3D-TOF imaging system based on ArmCortex-M7

Abstract

The utility model provides a 3D-TOF imaging system based on ArmCortex-M7. The 3D-TOF imaging system based on ArmCortex-M7 comprises a sensor system, an imaging chip epc660, a power supply system, an MCU main control chip Arm CortexM7, a low power consumption Bluetooth BLE chip and an SDRAM memory. The power supply system is electrically connected with the sensor system, the imaging chip epc660, the MCU main control chip Arm CortexM7 and the low-power-consumption Bluetooth BLE chip; and the MCU main control chip Arm CortexM7 and the low power consumption Bluetooth BLE chip are respectively in signal connection with the SDRAM memory. According to the utility model, multifunctional optimization is carried out on an imaging system, high speed, high performance and optimal real-time response are realized, the system is suitable for a low-power-consumption, high-sensitivity and multi-scene imaging system, high performance, high reliability and long service life are realized by matching with a high-capacity battery and solar charging, and increasing experience requirements are met.

Description

Technical Field

[0001] The utility model relates to the technical field of 3D-TOF imaging, and more specifically, to a 3D-TOF imaging system based on Arm Cortex-M7. Background Art

[0002] With the rapid development of the Internet of Things, the interconnection of all things has entered thousands of households. The Internet of Things refers to the interconnection of various physical devices, sensors, and electronic devices to achieve data interaction and intelligent control through the Internet. Internet of Things products not only need to have high-definition imaging, but also require functions such as motion capture, temperature and humidity monitoring, and data transmission.

[0003] ToF is the abbreviation of Time of Flight, also known as Time-of-Flight 3D imaging. This imaging technology emits continuous infrared light pulses of a specific wavelength towards the target, receives the optical signal returned by the object to be measured through a specific sensor, and calculates the round-trip flight time or phase difference of the light to obtain the 3D depth information of the object to be measured. The brightness image of the ToF camera can be quickly connected through a model.

[0004] However, the existing ToF imaging devices on the global market currently generally have the following problems: the measurement distance is shorter than that of conventional measuring instruments, generally not exceeding 10 meters; the measurement results are affected by the properties of the object to be measured; the measurement results of most ToF imaging machines are significantly affected by the external environment, especially by external light sources; the resolution is relatively low, and the systematic error and random error have a significant impact on the results, and post-processing of data is required. Therefore, the existing 3D-ToF imaging systems inevitably have defects such as single function, poor performance, low reliability, high power consumption, and short service life, resulting in a low user experience.

[0005] Therefore, there is an urgent need to develop and design a 3D-TOF imaging system with more optimized functions, more stable performance, higher reliability, lower power consumption, and longer service life to solve the above-mentioned difficulties and problems in the existing technology and meet the growing experience needs of users. Summary of the Utility Model

[0006] In view of this, the purpose of the present utility model is to design a 3D-TOF imaging system based on Arm Cortex-M7, optimize the imaging system in multiple functions, use Arm Cortex_M7 as the main control chip of the MCU, adopt synchronous dynamic random access memory SDRAM as the memory, use the 3D-TOF imaging chip epc660 to output imaging data, and cooperate with Bluetooth transmission. It can not only read sensors but also transmit data, achieving high speed, high performance, and optimal real-time response. It is applicable to imaging systems with low power consumption, high sensitivity, and multiple scenarios, realizing high-performance, high-reliability, and long-life product performance, and meeting the growing experience needs of users.

[0007] The present utility model provides a 3D-TOF imaging system based on Arm Cortex-M7, including: a sensor system, an imaging chip epc660, a power supply system (for powering the system), a main control chip Arm Cortex_M7 of the MCU, a low-power Bluetooth BLE chip, and an SDRAM memory; the power supply system is electrically connected to the sensor system, the imaging chip epc660, the main control chip Arm Cortex_M7 of the MCU, and the low-power Bluetooth BLE chip respectively; the main control chip Arm Cortex_M7 of the MCU and the low-power Bluetooth BLE chip are respectively signal-connected to the SDRAM memory;

[0008] Preferably, the power supply system includes three power supplies, which are respectively: a main power supply, a solar charging power supply, and a battery; the present utility model adopts three power supplies. Even in the working condition without the main power supply, the system can be powered by the battery alone, or the solar charging power supply can power the system and charge the battery, thus realizing the use of clean energy and reducing carbon dioxide emissions.

[0009] The sensor system includes: an image sensor, an acceleration sensor, and a temperature and humidity sensor; the image sensor is signal-connected to the imaging chip epc660; the acceleration sensor and the temperature and humidity sensor are respectively signal-connected to the main control chip Arm Cortex_M7 of the MCU and the low-power Bluetooth BLE chip through the I2C integrated circuit bus.

[0010] Specifically, the acceleration sensor and the temperature and humidity sensor transmit the collected environmental information data to the main control chip Arm Cortex_M7 of the MCU and the low-power Bluetooth BLE chip through the I2C integrated circuit bus; the imaging chip epc660 performs sleep settings in specific situations where image acquisition is not required, which can achieve low power consumption, thus extending the battery life, and can transmit information to the terminal for use through Bluetooth devices, and users can monitor the camera information at any time.

[0011] Preferably, the MCU main control chip Arm Cortex_M7 transmits and controls data with the imaging chip epc660 through high-speed DDR signals, and reads the stored content with the imaging chip epc660 through the I2C integrated circuit bus; the imaging chip epc660 includes three working modes, which can achieve low power consumption in different environments. The three working modes include: illumination modulation mode, distance measurement mode and non-distance measurement mode.

[0012] Specifically, under normal use conditions, the MCU main control chip Arm Cortex_M7 takes pictures in various scenarios through data communication with the imaging chip epc660, compensates according to the distance, light intensity, etc., and can perform wireless transmission through Bluetooth to obtain the current environmental status and portrait collection information; in the sleep state, the system is in a low-power state, and the acceleration sensor and other sensors are also in a low-power mode and non-shutdown state.

[0013] Furthermore, the 3D-TOF imaging system includes: a battery management chip. The low-power Bluetooth BLE chip is signal-connected to the battery management chip through the I2C integrated circuit bus, and the battery management chip is electrically connected to the main power supply, the solar charging power supply, and the battery.

[0014] Specifically, the low-power Bluetooth BLE chip uses I2C to judge and select the main power supply and the battery for the battery management chip, and controls the battery charging, and outputs a system voltage of 4.5V (main power supply) or 4.2V (battery) to improve the power utilization efficiency;

[0015] Furthermore, the 3D-TOF imaging system also includes: a low-dropout linear regulator LDO chip, a buck DCDC chip, and a buck-boost DCDC chip; the low-dropout linear regulator LDO chip is electrically connected to the battery management chip, and the buck DCDC chip is electrically connected to the battery management chip; the buck-boost DCDC chip is electrically connected to the imaging chip epc660;

[0016] The system voltage is reduced to 3.3V through an LDO (low-dropout linear regulator) for use by the 3D acceleration sensor, ambient light sensor, temperature and humidity sensor, and Bluetooth;

[0017] The buck DCDC chip is used to reduce the system voltage to 5.3V, and the DCDC buck-boost power chip generates ±10V voltage to supply power to the imaging chip epc660, and converts the 5.3V voltage into 3.3V voltage to supply power to the MCU main control chip Arm Cortex_M7 and the memory SDRAM;

[0018] Each of the low-dropout linear regulator (LDO) chip, step-down DC-DC chip, and buck-boost DC-DC chip has an enable pin. Through the enable function of the MCU, a low-power mode and a low-power sleep state in which power is turned off when not in use can be achieved.

[0019] Further, the 3D-TOF imaging system is configured with an illumination system adjustable according to ambient light. The illumination system includes two paths: one is an ambient light sensor, which is signal-connected to the MCU main control chip Arm Cortex_M7. According to the intensity of the ambient light, the voltage of the lighting lamp is controlled by the MCU main control chip Arm Cortex_M7 to change the intensity of the light, so as to meet the lighting adjustment in different ambient lights; the other path is an illumination compensator, and an imaging glass chip is provided inside the illumination compensator, and the imaging glass chip realizes high-definition and smooth imaging.

[0020] Further, the 3D-TOF imaging system is configured with a USB interface, a JTAG interface, and a 3.3V serial port. The USB interface and the JTAG interface are both electrically connected to the MCU main control chip Arm Cortex_M7; the 3.3V serial port is electrically connected to the low-power Bluetooth BLE chip.

[0021] Specifically, the main control chip Arm Cortex_M7 of the MCU is debugged through the USB interface, and software is downloaded using JTAG, which is safe and stable. Preferably, the USB interface can be adapted to various types such as USB2.0 and USB3.0 to improve stability and reliability. The BLE chip is debugged using the serial port 3.3V and software is downloaded using the JTAG interface; preferably, it is paired with a Nordic antenna tuning chip for antenna tuning to achieve optimal performance such as strong power and long signal propagation distance.

[0022] Furthermore, the battery uses a 5200mAh rechargeable lithium manganese battery. Combined with a high-capacity 5200mAh battery and solar charging, it can achieve multiple functions such as outdoor automatic charging and charger charging. The 5200mAh rechargeable lithium manganese battery has a high energy density. Compared with other rechargeable batteries, the lithium manganese battery can provide longer usage time; it has a long lifespan. Since lithium manganate is used as the cathode material, it is not prone to swelling and dissolution, so the battery has a long lifespan; it has a low self-discharge rate and can maintain its charge for a long time even if not used for a long time; it has excellent environmental performance, does not contain harmful substances such as heavy metals, and is friendly to the environment; it has a low price. The cathode active material uses electrolytic manganese dioxide, which is a relatively inexpensive one among the cathode active materials of lithium batteries and can be widely promoted and applied; it has excellent electrical performance: its specific energy is 5 to 10 times that of dry batteries, the load voltage is 2.8V, the discharge voltage is relatively stable, and it can work in the range of -40 to +50°C; it has a long storage life: under normal temperature conditions, the battery storage life exceeds 10 years, and the annual capacity drop is about 1%; it is safe and reliable, and no gas is evolved during storage and discharge, and the safety is good.

[0023] Furthermore, the 3D-TOF imaging system is reserved with a load power interface, and the load power interface is connected to the required load according to actual needs, so as to realize more abundant product functions and application forms.

[0024] Furthermore, multiple (preferably 4) fixed connection holes are provided on the outer shell of the 3D-TOF imaging system, and the 3D-TOF imaging system is fixedly connected to the corresponding use area through multiple (preferably four) screws. This greatly improves the convenience of use. The installation operation is simple, and it can monitor movements. The acceleration sensor can dynamically adjust the camera state and machine performance under moving or static conditions.

[0025] Furthermore, an outer shell is provided outside the 3D-TOF imaging system, and the overall structure of the outer shell is fully enclosed. Preferably, it reaches IP67 level in terms of waterproof, dustproof, and anti-static.

[0026] Preferably, the temperature and humidity sensor is signal-connected to the battery management chip. The temperature and humidity sensor is used to monitor the environmental temperature and humidity, including monitoring the charging temperature. For example, when the ambient temperature is higher than 45°C, charging is not carried out, and charging resumes when the temperature is lower. When the temperature is higher than 85°C, the system actively enters the power-off non-working mode to protect the system and equipment and improve the reliability and lifespan of the equipment.

[0027] When the ambient temperature changes, for example, due to changes in the external power supply or other situations that cause ambient temperature changes, the MCU main control chip Arm Cortex_M7 transmits the data change information to the low-power Bluetooth BLE chip, and the low-power Bluetooth BLE chip sends the data change information to the user terminal for viewing and maintenance, so that the imaging meets the high-definition timeliness requirements. It is also possible to connect to the device through the USB interface, JTAG interface, and 3.3V serial port to check the entire 3D-TOF imaging system and perform image processing.

[0028] The service life of the 3D-TOF imaging system of the present utility model can reach 10 years. Based on excellent chip processing performance, the service time of the device is effectively extended, and the power supply environment can be adjusted according to requirements, with high reliability, suitable for most high and low temperature, global use scenarios. And according to the user's usage requirements, the transmission rate and access dynamics can be customized, and the transmission rate can reach at least 600 MHz, and different power supply environments can be applied according to the user's status.

[0029] The 3D-TOF imaging system of the present utility model can be applied to scenarios where real-time detection of the environment is realized through Internet of Things control. It can be rechargeable, easy to operate, and has the advantages of high performance, high speed, high efficiency, and long life.

[0030] Compared with the prior art, the beneficial effects of the present utility model are:

[0031] The 3D-TOF imaging system based on Arm Cortex-M7 provided by the present utility model optimizes the imaging system multifunctionally. Using Arm Cortex_M7 as the main control chip of the MCU, using synchronous dynamic random access memory SDRAM as the memory can be paired with high-speed small signals, using the 3D-TOF imaging chip epc660 to output imaging data, which can be paired with high-speed signals for data transmission, and paired with Bluetooth transmission. It can not only read sensors but also transmit data, realizing a low-power, highly sensitive imaging system with high speed, high performance, and optimal real-time response suitable for multiple scenarios; it can be paired with a high-capacity 5200mAh battery and solar charging, and can realize multiple functions of outdoor automatic charging and charger charging, realizing high-performance, high-reliability, and long-life product usability, meeting the growing experience needs of users; and the development is simple and efficient, the configuration is flexible, the applicable surface for multiple application scenarios is wider, the system maintainability and stability are good, and it has broad application prospects for promotion. Description of the Drawings

[0032] By reading the detailed description of the preferred embodiments below, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present utility model.

[0033] In the accompanying drawings:

[0034] Figure 1 is a schematic diagram of the 3D-TOF imaging system architecture based on Arm Cortex-M7 of the present utility model;

[0035] Figure 2 is a schematic diagram of the principle of the 3D-TOF imaging system architecture based on Arm Cortex-M7 of the embodiment of the present utility model;

[0036] Figure 3 is a schematic diagram of the principle of the power management architecture of the embodiment of the present utility model;

[0037] Figure 4 is a schematic diagram of the architecture connection principle of the imaging chip epc660, the MCU main control chip Arm Cortex_M7, and the SDRAM memory of the embodiment of the present utility model;

[0038] Figure 5 is a schematic diagram of the architecture connection principle of the low-power Bluetooth BLE chip and the lighting system of the embodiment of the present utility model. Detailed implementation manners

[0039] Here, exemplary embodiments will be described in detail, and the examples are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present disclosure. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0040] The terms used in the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The singular forms "a", "the", and "said" used in the present disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0041] It should be understood that although the terms first, second, and third may be used in the present disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present disclosure, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "when" or "while" or "in response to determining".

[0042] Embodiment

[0043] The embodiment of the utility model provides a 3D-TOF imaging system based on Arm Cortex-M7, as shown in Figure 1 , 2 shown.

[0044] Connect the power supply system to the sensor system, imaging chip epc660, MCU main control chip Arm Cortex_M7, and low-power Bluetooth BLE chip respectively; connect the MCU main control chip Arm Cortex_M7 and low-power Bluetooth BLE chip to the SDRAM memory (as shown in Figure 4 shown);

[0045] Set the power supply system to three power supplies: main power supply, solar charging power supply, and 5200mAh rechargeable lithium manganese battery; in this embodiment, by adopting three power supplies, even under the condition of lacking the main power supply, the system can be powered separately by the 5200mAh rechargeable lithium manganese battery, or the solar charging power supply can power the system and charge the 5200mAh rechargeable lithium manganese battery, realizing the use of clean energy and reducing carbon dioxide emissions.

[0046] Connect the low-power Bluetooth BLE chip to the battery management chip through the I2C integrated circuit bus, and connect the main power supply (DC_IN 5-12V), solar charging power supply (SOLAR 9v), and battery (BATTERY 3.7V_5200mAh) to the battery management chip (POWER), as Figure 2 shown. As Figure 3 shown, use the low-power Bluetooth BLE chip (Nordic) to judge and select the main power supply and the battery power supply of the battery management chip through the I2C integrated circuit bus, control the battery charging, and output a system voltage of 4.5V (main power supply) or 4.2V (battery), improving the power utilization efficiency;

[0047] Connect the low-dropout linear regulator (LDO) chip to the battery management chip, and connect the buck DCDC chip to the battery management chip; connect the buck-boost DCDC chip to the imaging chip epc660; use the LDO (low-dropout linear regulator) to step down the system voltage to 3.3V for the 3D acceleration sensor, ambient light sensor, temperature and humidity sensor, and Bluetooth to use; use the buck DCDC chip to step down the system voltage to 5.3V, and generate ±10V voltage through the buck-boost DCDC power chip to supply power to the imaging chip epc660, and convert the 5.3V voltage into 3.3V voltage to supply power to the MCU main control chip Arm Cortex_M7 and the memory SDRAM; each of the low-dropout linear regulator LDO chip, buck DCDC chip, and buck-boost DCDC chip has an enable pin, and through the enable of the MCU, a low-power mode and a low-power sleep state of powering off when not in use are achieved.

[0048] Connect the image sensor to the imaging chip epc660; connect the acceleration sensor and the temperature and humidity sensor to the MCU main control chip Arm Cortex_M7 and the low-power Bluetooth BLE chip respectively through the I2C integrated circuit bus. As Figure 4 shown, the acceleration sensor and the temperature and humidity sensor transmit the collected environmental information data to the MCU main control chip Arm Cortex_M7 and the low-power Bluetooth BLE chip through the I2C integrated circuit bus; the imaging chip epc660 performs sleep settings in specific cases where image acquisition is not required to achieve low power consumption, thereby extending the battery life, and transmits information to the terminal for use through the Bluetooth device, and the user can monitor the camera information at any time.

[0049] Transmit and control data between the MCU main control chip Arm Cortex_M7 and the imaging chip epc660 through the DDR high-speed signal, and read the stored content from the imaging chip epc660 through the I2C integrated circuit bus; the imaging chip epc660 includes three working modes: illumination modulation mode, distance measurement mode, and non-distance measurement mode, to achieve low-power operation in different environments.

[0050] In the actual application of this embodiment, under normal use conditions, the MCU main control chip Arm Cortex_M7 performs shooting in various scenarios through data communication with the imaging chip epc660, and performs compensation through the illumination compensator of the lighting system according to the distance, light intensity, etc., and can perform wireless transmission through the low-power Bluetooth BLE chip (Nordic), as Figure 5 shown, to obtain the current environmental status and portrait acquisition information; in the sleep state, the system is in a low-power state, and the acceleration sensor and other sensors are also in a low-power mode and not in a shutdown state.

[0051] Connect the ambient light sensor of the lighting system to the MCU main control chip Arm Cortex_M7. According to the intensity of the ambient light, the MCU main control chip Arm Cortex_M7 controls the voltage of the lighting lamp, realizing the change of the light intensity, so as to meet the lighting adjustment under different ambient lights; through the imaging glass chip set inside the lighting compensator, high-definition and smooth imaging are realized.

[0052] Connect the USB interface and JTAG interface to the MCU main control chip Arm Cortex_M7; connect the 3.3V serial port to the low-power Bluetooth BLE chip. Debug the MCU main control chip Arm Cortex_M7 through the USB interface and download software using JTAG, which is safe and stable. In this embodiment, the USB interface is compatible with various types such as USB2.0 and USB3.0. The BLE chip is debugged using the serial port 3.3V and software is downloaded using the JTAG interface; it is paired with the antenna tuning chip of Nordic for antenna tuning to achieve the best performance such as strong power and long signal propagation distance.

[0053] Connect the temperature and humidity sensor to the battery management chip. Use the temperature and humidity sensor to monitor the ambient temperature and humidity and the charging temperature. When the ambient temperature is higher than 45°C, charging is not allowed. When the ambient temperature is lower than 45°C, charging resumes. When the temperature is higher than 85°C, the imaging system actively enters the power-off and non-working mode to protect the imaging system and the device, improving the reliability and lifespan of the device. When the ambient temperature changes, the MCU main control chip Arm Cortex_M7 transmits the data change information to the low-power Bluetooth BLE chip, and the low-power Bluetooth BLE chip sends the data change information to the user terminal for viewing and maintenance, enabling the imaging to meet the high-definition timeliness requirements.

[0054] Fix and connect the 3D-TOF imaging system to the corresponding usage area through 4 fixed connection holes set on the housing using 4 screws, which greatly improves the convenience of use. The installation operation is simple, and it can also monitor movement. The acceleration sensor can dynamically adjust the camera state and machine performance under moving or static conditions. Connect the required load through the reserved load power interface, thereby realizing more abundant product functions and application forms.

[0055] A preferred application example of the 3D-TOF imaging system in this embodiment is applied to the scenario of real-time detection of the environment through Internet of Things control, which can be charged for use, has a simple operation, and has advantages such as high performance, high speed, high efficiency, and long lifespan.

[0056] The structure of the 3D-TOF imaging system in this embodiment is fully enclosed, achieving IP67-level waterproof, dustproof, and anti-static properties, with a service life of up to 10 years. Based on excellent chip processing performance, the usage time of the device is effectively extended, and the power supply environment can be adjusted according to requirements, with high reliability, suitable for most high and low temperature and global usage scenarios. Moreover, according to the user's usage requirements, the transmission rate and access dynamics can be customized. The transmission rate can reach at least 600 MHz, and different power supply environments can be applied according to the user's status.

[0057] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of the present invention.

[0058] The above are only the preferred embodiments of the present invention and are not used to limit the present invention; for those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent substitution, or improvement made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. 3D-TOF imaging system based on Arm Cortex-M7, characterized in that Including: A sensor system, an imaging chip epc660, a power supply system, an MCU main control chip Arm Cortex_M7, a low-power Bluetooth BLE chip, and an SDRAM memory; the power supply system is electrically connected to the sensor system, the imaging chip epc660, the MCU main control chip Arm Cortex_M7, and the low-power Bluetooth BLE chip respectively; the MCU main control chip Arm Cortex_M7 and the low-power Bluetooth BLE chip are respectively signal-connected to the SDRAM memory.

2. The 3D-TOF imaging system based on Arm Cortex-M7 according to claim 1, wherein The sensor system includes: an image sensor, an acceleration sensor, and a temperature and humidity sensor; the image sensor is signal-connected to the imaging chip epc660; the acceleration sensor and the temperature and humidity sensor are respectively signal-connected to the MCU main control chip Arm Cortex_M7 and the low-power Bluetooth BLE chip through an I2C integrated circuit bus.

3. The 3D-TOF imaging system based on Arm Cortex-M7 according to claim 1, wherein The 3D-TOF imaging system further includes: a battery management chip, the low-power Bluetooth BLE chip is signal-connected to the battery management chip through an I2C integrated circuit bus, and the battery management chip is electrically connected to the power supply system.

4. The 3D-TOF imaging system based on Arm Cortex-M7 according to claim 3, characterized in that, The 3D-TOF imaging system further includes: a low-dropout linear regulator LDO chip, a buck DCDC chip, and a buck-boost DCDC chip; the low-dropout linear regulator LDO chip is electrically connected to the battery management chip, the buck DCDC chip is electrically connected to the battery management chip; the buck-boost DCDC chip is electrically connected to the imaging chip epc660.

5. The 3D-TOF imaging system based on Arm Cortex-M7 according to claim 1, characterized in that, The 3D-TOF imaging system is configured with an illumination system adjustable according to ambient light, and the illumination system includes two paths: one path is an ambient light sensor, and the ambient light sensor is signal-connected to the MCU main control chip Arm Cortex_M7; the other path is an illumination compensator, and an imaging glass chip is provided inside the illumination compensator.

6. The 3D-TOF imaging system based on Arm Cortex-M7 according to claim 1, characterized in that, The 3D-TOF imaging system is configured with a USB interface, a JTAG interface, and a 3.3V serial port. The USB interface and the JTAG interface are both electrically connected to the MCU main control chip Arm Cortex_M7; the 3.3V serial port is electrically connected to the low-power Bluetooth BLE chip.

7. The 3D-TOF imaging system based on Arm Cortex-M7 according to claim 1, wherein The power supply system uses a 5200mAh rechargeable lithium manganese battery.

8. The 3D-TOF imaging system based on Arm Cortex-M7 according to claim 1, wherein The 3D-TOF imaging system is reserved with a load power interface, and the load power interface is connected to the required load according to actual needs.

9. The 3D-TOF imaging system based on Arm Cortex-M7 according to claim 2, wherein The outside of the 3D-TOF imaging system is provided with a housing, and the structure of the housing is completely airtight.

10. The 3D-TOF imaging system based on Arm Cortex-M7 according to claim 9, wherein, A plurality of fixed connection holes are provided on the housing, and the 3D-TOF imaging system is fixedly connected to the corresponding use area through a plurality of screws.

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