Logic board comprehensive performance testing device

Abstract

The utility model provides a logic board comprehensive performance testing device which comprises a control module, a data acquisition module and a testing module, and the control module comprises a single-chip microcomputer module, a 485 communication module, a shift register module, a photoelectric coupler module and a reverse driving module. According to the logic board comprehensive performance testing device, for testing logic boards of different models, multiple testing devices do not need to be developed, only testing needle beds of different models need to be replaced, cost input is reduced, a large number of storage positions are not occupied, the utilization rate of the testing devices is high, and the testing device is convenient to use for upgrading of the logic boards. Similarly, only test needle beds of different models need to be replaced, the test requirements of logic boards of different models can be met, and normal delivery of products is guaranteed. The logic board comprehensive performance testing device can be widely applied to logic board comprehensive performance testing.

Description

Technical Field

[0001] The utility model relates to a photoelectric product testing device, in particular to a comprehensive performance testing device for a logic board. Background Art

[0002] The logic board is an indispensable component in a liquid crystal TV. It includes key parts such as a signal processor, an image processor, an audio processor, a power management unit, a control interface, a memory, and a regulator. Therefore, there are relatively high testing standards for the performance of the logic board.

[0003] Due to the diversity of logic board models, currently most enterprises develop different models of testing devices to meet the testing requirements of different models of logic boards. However, each set of testing devices needs to be equipped with dedicated upper computers, workbenches, test probe beds and other supporting facilities. In this way, not only does it increase the cost investment, but also each set of testing devices requires a sufficiently large storage location, occupying a large space area. Moreover, due to the alternating production of different models of logic boards, there will be a problem of a large number of testing devices being idle, resulting in a low utilization rate of the testing devices.

[0004] Furthermore, due to the relatively frequent replacement of logic boards, when a certain model of logic board is phased out or changed, the testing device corresponding to that model can no longer be used, and new testing devices need to be developed. However, the delivery period of logic board products is usually 7 - 10 days, and it is difficult to meet the delivery period requirements by developing new testing devices, resulting in the inability to deliver products normally. Content of the Utility Model

[0005] In view of the above technical problems, the utility model provides a comprehensive performance testing device for a logic board. For testing different models of logic boards, this comprehensive performance testing device for a logic board does not require developing multiple testing devices. Only different models of test probe beds need to be replaced, which reduces the cost investment, does not occupy a large storage location, and has a high utilization rate of the testing device. Moreover, for the problem of logic board replacement, only different models of test probe beds need to be replaced to meet the testing requirements of different models of logic boards and ensure the normal delivery of products.

[0006] To this end, the technical solution of the utility model is a comprehensive performance testing device for a logic board, which includes a control module, a data acquisition module and a testing module. The control module includes a single-chip microcomputer module, a 485 communication module, a shift register module, an optocoupler module and a reverse drive module;

[0007] The data acquisition module includes a voltage acquisition module and a waveform acquisition module;

[0008] The test module includes a logic board placement seat and a relay. One end of the relay is connected to a cylinder, and the cylinder's rise and fall are controlled by the relay. At the other end of the cylinder, a test pin bed is fixedly installed, and at the other end of the test pin bed, test probes are fixedly installed.

[0009] The test module is provided with a start button, through which the operation of the test module is controlled.

[0010] One end of the single-chip microcomputer module is electrically connected to one end of the shift register module. The other end of the shift register module is electrically connected to one end of the reverse drive module. The other end of the reverse drive module is electrically connected to the test module. The other end of the single-chip microcomputer module is respectively electrically connected to the 485 communication module and the optocoupler module. The other end of the 485 communication module is connected to a DIP switch, and the other end of the DIP switch is connected to the upper computer. The other end of the optocoupler module is electrically connected to the test module.

[0011] One end of the voltage acquisition module is electrically connected to the single-chip microcomputer module, and the other end of the voltage acquisition module is electrically connected to the upper computer.

[0012] One end of the waveform acquisition module is electrically connected to the test module, and the other end of the waveform acquisition module is electrically connected to the upper computer.

[0013] The upper computer is connected to a signal generator, and the other end of the signal generator is electrically connected to the test module.

[0014] Preferably, pin 1 of the single-chip microcomputer module is electrically connected to pin 14 of the shift register module, pin 4 of the single-chip microcomputer module is electrically connected to pin 10 of the shift register module, pin 5 of the single-chip microcomputer module is electrically connected to pin 11 of the shift register module, pin 6 of the single-chip microcomputer module is electrically connected to pin 12 of the shift register module, pin 12 of the single-chip microcomputer module is connected to the positive terminal of DC5V, pin 14 of the single-chip microcomputer module is connected to capacitor C36, and the other end of capacitor C36 is connected to the positive terminal of DC5V.

[0015] Pin 1 of the shift register module is electrically connected to pin 8 of the reverse drive module, pin 2 of the shift register module is electrically connected to pin 7 of the reverse drive module, pin 3 of the shift register module is electrically connected to pin 6 of the reverse drive module, pin 4 of the shift register module is electrically connected to pin 5 of the reverse drive module, pin 5 of the shift register module is electrically connected to pin 4 of the reverse drive module, pin 6 of the shift register module is electrically connected to pin 3 of the reverse drive module, pin 7 of the shift register module is electrically connected to pin 2 of the reverse drive module, and pin 8 of the shift register module is electrically connected to pin 1 of the reverse drive module.

[0016] Pin 10 of the reverse drive module is connected to the positive terminal of DC5V. The positive terminal of DC5V is also connected to capacitor C17, and the other end of capacitor C17 is grounded. Pin 9 of the reverse drive module is grounded;

[0017] A resistor R265 is connected to pin 15 of the single-chip microcomputer module. The other end of resistor R265 is electrically connected to pin 1 of the 485 communication module. A resistor R267 is connected to pin 16 of the single-chip microcomputer module. The other end of resistor R267 is connected to a triode Q2. Resistor R267 is electrically connected to the base of triode Q2. The collector of triode Q2 is electrically connected to pins 2 and 3 of the 485 communication module respectively. The collector of triode Q2 is also connected to a resistor R266, and the other end of resistor R266 is connected to the positive terminal of DC5V. The emitter of triode Q2 is electrically connected to pins 4 and 5 of the 485 communication module respectively. The emitter of triode Q2 is also grounded;

[0018] Resistors R269 and R270 are respectively connected to pin 6 of the 485 communication module. The other end of resistor R270 is connected to the positive terminal of DC5V. The other end of resistor R269 is connected to a resistor R268. The end of resistor R269 close to resistor R268 is also electrically connected to pin 7 of the 485 communication module. The other end of resistor R268 is respectively connected to a capacitor C35 and a diode D2. The end of capacitor C35 close to resistor R268 is grounded. The other end of capacitor C35 is electrically connected to pin 8 of the 485 communication module. The end of capacitor C35 close to pin 8 of the 485 communication module is also connected to the positive terminal of DC5V. The other end of diode D2 is connected to a diode D3. The other end of diode D3 is connected to a diode D4. The other end of diode D4 is grounded. The end of diode D2 close to diode D3 is electrically connected to the end of resistor R268 close to resistor R269. The end of diode D2 close to diode D3 is also electrically connected to the DIP switch. The end of diode D3 close to diode D4 is electrically connected to the end of resistor R269 close to resistor R270. The end of diode D3 close to diode D4 is also electrically connected to the DIP switch;

[0019] The other end of the DIP switch is electrically connected to the upper computer;

[0020] A resistor R282 is connected to pin 23 of the single-chip microcomputer module. The other end of resistor R282 is electrically connected to the negative pole of the optocoupler module. The positive pole of the optocoupler module is connected to a resistor R281, and the other end of resistor R281 is connected to the positive terminal of DC5V;

[0021] The collector of the optocoupler module is connected to a resistor R283. The other end of the resistor R283 is respectively connected to a resistor R284 and a diode D7. The end of the resistor R283 close to the resistor R284 is simultaneously connected to the positive terminal of DC12V. The end of the diode D7 close to the resistor R284 is electrically connected to the coil of the relay. The other end of the resistor R284 is connected to an LED lamp. The other end of the LED lamp is electrically connected to the other end of the diode D7. The end of the diode D7 close to the LED lamp is electrically connected to the coil of the relay. The control circuit of the relay is connected to the positive terminal of DC24V;

[0022] The emitter of the optocoupler module is connected to a triode Q5. The emitter of the optocoupler module is electrically connected to the base of the triode Q5. The collector of the triode Q5 is electrically connected to the end of the diode D7 close to the LED lamp;

[0023] The emitter of the optocoupler module is simultaneously connected to a resistor R285. The other end of the resistor R285 is electrically connected to the emitter of the triode Q5. The end of the resistor R285 close to the emitter of the triode Q5 is grounded.

[0024] Preferably, the voltage acquisition module and the host computer are electrically connected through a PCI bus;

[0025] The waveform acquisition module and the host computer are electrically connected through a USB.

[0026] Preferably, the number of start buttons is two, and the two start buttons are connected in series.

[0027] The beneficial effects of the present utility model are:

[0028] 1. The control module can be externally connected to a maximum of 128 product inputs. By combining the shift register module with the optocoupler module and the reverse drive module, each input can be quickly switched, and the voltage, waveform, and frequency can be collected through the voltage acquisition module and the waveform acquisition module to achieve high-efficiency testing.

[0029] 2. By developing a general host computer system and testing device, rapid product changeover can be achieved simply by calling the corresponding test program and replacing the corresponding test probe bed during product changeover;

[0030] Moreover, for the update and replacement of the logic board, only the corresponding test probe bed needs to be manufactured to meet the performance test requirements of the replacement products, greatly reducing the manufacturing cost, and there is no need to manufacture multiple sets of testing devices for different models of products. Description of the Drawings

[0031] Figure 1 is the logic block diagram of the test method of the present utility model;

[0032] Figure 2 It is a schematic diagram of the single-chip microcomputer module in the present utility model;

[0033] Figure 3 It is a schematic diagram of the 485 communication module in the present utility model;

[0034] Figure 4 It is a schematic diagram of the connection principle between the optocoupler module and the relay in the present utility model;

[0035] Figure 5 It is a schematic diagram of the reverse drive module in the present utility model;

[0036] Figure 6 It is a schematic diagram of the shift register module in the present utility model.

[0037] Symbol description in the figure:

[0038] 1. Single-chip microcomputer module; 2. 485 communication module; 3. Shift register module; 4. Optocoupler module; 5. Reverse drive module; 6. Relay; 7. DIP switch. Specific implementation manners

[0039] The following further describes the present utility model in conjunction with embodiments.

[0040] Through Figures 1-6 It can be seen that the comprehensive performance test device for the logic board includes a control module, a data acquisition module, and a test module. The control module includes a single-chip microcomputer module 1, a 485 communication module 2, a shift register module 3, an optocoupler module 4, and a reverse drive module 5.

[0041] Among them, the single-chip microcomputer module 1 is the core of the entire control module and also the core of the entire set of test systems. In this system, the single-chip microcomputer module mainly has two functions:

[0042] (1) Control function: By interacting with the host computer, control the relay to act according to the protocol requirements, such as controlling the lifting of the cylinder, turning on the LED light, and the screen power supply switch, etc.

[0043] (2) Data processing: Analyze and process the data sent by the host computer, and then make corresponding processing according to the processing results.

[0044] The single-chip microcomputer module 1 can also detect whether the magnetic switch of the cylinder is attracted, whether the start button is pressed, the switching result of the voltage acquisition mode and the waveform frequency acquisition mode, the result of the relay controlling the lifting of the cylinder, the result of the relay controlling the color switching of the LED light, the enable of the relay controlling the screen, and the result of the power supply switch.

[0045] The 485 communication module 2 uses differential signal transmission technology, has the characteristics of high anti-interference ability and long-distance transmission, and is mainly used to realize serial data communication.

[0046] The host computer and the microcontroller module 1 perform data interaction through the 485 communication module 2 to achieve the linkage of the entire system.

[0047] The shift register module 3 is a common serial input / parallel output shift register chip, which has the characteristics of high speed, low power consumption and strong reliability, and can realize data shift operation and parallel output.

[0048] The shift register module 3 mainly has two functions:

[0049] (1) Data expansion: Through serial input and shift operation, a single data pin can be expanded into 8 parallel output pins.

[0050] (2) Saving IO resources: Through the serial input and parallel output methods to realize data shift and storage, a large amount of IO resources can be saved when connecting external devices.

[0051] In this patent, the control module can be externally connected to a maximum of 128 product inputs. By combining the shift register module 3 with the optocoupler module 4 and the reverse drive module 5, each input can be quickly switched, and the voltage, waveform and frequency can be collected through the voltage acquisition module and the waveform acquisition module.

[0052] The optocoupler module 4 plays an isolation and protection role in the circuit, isolating each product input to avoid interference between each other.

[0053] The reverse drive module 5 is a commonly used Darlington array integrated circuit with high voltage and large current, and mainly has two functions:

[0054] (1) A freewheeling diode is built into the emitter of each Darlington, which can provide a discharge path for the induced electromotive force when the load (such as a motor or a relay coil) is powered off, protecting the circuit from damage by reverse voltage peaks.

[0055] (2) The high gain characteristic of the Darlington array means that only a small base current is required to drive a large load current, and the input end can accept 5V TTL / CMOS logic level, enabling the chip to be directly interfaced with digital circuits such as microcontrollers and logic gates without additional level conversion, thus reducing the power consumption of the drive circuit.

[0056] The built-in freewheeling diode and open-collector output structure of the reverse drive module 5 provide good protection functions, enhance the reliability and stability of the system, integrate multiple Darlington pairs and freewheeling diodes, greatly simplify the circuit design, reduce the number of external components, and reduce the complexity and cost of the circuit board.

[0057] The relay realizes the switching action of the control circuit through electromagnetic suction, and controls the lifting of the cylinder, the state switching of the LED lamp, the screen enabling, the screen power supply switch, etc.

[0058] The data acquisition module includes a voltage acquisition module and a waveform acquisition module.

[0059] The test module includes a logic board placement seat and a relay 6. One end of the relay 6 is connected to a cylinder, and the relay 6 controls the rising and falling of the cylinder. The other end of the cylinder is fixedly provided with a test pin bed, and the other end of the test pin bed is fixedly provided with test probes.

[0060] The test module is provided with a start button, and the operation of the test module is controlled through the start button.

[0061] One end of the single-chip microcomputer module 1 is electrically connected to one end of the shift register module 3. The other end of the shift register module 3 is electrically connected to one end of the reverse drive module 5. The other end of the reverse drive module 5 is electrically connected to the test module. The other end of the single-chip microcomputer module 1 is respectively electrically connected to the 485 communication module 2 and the optocoupler module 4. The other end of the 485 communication module 2 is connected to a DIP switch 7, and the other end of the DIP switch 7 is connected to the upper computer. The other end of the optocoupler module 4 is electrically connected to the test module.

[0062] One end of the voltage acquisition module is electrically connected to the single-chip microcomputer module 1, and the other end of the voltage acquisition module is electrically connected to the upper computer.

[0063] One end of the waveform acquisition module is electrically connected to the test module, and the other end of the waveform acquisition module is electrically connected to the upper computer.

[0064] The upper computer is connected to a signal generator, and the other end of the signal generator is electrically connected to the test module.

[0065] Pin 1 of the single-chip microcomputer module 1 is electrically connected to pin 14 of the shift register module 3. Pin 4 of the single-chip microcomputer module 1 is electrically connected to pin 10 of the shift register module 3. Pin 5 of the single-chip microcomputer module 1 is electrically connected to pin 11 of the shift register module 3. Pin 6 of the single-chip microcomputer module 1 is electrically connected to pin 12 of the shift register module 3. Pin 12 of the single-chip microcomputer module 1 is connected to the positive terminal of DC5V. Pin 14 of the single-chip microcomputer module 1 is connected to capacitor C36, and the other end of capacitor C36 is connected to the positive terminal of DC5V.

[0066] Pin 1 of the shift register module 3 is electrically connected to pin 8 of the reverse driving module 5, pin 2 of the shift register module 3 is electrically connected to pin 7 of the reverse driving module 5, pin 3 of the shift register module 3 is electrically connected to pin 6 of the reverse driving module 5, pin 4 of the shift register module 3 is electrically connected to pin 5 of the reverse driving module 5, pin 5 of the shift register module 3 is electrically connected to pin 4 of the reverse driving module 5, pin 6 of the shift register module 3 is electrically connected to pin 3 of the reverse driving module 5, pin 7 of the shift register module 3 is electrically connected to pin 2 of the reverse driving module 5, and pin 8 of the shift register module 3 is electrically connected to pin 1 of the reverse driving module 5.

[0067] Pin 10 of the reverse driving module 5 is connected to the positive terminal of DC5V. The positive terminal of DC5V is also connected to a capacitor C17, and the other end of the capacitor C17 is grounded. Pin 9 of the reverse driving module 5 is grounded.

[0068] A resistor R265 is connected to pin 15 of the single-chip microcomputer module 1. The other end of the resistor R265 is electrically connected to pin 1 of the 485 communication module 2. A resistor R267 is connected to pin 16 of the single-chip microcomputer module 1. The other end of the resistor R267 is connected to a triode Q2. The resistor R267 is electrically connected to the base of the triode Q2. The collector of the triode Q2 is electrically connected to pins 2 and 3 of the 485 communication module 2 respectively. The collector of the triode Q2 is also connected to a resistor R266, and the other end of the resistor R266 is connected to the positive terminal of DC5V. The emitter of the triode Q2 is electrically connected to pins 4 and 5 of the 485 communication module 2 respectively, and the emitter of the triode Q2 is also grounded.

[0069] A resistor R269 and a resistor R270 are respectively connected to pin 6 of the 485 communication module 2. The other end of the resistor R270 is connected to the positive terminal of DC5V. The other end of the resistor R269 is connected to a resistor R268. The end of the resistor R269 close to the resistor R268 is electrically connected to pin 7 of the 485 communication module 2 at the same time. The other end of the resistor R268 is respectively connected to a capacitor C35 and a diode D2. The end of the capacitor C35 close to the resistor R268 is grounded. The other end of the capacitor C35 is electrically connected to pin 8 of the 485 communication module 2. The end of the capacitor C35 close to pin 8 of the communication module 2 is connected to the positive terminal of DC5V at the same time. The other end of the diode D2 is connected to a diode D3. The other end of the diode D3 is connected to a diode D4. The other end of the diode D4 is grounded. The end of the diode D2 close to the diode D3 is electrically connected to the end of the resistor R268 close to the resistor R269. The end of the diode D2 close to the diode D3 is electrically connected to the DIP switch 7 at the same time. The end of the diode D3 close to the diode D4 is electrically connected to the end of the resistor R269 close to the resistor R270. The end of the diode D3 close to the diode D4 is electrically connected to the DIP switch 7 at the same time.

[0070] The other end of the DIP switch 7 is electrically connected to the upper computer.

[0071] A DIP switch is a digital electronic switch that can control the output state of external devices through binary codes represented by different switch states.

[0072] In this patent, when the test device needs to be debugged, by setting the state of the DIP switch, the lifting of the cylinder, the screen enable, the screen power switch, etc. can be manually controlled to perform manual operations on the test device.

[0073] Pin 23 of the single-chip microcomputer module 1 is connected to a resistor R282. The other end of the resistor R282 is electrically connected to the negative pole of the optocoupler module 4. The positive pole of the optocoupler module 4 is connected to a resistor R281, and the other end of the resistor R281 is connected to the positive terminal of DC5V.

[0074] The collector of the optocoupler module 4 is connected to a resistor R283. The other end of the resistor R283 is respectively connected to a resistor R284 and a diode D7. The end of the resistor R283 close to the resistor R284 is simultaneously connected to the positive terminal of DC12V. The end of the diode D7 close to the resistor R284 is simultaneously electrically connected to the coil of the relay 6. The other end of the resistor R284 is connected to an LED lamp. The other end of the LED lamp is electrically connected to the other end of the diode D7. The end of the diode D7 close to the LED lamp is simultaneously electrically connected to the coil of the relay 6. The control circuit of the relay 6 is connected to the positive terminal of DC24V.

[0075] The emitter of the optocoupler module 4 is connected to a triode Q5. The emitter of the optocoupler module 4 is electrically connected to the base of the triode Q5. The collector of the triode Q5 is electrically connected to the end of the diode D7 close to the LED lamp.

[0076] The emitter of the optocoupler module 4 is simultaneously connected to a resistor R285. The other end of the resistor R285 is electrically connected to the emitter of the triode Q5. The end of the resistor R285 close to the emitter of the triode Q5 is simultaneously grounded.

[0077] The voltage acquisition module is electrically connected to the upper computer through a PCI bus.

[0078] The waveform acquisition module is electrically connected to the upper computer through a USB.

[0079] The number of start buttons is two. The two start buttons are connected in series. During operation, both start buttons need to be pressed simultaneously for the test device to run, avoiding equipment operation failures caused by misoperations of the operator. Moreover, it can avoid the situation of personnel injury caused by misoperations of the operator.

[0080] A method for performing performance testing using the above-mentioned comprehensive performance testing device for logic boards includes the following steps:

[0081] Step (1): Turn on the power supply and install the test probe bed for the logic board model to be tested.

[0082] Step (2): Place the logic board to be tested on the logic board placement seat, start the host computer program, select the logic board model to be tested, click the run button on the host computer interface, the host computer sends a power-off instruction to the signal generator to control the signal generator to power off, and then sends a parameter adjustment instruction to control the signal generator to switch to the parameters of the logic board model to be tested.

[0083] Step (3): The host computer program sends a cylinder closing instruction to the single-chip microcomputer module 1 to turn off the automatic rising function of the cylinder.

[0084] Step (4): Press the two start buttons simultaneously, the relay 6 controls the cylinder to descend, and the test probes on the test probe bed are in contact with the test points on the logic board. After the host computer program sends a magnetic switch closing instruction to the single-chip microcomputer module 1 and the single-chip microcomputer module 1 detects the closing of the magnetic switch, it sends a feedback instruction to the host computer program.

[0085] Step (5): After receiving the instruction, the host computer program sends a reset instruction to the single-chip microcomputer module 1 to reset the states of all modules on the control module.

[0086] Step (6): The host computer program sends a voltage output instruction to the signal generator, and the signal generator outputs a preset voltage to supply power to the logic board.

[0087] Step (7): The host computer program sends a power supply instruction to the single-chip microcomputer module 1 to control the screen enable and screen power supply.

[0088] Step (8): The host computer program sends a mode switching instruction to the single-chip microcomputer module 1 to switch the control module to operate in the mode of using the voltage acquisition module.

[0089] Step (9): The host computer program sends a channel switching instruction to the single-chip microcomputer module 1. The control module controls the operation of the optocoupler module 4 according to the program preset for the logic board model, opens the corresponding channel through the optocoupler module 4, and then forms a voltage conversion circuit through the shift register module 3 and the reverse drive module 5 to collect the voltage parameters of the logic board.

[0090] Step (10): The host computer program sends a mode switching instruction to the single-chip microcomputer module 1 to switch the control module to operate in the mode of using the waveform acquisition module.

[0091] Step (11): The host computer program sends a channel switching instruction to the single-chip microcomputer module 1 to control the enabling of the corresponding channel and turn on the channel. The dynamic link library of the waveform acquisition module is used to enable the acquisition control module, and at the same time, the frequency detection channel of the logic board corresponding to the channel is turned on. The waveform parameters and frequency parameters of the logic board are collected through the waveform acquisition module.

[0092] Step (12): The host computer program sends a shutdown instruction to the signal generator to control the shutdown of the output end of the signal generator.

[0093] Step (13): The host computer program sends a shutdown instruction to the single-chip microcomputer module 1 to control the shutdown of the screen enabling and the screen power supply.

[0094] Step (14): The host computer program makes a comprehensive judgment based on the collected voltage parameters, waveform parameters, and frequency. Then, the host computer sends the test result to the single-chip microcomputer module 1. When the test result is a good product, the color of the LED light is green. When the test result is a defective product, the color of the LED light is red. At the same time, the relay 6 controls the cylinder to rise to complete a single performance test.

[0095] In this comprehensive performance test device and test method for the logic board, by developing a general host computer system and test device, rapid product changeover can be achieved only by calling the corresponding test program and replacing the corresponding test bed.

[0096] Moreover, for the update and replacement of the logic board, only by manufacturing the corresponding test bed can the performance test requirements of the replacement products be met, greatly reducing the manufacturing cost, and there is no need to manufacture multiple sets of test devices for different models of products.

[0097] At the same time, the problem of storage space is also fully improved. Only the test beds of different models need to be stored. For example, a shelf with a specification of 2200*1800*600 can store 16 test beds. Compared with storing the entire set of test devices, it is both convenient for management and saves space.

[0098] Most importantly, in actual operation, it takes at least 20 days to manufacture a complete set of test devices, while the cycle for manufacturing a single test bed is only 3 days, which can fully ensure the normal delivery of products.

[0099] Only the above-mentioned are specific embodiments of the present utility model, and the scope of implementation of the present utility model cannot be limited thereby. Therefore, the replacement of equivalent components or equivalent changes and modifications made according to the scope of patent protection of the present utility model should still fall within the scope covered by the claims of the present utility model.

Claims

1. A comprehensive performance testing device for a logic board, characterized in that: It includes a control module, a data acquisition module and a test module. The control module includes a single-chip microcomputer module, a 485 communication module, a shift register module, an optocoupler module and a reverse drive module; The data acquisition module includes a voltage acquisition module and a waveform acquisition module; The test module includes a logic board placement seat and a relay. One end of the relay is connected to a cylinder. The cylinder is controlled to rise and fall through the relay. The other end of the cylinder is fixedly provided with a test bed, and the other end of the test bed is fixedly provided with test probes; A start button is provided on the test module, and the operation of the test module is controlled through the start button; One end of the single-chip microcomputer module is electrically connected to one end of the shift register module. The other end of the shift register module is electrically connected to one end of the reverse drive module. The other end of the reverse drive module is electrically connected to the test module. The other end of the single-chip microcomputer module is respectively electrically connected to the 485 communication module and the optocoupler module. The other end of the 485 communication module is connected to a DIP switch, and the other end of the DIP switch is connected to a host computer. The other end of the optocoupler module is electrically connected to the test module; One end of the voltage acquisition module is electrically connected to the single-chip microcomputer module, and the other end of the voltage acquisition module is electrically connected to the host computer; One end of the waveform acquisition module is electrically connected to the test module, and the other end of the waveform acquisition module is electrically connected to the host computer; The host computer is connected to a signal generator, and the other end of the signal generator is electrically connected to the test module.

2. The comprehensive performance testing device for a logic board according to claim 1, wherein: Pin 1 of the single-chip microcomputer module is electrically connected to pin 14 of the shift register module. Pin 4 of the single-chip microcomputer module is electrically connected to pin 10 of the shift register module. Pin 5 of the single-chip microcomputer module is electrically connected to pin 11 of the shift register module. Pin 6 of the single-chip microcomputer module is electrically connected to pin 12 of the shift register module. Pin 12 of the single-chip microcomputer module is connected to the positive terminal of DC5V. Pin 14 of the single-chip microcomputer module is connected to capacitor C36, and the other end of capacitor C36 is connected to the positive terminal of DC5V; Pin 1 of the shift register module is electrically connected to pin 8 of the reverse drive module. Pin 2 of the shift register module is electrically connected to pin 7 of the reverse drive module. Pin 3 of the shift register module is electrically connected to pin 6 of the reverse drive module. Pin 4 of the shift register module is electrically connected to pin 5 of the reverse drive module. Pin 5 of the shift register module is electrically connected to pin 4 of the reverse drive module. Pin 6 of the shift register module is electrically connected to pin 3 of the reverse drive module. Pin 7 of the shift register module is electrically connected to pin 2 of the reverse drive module. Pin 8 of the shift register module is electrically connected to pin 1 of the reverse drive module; Pin 10 of the reverse drive module is connected to the positive terminal of DC5V. The positive terminal of DC5V is simultaneously connected to capacitor C17, and the other end of capacitor C17 is grounded. Pin 9 of the reverse drive module is grounded; Pin 15 of the single-chip microcomputer module is connected to resistor R265. The other end of resistor R265 is electrically connected to Pin 1 of the 485 communication module. Pin 16 of the single-chip microcomputer module is connected to resistor R267. The other end of resistor R267 is connected to triode Q2. Resistor R267 is electrically connected to the base of triode Q2. The collector of triode Q2 is electrically connected to Pins 2 and 3 of the 485 communication module respectively. The collector of triode Q2 is also connected to resistor R266 at the same time. The other end of resistor R266 is connected to the positive terminal of DC5V. The emitter of triode Q2 is electrically connected to Pins 4 and 5 of the 485 communication module respectively. The emitter of triode Q2 is also grounded at the same time; Pin 6 of the 485 communication module is connected to resistor R269 and resistor R270 respectively. The other end of resistor R270 is connected to the positive terminal of DC5V. The other end of resistor R269 is connected to resistor R268. The end of resistor R269 close to resistor R268 is electrically connected to Pin 7 of the 485 communication module at the same time. The other end of resistor R268 is connected to capacitor C35 and diode D2 respectively. The end of capacitor C35 close to resistor R268 is grounded. The other end of capacitor C35 is electrically connected to Pin 8 of the 485 communication module. The end of capacitor C35 close to Pin 8 of the 485 communication module is connected to the positive terminal of DC5V at the same time. The other end of diode D2 is connected to diode D3. The other end of diode D3 is connected to diode D4. The other end of diode D4 is grounded. The end of diode D2 close to diode D3 is electrically connected to the end of resistor R268 close to resistor R269. The end of diode D2 close to diode D3 is electrically connected to the DIP switch at the same time. The end of diode D3 close to diode D4 is electrically connected to the end of resistor R269 close to resistor R270. The end of diode D3 close to diode D4 is electrically connected to the DIP switch at the same time; The other end of the DIP switch is electrically connected to the upper computer; Pin 23 of the single-chip microcomputer module is connected to resistor R282. The other end of resistor R282 is electrically connected to the negative pole of the optocoupler module. The positive pole of the optocoupler module is connected to resistor R281. The other end of resistor R281 is connected to the positive terminal of DC5V; The collector of the optocoupler module is connected to resistor R283. The other end of resistor R283 is connected to resistor R284 and diode D7 respectively. The end of resistor R283 close to resistor R284 is connected to the positive terminal of DC12V at the same time. The end of diode D7 close to resistor R284 is electrically connected to the coil of the relay at the same time. The other end of resistor R284 is connected to an LED lamp. The other end of the LED lamp is electrically connected to the other end of diode D7. The end of diode D7 close to the LED lamp is electrically connected to the coil of the relay at the same time. The control circuit of the relay is connected to the positive terminal of DC24V; The emitter of the optocoupler module is connected to a triode Q5. The emitter of the optocoupler module is electrically connected to the base of the triode Q5. The collector of the triode Q5 is electrically connected to one end of the diode D7 close to the LED lamp; The emitter of the optocoupler module is also connected to a resistor R285. The other end of the resistor R285 is electrically connected to the emitter of the triode Q5. One end of the resistor R285 close to the emitter of the triode Q5 is grounded at the same time.

3. The comprehensive performance testing device for a logic board according to claim 1, wherein: The voltage acquisition module and the host computer are electrically connected through a PCI bus; The waveform acquisition module and the host computer are electrically connected through a USB; 4. The integrated performance testing device for logic boards according to claim 1, characterized in that: The number of start buttons is two, and the two start buttons are connected in series.

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