Slide glass boat and coating equipment

Abstract

The utility model relates to the technical field of solar cell production equipment, and discloses a slide glass boat and coating equipment, the coating equipment comprises a furnace mouth and a furnace tail, the slide glass boat comprises a plurality of groups of boat piece assemblies, the multiple sets of boat piece assemblies comprise the first boat piece assembly used for being arranged close to the furnace mouth and the second boat piece assembly used for being arranged close to the furnace tail. Any one of the multiple boat piece assemblies comprises at least two boat pieces arranged at intervals, and the distance between every two adjacent boat pieces in the first boat piece assembly is smaller than the distance between every two adjacent boat pieces in the second boat piece assembly. According to the slide glass boat, the problem of poor film thickness uniformity caused by temperature difference of slide glass boats in different areas is solved, and the film thickness uniformity of silicon wafers in the slide glass boat is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of solar cell production equipment, in particular to a wafer carrier and a coating device. Background Art

[0002] For the production and processing of solar cells, the coating process is a relatively important process. If the film layers on the silicon wafers are too thick or too thin after the coating process, it will affect the appearance of the solar cells, resulting in color differences in each solar cell. The color differences are mainly caused by uneven film thickness during the coating process.

[0003] Among them, the uniformity of the film thickness is related to factors such as deposition time, deposition flow rate, and deposition temperature. In addition, it is also related to the temperature uniformity in the coating device. The temperature at the furnace mouth of the coating device is lower, and the temperature at the furnace tail is higher. Therefore, the thickness of the solar cells at the furnace mouth is lower, and the thickness of the solar cells at the furnace tail is higher, which affects the yield and photoelectric conversion efficiency of the solar cells. Summary of the Utility Model

[0004] Embodiments of the utility model disclose a wafer carrier and a coating device, which are used to solve the problem of uneven film thickness of silicon wafers in different regions of the wafer carrier in the prior art and improve the uniformity of the film thickness during coating of the wafer carrier.

[0005] In a first aspect, embodiments of the present application disclose a wafer carrier for a coating device. The coating device includes a furnace mouth and a furnace tail. The wafer carrier includes multiple groups of wafer components. The multiple groups of wafer components include a first wafer component arranged close to the furnace mouth and a second wafer component arranged close to the furnace tail.

[0006] Any one of the multiple groups of wafer components includes at least two wafers arranged at intervals, and the distance between adjacent wafers in the first wafer component is less than the distance between the wafers in the second wafer component.

[0007] Further, the multiple groups of wafer components are arranged in a first direction, and the wafers in each group of wafer components are arranged in the first direction. The first direction is the arrangement direction of the furnace mouth and the furnace tail, and the distance between the multiple groups of wafer components gradually increases in the direction from the furnace mouth to the furnace tail.

[0008] Further, in the same wafer component, the distance between adjacent wafers gradually increases in a second direction. The second direction is the direction from the center of the coating device to the furnace wall of the coating device.

[0009] Further, the multiple sets of wafer components further include at least one set of third wafer components, and the at least one set of third wafer components is disposed between the first wafer component and the second wafer component and arranged along a first direction, where the first direction is the arrangement direction of the furnace mouth and the furnace tail, and the distance between adjacent wafers of the third wafer component is greater than the distance of the first wafer component and less than the distance of the second wafer component.

[0010] Further, there are multiple sets of the third wafer components, and the distances of the multiple sets of the third wafer components are equal; or

[0011] Along the direction from the furnace mouth to the furnace tail, the distances of the multiple sets of the third wafer components gradually increase.

[0012] Further, the distance between adjacent wafers is 9 mm to 13 mm.

[0013] Further, the third wafer components are respectively arranged at intervals with the first wafer component and the second wafer component.

[0014] Further, the number of wafers in each set of wafer components is the same, and the wafers in adjacent two sets of wafer components are connected to form a whole one by one, and a support rod is provided at the connection of the adjacent two sets of wafer components.

[0015] Further, the wafers in adjacent two sets of wafer components are connected to form a straight line structure, or the wafers in adjacent two sets of wafer components are connected to form a broken line structure.

[0016] Further, the multiple sets of wafer components are arranged along the first direction, and the wafers in each set of wafer components are all arranged along the first direction, where the first direction is the arrangement direction of the furnace mouth and the furnace tail, and the distances of the multiple sets of wafer components gradually increase along the direction from the furnace mouth to the furnace tail.

[0017] Further, the distance between adjacent two wafers in each set of wafer components gradually increases along the direction from the furnace mouth to the furnace tail.

[0018] In a second aspect, an embodiment of the present application provides a coating device, and the coating device includes a furnace body, the furnace body includes a furnace mouth and a furnace tail, a wafer carrier as described in any item of the first aspect is provided in the furnace body, the first wafer component of the wafer carrier is arranged close to the furnace mouth, and the second wafer component of the wafer carrier is arranged close to the furnace tail.

[0019] Compared with the prior art, the present application has at least the following beneficial effects:

[0020] The present application provides a wafer boat, which is used in a coating equipment. The wafer boat includes multiple groups of wafer components. Among them, the first wafer component is close to the furnace mouth of the coating equipment, and there is a large heat loss during the coating process. The second wafer component is close to the furnace tail, and the heat loss during the coating process is small. Therefore, the distance between adjacent wafers in the first wafer component is set to be smaller than that in the second wafer component. Among them, the narrow distance in the first wafer component helps to reduce the rate of heat dissipation in this area, increase the ionization intensity in the first wafer component, and make up for the phenomenon of thinner film layers caused by lower temperature in the furnace mouth area. The larger distance in the second wafer component helps to increase the rate of heat dissipation in this area, reduce the ionization intensity in the second wafer component, and make up for the phenomenon of thicker film layers caused by higher temperature in the furnace tail area. It reduces the temperature difference of the entire wafer boat, ensures good uniformity of the film layer thickness of the prepared silicon wafers, does not cause color difference, and improves the yield and efficiency of solar cells. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0022] Figure 1 is a schematic structural diagram of a prior art coating equipment provided by the present application;

[0023] Figure 2 is a schematic structural diagram of a coating equipment provided by an embodiment of the present application;

[0024] Figure 3 is a schematic structural diagram of a first wafer boat provided by an embodiment of the present application;

[0025] Figure 4 is a schematic structural diagram of a second wafer boat provided by an embodiment of the present application;

[0026] Figure 5 is a schematic structural diagram of a third wafer boat provided by an embodiment of the present application;

[0027] Figure 6 is a schematic structural diagram of a fourth wafer boat provided by an embodiment of the present application;

[0028] Figure 7 is a schematic structural diagram of a fifth wafer boat provided by an embodiment of the present application;

[0029] Figure 8 is a schematic structural diagram of a sixth wafer boat provided by an embodiment of the present application;

[0030] Figure 9It is a schematic diagram of the setting direction of the boat blade in any one of the first boat blade assemblies provided by the embodiments of the present application;

[0031] Figure 10 It is a schematic diagram of the setting direction of the boat blade in any one of the second boat blade assemblies provided by the embodiments of the present application;

[0032] Figure 11 It is a schematic diagram of the setting direction of the boat blade in any one of the third boat blade assemblies provided by the embodiments of the present application.

[0033] Icons: 1. Coating equipment; 11. Furnace opening; 12. Furnace tail; 2. Carrier boat; 3. First boat blade assembly; 4. Second boat blade assembly; 5. Boat blade; 6. Third boat blade assembly; 6a. First group of third boat blade assemblies; 6b. Second group of third boat blade assemblies; 7. Support rod; X. First direction; Y. Second direction. Detailed implementation manners

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0035] In the present invention, the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", etc. is based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit that the indicated devices, elements or components must have a specific orientation, or be constructed and operated in a specific orientation.

[0036] Moreover, in addition to being used to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present invention can be understood according to specific situations.

[0037] In addition, terms such as "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, the meaning of "a plurality" is two or more.

[0038] The technical solution provided by the present utility model will be further described below in conjunction with embodiments and drawings.

[0039] The coating process in the production and preparation process of solar cells is extremely important. In this process, the carrier boat with silicon wafers is sent into the coating equipment, and chemical gases such as ammonia, silane, nitrous oxide, trimethylaluminum, etc. are introduced into the vacuum environment. The above gases are discharged in the carrier boat, and then a passivation film is formed on the surface of the silicon wafer. The passivation film includes silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, etc., which can effectively reduce recombination and increase the absorption rate of sunlight, thereby improving the photoelectric conversion efficiency of solar cells.

[0040] Among them, as Figure 1 shown, a furnace door and an air inlet are provided at the position of the furnace mouth 11 of the coating equipment 1, and the spacing between the boat wafers 5 of the carrier boat 2 located in the coating equipment 1 is the same in different boat wafer assemblies. Therefore, with the opening and closing of the furnace door, serious heat loss occurs in the area of the furnace mouth 11. And the arrow shown in the figure is the transmission direction of the process gas in the coating equipment 1. It can be seen from the figure that the process gas enters from the furnace mouth 11 and exits from the furnace tail 12. When the process gas enters the furnace mouth 11, it needs to be heated, so high heat loss also occurs in the heating process in the area of the furnace mouth 11, resulting in a thinner film thickness of the silicon wafer in the area of the furnace mouth 11; while the furnace tail 12 area of the coating equipment 1 is located at the deepest part of the coating equipment 1, and the heat dissipation in this area is slower and the temperature is higher, so the film thickness of the silicon wafer in the furnace tail 12 area is thicker. Therefore, the thickness difference of the finally prepared solar cells is relatively high, and there is a color difference, which not only affects the appearance of the solar cells but also has an adverse impact on their photoelectric conversion efficiency.

[0041] Based on the above problems, the embodiments of the present application provide a carrier boat and a coating equipment, by adjusting the distance between adjacent boat wafers in different boat wafer assemblies of the carrier boat, so as to reduce the influence of the large temperature difference between the furnace mouth and the furnace tail areas in the coating equipment on the film thickness of the coating process, thereby making the thickness uniformity of the silicon wafer film layer after the coating process high.

[0042] In the first aspect, the embodiments of the present application provide a carrier boat 2, as Figures 2 to 8 shown, the carrier boat 2 is used for the coating equipment 1, the coating equipment 1 includes a furnace mouth 11 and a furnace tail 12, the carrier boat 2 includes multiple groups of boat wafer assemblies, and the multiple groups of boat wafer assemblies include a first boat wafer assembly 3 arranged close to the furnace mouth 11 and a second boat wafer assembly 4 arranged close to the furnace tail 12; any boat wafer assembly in the multiple groups of boat wafer assemblies includes at least two spaced boat wafers 5, and the distance between adjacent boat wafers 5 in the first boat wafer assembly 3 is less than the distance between adjacent boat wafers 5 in the second boat wafer assembly 4.

[0043] The boat slice 5 in the boat slice assembly is used to place the silicon wafer. After placing the wafer boat 2 with the silicon wafer in the coating equipment 1 for the coating process, a layer of film is deposited on the surface of the silicon wafer. Therefore, the design of the wafer boat 2 in this application is used to improve the film thickness deposited on the surface of the silicon wafer. The wafer boat 2 is applicable not only to coating the front side of the silicon wafer but also to coating the back side of the silicon wafer.

[0044] That is to say, for the wafer boat 2 provided in this application, the spacing between adjacent boat slices 5 in the first boat slice assembly 3 arranged in the area near the furnace mouth 11 is smaller, which reduces the heat dissipation rate in the first boat slice assembly 3 and increases the ionization intensity, thereby increasing the film thickness of the silicon wafer in the first boat slice assembly 3 after the coating process. While the spacing between adjacent boat slices 5 in the second boat slice assembly 4 arranged in the area near the furnace tail 12 is larger, which helps to increase the heat dissipation rate in the second boat slice assembly 4 and reduce the ionization intensity during the coating process, making the film thickness of the silicon wafer in the second boat slice assembly 4 smaller after the coating process. Through the above spacing setting method, the situation where the film thickness varies greatly due to the difference in coating temperature between different boat slice assemblies is reduced, so that the film thickness of different boat slice assemblies has high uniformity.

[0045] In an alternative embodiment, the arrangement direction of the boat slices 5 in each group of boat slice assemblies is the same, that is, the boat slices 5 in each group of boat slice assemblies are arranged along the first direction X, and the first direction X is the arrangement direction of the furnace mouth 11 and the furnace tail 12; or the boat slices 5 in each group of boat slice assemblies are arranged perpendicular to the first direction X. In another alternative embodiment, the arrangement directions of the boat slices 5 in different boat slice assemblies are different, that is, the boat slices 5 in the first boat slice assembly 3 are arranged along the first direction X, and the boat slices 5 in the second boat slice assembly 4 are arranged perpendicular to the first direction X, or the boat slices 5 in the first boat slice assembly 3 are arranged perpendicular to the first direction X, and the boat slices 5 in the second boat slice assembly 4 are arranged along the first direction X.

[0046] In addition, there are also various possibilities for the setting direction of the boat slice 5 in any boat slice assembly. In the first alternative embodiment, as Figure 9 shown, the setting direction of the boat slice 5 in any boat slice assembly is parallel to the first direction X, and the boat slices 5 are parallel to each other. In the second alternative embodiment, as Figure 10 shown, the setting direction of the boat slice 5 in any boat slice assembly has a certain angle with the first direction X, and the boat slices 5 are parallel to each other. In the third alternative embodiment, as Figure 11 shown, the setting direction of the boat slice 5 in any boat slice assembly has a certain angle with the first direction X, and the boat slices 5 are not arranged in a parallel manner. In addition, the setting directions of the boat slices 5 in different boat slice assemblies can be the same or different, and when the setting directions of the boat slices 5 in the same boat slice assembly are the same, Figures 9 to 11any of the setting directions; if the setting directions of the boat blades 5 in the same boat blade assembly are different, then at least two of the setting directions in Figures 9 to 11 are adopted.

[0047] In addition, the number of boat blades 5 in the first boat blade assembly 3 and the second boat blade assembly 4 can be the same or different, and the present application does not limit this here.

[0048] In addition, the boat blade 5 can place silicon wafers with at least one of the sizes of 166mm, 158mm, 182mm, and 210mm. Specifically, when the lengths of the boat blades 5 in different groups of boat blade assemblies are the same, at this time the boat blade 5 can place a silicon wafer with one of the sizes of 166mm, 158mm, 182mm, and 210mm, or when the lengths of the boat blades 5 in different groups of boat blade assemblies are different, at this time the carrier boat 2 can be used to place multiple silicon wafers with different sizes, and the present application does not limit this here. The specific design method is determined according to actual production needs. Exemplarily, when the boat blade 5 of the first boat blade assembly 3 places a silicon wafer with a size of 210mm, at this time the boat blade 5 of the second boat blade assembly 4 places a silicon wafer with a size of 182mm.

[0049] Moreover, the material of the boat blades 5 in each boat blade assembly of the carrier boat 2 can be graphite or quartz. In this embodiment, graphite is used as the material of the boat blades 5 of the carrier boat 2, which has a lower manufacturing cost, is more economical and affordable, and is also beneficial to the ionization process in the coating process.

[0050] Among them, multiple groups of boat blade assemblies are arranged along the first direction X, and the boat blades 5 in each group of boat blade assemblies are all arranged perpendicular to the first direction X. The first direction X is the arrangement direction of the furnace mouth 11 and the furnace tail 12, and the spacing between multiple groups of boat blade assemblies gradually increases along the direction from the furnace mouth 11 to the furnace tail 12.

[0051] Compared with the design in which the boat blades 5 of the first boat blade assembly 3 and the boat blades 5 of the second boat blade assembly 4 are arranged in one direction along the first direction X and the other is arranged perpendicular to the first direction X, the fact that multiple groups of boat blade assemblies 5 are all arranged perpendicular to the first direction X helps to reduce the difficulty of putting the silicon wafer into or taking it out of the boat blade assembly and improve the production and processing efficiency. Among them, the heat dissipation rate of the boat blade assembly closer to the furnace tail 12 area is slower, and the heat dissipation rate of the boat blade assembly closer to the furnace mouth 11 area is faster. Therefore, by setting the spacing between adjacent boat blades 5 in the boat blade assembly to gradually increase along the direction from the furnace mouth 11 to the furnace tail 12, the heat dissipation rate of the boat blade assembly in the furnace mouth 11 area is slower, increasing the ionization intensity of the first boat blade assembly 3, and the heat dissipation rate of the boat blade assembly in the furnace tail 12 area is faster, reducing the ionization intensity of the second boat blade assembly 4, thereby compensating for the large difference in film thickness caused by lower or higher temperatures, reducing the difference in film thickness in different boat blade assemblies, and the deposited film thickness has high uniformity.

[0052] In an alternative embodiment, as Figure 3 shown, in the same boat slice assembly, the spacing between adjacent boat slices 5 is the same.

[0053] In another alternative embodiment, as Figure 4 shown, in the same boat slice assembly, the spacing between adjacent boat slices 5 gradually increases along the second direction Y, and the second direction Y is the direction from the center of the coating device 1 to the furnace wall of the coating device 1. Such a spacing setting method is adopted because the heating wire of the coating device 1 is arranged around the outside of the coating device 1. Therefore, when approaching the furnace wall area of the coating device 1, the temperature of the boat slice 5 in this area is relatively high, and the thickness of the deposited film is relatively high. While when approaching the middle area, on the one hand, the boat slice 5 in the middle area is far from the heating wire, and on the other hand, due to the blocking effect of the boat slice 5 near the furnace wall area, the temperature of the boat slice 5 in the middle area is relatively low, resulting in a decreasing trend of the temperature of any boat slice assembly from both sides of the furnace wall to the middle area. Therefore, compared with the setting method where the spacing between adjacent boat slices 5 is the same in each group of boat slice assemblies, the setting method where the spacing between adjacent boat slices 5 in any boat slice assembly increases from the middle area to both sides of the furnace wall can effectively reduce the heat dissipation rate in the middle area and increase the heat dissipation rate in the two side areas, thereby making the temperature difference of the same boat slice assembly relatively small. In addition, it helps to increase the ionization intensity in the middle area and reduce the ionization intensity in the two side areas, thus ensuring that the film thickness difference of the same boat slice assembly is relatively small and the thickness uniformity is relatively high.

[0054] Furthermore, as Figures 2 to 8 shown, the multiple groups of boat slice assemblies further include at least one group of third boat slice assemblies 6. At least one group of third boat slice assemblies 6 is arranged between the first boat slice assembly 3 and the second boat slice assembly 4 and arranged along the first direction X. The first direction X is the arrangement direction of the furnace mouth 11 and the furnace tail 12. The spacing between adjacent boat slices 5 of the third boat slice assembly 6 is greater than the spacing of the first boat slice assembly 3 and less than the spacing of the second boat slice assembly 4.

[0055] It can be understood that the third boat slice assembly 6 is located in the middle area of the furnace body of the coating device 1. During coating, compared with the low temperature at the furnace mouth and the high temperature at the furnace tail, the temperature in the middle area is relatively ideal. Therefore, compared with the first boat slice assembly 3 and the second boat slice assembly 4, the third boat slice assembly 6 has a relatively high stability of the heat dissipation rate and a moderate temperature during coating, and finally the deposited film thickness is appropriate.

[0056] That is to say, in the direction from the furnace mouth 11 to the furnace tail 12, the spacing between the first boat sheet assembly 3, the third boat sheet assembly 6, and the second boat sheet assembly 4 gradually increases, so that the heat loss rate of the first boat sheet assembly 3, the third boat sheet assembly 6, and the second boat sheet assembly 4 gradually increases, reducing the temperature difference between different boat sheet assemblies, and making the ionization intensity of the first boat sheet assembly 3, the third boat sheet assembly 6, and the second boat sheet assembly 4 gradually decrease, which helps to compensate for the large difference in film thickness caused by temperature difference, so that the difference in film thickness of different groups of boat sheet assemblies is small, thereby ensuring the uniformity of film thickness of different groups of boat sheet assemblies.

[0057] In addition, there are multiple groups of third boat sheet assemblies 6, and the spacing between the multiple groups of third boat sheet assemblies 6 is equal; or the spacing between the multiple groups of third boat sheet assemblies 6 gradually increases in the direction from the furnace opening 11 to the furnace tail 12.

[0058] It should be noted that the number of the third boat-to-chip assemblies 6 can be multiple groups. The more the number of the third boat-to-chip assemblies 6 is, the more efficient the production and processing of the coating process is. However, the temperature variation of the multiple groups of the third boat-to-chip assemblies 6 is relatively different, and it is difficult to effectively control the uniformity of the film thickness during coating. Therefore, when the number of the third boat-to-chip assemblies 6 is 2 to 4, the temperature field difference of the third boat-to-chip assemblies 6 will not be too large due to the excessive number of the third boat-to-chip assemblies 6, so that the thickness difference of the deposited silicon wafer is relatively large; nor will the production and processing efficiency be affected due to the small number of the third boat-to-chip assemblies 6. Among them, when the spacing of the third boat-to-chip assemblies 6 gradually increases along the direction from the furnace mouth 11 to the furnace tail 12, at this time, not only the temperature difference of the multiple groups of the third boat-to-chip assemblies 6 can be reduced, the intensity of their ionization can be reduced, the uniformity of the coating of the third boat-to-chip assemblies 6 can be improved, and the production and processing efficiency of the coating process can also be improved.

[0059] For example, Figures 3 to 4 As shown, when the number of groups of the third boat sheet assembly 6 is 2, the third boat sheet assembly 6 includes a first group of third boat sheet assembly 6a and a second group of third boat sheet assembly 6b. The spacing between adjacent boat sheets 5 in the first group of third boat sheet assembly 6a is equal to the spacing between adjacent boat sheets 5 in the second group of third boat sheet assembly 6b, or the spacing between adjacent boat sheets 5 in the first group of third boat sheet assembly 6a is smaller than the spacing between adjacent boat sheets 5 in the second group of third boat sheet assembly 6b.

[0060] In addition, the spacing between adjacent boats 5 can be 9 mm to 13 mm. At this time, on the one hand, the number of boats 5 in the same boat assembly is large, thereby improving the efficiency of production and processing. In addition, the spacing also helps to reduce the difficulty of taking out and putting silicon wafers from the boats 5 of the wafer carrier boat 2, thereby reducing the scratches on the silicon wafers caused by the wafer carrier boat 2 during processing; on the other hand, when the spacing between the boats 5 changes within the above range, the intensity of the electric field radio frequency can be optimized, thereby optimizing the coating rate, so that the thickness of the deposited thick film layer is more uniform.

[0061] In an alternative embodiment, as Figure 7 shown, the third boat plate assembly 6 is spaced from the first boat plate assembly 3 and the second boat plate assembly 4 respectively. At this time, the first boat plate assembly 3, the third boat plate assembly 6 and the second boat plate assembly 4 are independent structures. Any one of the boat plate assemblies has a small volume, light weight and simple structure, which is convenient for maintenance and replacement, and reduces the maintenance cost. And because the first boat plate assembly 3, the third boat plate assembly 6 and the second boat plate assembly 4 are independent structures, the adjustment of the middle boat plate 5 spacing of any one boat plate assembly will not be affected by other boat plate assemblies, and there are more possibilities for adjustment and the adjustment difficulty is lower, which is beneficial to reducing the production cost of the wafer carrier 2.

[0062] In an alternative embodiment, as Figure 4 shown, the number of boat plates 5 in each group of boat plate assemblies is the same, and the boat plates 5 in adjacent two groups of boat plate assemblies are connected to each other as a whole, and a support rod 7 is provided at the connection of adjacent two groups of boat plate assemblies. In such an embodiment, the wafer carrier 2 is a whole. Therefore, after the silicon wafers are placed in the wafer carrier 2, all the boat plate assemblies can be sent into the coating equipment 1 at one time or taken out from the coating equipment 1 after processing, which helps to improve the production and processing efficiency of the coating process, and the structures of different boat plate assemblies are interrelated, which is beneficial to the control of the ionization process and reduces the processing difficulty of the coating process.

[0063] Among them, a support rod 7 is provided at the connection of adjacent two groups of boat plate assemblies, so the position of the support rod 7 affects the length of the boat plates 5 in adjacent boat plate assemblies. In an alternative embodiment, the lengths of the boat plates 5 in adjacent boat plate assemblies are the same. In another alternative embodiment, the lengths of the boat plates 5 in adjacent boat plate assemblies are different. In addition, the support rod 7 connects the boat plates 5 in the same boat plate assembly in series, so that positive and negative poles are formed between adjacent boat plates 5 in the same boat plate assembly, which helps the ionization process in the coating process. Among them, the material of the support rod 7 can be plastic, glass, ceramic, mica, asbestos, etc., and the present application does not limit this here.

[0064] Furthermore, as Figure 4 shown, the boat plates 5 in adjacent two groups of boat plate assemblies are connected to form a straight line structure, or, as Figure 8 shown, the boat plates 5 in adjacent two groups of boat plate assemblies are connected to form a broken line structure. Among them, the broken line structure is mainly because the temperature change of the coating equipment 1 will show a non-linear relationship. Therefore, by adjusting the spacing of the boat plates 5 in the wafer carrier 2, the intensity of the electric field radio frequency is changed, so as to make up for the phenomenon that the film thickness difference in different boat plate assemblies of the same wafer carrier 2 caused by the temperature difference is large, so that the film thickness difference of the silicon wafers in the wafer carrier 2 is small, thereby improving the yield and photoelectric conversion efficiency of the solar cell.

[0065] In an alternative embodiment, multiple groups of boat blade assemblies are arranged along the first direction X, and the boat blades 5 in each group of boat blade assemblies are all arranged along the first direction X. The first direction X is the arrangement direction of the furnace mouth 11 and the furnace tail 12, and the spacing between multiple groups of boat blade assemblies gradually increases in the direction from the furnace mouth to the furnace tail. In such an embodiment, by improving the spacing between adjacent boat blades 5 in multiple groups of boat blade assemblies, making it gradually increase in the direction from the furnace mouth to the furnace tail, the film thickness difference between different boat blade assemblies is reduced.

[0066] In an alternative embodiment, as Figure 5 shown, the spacing between adjacent boat blades 5 in any boat blade assembly is the same.

[0067] In an alternative embodiment, as Figure 6 shown, the spacing between adjacent boat blades 5 in each group of boat blade assemblies gradually increases in the direction from the furnace mouth 11 to the furnace tail 12. Along the direction from the furnace mouth to the furnace tail, the temperature of any group of boat blade assemblies gradually increases. Therefore, it is designed that the spacing between adjacent boat blades 5 in each group of boat blade assemblies gradually increases in the direction from the furnace mouth 11 to the furnace tail 12, reducing the phenomenon of large film thickness difference caused by large temperature difference in the same boat blade assembly, and making the film thickness in the same boat blade assembly have high uniformity.

[0068] In a second aspect, as Figure 2 shown, an embodiment of the present application discloses a coating device 1. The coating device 1 includes a furnace body, the furnace body includes a furnace mouth 11 and a furnace tail 12, a wafer carrier boat 2 according to any item of the first aspect is provided in the furnace body, the first boat blade assembly 3 of the wafer carrier boat 2 is arranged close to the furnace mouth 11, and the second boat blade assembly 4 of the wafer carrier boat 2 is arranged close to the furnace tail 12. A wafer carrier boat 2 is provided in the furnace body of the coating device 1. Through the design of the wafer carrier boat 2 in the coating device 1, after the process is carried out using the coating device 1, the thickness difference of the deposited silicon wafers is small and the uniformity is high.

[0069] The above has introduced in detail a wafer carrier boat and a coating device disclosed in the embodiments of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand a wafer carrier boat and a coating device: At the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A carrier boat for a coating device, characterized in that, The coating equipment includes a furnace mouth and a furnace tail. The wafer carrier includes multiple groups of wafer components. The multiple groups of wafer components include a first wafer component arranged close to the furnace mouth and a second wafer component arranged close to the furnace tail. Any one of the multiple groups of wafer components includes at least two wafers arranged at intervals, and the distance between adjacent wafers in the first wafer component is smaller than the distance between the wafers in the second wafer component.

2. The carrier boat according to claim 1, wherein The multiple groups of wafer components are arranged in a first direction, and the wafers in each group of wafer components are arranged perpendicular to the first direction. The first direction is the arrangement direction of the furnace mouth and the furnace tail, and the distance between the multiple groups of wafer components gradually increases in the direction from the furnace mouth to the furnace tail.

3. The carrier boat according to claim 2, wherein In the same wafer component, the distance between adjacent wafers gradually increases in a second direction, and the second direction is the direction from the center of the coating equipment to the furnace wall of the coating equipment.

4. The wafer boat according to claim 1, wherein, The multiple groups of wafer components further include at least one group of third wafer components. The at least one group of third wafer components is arranged between the first wafer component and the second wafer component and arranged in the first direction. The first direction is the arrangement direction of the furnace mouth and the furnace tail. The distance between adjacent wafers in the third wafer component is greater than the distance between the wafers in the first wafer component and smaller than the distance between the wafers in the second wafer component.

5. The carrier boat according to claim 4, characterized in that, There are multiple groups of the third wafer components, and the distances between the multiple groups of the third wafer components are equal; or In the direction from the furnace mouth to the furnace tail, the distances between the multiple groups of the third wafer components gradually increase.

6. The carrier boat according to claim 1, characterized in that, The distance between adjacent wafers is 9 mm to 13 mm.

7. The carrier boat according to claim 4, characterized in that, The third wafer components are respectively arranged at intervals from the first wafer component and the second wafer component.

8. The carrier boat according to claim 3, wherein, The number of wafers in each group of wafer components is the same, and the wafers in adjacent two groups of wafer components are connected to form a whole one by one. A support rod is provided at the connection of adjacent two groups of wafer components.

9. The carrier boat according to claim 8, characterized in that, The wafers in adjacent two groups of wafer components are connected to form a straight-line structure, or the wafers in adjacent two groups of wafer components are connected to form a broken-line structure.

10. The carrier boat according to claim 1, characterized in that, The multiple groups of wafer components are arranged in a first direction, and the wafers in each group of wafer components are arranged in the first direction. The first direction is the arrangement direction of the furnace mouth and the furnace tail, and the distance between the multiple groups of wafer components gradually increases in the direction from the furnace mouth to the furnace tail.

11. The carrier boat according to claim 1, characterized in that, In each group of wafer components, the distance between adjacent two wafers gradually increases in the direction from the furnace mouth to the furnace tail.

12. A coating device, characterized in that, The coating equipment includes a furnace body. The furnace body includes a furnace mouth and a furnace tail. A wafer carrier as claimed in any one of claims 1 to 11 is provided in the furnace body. The first wafer component of the wafer carrier is arranged close to the furnace mouth, and the second wafer component of the wafer carrier is arranged close to the furnace tail.

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