Imaging device

Abstract

The utility model relates to a camera device. The camera device comprises a housing; the mounting bracket is mounted in the shell; the main circuit board is mounted on one side of the mounting bracket along the first direction; the first deformable heat dissipation part is located on the side, opposite to the mounting support in the first direction, of the main circuit board, and one end of the first deformable heat dissipation part is connected with the main circuit board; the first deformable heat dissipation part can deform so as to abut against the inner wall of the shell in the first direction. The second deformable heat dissipation part is positioned on one side, back to the main circuit board, of the mounting bracket along the first direction; one end of the second deformable heat dissipation part is connected with the mounting bracket; the second deformable heat dissipation part can deform so as to abut against the inner wall of the shell in the first direction. And the camera module is electrically connected with the main circuit board. The camera device is good in heat dissipation effect and suitable for the plug-in type main circuit board.

Description

Technical Field

[0001] This application relates to the technical field of imaging devices, and particularly to an imaging device. Background Art

[0002] Imaging devices are widely used in scenarios such as intelligent interaction and real-time monitoring. An imaging device generally includes a housing, a camera module, a main circuit board, a circuit board bracket, etc. The main circuit board is installed on the circuit board bracket. The main circuit board and the circuit board bracket are located inside the housing.

[0003] In the imaging devices in related technologies, the heat dissipation solution for the main circuit board is generally: a thermal conductive silicone is provided between the main circuit board and the inner wall of the housing, and both sides of the thermal conductive silicone are respectively in close contact with the main circuit board and the inner wall of the housing, so as to transfer the heat of the main circuit board to the housing through the thermal conductive silicone and dissipate the heat outward through the housing. However, the heat dissipation efficiency of this heat dissipation solution is relatively low, and it cannot meet the heat dissipation requirements of the plug-in main circuit board. Summary of the Utility Model

[0004] Based on this, in view of the problem that the heat dissipation solution of setting a thermal conductive silicone between the main circuit board and the inner wall of the housing in the imaging device in related technologies has relatively low heat dissipation efficiency and cannot meet the heat dissipation requirements of the plug-in main circuit board, it is necessary to provide an imaging device.

[0005] An imaging device, the imaging device includes:

[0006] A housing;

[0007] A mounting bracket, installed inside the housing;

[0008] A main circuit board, installed on one side of the mounting bracket along a first direction;

[0009] A first deformable heat dissipation part, located on the side of the main circuit board along the first direction away from the mounting bracket, and one end of the first deformable heat dissipation part is connected to the main circuit board; the first deformable heat dissipation part can generate deformation along the first direction so as to be in contact with the inner wall of the housing along the first direction;

[0010] A second deformable heat dissipation part, located on the side of the mounting bracket along the first direction away from the main circuit board; one end of the second deformable heat dissipation part is connected to the mounting bracket; the second deformable heat dissipation part can generate deformation along the first direction so as to be in contact with the inner wall of the housing along the first direction; and

[0011] A camera module, electrically connected to the main circuit board.

[0012] In the above-described imaging device, when the connection structure of the main circuit board and the mounting bracket is assembled into the housing, since the first deformable heat dissipation portion can generate deformation in the first direction and the second deformable heat dissipation portion can generate deformation in the first direction, during the process of pushing the connection structure of the main circuit board and the mounting bracket into the housing in the second direction by applying an external force, it is easy to overcome the resistance between the first deformable heat dissipation portion and the inner wall of the housing and the resistance between the second deformable heat dissipation portion and the inner wall of the housing. As a result, the connection structure of the main circuit board and the mounting bracket can be smoothly inserted into the interior of the housing in the second direction. After the connection structure of the main circuit board and the mounting bracket is inserted into the interior of the housing, the deformation of the first deformable heat dissipation portion in the first direction can cause it to abut against the inner wall of the housing in the first direction, and the deformation of the second deformable heat dissipation portion in the first direction can cause it to abut against the inner wall of the housing in the first direction. Thus, the heat of the main circuit board can be transferred to the housing through the first deformable heat dissipation portion; transferred to the second deformable heat dissipation portion through the mounting bracket, and then transferred to the housing through the second deformable heat dissipation portion, thereby achieving a good heat dissipation effect. The heat dissipation solution of the imaging device according to the embodiment of the present application has a good heat dissipation effect and is applicable to an insertable main circuit board.

[0013] In one embodiment, the first deformable heat dissipation portion is an elastic structure and can abut against the inner wall of the housing in the first direction through elastic deformation.

[0014] Since the first deformable heat dissipation portion abuts against the inner wall of the housing in the first direction through elastic deformation, when an external force is applied to push the connection structure of the main circuit board and the mounting bracket into the housing in the second direction, it is easy to overcome the resistance between the first deformable heat dissipation portion and the inner wall of the housing. When the external force is removed, the first deformable heat dissipation portion can reliably abut against the inner wall of the housing through elastic deformation.

[0015] In one embodiment, the second deformable heat dissipation portion is an elastic structure and can abut against the inner wall of the housing in the first direction through elastic deformation.

[0016] Since the second deformable heat dissipation portion abuts against the inner wall of the housing in the first direction through elastic deformation, when an external force is applied to push the connection structure of the main circuit board and the mounting bracket into the housing in the second direction, it is easy to overcome the resistance between the second deformable heat dissipation portion and the inner wall of the housing. When the external force is removed, the second deformable heat dissipation portion can reliably abut against the inner wall of the housing through elastic deformation.

[0017] In one embodiment, the first deformable heat dissipation portion is a metal spring piece. The sheet structure is easy to fix to the main circuit board and can increase the contact area with the main circuit board, making it easy to dissipate heat.

[0018] In one embodiment, the second deformable heat dissipation part is a metal spring piece. The sheet structure is easy to be fixed to the mounting bracket, and can increase the contact area with the mounting bracket, facilitating heat dissipation.

[0019] In one embodiment, the metal spring piece includes an arc section and a straight section. The straight section is parallel to the main circuit board. One end of the arc section is connected to one end of the straight section. The arc section can be elastically deformed to abut against the inner wall of the housing along the first direction.

[0020] When the first deformable heat dissipation part is a metal spring piece, the straight section of the first deformable heat dissipation part is convenient for being fixedly connected to the main circuit board, and the straight section of the first deformable heat dissipation part can be attached to the surface of the main circuit board, with a relatively large contact area, so as to quickly and effectively transfer the heat of the main circuit board to the first deformable heat dissipation part. During the process of assembling the connection structure of the mounting bracket and the main circuit board into the housing, by abutting the convex arc surface of the arc section of the first deformable heat dissipation part against the inner wall of the housing, it is convenient to overcome the resistance between the arc section and the inner wall of the housing, so as to facilitate pushing the main circuit board and the connection structure of the main circuit board into the housing.

[0021] When the second deformable heat dissipation part is a metal spring piece, the straight section of the second deformable heat dissipation part is convenient for being fixedly connected to the mounting bracket, and the straight section of the second deformable heat dissipation part can be attached to the surface of the mounting bracket, with a relatively large contact area, so as to quickly and effectively transfer the heat of the mounting bracket to the second deformable heat dissipation part. During the process of assembling the connection structure of the main circuit board and the mounting bracket into the housing, by abutting the convex arc surface of the arc section of the second deformable heat dissipation part against the inner wall of the housing, it is convenient to overcome the resistance between the arc section and the inner wall of the housing, so as to facilitate pushing the main circuit board and the connection structure of the mounting bracket into the housing.

[0022] In one embodiment, the mounting bracket includes:

[0023] A support plate, which is spaced from the main circuit board along the first direction, and the second deformable heat dissipation part is located on the side of the support plate facing away from the main circuit board; and,

[0024] A connecting column, one end of which is connected to the support plate and the other end is connected to the main circuit board.

[0025] Since the two ends of the connecting column are respectively connected to the support plate and the main circuit board, in this way, the support plate and the main circuit board can be spaced along the first direction, so that the main circuit board can be as close as possible to the first inner wall of the housing, and the support plate can be as close as possible to the second inner wall of the housing, further facilitating the contact between the first deformable heat dissipation part and the first inner wall of the housing, facilitating the contact between the second deformable heat dissipation part and the second inner wall of the housing, and facilitating heat dissipation of the main circuit board.

[0026] In one embodiment, the imaging device further includes a bolt, the head of the bolt is located on the side of the main circuit board facing away from the support plate and abuts against the main circuit board; the screw of the bolt passes through the main circuit board and is threadedly connected to the connecting column. Thus, it is convenient to fix the main circuit board to the connecting column.

[0027] In one embodiment, the number of the first deformable heat dissipation parts is multiple; and / or, the number of the second deformable heat dissipation parts is multiple. This is beneficial to dissipate heat from the main circuit board more quickly.

[0028] In one embodiment, the housing has two side walls opposite to each other in the third direction, and the first direction, the third direction, and the second direction are perpendicular to each other in pairs;

[0029] First guiding chutes are respectively provided on the two side walls, and two sides of the mounting bracket in the third direction are respectively in sliding fit with the first guiding chutes on the two side walls in the second direction; and / or,

[0030] Second guiding chutes are respectively provided on the two side walls, and two sides of the main circuit board in the third direction are respectively in sliding fit with the second guiding chutes on the two side walls in the second direction.

[0031] The first guiding chute can accurately define the sliding direction of the mounting bracket, facilitating the smooth and stable assembly of the mounting bracket into the housing. The second guiding chute can accurately define the sliding direction of the main circuit board, facilitating the smooth and stable assembly of the main circuit board into the housing.

[0032] In one embodiment, one end of the housing in the second direction is provided with a first opening; the first opening is used for the connection structure of the mounting bracket and the main circuit board to be inserted into the housing in the second direction, and the second direction is perpendicular to the first direction;

[0033] The imaging device further includes a first cover body, and the first cover body is fixedly connected to the housing and covers the first opening.

[0034] The connection structure of the mounting bracket and the main circuit board can be inserted into the housing from the first opening in the second direction. The first cover body covers the first opening, so as to protect the components inside the housing. The first cover body and the housing can be fixedly connected by means of bolt connection or the like.

[0035] In one embodiment, the imaging device further includes a second cover body, and the camera module is mounted on the second cover body;

[0036] One end of the housing in the second direction is provided with a second opening, the second cover body is fixedly connected to the housing and covers the second opening, and the second direction is perpendicular to the first direction.

[0037] The camera module can be first installed on the second cover body, and then the second cover body can be fixedly connected to the housing and covered on the second opening, which is convenient for assembling the camera module. Description of the Drawings

[0038] Figure 1 It is a schematic structural diagram of a camera device according to an embodiment.

[0039] Figure 2 is Figure 1 exploded view of the structure of.

[0040] Figure 3 is Figure 1 a cross-sectional view of.

[0041] Description of the reference numerals:

[0042] XX’, the first direction; YY’, the second direction; ZZ’, the third direction;

[0043] 100, housing; 101, first opening; 102, second opening; 110, first cover body; 120, second cover body; 103, first guiding sliding groove;

[0044] 200, mounting bracket; 210, support plate; 220, connecting column; 221, bolt;

[0045] 300, main circuit board;

[0046] 400, first deformable heat dissipation part; 410, arc section; 420, straight section;

[0047] 500, second deformable heat dissipation part;

[0048] 600, camera module. Detailed Description of the Embodiment

[0049] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe in detail the specific embodiments of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0050] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings. These are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present application.

[0051] In addition, if there are terms such as "first" and "second", these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, if there is a term "plurality", the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0052] In the present application, unless otherwise clearly defined and limited, if there are terms such as "mounted", "connected", "connected to", "fixed", etc., these terms should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0053] In the present application, unless otherwise clearly defined and limited, if there is a description such as a first feature being "on" or "under" a second feature, the meaning may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0054] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.

[0055] In the camera device in the related art, the heat dissipation solution for the main circuit board is generally as follows: a heat-conducting silicone gel is provided between the main circuit board and the housing, and both sides of the heat-conducting silicone gel are respectively in close contact with the main circuit board and the inner wall of the housing, so that the heat of the main circuit board is transferred to the housing through the heat-conducting silicone gel and dissipated to the outside through the housing. However, the heat dissipation efficiency of the heat-conducting silicone gel is relatively low. Moreover, when the plug-in main circuit board is assembled with the housing, it needs to be inserted into the housing from one end of the housing. This results in that after the main circuit board is inserted into the housing, the heat-conducting silicone gel cannot be clamped between the inner wall of the housing and the main circuit board anymore. If the heat-conducting silicone gel is first attached to the inner wall of the housing, it will cause a large resistance to the main circuit board by the heat-conducting silicone gel, making it difficult to smoothly insert the main circuit board into the housing. Therefore, the heat dissipation solution of setting the heat-conducting silicone gel between the main circuit board and the housing cannot meet the heat dissipation requirements of the plug-in main circuit board.

[0056] For this reason, the embodiment of the present application provides a camera device. Since the first deformable heat dissipation part can generate deformation in the first direction and the second deformable heat dissipation part can generate deformation in the first direction, when the connection structure of the main circuit board and the mounting bracket is pushed into the housing in the second direction by applying an external force, it is easy to overcome the resistance between the first deformable heat dissipation part and the inner wall of the housing and the resistance between the second deformable heat dissipation part and the inner wall of the housing, so that the connection structure of the main circuit board and the mounting bracket can be smoothly inserted into the housing in the second direction. After the connection structure of the main circuit board and the mounting bracket is inserted into the housing, the deformation of the first deformable heat dissipation part in the first direction can make it abut against the inner wall of the housing in the first direction, and the deformation of the second deformable heat dissipation part in the first direction can make it abut against the inner wall of the housing in the first direction. Thus, the heat of the main circuit board can be transferred to the housing through the first deformable heat dissipation part; transferred to the second deformable heat dissipation part through the mounting bracket, and then transferred to the housing through the second deformable heat dissipation part, thereby achieving a good heat dissipation effect. The heat dissipation solution of the camera device in the embodiment of the present application has a good heat dissipation effect and is applicable to the plug-in main circuit board.

[0057] Please refer to Figure 1 and Figure 2 , a camera device provided by an embodiment of the present application includes: a housing 100, a mounting bracket 200, a main circuit board 300, a first deformable heat dissipation part 400, a second deformable heat dissipation part 500, and a camera module 600.

[0058] The mounting bracket 200 is installed inside the housing 100. The main circuit board 300 is installed on one side of the mounting bracket 200 along the first direction XX'. The first direction XX' is the arrangement direction of the main circuit board 300 and the mounting bracket 200. Optionally, the first direction XX' is the thickness direction of the main circuit board 300.

[0059] The first deformable heat dissipation part 400 is located on the side of the main circuit board 300 along the first direction XX' and facing away from the mounting bracket 200, and one end of the first deformable heat dissipation part 400 is connected to the main circuit board 300. The first deformable heat dissipation part 400 can generate deformation along the first direction XX' so as to abut against the inner wall of the housing 100 along the first direction XX'.

[0060] The second deformable heat dissipation part 500 is located on the side of the mounting bracket 200 along the first direction XX' and facing away from the main circuit board 300. One end of the second deformable heat dissipation part 500 is connected to the mounting bracket 200. The second deformable heat dissipation part 500 can generate deformation along the first direction XX' so as to abut against the inner wall of the housing 100 along the first direction XX'.

[0061] The camera module 600 is electrically connected to the main circuit board 300, so that signals can be transmitted between the two.

[0062] When the above-mentioned imaging device is assembled and the connection structure of the main circuit board 300 and the mounting bracket 200 is assembled into the housing 100, since the first deformable heat dissipation part 400 can generate deformation along the first direction XX', and the second deformable heat dissipation part 500 can generate deformation along the first direction XX', therefore, when the connection structure of the main circuit board 300 and the mounting bracket 200 is pushed into the housing 100 along the second direction YY' by applying an external force, it is easy to overcome the resistance between the first deformable heat dissipation part 400 and the inner wall of the housing 100 and the resistance between the second deformable heat dissipation part 500 and the inner wall of the housing 100, so that the connection structure of the main circuit board 300 and the mounting bracket 200 can be smoothly inserted into the interior of the housing 100 along the second direction YY'. The second direction YY' is perpendicular to the first direction XX'. After the connection structure of the main circuit board 300 and the mounting bracket 200 is inserted into the interior of the housing 100, the deformation of the first deformable heat dissipation part 400 along the first direction XX' can make it abut against the inner wall of the housing 100 along the first direction XX', and the deformation of the second deformable heat dissipation part 500 along the first direction XX' can make it abut against the inner wall of the housing 100 along the first direction XX', so that the heat of the main circuit board 300 can be transferred to the housing 100 through the first deformable heat dissipation part 400; transferred to the second deformable heat dissipation part 500 through the mounting bracket 200, and then transferred to the housing 100 through the second deformable heat dissipation part 500, thereby achieving a good heat dissipation effect. It can be seen that the heat dissipation solution of the imaging device in the embodiment of the present application has a good heat dissipation effect and can be applied to the plug-in main circuit board.

[0063] It can be understood that the housing 100 has a first inner wall (not labeled) and a second inner wall (not labeled) opposite to each other along the first direction XX'. The first deformable heat dissipation part 400 is used to abut against the first inner wall along the first direction XX'. The second deformable heat dissipation part 500 is used to abut against the second inner wall along the first direction XX'.

[0064] Optionally, the housing 100 is made of a metal material, which is convenient for heat conduction. For example, aluminum alloy, iron, or copper.

[0065] Optionally, the mounting bracket 200 is a metal bracket, which has a good heat dissipation effect. The material used for the mounting bracket 200 is, for example, aluminum alloy, iron, or copper.

[0066] Optionally, the first deformable heat dissipation part 400 is made of a metal material, which has a good heat dissipation effect. The second deformable heat dissipation part 500 is made of a metal material, which has a good heat dissipation effect.

[0067] In one embodiment, the first deformable heat dissipation part 400 is an elastic structure and can abut against the inner wall of the housing 100 along the first direction XX' through elastic deformation.

[0068] During the process of assembling the connection structure of the main circuit board 300 and the mounting bracket 200 into the housing 100, the first deformable heat dissipation part 400 is in abutment with the inner wall of the housing 100 along the first direction XX' through elastic deformation. When an external force is applied to push the connection structure of the main circuit board 300 and the mounting bracket 200 into the housing 100 along the second direction YY', it is easy to overcome the resistance between the first deformable heat dissipation part 400 and the inner wall of the housing 100. When the connection structure of the main circuit board 300 and the mounting bracket 200 is assembled in place, the external force is removed, and then the first deformable heat dissipation part 400 can be in reliable abutment with the inner wall of the housing 100 along the first direction XX' through elastic deformation, so that the heat of the main circuit board 300 can be transferred to the housing 100.

[0069] In one embodiment, the second deformable heat dissipation part 500 is an elastic structure and can be in abutment with the inner wall of the housing 100 along the first direction XX' through elastic deformation.

[0070] During the process of assembling the connection structure of the main circuit board 300 and the mounting bracket 200 into the housing 100, the second deformable heat dissipation part 500 is in abutment with the inner wall of the housing 100 along the first direction XX' through elastic deformation. When an external force is applied to push the connection structure of the main circuit board 300 and the mounting bracket 200 into the housing 100 along the second direction YY', it is easy to overcome the resistance between the second deformable heat dissipation part 500 and the inner wall of the housing 100. When the connection structure of the main circuit board 300 and the mounting bracket 200 is assembled in place, the external force is removed, and then the second deformable heat dissipation part 500 can be in reliable abutment with the inner wall of the housing 100 along the first direction XX' through elastic deformation, so that the heat of the main circuit board 300 can be transferred to the housing 100.

[0071] The material used for the first deformable heat dissipation part 400 is, for example, stainless steel, aluminum alloy, copper, etc.

[0072] The connection method between the first deformable heat dissipation part 400 and the main circuit board 300 can be bolt connection, riveting, welding, etc.

[0073] The material used for the second deformable heat dissipation part 500 is, for example, stainless steel, aluminum alloy, copper, etc.

[0074] The connection method between the second deformable heat dissipation part 500 and the mounting bracket 200 can be bolt connection, riveting, welding, etc.

[0075] In one embodiment, the first deformable heat dissipation part 400 is a metal spring sheet. The metal spring sheet is sheet-shaped, and it is easy to generate a large contact area with the main circuit board 300 and the inner wall of the housing 100, and the heat dissipation effect is good. The metal spring sheet is a sheet structure and is easy to be fixed to the main circuit board 300.

[0076] In other embodiments, the first deformable heat dissipation part may also be an elastic structure in other forms, such as a beaded screw.

[0077] In one embodiment, the second deformable heat dissipation part is a metal spring piece. The metal spring piece is sheet-shaped, and it is easy to generate a large contact area between the metal spring piece and the inner wall of the mounting bracket and the housing, so the heat dissipation effect is good. The metal spring piece is a sheet structure and is easy to be fixed to the mounting bracket.

[0078] In other embodiments, the second deformable heat dissipation part may also be an elastic structure in other forms, such as a beaded screw.

[0079] Please refer to Figure 2 and Figure 3 , in one embodiment, the metal spring piece includes an arc section 410 and a straight section 420. The straight section 420 is parallel to the main circuit board 300. One end of the arc section 410 is connected to one end of the straight section 420. The arc section 410 can be elastically deformed to abut against the inner wall of the housing 100 along the first direction XX'.

[0080] When the first deformable heat dissipation part 400 is a metal spring piece, since the straight section 420 of the first deformable heat dissipation part 400 is parallel to the main circuit board 300, it is convenient to fixedly connect the first deformable heat dissipation part 400 to the main circuit board 300. Moreover, the straight section 420 of the first deformable heat dissipation part 400 can be attached to the main circuit board 300, and the contact area is relatively large, so that the heat of the main circuit board 300 can be quickly and effectively transferred to the first deformable heat dissipation part 400. According to Figure 3 It can be understood that the convex arc surface of the arc section 410 abuts against the inner wall of the housing 100. During the process of assembling the connection structure of the main circuit board 300 and the mounting bracket 200 into the housing 100, by abutting the convex arc surface of the arc section 410 of the first deformable heat dissipation part 400 against the inner wall of the housing 100, it is convenient to overcome the resistance between the arc section 410 of the first deformable heat dissipation part 400 and the inner wall of the housing 100, so as to facilitate the pushing of the connection structure of the main circuit board 300 and the mounting bracket 200 into the housing 100.

[0081] Similarly, when the second deformable heat dissipation part is a metal spring piece, the straight section of the second deformable heat dissipation part is convenient for fixedly connecting with the mounting bracket, and the straight section of the second deformable heat dissipation part can be attached to the surface of the mounting bracket, and the contact area is relatively large, so that the heat of the mounting bracket can be quickly and effectively transferred to the second deformable heat dissipation part. During the process of assembling the connection structure of the main circuit board and the mounting bracket into the housing, by abutting the convex arc surface of the arc section of the second deformable heat dissipation part against the inner wall of the housing, it is convenient to overcome the resistance between the arc section and the inner wall of the housing, so as to facilitate the pushing of the connection structure of the main circuit board and the mounting bracket into the housing.

[0082] Please refer to Figure 2 andFigure 3 In one embodiment, the second deformable heat dissipation part 500 can be plastically deformed under an external force, so that the second deformable heat dissipation part 500 can be in contact with the inner wall of the housing 100 along the first direction XX'.

[0083] During actual assembly, first apply an external force to plastically deform the second deformable heat dissipation part 500, so that the second deformable heat dissipation part 500 can be in a state of being in contact with the inner wall of the housing 100 along the first direction XX'. Then, apply an external force to push the connection structure of the main circuit board 300 and the mounting bracket 200 into the housing 100. During the pushing process, the second deformable heat dissipation part 500 is in contact with the inner wall of the housing 100. However, since the second deformable heat dissipation part 500 can undergo a certain amount of plastic deformation, it is easy to overcome the resistance between the second deformable heat dissipation part 500 and the inner wall of the housing 100 during the pushing process, so that the connection structure of the main circuit board 300 and the mounting bracket 200 can be smoothly inserted into the housing 100 along the second direction YY'. After being pushed in place, the second deformable heat dissipation part 500 can still remain in contact with the inner wall of the housing 100.

[0084] Optionally, the material used for the second deformable heat dissipation part 500 is aluminum alloy, copper, etc.

[0085] Optionally, the second deformable heat dissipation part 500 has an arc-shaped structure, and the convex arc surface of the arc-shaped structure is in contact with the inner wall of the housing 100.

[0086] Please refer to Figure 2 and Figure 3 In one embodiment, the second deformable heat dissipation part 500 and the mounting bracket 200 are of an integrally formed structure, which is convenient for processing and forming. Specifically, the second deformable heat dissipation part 500 and the mounting bracket 200 can be formed by integral stamping.

[0087] In other embodiments, the second deformable heat dissipation part and the mounting bracket can also be separately processed, and the two are connected by a connecting member. The connection method between the second deformable heat dissipation part and the mounting bracket can be bolt connection, riveting, welding, etc.

[0088] Please refer to Figure 2 and Figure 3 In one embodiment, the mounting bracket 200 includes a support plate 210 and a connecting column 220. The support plate 210 is spaced from the main circuit board 300 along the first direction XX', and the second deformable heat dissipation part 500 is located on the side of the support plate 210 facing away from the main circuit board 300. One end of the connecting column 220 is connected to the support plate 210, and the other end is connected to the main circuit board 300.

[0089] Since both ends of the connecting column 220 are respectively connected to the support plate 210 and the main circuit board 300, in this way, the support plate 210 and the main circuit board 300 can be arranged at intervals along the first direction XX'. Thus, the main circuit board 300 can be made as close as possible to the first inner wall of the housing 100, and the support plate 210 can be made as close as possible to the second inner wall of the housing 100. Furthermore, it is convenient for the first deformable heat dissipation part 400 to contact the first inner wall of the housing 100, and it is convenient for the second deformable heat dissipation part 500 to contact the second inner wall of the housing 100, which is convenient for dissipating heat from the main circuit board 300.

[0090] The support plate 210 and the connecting column 220 can be an integrally formed structure or a split structure connected to each other.

[0091] Please refer to Figure 2 , in an embodiment, the imaging device further includes a bolt 221, and the connecting column 220 and the main circuit board 300 are fixedly connected by the bolt 221. Specifically, the head of the bolt 221 is located on the side of the main circuit board 300 facing away from the support plate 210 and abuts against the main circuit board 300. The screw of the bolt 221 passes through the main circuit board 300 and is threadedly connected to the connecting column 220, so as to conveniently fix the main circuit board 300 to the connecting column 220.

[0092] In an embodiment, the number of the connecting columns 220 is multiple, such as two, three, four, etc. The main circuit board 300 can be supported more stably by the multiple connecting columns 220, and the heat from the main circuit board 300 can be conducted to the support plate 210 more quickly.

[0093] Specifically, the number of the bolts 221 can also be multiple, and the bolts 221 are arranged in one-to-one correspondence with the connecting columns 220.

[0094] In an embodiment, the number of the first deformable heat dissipation parts 400 is multiple, which is beneficial to dissipating heat from the main circuit board 300 more quickly.

[0095] In an embodiment, the number of the second deformable heat dissipation parts 500 is multiple, which is beneficial to dissipating heat from the main circuit board 300 more quickly.

[0096] In an embodiment, the housing 100 has two side walls opposite to each other along the third direction ZZ'. Please refer to Figure 2 , first guiding chutes 103 are respectively provided on the two side walls. Both sides of the mounting bracket 200 along the third direction ZZ' are respectively in sliding fit with the first guiding chutes 103 on the two side walls along the second direction YY'. The first direction XX', the second direction YY', and the third direction ZZ' are perpendicular to each other in pairs.

[0097] Specifically, the length direction of the first guiding chute 103 is along the second direction YY'. During the process of inserting the mounting bracket 200 into the interior of the housing 100, since the two sides of the mounting bracket 200 along the third direction ZZ' are respectively in sliding fit with the first guiding chutes 103 on the two side walls along the second direction YY', the first guiding chute 103 can accurately define the sliding direction of the mounting bracket 200, facilitating the smooth and stable assembly of the mounting bracket 200 into the housing 100.

[0098] Specifically, it can be that the two sides of the support plate 210 along the third direction ZZ' are respectively in sliding fit with the first guiding chutes 103 on the two side walls along the second direction YY'.

[0099] In an embodiment, the housing 100 has two side walls opposite to each other along the third direction ZZ'. Second guiding chutes are respectively provided on the two side walls. The two sides of the main circuit board 300 along the third direction ZZ' are respectively in sliding fit with the second guiding chutes on the two side walls along the second direction YY'. The first direction XX', the second direction YY', and the third direction ZZ' are perpendicular to each other in pairs.

[0100] Specifically, the length direction of the second guiding chute is along the second direction YY'. During the process of inserting the main circuit board 300 into the interior of the housing 100, since the two sides of the main circuit board 300 along the third direction ZZ' are respectively in sliding fit with the second guiding chutes on the two side walls along the second direction YY', the second guiding chute can accurately define the sliding direction of the main circuit board 300, facilitating the smooth and stable assembly of the main circuit board 300 into the housing 100.

[0101] Please refer to Figure 2 , in an embodiment, one end of the housing 100 along the second direction YY' is provided with a first opening 101. The first opening 101 is used for the connection structure of the mounting bracket 200 and the main circuit board 300 to be inserted into the housing 100 along the second direction YY'. The imaging device further includes a first cover body 110, and the first cover body 110 is fixedly connected to the housing 100 and covers the first opening 101.

[0102] The connection structure of the mounting bracket 200 and the main circuit board 300 can be inserted into the housing 100 from the first opening 101 along the second direction YY'. The first cover body 110 covers the first opening 101, so as to protect the various components inside the housing 100. The first cover body 110 and the housing 100 can be fixedly connected by means of bolt connection or the like.

[0103] Specifically, the mounting bracket 200 and the first cover 110 can be fixedly connected by means of bolt connection or the like. The main circuit board 300 and the first cover 110 can be fixedly connected by means of bolt connection or the like. In this way, the mounting bracket 200, the main circuit board 300, and the first cover 110 can be first connected into a whole, and then this whole is assembled with the housing 100, which is convenient for assembly. The first cover 110 can be made of a metal material, such as aluminum alloy, which is convenient for heat dissipation.

[0104] In one embodiment, the first cover 110 is provided with a power supply connection terminal and a signal connection terminal. The power supply connection terminal and the signal connection terminal are respectively connected to the main circuit board 300. The power supply connection terminal is used to connect with a power supply wire, so as to be able to supply power to the main circuit board 300. The signal connection terminal is used to connect with a signal wire, so as to facilitate the main circuit board 300 to transmit signals through the signal wire.

[0105] Please refer to Figure 2 , in one embodiment, one end of the housing 100 along the second direction YY' is provided with a second opening 102. The imaging device further includes a second cover 120, and the camera module 600 is installed on the second cover 120. The second cover 120 is fixedly connected to the housing 100 and covers the second opening 102.

[0106] The camera module 600 can be first installed on the second cover 120, and then the second cover 120 is fixedly connected to the housing 100 and covers the second opening 102, which is convenient for assembling the camera module 600.

[0107] The second cover 120 can be made of a metal material, such as aluminum alloy, copper, etc. In this way, the camera module 600 can directly dissipate heat through the second cover 120.

[0108] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0109] The above-described embodiments only represent several implementation manners of the present application. Their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several deformations and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. An imaging device, characterized in that, The camera device includes: a housing (100); a mounting bracket (200) installed inside the housing (100); a main circuit board (300) installed on one side of the mounting bracket (200) along the first direction (XX'); a first deformable heat dissipation part (400) located on the side of the main circuit board (300) opposite to the mounting bracket (200) along the first direction (XX'), with one end of the first deformable heat dissipation part (400) connected to the main circuit board (300); the first deformable heat dissipation part (400) can generate deformation along the first direction (XX') so as to abut against the inner wall of the housing (100) along the first direction (XX'); a second deformable heat dissipation part (500) located on the side of the mounting bracket (200) opposite to the main circuit board (300) along the first direction (XX'); one end of the second deformable heat dissipation part (500) is connected to the mounting bracket (200); the second deformable heat dissipation part (500) can generate deformation along the first direction (XX') so as to abut against the inner wall of the housing (100) along the first direction (XX'); and a camera module (600) electrically connected to the main circuit board (300).

2. The camera device according to claim 1, wherein the first deformable heat dissipation part (400) is an elastic structure and can abut against the inner wall of the housing (100) along the first direction (XX') through elastic deformation; and / or, the second deformable heat dissipation part (500) is an elastic structure and can abut against the inner wall of the housing (100) along the first direction (XX') through elastic deformation.

3. The camera device according to claim 1, wherein the first deformable heat dissipation part (400) is a metal spring piece; and / or, the second deformable heat dissipation part (500) is a metal spring piece.

4. The imaging device according to claim 3, wherein The metal spring piece includes an arc section and a straight section. The straight section is parallel to the main circuit board (300). One end of the arc section is connected to one end of the straight section. The arc section can abut against the inner wall of the housing (100) along the first direction (XX') through elastic deformation.

5. The camera device according to claim 1, wherein the mounting bracket (200) includes: a support plate (210) spaced from the main circuit board (300) along the first direction (XX'), and the second deformable heat dissipation part (500) is located on the side of the support plate (210) opposite to the main circuit board (300); and, a connecting column (220) with one end connected to the support plate (210) and the other end connected to the main circuit board (300).

6. The imaging device according to claim 5, characterized in that, It further includes a bolt (221), the head of the bolt (221) is located on the side of the main circuit board (300) facing away from the support board (210) and abuts against the main circuit board (300); the screw of the bolt (221) passes through the main circuit board (300) and is threadedly connected to the connection post (220).

7. The imaging device according to claim 1, wherein The number of the first deformable heat dissipation parts (400) is multiple; and / or, the number of the second deformable heat dissipation parts (500) is multiple.

8. The imaging device according to claim 1, characterized in that, The housing (100) has two side walls opposite to each other along the third direction (ZZ'), and the first direction (XX'), the third direction (ZZ'), and the second direction (YY') are perpendicular to each other in pairs; First guiding chutes (103) are respectively provided on the two side walls, and both sides of the mounting bracket (200) along the third direction (ZZ') are respectively in sliding fit with the first guiding chutes (103) on the two side walls along the second direction (YY'); and / or, Second guiding chutes are respectively provided on the two side walls, and both sides of the main circuit board (300) along the third direction (ZZ') are respectively in sliding fit with the second guiding chutes on the two side walls along the second direction (YY').

9. The imaging device according to claim 1, wherein One end of the housing (100) along the second direction (YY') is provided with a first opening (101); the first opening (101) is used for the connection structure of the mounting bracket (200) and the main circuit board (300) to be inserted into the housing (100) along the second direction (YY'), and the second direction (YY') is perpendicular to the first direction (XX'); The imaging device further includes a first cover body (110), and the first cover body (110) is fixedly connected to the housing (100) and covers the first opening (101).

10. The imaging device according to claim 1, wherein The imaging device further includes a second cover body (120), and the camera module (600) is mounted on the second cover body (120); One end of the housing (100) along the second direction (YY') is provided with a second opening (102), the second cover body (120) is fixedly connected to the housing (100) and covers the second opening (102), and the second direction (YY') is perpendicular to the first direction (XX').

Images