Epoxy resin waste flushing device for patch transmitting tube

Abstract

The utility model relates to the field of punching processing, and provides an epoxy resin waste punching and removing device for a patch transmitting tube, which comprises a rack, a feeding plate, a translation piece, a punching die and a driving piece, the translation piece is mounted in the rack; the driving part is installed on the top of the rack, and the driving end of the driving part penetrates through the rack and extends towards the translation part. The punching die is connected with the driving end of the driving part and is positioned in the rack; the feeding plate for placing a patch transmitting tube patch plate is in sliding connection with the translation piece and slides to the position under the punching die along the translation piece; the feeding plate is provided with a flushing opening matched with the position of epoxy resin waste attached to the patch transmitting tube. The driving part drives the punching die to move towards the feeding plate, and the punching die penetrates through the punching and removing opening to punch and remove epoxy resin waste. The punching device has the effect of high-precision and high-efficiency punching removal of waste materials.

Description

Technical Field

[0001] The present application relates to the field of stamping processing, and particularly to an epoxy resin waste flushing device for a chip emitting tube. Background Art

[0002] In the production process of chip emitting tubes, the coating of epoxy resin is one of the key steps. However, in this process, excess epoxy resin adheres to the hollow parts of the lead frame, which affects the subsequent cutting process. At present, although there are some flushing devices on the market, their flushing efficiency and flushing accuracy still need to be improved.

[0003] Although traditional mechanical equipment can improve the flushing efficiency to a certain extent, due to its simple design, it cannot meet the requirements of high-precision and high-efficiency flushing. At the same time, due to the rough operation of mechanical equipment, it is easy to damage the product and affect the product quality. Summary of the Invention

[0004] In order to improve the above problems, the present application provides an epoxy resin waste flushing device for a chip emitting tube.

[0005] The epoxy resin waste flushing device for a chip emitting tube provided by the present application adopts the following technical solutions:

[0006] An epoxy resin waste flushing device for a chip emitting tube includes a frame, a loading plate, a translation member, a punching die and a driving member; the translation member is installed inside the frame; the driving member is installed on the top of the frame, and the driving end extends through the frame towards the translation member; the punching die is connected to the driving end of the driving member and is located inside the frame; the loading plate for placing the chip plate of the chip emitting tube is slidably connected to the translation member and slides along the translation member to directly below the punching die; a flushing opening matching the position of the epoxy resin waste attached to the chip emitting tube is formed on the loading plate; the driving member drives the punching die to move towards the loading plate, and the punching die penetrates through the flushing opening to flush the epoxy resin waste.

[0007] By adopting the above technical solutions, after placing the completed whole chip emitting tubes on the loading plate and aligning the epoxy resin waste of the chip emitting tubes with the flushing opening, the loading plate is pushed into the frame along the translation member until the chip emitting tubes are directly below the punching die to determine the flushing position. The driving member drives the punching die to move towards the loading plate, and the punching die penetrates through the flushing opening, so as to achieve the effect of accurately and uniformly flushing all the waste on the chip plate of the chip emitting tube and improve the flushing efficiency.

[0008] Optionally, a positioning portion is provided on the loading plate; the positioning portion is inserted into the chip plate of the chip emitting tube.

[0009] By adopting the above technical solution, when the whole patch board moves in the vertical direction and is inserted into the positioning part, the placement position of the whole patch board is fixed, so that the epoxy resin waste attached to each patch emitter tube on the patch board is aligned with the die, ensuring the accuracy of the punching position.

[0010] Optionally, the loading board is further provided with an induction part, which is embedded in the loading board and the induction end faces towards the die direction, and the induction part is used to detect the position of the patch emitter tube patch board.

[0011] By adopting the above technical solution, when the patch board of the patch emitter tube is placed on the loading board, if the induction end of the induction part is covered, the placement position is accurate when the induction part senses. If the placement position of the patch board is inaccurate and the induction part recognizes that the patch board fails to cover the induction end, an alarm can be issued to let the worker adjust the position, thus ensuring the accuracy of the placement position of the patch board and improving the accuracy of punching the waste.

[0012] Optionally, the frame is further provided with a baffle, and the baffle is located above the translation part.

[0013] By adopting the above technical solution, the baffle can prevent the epoxy resin waste from splashing when being punched with excessive force.

[0014] Optionally, the baffle is made of a transparent material.

[0015] By adopting the above technical solution, the baffle made of a transparent material enables the user to observe the situation of the loading board below the die from the outside, ensuring the stability of the punching process.

[0016] Optionally, a safety sensor is further provided on the frame.

[0017] By adopting the above technical solution, the main function of the safety sensor is to detect whether someone puts their hand or sundries into the frame during punching, avoid accidents, and improve the safety of processing.

[0018] Optionally, the frame is further provided with a recycling part, and the recycling part is located below the translation part; a recycling opening is formed on the recycling part.

[0019] By adopting the above technical solution, the recycling opening is arranged on the recycling board, enabling the epoxy resin waste after punching to fall from the punching opening to the recycling board and be recycled through the recycling opening, achieving the function of convenient and unified recycling of waste.

[0020] Optionally, the recycling part is provided with a conical surface, and the end of the conical surface is the recycling opening.

[0021] By adopting the above technical solution, the conical surface is used to form an inclined angle on the surface of the recycling part. After the waste material falls onto the conical surface, it can roll or slide along the inclined angle under the influence of gravity into the recycling port, further improving the convenience of recycling.

[0022] In summary, the present application includes at least one of the following beneficial technical effects:

[0023] 1. Place the completed whole-piece patch emitter tube on the loading plate, and after aligning the epoxy resin waste of the patch emitter tube with the punching port, push the loading plate into the machine frame along the translation part until the patch emitter tube is directly below the punching die to determine the punching position. The driving part drives the punching die to move towards the loading plate, and the punching die penetrates the punching port to achieve the effect of accurately and uniformly punching all the waste materials on the patch board of the patch emitter tube;

[0024] 2. When the whole patch board moves in the vertical direction and is inserted into the positioning part, the placement position of the overall patch board is fixed, so that the epoxy resin waste attached to each patch emitter tube on the patch board is aligned with the punching die, ensuring the accuracy of the punching position;

[0025] 3. When the patch board of the patch emitter tube is placed on the loading plate, if the sensing end of the sensing part is covered, the placement position is accurate when the sensing part senses. If the placement position of the patch board is inaccurate and the sensing part recognizes that the patch board fails to cover the sensing end, an alarm can be issued to let the worker adjust the position, thus ensuring the accuracy of the placement position of the patch board and improving the accuracy of punching the waste materials;

[0026] 4. The main function of the safety sensor is to be able to detect whether someone puts their hand or sundries into the machine frame during punching, avoid accidents, and improve the safety of processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a top view structural schematic diagram of a patch board in an embodiment of the present application;

[0028] Figure 2 is a first three-dimensional structural schematic diagram of a punching device in some embodiments of the present application;

[0029] Figure 3 is a second three-dimensional structural schematic diagram of a punching device in some embodiments of the present application;

[0030] Figure 4 is a third three-dimensional structural schematic diagram of a punching device in some embodiments of the present application;

[0031] Figure 5 is a fourth three-dimensional structural schematic diagram of a punching device in some embodiments of the present application;

[0032] Figure 6It is a schematic three-dimensional structure diagram of the separation of the loading plate of the flushing device in some embodiments of the present application;

[0033] The labels in the drawings are: 1, frame; 11, baffle; 12, safety sensor; 13, recovery member; 131, recovery port; 2, loading plate; 21, flushing port; 22, positioning portion; 23, sensing portion; 3, translation member; 4, punching die; 5, driving member; 6, patch board; 61, positioning port. Detailed implementation manners

[0034] The following uses specific specific examples to illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the information disclosed in the present application. The present application can also be implemented or applied through other different specific implementation manners. Various details in the present application can also be modified or changed according to different viewpoints and application systems without departing from the spirit of the present application. It should be noted that, without conflict, the embodiments and features in the embodiments of the present application can be combined with each other.

[0035] The following takes the drawings as a reference and details the embodiments of the present application so that those skilled in the technical field to which the present application belongs can easily implement it. The present application can be embodied in many different forms and is not limited to the embodiments described herein.

[0036] In the description of the present application, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics represented in connection with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials, or characteristics represented can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples represented in the present application and the features of the different embodiments or examples.

[0037] In addition, the terms "first" and "second" are only used for indicating purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0038] Throughout the specification, when a device is said to be "connected" to another device, this includes not only the case of "direct connection", but also the case of "indirect connection" where other elements are placed in between. In addition, when a device is said to "include" a certain component, unless there is a particularly contrary record, it does not exclude other components, but means that other components may also be included.

[0039] The following will further elaborate on this application in conjunction with the attached Figure 1 - attached Figure 6 , for a more detailed description.

[0040] The embodiment of this application discloses an epoxy resin waste flushing device for surface mount emitters.

[0041] An epoxy resin waste flushing device for surface mount emitters is applied to the surface mount board 6 that is interconnected when the surface mount emitters are produced. Referring to Figure 1 as shown, an outer metal frame is attached to the surface mount board 6, and individual surface mount emitters inside are interconnected by metal connection pieces. The main function of this device is to flush the epoxy resin waste on the surface of the surface mount emitters after production to ensure the integrity of the surface of the surface mount emitters.

[0042] Referring to Figure 2 as shown, this flushing device includes a frame 1, a loading board 2, a translation member 3, a punching die 4, and a driving member 5; the frame 1 is the main support frame and can be installed on a workbench or a working plane. The translation member 3 is installed inside the frame 1. The translation member 3 can adopt a translation track, and at least two groups of translation tracks are provided, located on both sides of the frame 1 respectively, to provide positioning and guidance. The driving member 5 is installed on the top of the frame 1. The driving member 5 can adopt any driving element such as a cylinder, a hydraulic cylinder, or an oil cylinder. At the same time, the driving end of the driving member 5 penetrates the frame 1 in the vertical direction for telescoping and can extend towards the translation member 3.

[0043] The punching die 4 is connected to the driving end of the driving member 5 and is located inside the frame 1. A number of punching heads for flushing the epoxy resin waste on the surface mount board 6 of the surface mount emitters are provided on the punching die 4. The positions of the punching heads correspond to the positions of the epoxy resin waste beside the metal connection pieces in the whole surface mount board 6, so that when the punching die 4 is driven by the driving member 5, it can penetrate through the gaps between the metal connection pieces, and the epoxy resin waste can be flushed downward.

[0044] The feeding plate 2 for placing the patch emitting tube patch board 6 is slidably connected to the translation member 3 and slides along the translation member 3 to directly below the punching die 4. The feeding plate 2 provides a placement function. The translation member 3 limits and guides the feeding plate 2, making the movement track of the feeding plate 2 fixed. When the patch emitting tube is placed on the feeding plate 2, the patch emitting tube can move along the translation member 3 to directly below the punching die 4 through the feeding plate 2, ensuring the accuracy of the moving position and avoiding the situation of punching and damaging the patch emitting tube due to position deviation.

[0045] The feeding plate 2 is provided with punching removal openings 21 that match the positions of the epoxy resin waste attached to the patch emitting tube. A plurality of punching removal openings 21 are provided, and each punching removal opening 21 corresponds to a punch on the punching die 4. When the punching die 4 moves towards the punching removal opening 21, it penetrates the epoxy resin waste and punches out the epoxy resin waste, causing the waste epoxy resin waste to fall from the punching removal opening 21.

[0046] Among them, the feeding plate 2 can be provided with a push-pull handle. Through the push-pull handle, it is convenient to push and pull the feeding plate 2 along the translation member 3, which plays a role in facilitating the storage or removal of the patch emitting tube.

[0047] Specifically, after placing the completed whole piece of patch emitting tubes on the feeding plate 2 and aligning the epoxy resin waste of the patch emitting tube with the punching removal opening 21, the feeding plate 2 is pushed into the frame 1 along the translation member 3 until the patch emitting tube is directly below the punching die 4 to determine the punching position. The driving member 5 drives the punching die 4 to move towards the feeding plate 2, and the punch on the punching die 4 penetrates the punching removal opening 21 to punch out the waste of the patch emitting tube.

[0048] After punching, the driving end of the driving member 5 rises and drives the punching die 4 to separate from the feeding plate 2, so that the feeding plate 2 can be pulled out along the translation member 3 for replacement.

[0049] In some embodiments, referring to Figure 2 As shown, the feeding plate 2 is provided with a positioning portion 22. The positioning portion 22 is inserted into the patch emitting tube patch board 6. The positioning portion 22 can adopt a plurality of positioning columns. A plurality of positioning openings 61 can be opened on the metal frame of the whole patch board 6. When the whole patch board 6 moves in the vertical direction and aligns the positioning openings 61 with the positioning columns, the positioning openings 61 are inserted into the positioning columns, so that the placement position of the whole patch board 6 is fixed, ensuring that the epoxy resin waste attached to each patch emitting tube on the patch board 6 is aligned with the punch on the punching die 4 and guaranteeing the accuracy of the punching position.

[0050] Further, the loading plate 2 is also provided with a stepped inner groove, and the style of the inner groove wall of the stepped inner groove matches the outer wall size of the patch board 6, so that when the patch board 6 is directly placed in the stepped inner groove, it can just be embedded into the inner groove. At the same time, with the insertion and positioning of the positioning portion 22, the positioning effect is further accelerated, and there is no need to slowly align and insert the positioning portion 22 in sequence, improving the convenience and positioning accuracy.

[0051] Furthermore, a separation notch is provided in the stepped inner groove. The separation notch enables the user to directly hold the patch board 6 with the hand and then lift the patch board 6 upward, so that the patch board 6 can be directly lifted off the stepped inner groove and the positioning portion 22, further improving the convenience of taking out the patch board 6.

[0052] Still further, as shown in Figure 3 the loading plate 2 is also provided with a sensing portion 23. The sensing portion 23 is embedded in the loading plate 2 and the sensing end faces the direction of the punching die 4. The sensing portion 23 can adopt a photoelectric sensor and can be embedded at the position of the loading plate 2 corresponding to the edge of the patch board 6. Whether the position of the patch board 6 is accurately placed can be judged by whether the sensing end of the photoelectric sensor is covered. Therefore, the sensing portion 23 can be used to detect the position of the patch board 6 for the patch emitting tube.

[0053] Specifically, when the patch board 6 of the patch emitting tube is placed on the loading plate 2, if the sensing end of the sensing portion 23 is covered, the sensing portion 23 senses that the placement position is accurate. If the placement position of the patch board 6 is inaccurate and the sensing portion 23 recognizes that the patch board 6 fails to cover the sensing end, an alarm can be issued to let the worker adjust the position, thus ensuring the accurate placement position of the patch board 6 and improving the accuracy of punching the waste material.

[0054] In some embodiments, as shown in Figure 4 the frame 1 is also provided with a baffle 11. The baffle 11 is located above the translation member 3 and is spaced from the parallel member by a preset distance.

[0055] The baffle 11 can prevent the epoxy resin waste material from splashing when being subjected to excessive force during punching.

[0056] Among them, the baffle 11 is slidably connected to the frame 1 in the vertical direction, and when the baffle 11 slides downward, it abuts against the translation member 3. A sliding groove is opened on the frame 1, and the baffle 11 is inserted into the sliding groove so that it can slide up and down in the vertical direction along the sliding groove. When punching, the baffle 11 can be slid vertically to the translation member 3 to block the separation path of the loading plate 2 and prevent the loading plate 2 from detaching from the translation member 3 due to excessive force.

[0057] Furthermore, the baffle 11 is made of a transparent material, which can be transparent plastic. The use of a transparent material for the baffle 11 enables the user to observe the feeding plate 2 below the punching die 4 from the outside. If it is found that the patch board 6 is offset, the driving member 5 can be closed in time. After opening the baffle 11, the feeding plate 2 can be pulled out along the translation member 3 to be finely adjusted to the accurate position. At the same time, it is also convenient to observe the punching situation during punching to ensure the stability of the punching process.

[0058] Wherein, when the feeding plate 2 is provided with a handle, a through slot can be provided on the baffle 11, and the handle can extend out from the through slot, so that the handle does not affect the blocking effect of the baffle 11.

[0059] In some embodiments, referring to Figure 5 As shown, a safety sensor 12 is further provided on the frame 1. The safety sensor 12 can be an optoelectronic sensor. Its main function is to detect whether someone puts their hand or sundries into the frame 1 during punching to avoid accidents. The optoelectronic sensor can determine whether the punching environment is safe by whether there is occlusion at the detection point.

[0060] In some embodiments, referring to Figure 6 As shown, a recycling member 13 is further provided on the frame 1. The recycling member 13 is located below the translation member 3. A recycling port 131 is opened on the recycling member 13. The recycling member 13 can be a recycling plate. The recycling port 131 is provided on the recycling plate, which can enable the epoxy resin waste after punching to fall from the punching port 21 to the recycling plate and be recycled through the recycling port 131, achieving the effect of convenient unified recycling of waste.

[0061] Furthermore, the recycling member 13 is provided with a conical surface, and the end of the conical surface is the recycling port 131. The conical surface is used to form an inclined angle on the surface of the recycling member 13. After the waste falls onto the conical surface, it can roll or slide along the inclined angle under the influence of gravity into the recycling port 131, further improving the convenience of recycling.

[0062] The embodiments of the specific implementation manners are all preferred embodiments of the present application, and do not limit the protection scope of the present application accordingly. The same components are denoted by the same reference numerals. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. An epoxy resin waste flushing device for a surface mount emitter tube, characterized in that, It includes a frame (1), a loading plate (2), a translator (3), a punching die (4) and a driving member (5); the translator (3) is installed inside the frame (1); the driving member (5) is installed at the top of the frame (1), and its driving end penetrates through the frame (1) and extends towards the translator (3); the punching die (4) is connected to the driving end of the driving member (5) and is located inside the frame (1). The loading plate (2) for placing the patch board (6) of the patch LED is slidably connected to the translator (3) and slides along the translator (3) to directly below the punching die (4); a punching opening (21) matching the position of the epoxy resin waste adhered to the patch LED is formed on the loading plate (2); the driving member (5) drives the punching die (4) to move towards the loading plate (2), and the punching die (4) penetrates through the punching opening (21) to punch out the epoxy resin waste.

2. The epoxy resin waste flushing device for a chip emitting tube according to claim 1, characterized in that, A positioning portion (22) is provided on the loading plate (2); the positioning portion (22) is inserted into the patch board (6) of the patch LED.

3. The epoxy resin waste flushing device for a chip emitting tube according to claim 1 or 2, characterized in that The loading plate (2) is further provided with a sensing portion (23), the sensing portion (23) is embedded in the loading plate (2), and its sensing end faces towards the punching die (4), and the sensing portion (23) is used to detect the position of the patch board (6) of the patch LED.

4. An epoxy resin waste flushing device for a surface mount emitter tube according to claim 1, characterized in that, The frame (1) is further provided with a baffle (11), and the baffle (11) is located above the translator (3).

5. The epoxy resin waste flushing device for a patch emitting tube according to claim 4, characterized in that, The baffle (11) is made of a transparent material.

6. The epoxy resin waste flushing device for the surface mount emitter tube according to claim 1, characterized in that, A safety sensor (12) is further provided on the frame (1).

7. The epoxy resin waste flushing device for a patch emitter tube according to claim 1, wherein, The frame (1) is further provided with a recycling member (13), and the recycling member (13) is located below the translator (3); a recycling opening (131) is formed on the recycling member (13).

8. The epoxy resin waste flushing device for a chip emitting tube according to claim 7, characterized in that, The recycling member (13) is provided with a conical surface, and the end of the conical surface is the recycling opening (131).

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