrigeration chip.
3. The water-cooled beauty device according to claim 1, wherein, The temperature conducting member is a metal member.
4. The water-cooled beauty instrument according to claim 1, wherein The temperature conducting member is a part of the cooling box, and the cooling box is a metal box body.
5. The water-cooled beauty device according to claim 1, characterized in that, A slot is provided inside the care head. One end of the cooling box away from the semiconductor refrigeration chip is provided with a plugging protrusion, and the plugging protrusion is inserted into the slot.
6. The water-cooled beauty instrument according to claim 5, wherein It further includes a circuit component. The circuit component is arranged in the slot and is electrically connected to the semiconductor refrigeration chip.
7. The water-cooled beauty instrument according to claim 6, wherein A temperature sensing component connected to the cooling box is provided on the circuit component.
8. The water-cooled beauty device according to claim 1, characterized in that, The cooling box includes a box body and a bottom cover. The box body is provided with an opening at one end away from the semiconductor refrigeration chip. The bottom cover is locked to the box body to seal the opening. A sealing ring is provided between the box body and the bottom cover.
9. The water-cooled beauty instrument according to claim 1, wherein It further includes a cold and hot conductor and a fixing bracket. An opening is provided on the care head. The cold and hot conductor is arranged at the opening of the care head. The fixing bracket is arranged inside the care head. The cold and hot conductor is locked to the fixing bracket, and the fixing bracket is locked to the cooling box. The semiconductor refrigeration chip is clamped between the cold and hot conductor and the cooling box.