Vapor deposition equipment

Abstract

The utility model belongs to the technical field of display device manufacturing, and discloses vapor deposition equipment which comprises a placing frame arranged at the cavity bottom of a transfer chamber and a dust removal device, a substrate is stored on the placing frame, the dust removal device comprises a driving part, a dust removal box and a dust suction assembly, the dust removal box is arranged at the driving end of the driving part, and the cavity bottom of the transfer chamber is a transfer cavity bottom. The dust removal box is spaced from the transfer cavity bottom, a containing groove is formed in the side, facing the transfer cavity bottom, of the dust removal box, the length of the containing groove extends in the first direction, a dust suction assembly is arranged in the containing groove, and the driving part is in transmission connection with the dust removal box and drives the dust removal box and the dust suction assembly to move in the second direction to remove impurities at the transfer cavity bottom. According to the vapor deposition equipment disclosed by the utility model, the dust removal device is arranged in the transfer chamber, so that automatic dust removal of the environment in the transfer chamber is realized, a good working environment of the transfer chamber is ensured, and the situation that a substrate is temporarily stored in the transfer chamber and is polluted by dust is reduced, thereby improving the deposition yield of the substrate.

Description

Technical Field

[0001] The utility model relates to the technical field of display device manufacturing, in particular to a chemical vapor deposition device. Background Art

[0002] With the development of semiconductor technology, plasma enhanced chemical vapor deposition (PECVD) devices are increasingly widely developed and used. In this device, a gas source is introduced into a deposition chamber, and the gas source is excited into plasma under set conditions. The plasma adsorbs on the surface of a substrate to form a thin film. Factors such as the operating environment, gas flow rate, radio frequency electric field power, and process temperature may all have an important impact on the quality of the finally formed thin film.

[0003] Refer to Figure 1 As shown, an existing chemical vapor deposition device includes an operation chamber 1′, and a sample preparation chamber 2′, a transfer chamber 3′, and a deposition chamber 4′ surrounding the operation chamber. The sample preparation chamber is used to store a certain number of substrates 5′ and perform corresponding dust removal operations. The transfer chamber 3′ provides a space for temporarily storing the substrates 5′. The deposition chamber 4′ is used to perform deposition processing on the substrates 5′. Valves 6′ are provided in the sample preparation chamber 2′, the transfer chamber 3′, and the deposition chamber 4′ to communicate with or seal off from the operation chamber 1′. A manipulator 7′ in the operation chamber 1′ is used to place the substrates 5′ temporarily stored in the transfer chamber 3′ into the deposition chamber 4′ for deposition, and to place the substrates 5′ in the sample preparation chamber 2′ into the transfer chamber 3′ for temporary storage.

[0004] The existing technology has the following deficiencies: In addition to trace dust in the operating environment, structural friction such as the frequent opening and closing of the valves 6′ and the long-term operation of the manipulator 7′ will also generate a certain amount of dust. Therefore, after the substrates 5′ are dust-removed in the sample preparation chamber 2′ and transferred to the transfer chamber 3′, since the transfer chamber 3′ only functions to temporarily store the substrates 5′, there is a possibility that the substrates 5′ will be contaminated with dust when placed in the transfer chamber 3′, affecting the deposition quality of the substrates 5′. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a chemical vapor deposition device, which has a simple structure and an automatic dust removal device in the transfer chamber to ensure the cleanliness of the temporary storage environment of the substrates to be plated.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] Provided is a vapor deposition device, including a manipulator, a sample preparation chamber, a transfer chamber, and a deposition chamber arranged in sequence. The manipulator is used to place the substrate in the sample preparation chamber into the transfer chamber for temporary storage and to place the substrate temporarily stored in the transfer chamber into the deposition chamber for deposition. The vapor deposition device further includes a placement rack and a dust removal device arranged at the bottom of the cavity of the transfer chamber. The substrate is stored on the placement rack, and the dust removal device is located below the placement rack. The dust removal device includes a driving member, a dust removal box, and a dust suction assembly. The dust removal box is arranged at the driving end of the driving member. The bottom of the cavity of the transfer chamber is the transfer cavity bottom. The dust removal box is spaced from the transfer cavity bottom, and a receiving groove is formed on one side of the dust removal box facing the transfer cavity bottom. The length of the receiving groove extends in a first direction, and the dust suction assembly is arranged in the receiving groove. The driving member is in transmission connection with the dust removal box, driving the dust removal box and the dust suction assembly to move in a second direction to clean the transfer cavity bottom. Wherein, the first direction and the second direction are perpendicularly arranged.

[0008] As a preferred solution of the vapor deposition device, the dust suction assembly includes a controller, an anode plate and a cathode plate arranged at intervals in the vertical direction in the receiving groove. The anode plate is located above the cathode plate. Both the anode plate and the cathode plate are connected to an external power source through the controller. A dust discharge port is formed in the transfer cavity bottom. The dust discharge port is connected to an external negative pressure mechanism. When the driving member drives the dust removal box to move to a specified position in the second direction, the projection of the dust discharge port in the vertical direction is located in the receiving groove. Wherein, the first direction and the second direction are both perpendicularly arranged with respect to the vertical direction.

[0009] As a preferred solution of the vapor deposition device, the vapor deposition device further includes a blow pipe. The dust discharge port is adjacent to one side of the dust removal box in the first direction. A blow pipe communicating with the receiving groove is arranged on the other side of the dust removal box in the first direction. The blow pipe is connected to an external blowing mechanism through the controller.

[0010] As a preferred solution of the vapor deposition device, the dust discharge port is connected to the external negative pressure mechanism through a dust removal pipe. A butterfly valve is arranged on the dust removal pipe. The butterfly valve is connected to the controller. A filter element is detachably connected to the dust removal pipe, and the filter element is located between the dust discharge port and the butterfly valve.

[0011] As a preferred solution of the vapor deposition device, the anode plate and the cathode plate are respectively detachably connected to the dust removal box.

[0012] As a preferred embodiment of the vapor deposition equipment, the dust removal box is an insulating box. The dust removal box has a first side and a second side arranged along the first direction. Two mounting openings communicating with the receiving groove are arranged at intervals along the vertical direction on the first side. Two mounting grooves are arranged at positions corresponding to the mounting openings on the groove wall of the receiving groove adjacent to the second side. The anode plate and the cathode plate are respectively inserted into the corresponding mounting grooves corresponding to the upper and lower two mounting openings.

[0013] As a preferred embodiment of the vapor deposition equipment, both the anode plate and the cathode plate include a stopping portion and a main body portion protruding from the stopping portion. One end of the main body portion away from the stopping portion is inserted into the mounting groove along the mounting opening. The stopping portion abuts against the first side. A through hole is formed in the stopping portion, and a threaded hole is formed in the first side. A bolt passes through the through hole and is screwed into the threaded hole to fix the stopping portion to the dust removal box.

[0014] As a preferred embodiment of the vapor deposition equipment, a plug-in groove is recessed on the first side. The stopping portion is inserted into the plug-in groove, and the threaded hole is arranged at the bottom of the plug-in groove.

[0015] As a preferred embodiment of the vapor deposition equipment, the driving member includes a motor, a lead screw, and a lead screw nut. The lead screw is rotatably arranged at the bottom of the transfer chamber through a bracket, and the length of the lead screw extends along the second direction. The lead screw nut is slidably arranged on the lead screw. The dust removal box is arranged on the lead screw nut. The motor is in transmission connection with the lead screw to drive the lead screw nut to drive the dust removal box to move along the second direction.

[0016] As a preferred embodiment of the vapor deposition equipment, the vapor deposition equipment further includes a guiding assembly. The guiding assembly includes a slide rail and a slide block. The slide rail is arranged at the bottom of the transfer chamber, and the length of the slide rail extends along the second direction. The lead screw and the slide rail are arranged at intervals along the first direction. The slide block is slidably arranged on the slide rail. Along the first direction, one end of the dust removal box is connected to the lead screw nut, and the other end is connected to the slide block.

[0017] The beneficial effects of the present utility model are as follows: By arranging a dust removal device in the transfer chamber, automatic dust removal in the transfer chamber is realized, the good working environment of the transfer chamber is ensured, the situation that the substrate is temporarily stored in the transfer chamber and contaminated by dust is reduced, thereby improving the deposition yield of the substrate; By arranging a receiving groove extending along the first direction in the dust removal box and using a driving member to drive the dust removal box and the dust removal assembly in the receiving groove to move along the second direction, comprehensive cleaning of the bottom of the transfer chamber is realized. The dust removal device has a simple and compact structure and occupies less space. Description of the Drawings

[0018] The present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0019] Figure 1 is a schematic structural diagram of an existing vapor deposition device;

[0020] Figure 2 is a schematic structural diagram of the vapor deposition device according to an embodiment of the present utility model;

[0021] Figure 3 is a schematic diagram of the cooperation of the dust removal device, the placement rack and the bottom of the transfer chamber according to an embodiment of the present utility model;

[0022] Figure 4 is a schematic diagram of the cooperation of the dust removal device and the bottom of the transfer chamber according to an embodiment of the present utility model;

[0023] Figure 5 is a schematic diagram of the cooperation of the dust removal box and the dust suction assembly according to an embodiment of the present utility model;

[0024] Figure 6 is a schematic structural diagram of the dust removal box according to an embodiment of the present utility model.

[0025] Figure 1 In:

[0026] 1′, operation room; 2′, sample preparation room; 3′, transfer room; 4′, deposition room; 5′, substrate; 6′, valve; 7′, manipulator;

[0027] Figures 2 to 6 In:

[0028] 100, manipulator; 200, sample preparation room; 300, transfer room; 301, bottom of the transfer chamber; 302, dust exhaust port; 400, deposition room; 500, substrate;

[0029] 1, placement rack; 2, dust removal device; 21, driving member; 211, motor; 212, lead screw; 213, lead screw nut; 214, bracket; 22, dust removal box; 221, receiving groove; 222, first side; 223, mounting opening; 224, mounting groove; 225, insertion groove; 23, dust suction assembly; 231, anode plate; 2311, stop portion; 2312, main body portion; 232, cathode plate; 3, air blowing pipe; 4, dust removal pipe; 5, guiding assembly; 51, slide rail; 52, slide block. Detailed implementation manners

[0030] The advantages and features of the present invention and the methods for achieving them will become apparent with reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms. The present embodiments are provided only to complete the disclosure of the present invention and to enable those skilled in the art to fully understand the scope of the present invention, and the present invention is limited only by the scope of the claims. The same reference numerals represent the same constituent elements throughout the specification.

[0031] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0032] like Figures 2 to 6 As shown, the vapor deposition equipment of the embodiment of the utility model includes a robot 100 and a sample preparation chamber 200, a transfer chamber 300 and a deposition chamber 400 arranged in sequence. The robot 100 is used to place the substrate 500 of the sample preparation chamber 200 into the transfer chamber 300 for temporary storage and to place the substrate 500 temporarily stored in the transfer chamber 300 into the deposition chamber 400 for deposition. The vapor deposition equipment also includes a placement rack 1 and a dust removal device 2 arranged at the bottom of the cavity of the transfer chamber 300. The substrate 500 is stored on the placement rack 1, and the dust removal device 2 is located below the placement rack 1. The dust removal device 2 includes a driving member 21, a dust removal box 22 and an absorber for absorbing impurities. The dust assembly 23 and the dust removal box 22 are arranged at the driving end of the driving member 21. The cavity bottom of the transfer chamber 300 is the transfer cavity bottom 301. The dust removal box 22 is spaced apart from the transfer cavity bottom 301, and the dust removal box 22 is provided with a receiving groove 221 on the side facing the transfer cavity bottom 301. The length of the receiving groove 221 extends along a first direction (the first direction is the X direction shown in the figure). The dust collection assembly 23 is arranged in the receiving groove 221. The driving member 21 is connected to the dust removal box 22 in a transmission manner, driving the dust removal box 22 and the dust collection assembly 23 to move along a second direction to remove impurities from the transfer cavity bottom 301 (the second direction is the Y direction shown in the figure), wherein the first direction is arranged perpendicular to the second direction.

[0033] It can be understood that by arranging a dust removal device 2 in the transfer chamber 300, automatic dust removal of the environment in the transfer chamber 300 is achieved, a good working environment of the transfer chamber 300 is ensured, and the occurrence of dust contamination caused by temporary storage of the substrate 500 in the transfer chamber 300 is reduced, thereby improving the deposition yield of the substrate 500 transferred from the transfer chamber 300 to the deposition chamber 400 for deposition; by arranging a receiving groove 221 extending along a first direction in the dust removal box 22, and using the driving member 21 to drive the dust removal box 22 and the dust removal component in the receiving groove 221 to move along a second direction, so as to achieve comprehensive cleaning of the transfer chamber bottom 301, the dust removal device 2 has a simple and compact structure and occupies little space, and under the condition of the same output power of the dust suction component 23, compared with directly adsorbing the entire transfer chamber bottom plane, the notch of the receiving groove 221 is relatively small, the suction force is more sufficient, and the dust removal effect is better.

[0034] Further, as Figure 5 and Figure 6 shown, the dust suction assembly 23 includes a controller, and an anode plate 231 and a cathode plate 232 which are arranged at intervals in the vertical direction (the vertical direction is the Z direction shown in the figure) in the accommodation groove 221. The anode plate 231 is located above the cathode plate 232. Both the anode plate 231 and the cathode plate 232 are connected to an external power supply through the controller. The bottom of the transfer cavity 301 is provided with a dust discharge port 302. The dust discharge port 302 is connected to an external negative pressure mechanism through a dust removal pipe 4. When the driving member 21 drives the dust removal box 22 to move to a specified position in the second direction, in this embodiment, the specified position is the extreme position of the output end of the driving member 21, that is, the position at the end where the dust removal box 22 can move in the second direction. The projection of the dust discharge port 302 in the vertical direction is located in the accommodation groove 221. Wherein, the first direction, the second direction and the vertical direction are perpendicular to each other. By forming a high-voltage electric field between the anode plate 231 connected to the high-voltage DC power supply and the grounded cathode plate 232, the gas is ionized and collides with dust particles during movement, further making the dust particles carry negative charges and finally depositing on the anode plate 231 to achieve the dust removal effect. The structure of the dust suction assembly 23 is simple and the dust removal efficiency is high. For example, at the initial end of the driving member 21, the controller is used to control the energization of the electrode plates. At this time, the external negative pressure mechanism is in a shutdown state. The driving member 21 drives the dust removal box 22 to move in the second direction, so that the dust is adsorbed onto the anode plate 231 during the movement of the dust removal box 22 along the way. Until the driving member 21 drives the dust removal box 22 to move to the end in the second direction, the controller stops the energization of the electrode plates, and the anode plate 231 is no longer charged. At this time, the dust can fall off from the anode plate 231. Synchronously, the controller is used to control the start of the external negative pressure mechanism, so that a negative pressure can be generated at the discharge port to discharge the dust in the dust removal box 22.

[0035] Even further, as Figures 2 to 6As shown, the vapor deposition apparatus further includes a blowing pipe 3. The dust discharge port 302 is adjacent to one side of the dust removal box 22 along the first direction. A blowing pipe 3 communicating with the receiving groove 221 is provided on the other side of the dust removal box 22 along the first direction. The blowing pipe 3 is connected to an external blowing mechanism through a controller. Through the arrangement of the blowing pipe, on the one hand, it can blow the dust at the bottom 301 of the transfer chamber to disperse between the anode plate 231 and the cathode plate 232 for charging, improving the cleaning efficiency of the dust at the bottom 301 of the transfer chamber; on the other hand, it can form a relatively large spaced space with the dust discharge port 302, with a wide coverage area of the purging space, improving the cleaning efficiency of the dust in the receiving groove 221. For example, during the process of the driving member 21 driving the dust removal box 22 to move along the second direction, the controller controls the external blowing mechanism to operate at a low power, only generating a low-pressure positive blowing gas to gently blow the dust at the bottom 301 of the transfer chamber until the dust removal box 22 moves to the end and faces the dust discharge port 302, then the controller controls the external blowing mechanism to operate at a high power, generating a high-pressure blowing gas to form an overall natural flow with the negative pressure discharge of the dust discharge port 302, improving the cleaning efficiency of the dust in the dust removal box 22. It should be noted that the negative pressure of the dust discharge port 302 should be much higher than the positive pressure of the blowing pipe 3.

[0036] Optionally, the dust discharge port 302 is connected to an external negative pressure mechanism through a dust removal pipe 4. A butterfly valve is provided on the dust removal pipe 4, and the butterfly valve is connected to the controller. A filter element is detachably connected to the dust removal pipe 4, and the filter element is located between the dust discharge port 302 and the butterfly valve. Through the arrangement of the filter element, it is convenient for the unified collection and treatment of the discharged dust, and the filter element is arranged between the dust discharge port 302 and the butterfly valve, reducing the occurrence of the situation where dust adheres to the butterfly valve and affects the opening and closing of the butterfly valve. In addition, the detachable setting of the filter element also facilitates the timely disassembly and assembly for cleaning or replacing the filter element, ensuring the fluidity of the dust removal pipe 4.

[0037] In some embodiments, the anode plate 231 and the cathode plate 232 are respectively detachably connected to the dust removal box 22, facilitating the installation, disassembly, maintenance or replacement of the anode plate 231 and the cathode plate 232, and improving the installation efficiency of the dust removal device 2.

[0038] Specifically, as Figure 5 and Figure 6As shown, the dust removal box 22 is an insulating box. The dust removal box 22 has a first side 222 and a second side arranged in the first direction. Two mounting openings 223 communicating with the receiving groove 221 are arranged at intervals in the vertical direction on the first side 222. Two mounting grooves 224 are arranged at positions corresponding to the mounting openings 223 on the groove wall of the receiving groove 221 adjacent to the second side. The anode plate 231 and the cathode plate 232 are respectively inserted into the corresponding mounting grooves 224 corresponding to the upper and lower two mounting openings 223, that is, one end of the anode plate 231 and the cathode plate 232 in the first direction is supported on the groove wall of the mounting groove 224, and the other end is supported on the cavity wall of the mounting opening 223, so as to realize the quick connection of the anode plate 231 and the cathode plate 232, and the quick installation of the two plates can be realized from outside the dust removal box 22, and the operation is convenient.

[0039] Of course, both the anode plate 231 and the cathode plate 232 include a stop portion 2311 and a main body portion 2312 protruding from the stop portion 2311. One end of the main body portion 2312 away from the stop portion 2311 is inserted into the mounting groove 224 along the mounting opening 223. The stop portion 2311 abuts against the first side 222. A through hole is opened on the stop portion 2311, and a threaded hole is opened on the first side 222. A bolt passes through the through hole and is screwed into the threaded hole to fix the stop portion 2311 to the dust removal box 22, so as to fix the plate to the dust removal box 22, effectively improving the connection strength between the plate and the dust removal box 22.

[0040] Furthermore, a plug-in groove 225 is recessed on the first side 222. The stop portion 2311 is inserted into the plug-in groove 225, and the threaded hole is arranged at the bottom of the plug-in groove 225. By respectively arranging the stop portion 2311 of the anode plate 231 and the stop portion 2311 of the cathode plate 232 in the two plug-in grooves 225, the exposure of the stop portion 2311 outside the mounting opening 223 is reduced, so as to avoid forming an electric field between the two stop portions 2311 and causing dust to adhere to the stop portion 2311 of the anode plate 231, and improving the protection of the dust removal box 22 for the stop portion 2311.

[0041] In other embodiments, such as Figure 3 and Figure 4As shown, the driving member 21 includes a motor 211, a screw rod 212 and a screw nut 213. The screw rod 212 is rotatably set on the bottom of the transfer chamber 301 through a bracket 214, and the length of the screw rod 212 extends along the second direction. The screw nut 213 is slidably set on the screw rod 212, and the dust removal box 22 is set on the screw nut 213. The motor 211 is connected to the screw rod 212 to drive the screw nut 213 to drive the dust removal box 22 to move along the second direction. The transmission method of the motor 211 driving the screw 212 has the following advantages: 1. High precision: the screw 212 motor 211 adopts screw transmission, the screw is rolled and formed once, the transmission accuracy can be 0.0005mm / mm, and the highest resolution can reach 0.0015mm; 2. The structure is simple and convenient for overall design; 3. High life: In fact, under normal load conditions, the screw 212 motor 211 can reach a life of at least 5 million cycles; 4. High efficiency: Compared with commonly used transmission mechanisms such as gear rack transmission or synchronous belt transmission, the screw 212 motor 211 has higher transmission efficiency. Of course, in addition to the transmission method of the motor 211 driving the screw 212, other linear drive structures such as cylinders and oil cylinders can also be selected.

[0042] Furthermore, the vapor deposition device also includes a guide assembly 5, which includes a slide rail 51 and a slide seat 52. The slide rail 51 is arranged at the bottom of the transfer chamber 301, and the length of the slide rail 51 extends along the second direction. The screw rod 212 and the slide rail 51 are spaced apart along the first direction, and the slide seat 52 is slidably arranged on the slide rail 51. Along the first direction, one end of the dust removal box 22 is connected to the screw rod nut 213, and the other end is connected to the slide seat 52. The dust removal box 22 moves on the slide rail 51 through the slide seat 52, which can enhance the guidance and movement stability of the dust removal box 22. In addition, the driving member 21 and the guide assembly 5 are respectively arranged at the two ends of the dust removal box 22 along the first direction, so as to reduce the structure from blocking the notch of the accommodating groove 221, thereby ensuring the dust removal efficiency of the dust removal box 22.

[0043] Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments, but can be manufactured in various forms, and those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical spirit or basic features of the present invention. Therefore, it should be understood that the above embodiments are exemplary and not restrictive in all aspects.

Claims

1. A vapor deposition device, comprising a manipulator, a sample preparation chamber, a transfer chamber, and a deposition chamber arranged in sequence. The manipulator is used to place the substrate in the sample preparation chamber into the transfer chamber for temporary storage and to place the substrate temporarily stored in the transfer chamber into the deposition chamber for deposition. It is characterized in that, It further includes a placement rack and a dust removal device disposed at the bottom of the cavity of the transfer chamber. The substrate is stored on the placement rack, and the dust removal device is located below the placement rack. The dust removal device includes a driving member, a dust removal box, and a dust suction assembly. The dust removal box is disposed at the driving end of the driving member. The bottom of the cavity of the transfer chamber is the transfer chamber bottom. The dust removal box is spaced from the transfer chamber bottom, and a receiving groove is formed on one side of the dust removal box facing the transfer chamber bottom. The length of the receiving groove extends in a first direction, and the dust suction assembly is disposed in the receiving groove. The driving member is in transmission connection with the dust removal box, driving the dust removal box and the dust suction assembly to move in a second direction to clean the transfer chamber bottom. Wherein, the first direction and the second direction are perpendicularly arranged.

2. The vapor deposition apparatus according to claim 1, characterized in that, The dust suction assembly includes a controller, an anode plate and a cathode plate which are arranged at intervals in the vertical direction in the receiving groove. The anode plate is located above the cathode plate. Both the anode plate and the cathode plate are connected to an external power supply through the controller. A dust discharge port is formed in the transfer chamber bottom, and the dust discharge port is connected to an external negative pressure mechanism. When the driving member drives the dust removal box to move to a specified position in the second direction, the projection of the dust discharge port in the vertical direction is located in the receiving groove. Wherein, both the first direction and the second direction are perpendicularly arranged with respect to the vertical direction.

3. The vapor deposition apparatus according to claim 2, wherein It further includes a blow pipe. The dust discharge port is adjacent to one side of the dust removal box in the first direction, and the blow pipe communicated with the receiving groove is disposed on the other side of the dust removal box in the first direction. The blow pipe is connected to an external blowing mechanism through the controller.

4. The vapor deposition apparatus according to claim 2, wherein The dust discharge port is connected to the external negative pressure mechanism through a dust removal pipe. A butterfly valve is disposed on the dust removal pipe, and the butterfly valve is connected to the controller. A filter element is detachably connected to the dust removal pipe, and the filter element is located between the dust discharge port and the butterfly valve.

5. The vapor deposition apparatus according to claim 2, wherein The anode plate and the cathode plate are respectively detachably connected to the dust removal box.

6. The vapor deposition apparatus according to claim 5, wherein, The dust removal box is an insulating box. The dust removal box has a first side face and a second side face arranged in the first direction. Two installation openings communicated with the receiving groove are arranged at intervals in the vertical direction on the first side face. Installation grooves corresponding to the installation openings are formed in the groove wall of the receiving groove adjacent to the second side face. The anode plate and the cathode plate are respectively inserted into the corresponding installation grooves corresponding to the upper and lower two installation openings.

7. The vapor deposition apparatus according to claim 6, wherein Both the anode plate and the cathode plate include a stop portion and a main body portion protruding from the stop portion. One end of the main body portion away from the stop portion is inserted into the installation groove along the installation opening. The stop portion abuts against the first side face. A through hole is formed in the stop portion, and a threaded hole is formed in the first side face. A bolt passes through the through hole and is screwed into the threaded hole to fix the stop portion to the dust removal box.

8. The vapor deposition apparatus according to claim 7, wherein A plug-in groove is recessed in the first side face, and the stop portion is inserted into the plug-in groove. The threaded hole is formed at the bottom of the plug-in groove.

9. The vapor deposition apparatus according to any one of claims 1-8, characterized in that, The driving member includes a motor, a lead screw, and a lead screw nut. The lead screw is rotatably arranged at the bottom of the transfer cavity through a bracket, and the length of the lead screw extends along the second direction. The lead screw nut is slidably arranged on the lead screw, and the dust removal box is arranged on the lead screw nut. The motor is in transmission connection with the lead screw to drive the lead screw nut to drive the dust removal box to move along the second direction.

10. The vapor deposition apparatus according to claim 9, wherein It further includes a guiding component, which includes a slide rail and a sliding seat. The slide rail is arranged at the bottom of the transfer cavity, and the length of the slide rail extends along the second direction. The lead screw and the slide rail are arranged at intervals along the first direction. The sliding seat is slidably arranged on the slide rail. Along the first direction, one end of the dust removal box is connected to the lead screw nut, and the other end is connected to the sliding seat.

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