Invisible ultraviolet LED packaging structure

Abstract

The invisible ultraviolet LED packaging structure comprises a support and a perspective window, the top of the support is provided with an opening and is recessed inwards to form a packaging cavity used for installing an ultraviolet chip, the perspective window is installed at the opening of the support and is used for sealing the packaging cavity, the perspective window is provided with an optical film, and the optical film is arranged on the support. The optical thin film is used for absorbing visible light in ultraviolet light emitted by the ultraviolet chip; the packaging structure formed by the support and the perspective window can effectively protect the ultraviolet chip located in the packaging structure, ultraviolet light emitted by the ultraviolet chip can penetrate through the perspective window to sterilize and disinfect the external environment, meanwhile, visible light in the ultraviolet light emitted by the ultraviolet chip can be absorbed through the optical film arranged on the perspective window, and light pollution is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lamps, in particular to an invisible ultraviolet LED packaging structure. Background Art

[0002] Ultraviolet LED lamps have good sterilization and disinfection functions and are widely used in the household appliance field.

[0003] Since the operating time of some household appliances is relatively special, for example, air conditioners will operate late at night. During the sterilization and disinfection process of ultraviolet LED lamps, visible light will be emitted from the air outlet, causing light pollution and affecting people's rest at night, that is, light pollution.

[0004] To meet this special application requirement, the utility model proposes a special packaging structure. Summary of the Utility Model

[0005] In view of this, it is necessary to provide an invisible ultraviolet LED packaging structure to block visible light.

[0006] The utility model provides an invisible ultraviolet LED packaging structure, including a bracket and a perspective window. Among them, the top of the bracket is open and recessed inward to form a packaging cavity for installing an ultraviolet chip. The perspective window is installed at the opening of the bracket to close the packaging cavity. An optical film is provided on the perspective window, and the optical film is used to absorb visible light in the ultraviolet light emitted by the ultraviolet chip.

[0007] Further, the bracket includes an insulating ceramic bottom plate and a dam. The bottom of the dam is connected to the edge of the insulating ceramic bottom plate to form the packaging cavity.

[0008] Further, the bracket further includes a circuit connection layer, which is laid on the top of the insulating ceramic bottom plate, and the circuit connection layer is electrically connected to the ultraviolet chip.

[0009] Further, the bracket further includes a plurality of pads, and the plurality of pads are installed at the bottom of the insulating ceramic bottom plate and are electrically connected to the ultraviolet chip through the circuit connection layer.

[0010] Further, the bracket further includes a plurality of metal conduction columns corresponding to the plurality of pads one by one. The plurality of metal conduction columns penetrate through the insulating ceramic bottom plate, the tops of the plurality of metal conduction columns are all electrically connected to the circuit connection layer, and the bottoms of the plurality of metal conduction columns are respectively electrically connected to the corresponding pads.

[0011] Further, it further includes a Zener diode installed on the circuit connection layer, and the Zener diode is connected in parallel with the ultraviolet chip.

[0012] Further, the perspective window is made of quartz or sapphire.

[0013] Further, the optical thin film has an anti-reflection effect on light with a peak wavelength of 200-350 nm, and has an absorption cut-off effect on light with a peak wavelength of 350-780 nm. The peak wavelength of the ultraviolet light emitted by the ultraviolet chip is 200-320 nm.

[0014] Further, the dam is of a frame structure.

[0015] Further, the dam is of an annular structure.

[0016] Compared with the prior art, the packaging structure formed by the bracket and the perspective window can effectively protect the ultraviolet chip located therein. The ultraviolet light emitted by the ultraviolet chip can pass through the perspective window and sterilize and disinfect the external environment. At the same time, through the optical thin film provided on the perspective window, the visible light in the ultraviolet light emitted by the ultraviolet chip can be absorbed to avoid light pollution. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure in the invisible ultraviolet LED packaging structure provided by the embodiment of the present invention;

[0018] Figure 2 It is a top view schematic diagram of the bracket in the invisible ultraviolet LED packaging structure provided by the embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] The following will specifically describe the preferred embodiments of the present invention in conjunction with the drawings. The drawings form a part of this application and are used together with the embodiments of the present invention to explain the principle of the present invention, and are not used to limit the scope of the present invention.

[0020] As Figure 1 shown, an invisible ultraviolet LED packaging structure provided by the present invention includes a bracket 1 and a perspective window 4. Among them, the top of the bracket 1 is open and recessed inward to form a packaging cavity for installing an ultraviolet chip 2. The perspective window is installed at the opening of the bracket 1 to close the packaging cavity. An optical thin film is provided on the perspective window 4, and the optical thin film is used to absorb the visible light in the ultraviolet light emitted by the ultraviolet chip 2.

[0021] During implementation, the packaging structure formed by the bracket 1 and the perspective window 4 can effectively protect the ultraviolet chip 2 located therein. The ultraviolet light emitted by the ultraviolet chip 2 can pass through the perspective window and sterilize and disinfect the external environment. At the same time, through the optical thin film provided on the perspective window 4, the visible light in the ultraviolet light emitted by the ultraviolet chip 2 can be absorbed to avoid light pollution.

[0022] The bracket 1 in this embodiment is a structure for protecting the ultraviolet chip 2.

[0023] In one embodiment, the bracket 1 includes an insulating ceramic bottom plate 11 and a dam 15. The bottom of the dam 15 is connected to the edge of the insulating ceramic bottom plate 11 to form a packaging cavity.

[0024] The dam 15 in this embodiment is a frame structure. In another embodiment, the dam 15 is an annular structure. It can be understood that the shape of the dam 15 can also be triangular, etc., and is not limited thereto.

[0025] Among them, the insulating ceramic bottom plate 11 can be made of materials such as aluminum nitride ceramic, alumina ceramic, zirconia ceramic, etc.

[0026] As Figure 2 shown, for facilitating the external power supply connection to the ultraviolet chip 2, in one embodiment, the bracket 1 further includes a circuit connection layer 12. The circuit connection layer 12 is laid on the top of the insulating ceramic bottom plate 11, and the circuit connection layer 12 is electrically connected to the ultraviolet chip 2. Among them, the ultraviolet chip 2 is fixed on the surface of the circuit connection layer 12 by a die bonding process.

[0027] Among them, the bracket 1 further includes a plurality of pads 13. The plurality of pads 13 are installed at the bottom of the insulating ceramic bottom plate 11 and are electrically connected to the ultraviolet chip 2 via the circuit connection layer 12.

[0028] Among them, the bracket 1 further includes a plurality of metal conduction columns 14 corresponding to the plurality of pads 13 one by one. The plurality of metal conduction columns 14 penetrate through the insulating ceramic bottom plate 11. The tops of the plurality of metal conduction columns 14 are all electrically connected to the circuit connection layer 12, and the bottoms of the plurality of metal conduction columns 14 are respectively electrically connected to the corresponding pads 13.

[0029] The ultraviolet chip 2 in this embodiment is used to emit ultraviolet light, and the ultraviolet light contains visible light. And this application is exactly based on this need to intercept the above-mentioned visible light to eliminate light pollution.

[0030] This embodiment further includes a Zener diode 3 installed on the circuit connection layer 12. The Zener diode 3 is connected in parallel with the ultraviolet chip 2. The Zener diode 3 is used to protect the ultraviolet chip 2 to prevent the ultraviolet chip 2 from being electrostatically broken down. The turn-on voltage of the Zener diode 3 is slightly greater than the operating voltage of the ultraviolet chip 2.

[0031] The viewing window 4 in this embodiment is made of quartz or sapphire. It is installed at the opening of the bracket 1 for closing the packaging cavity. An optical film is provided on the viewing window 4, and the optical film is used to absorb the visible light in the ultraviolet light emitted by the ultraviolet chip 2.

[0032] The optical thin film in this embodiment has an antireflection effect on light with a peak wavelength of 200 - 350 nm and an absorption cut-off effect on light with a peak wavelength of 350 - 780 nm. Among them, the peak wavelength of the ultraviolet light emitted by the ultraviolet chip 2 is 200 - 320 nm. Therefore, the above optical thin film has the ability to enhance the transmission of ultraviolet light, improving the sterilization and disinfection effect. At the same time, the optical thin film can absorb and cut off visible light to eliminate light pollution.

[0033] The optical thin film in this embodiment is made of hafnium oxide and silicon oxide materials. Of course, other materials can also be used to make the above optical thin film.

[0034] It can be understood that the above functions can be achieved by arranging the optical thin film on either side of the perspective window 4, and there is no limitation in this regard.

[0035] Compared with the prior art: The packaging structure formed by the bracket 1 and the perspective window can effectively protect the ultraviolet chip 2 located therein. The ultraviolet light emitted by the ultraviolet chip 2 can pass through the perspective window to sterilize and disinfect the external environment. At the same time, through the optical thin film provided on the perspective window, the visible light in the ultraviolet light emitted by the ultraviolet chip 2 can be absorbed to avoid light pollution.

[0036] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.

Claims

1. An invisible ultraviolet LED packaging structure, characterized in that Comprising: A bracket with an open top and recessed inward to form a packaging cavity for mounting an ultraviolet chip; A perspective window installed at the opening of the bracket to close the packaging cavity. An optical thin film is provided on the perspective window, and the optical thin film is used to absorb visible light in the ultraviolet light emitted by the ultraviolet chip.

2. The invisible ultraviolet LED packaging structure according to claim 1, wherein, The bracket includes an insulating ceramic bottom plate and a dam. The bottom of the dam is connected to the edge of the insulating ceramic bottom plate to form the packaging cavity.

3. The invisible ultraviolet LED packaging structure according to claim 2, characterized in that, The bracket further includes a circuit connection layer laid on the top of the insulating ceramic bottom plate, and the circuit connection layer is electrically connected to the ultraviolet chip.

4. The invisible ultraviolet LED packaging structure according to claim 3, characterized in that, The bracket further includes a plurality of pads. The plurality of pads are installed at the bottom of the insulating ceramic bottom plate and are electrically connected to the ultraviolet chip via the circuit connection layer.

5. The invisible ultraviolet LED packaging structure according to claim 4, characterized in that, The bracket further includes a plurality of metal conduction columns corresponding one-to-one to the plurality of pads. The plurality of metal conduction columns penetrate through the insulating ceramic bottom plate. The tops of the plurality of metal conduction columns are all electrically connected to the circuit connection layer, and the bottoms of the plurality of metal conduction columns are respectively electrically connected to the corresponding pads.

6. The invisible ultraviolet LED packaging structure according to claim 3, wherein, It further includes a Zener diode installed on the circuit connection layer, and the Zener diode is connected in parallel with the ultraviolet chip.

7. The invisible ultraviolet LED packaging structure according to claim 1, characterized in that, The perspective window is made of quartz or sapphire.

8. The invisible ultraviolet LED packaging structure according to claim 1, characterized in that, The optical thin film has an antireflection effect on light with a peak wavelength of 200 - 350 nm and an absorption cut-off effect on light with a peak wavelength of 350 - 780 nm. The peak wavelength of the ultraviolet light emitted by the ultraviolet chip is 200 - 320 nm.

9. The invisible ultraviolet LED packaging structure according to claim 2, wherein, The dam is a frame structure.

10. The invisible ultraviolet LED packaging structure according to claim 2, wherein The dam is an annular structure.

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