Die bonding device of chip back cavity structure

Abstract

The utility model relates to the technical field of chip die bonding, in particular to a die bonding device of a chip back cavity structure, which comprises a working table, a slot is arranged in the working table, a first limiting assembly is arranged in the slot, a placing cavity is arranged at the top of the working table, a second limiting assembly is arranged in the placing cavity, and the second limiting assembly is arranged in the second limiting assembly. A first mechanical arm is arranged on one side of the open groove, a second mechanical arm is arranged on one side of the first mechanical arm, a suction cup assembly is arranged on one side of the second mechanical arm, a glue dripping assembly is arranged on the other side of the open groove, a first CCD photographing assembly is arranged on the top of the workbench, and the workbench is connected with a pressing table. A pressing assembly is arranged at the top of the pressing table, a conveying assembly is arranged in the pressing table, and by means of the structure of the suction cup assembly, the glue dripping assembly, the CCD photographing assembly and the pressing assembly, the problems that when the device is used for die bonding, response is slow through reciprocating of a lead screw, glue dripping and chip suction, and the overall die bonding efficiency can be higher are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip die bonding, in particular to a die bonding device for a chip back cavity structure. Background Technique

[0002] Die bonding equipment generally consists of a workbench, a chip positioning mechanism, a die bonding material coating system, a heating and cooling system, a detection and correction mechanism, and a packaging structure, etc. These parts work together to complete the die bonding process of the chip. During the die bonding process, the chip is first accurately placed in the back cavity on the substrate. Then, the die bonding material is coated on the contact surface between the chip and the substrate and cured by heating or pressure. During the curing process, the equipment will monitor the position and posture of the chip in real time and perform necessary corrections. Finally, after the chip is fixed and qualified in detection, packaging treatment is carried out to protect the chip.

[0003] Moreover, in the application document with the publication number CN219873411U, a fully automatic die bonding device applicable to multi-size chips is mentioned. Through the settings of 1. the drip nozzle, peristaltic pump, suction cup, first electric telescopic rod, second electric telescopic rod, and third electric telescopic rod in this utility model device, under the action of the peristaltic pump, glue is dripped onto the chip board through the drip nozzle. The first electric telescopic rod drives the drip nozzle to lift and can accurately drip the glue onto the chip board. The second electric telescopic rod drives the suction cup to lift. Under the combined action of the second electric telescopic rod and the suction cup, the chip can be first sucked and then placed on the chip board after dripping glue to realize chip die bonding. Under the action of the third electric telescopic rod, the second mounting bracket is driven to move to adjust the distance between the two suction cups, and die bonding processing of multi-size chips can be realized. Through the settings of the first fixing bracket, second fixing bracket, guide rod, and spring in this utility model device, the first fixing bracket and the second fixing bracket are connected as a whole through the guide rod. The spring can apply a pulling force towards the first fixing bracket to the second fixing bracket. Under the action of the pulling force, the first fixing bracket and the second fixing bracket can be tightly attached to both ends of the chip board respectively, and different-size chip boards can be quickly clamped and fixed, and die bonding processing of multi-size chips can be realized. However, there are still certain defects that need to be optimized. The specific defects are as follows: When die bonding with this device, the screw rod reciprocates, and the responses of dripping glue and sucking the chip are relatively slow, and the overall die bonding efficiency can be higher.

[0004] Therefore, it is particularly important to design a die bonding device for a chip back cavity structure to change the above technical defects and improve the overall practicability. Content of the Utility Model

[0005] The purpose of the utility model is to provide a die bonding device for a chip back cavity structure to solve the problems put forward in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solutions:

[0007] A die bonding device for a chip back cavity structure, comprising a workbench. A slot is provided inside the workbench, and a first limiting component is provided inside the slot. A placement cavity is provided on the top of the workbench, and a second limiting component is provided inside the placement cavity. A first robotic arm is provided on one side of the slot, a second robotic arm is provided on one side of the first robotic arm, a suction cup component is provided on one side of the second robotic arm, a glue dripping component is provided on the other side of the slot, a first CCD camera component is provided on the top of the workbench, the workbench is connected to a pressing table, a pressing component is provided on the top of the pressing table, and a conveying component is provided inside the pressing table.

[0008] As a preferred solution of the present utility model, the first limiting component includes a first electric push rod, a first pressure sensor, and a first push plate. The output end of the first electric push rod is fixedly connected to the first push plate, and the first pressure sensor is provided on the first push plate. The second limiting component includes two symmetrically arranged second electric push rods, a second pressure sensor, and a second push plate. The output end of the second electric push rod is fixedly connected to the second push plate, and the second pressure sensor is provided on the second push plate. Buffer pads are provided on both the first push plate and the second push plate.

[0009] As a preferred solution of the present utility model, the suction cup component includes a support block, an electric push rod, a fixing plate, a sliding table type cylinder, a first connecting block, and an electric vacuum suction cup. One end of the electric push rod is fixedly connected to the support block, the first connecting block is fixedly connected to the output end of the sliding table type cylinder, the electric vacuum suction cup is provided at the bottom end of the first connecting block, the fixing plate is bolted to the sliding table type cylinder, the output end of the electric push rod is fixedly connected to the fixing plate, and a displacement sensor is provided on the first connecting block.

[0010] As a preferred solution of the present utility model, the glue dripping component includes a fixing block, a fixing box, a first lead screw, a first lead screw nut, a glue storage box, an infusion tube, a first electric telescopic rod, a second electric telescopic rod, a second connecting block, a glue spraying cylinder, and a peristaltic pump. The first electric telescopic rod is fixedly connected to the first lead screw nut, the output end of the first electric telescopic rod is provided with a second connecting block, the bottom end of the second connecting block is provided with a second electric telescopic rod, the output end of the second electric telescopic rod is provided with a glue spraying cylinder, the liquid inlet of the peristaltic pump is connected to the liquid outlet of the glue storage box, the liquid outlet of the peristaltic pump is connected to the liquid inlet of the infusion tube, the liquid outlet of the infusion tube is connected to the glue spraying cylinder, and a laser distance sensor is provided on the glue spraying cylinder.

[0011] As a preferred solution of the present utility model, the pressing assembly includes a third electric telescopic rod, a sliding sleeve, a guide rail, a fourth electric telescopic rod, a fifth electric telescopic rod, a pressing block, a third connecting block, and a second CCD photographing assembly. The output end of the third electric telescopic rod is fixedly connected to the sliding sleeve. The guide rail is slidably connected to the sliding sleeve. One side surface of the sliding sleeve is fixedly connected to the fourth electric telescopic rod. The output end of the fourth electric telescopic rod is fixedly connected to the third connecting block. A fourth electric telescopic rod is provided at the bottom end of the third connecting block. The output end of the fourth electric telescopic rod is fixedly connected to the pressing block. The second CCD photographing assembly is fixedly connected to the workbench.

[0012] As a preferred solution of the present utility model, the conveying assembly includes a sixth electric telescopic rod, a support plate, a second lead screw, a second lead screw nut, a gripper robotic arm, a seventh electric telescopic rod, and a pressure receiving plate. The cross-sectional area of the support plate in the horizontal direction matches the cross-sectional area of the slot in the horizontal direction. The output end of the sixth electric telescopic rod is fixedly connected to the support plate. The second lead screw is arranged along the length direction of the pressing table. The output end of the seventh electric telescopic rod is fixedly connected to the pressure receiving plate. The pressure receiving plate is arranged at one end far from the workbench.

[0013] As a preferred solution of the present utility model, one end of the pressing table penetrates through the workbench and abuts against the slot.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] 1. In the present utility model, a die bonding device with a chip back cavity structure is provided. By using the structures of the suction cup assembly, the dispensing assembly, the CCD photographing assembly, and the pressing assembly, precise positioning, dispensing, and pressing are achieved through the cooperation of each set of components, ensuring firm die bonding. The integrated pressure sensor and buffer pad protect the chip from damage. At the same time, the high-efficiency conveying and continuous operation capabilities significantly improve the production efficiency and are applicable to various chip packaging requirements. After the chip and the substrate are respectively placed by the robotic arm, the limiting assembly initially fixes them, the CCD precisely positions them, the dispensing assembly precisely controls the glue, the suction cup assembly precisely grabs and places the chip. Subsequently, the conveying assembly sends the substrate to the pressure receiving plate. After the CCD confirms the position, the pressing assembly firmly presses the chip. At the same time, the robotic arm can continue to grab new materials, improving the overall efficiency and solving the problem that the die bonding efficiency of the device is relatively slow when the lead screw reciprocates during die bonding, dispensing, and chip suction, and the overall die bonding efficiency can be more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is the overall structural diagram of the present utility model;

[0017] Figure 2 is the schematic diagram of the suction cup assembly of the present utility model;

[0018] Figure 3 Schematic diagram of the glue - dropping component of the present utility model;

[0019] Figure 4 Schematic diagram of the pressing component of the present utility model;

[0020] Figure 5 Partial schematic diagram of the conveying component of the present utility model.

[0021] In the figure: 1, workbench; 101, slot; 102, first limiting component; 103, placement cavity; 104, second limiting component; 105, first robotic arm; 106, second robotic arm; 107, pressing table; 2, suction cup component; 201, support block; 203, fixing plate; 204, sliding - table cylinder; 205, first connecting block; 206, electric vacuum suction cup; 3, glue - dropping component; 301, fixing block; 302, fixing box; 303, glue storage box; 304, infusion tube; 305, first electric telescopic rod; 306, second electric telescopic rod; 307, second connecting block; 308, glue - spraying cylinder; 4, first CCD photographing component; 5, pressing component; 501, third electric telescopic rod; 502, sliding sleeve; 503, guide rail; 504, fourth electric telescopic rod; 505, fifth electric telescopic rod; 506, pressing block; 507, third connecting block; 6, conveying component; 601, sixth electric telescopic rod; 602, support plate; 603, pressure - receiving plate. Specific embodiments

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present utility model are given. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present utility model more thorough and comprehensive.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this utility model belongs. The terms used herein in the specification of this utility model are only for the purpose of describing specific embodiments and are not intended to limit this utility model. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items.

[0026] For the embodiments, please refer to Figures 1-5 , this utility model provides a technical solution:

[0027] A die bonding device for a chip back cavity structure, comprising a workbench 1. Inside the workbench 1, there is a slot 101. Inside the slot 101, there is a first limiting component 102. On the top of the workbench 1, there is a placement cavity 103. Inside the placement cavity 103, there is a second limiting component 104. On one side of the slot 101, there is a first robotic arm 105. On one side of the first robotic arm 105, there is a second robotic arm 106. On one side of the second robotic arm 106, there is a suction cup component 2. On the other side of the slot 101, there is a glue dispensing component 3. On the top of the workbench 1, there is a first CCD camera component 4. The workbench 1 is connected to a pressing table 107. On the top of the pressing table 107, there is a pressing component 5. Inside the pressing table 107, there is a conveying component 6. The chip is placed in the placement cavity of the workbench 1 by the second robotic arm. At the same time, the substrate is placed on the support plate 602 by the first robotic arm. Subsequently, the second electric push rod and the buffer pad in the second limiting component 104 initially fix the chip to prevent it from moving. At the same time, the first electric push rod in the first limiting component 102 drives the first push plate to fix the substrate to prevent it from moving. Then, the first CCD camera component 4 precisely locates the positions of the chip and the substrate. Subsequently, the glue dispensing component 3 precisely controls the amount of glue through a peristaltic pump, and through the flexible adjustment of the first and second electric telescopic rods, ensures that the glue spraying cylinder 308 releases glue at the accurate position, that is, the chip groove position on the substrate. Then, the electric vacuum suction cup 206 in the suction cup component 2 precisely grabs the chip and moves it above the chip groove under the coordinated action of the electric push rod and the slide table type cylinder 204. After that, the chip is placed at the predetermined position, that is, inside the chip groove on the substrate. Subsequently, the conveying component 6 is started, the sixth electric telescopic rod 601 moves downward, and at the same time, the gripper robotic arm and the seventh electric telescopic rod cooperate to grab the substrate. Then, the second lead screw drives the support plate 602 to move along the second lead screw, and conveys the substrate to the top of the pressure receiving plate 603. At this time, the second CCD camera component works. Although it is mainly used for positioning, it can also be used here to monitor the final position confirmation before pressing. Finally, the third and fourth electric telescopic rods of the pressing component 5 cooperate to work, so that the pressing block 506 firmly presses the chip to ensure the firmness of die bonding;

[0028] Among them, the first limiting component 102 includes a first electric push rod, a first pressure sensor, and a first push plate. The output end of the first electric push rod is fixedly connected to the first push plate, and the first pressure sensor is provided on the first push plate. The second limiting component 104 includes two symmetrically arranged second electric push rods, a second pressure sensor, and a second push plate. The output end of the second electric push rod is fixedly connected to the second push plate, and the second pressure sensor is arranged on the second push plate. Buffer pads are provided on both the first push plate and the second push plate. By combining the electric push rod and the pressure sensor, precise control of the pressure during the die bonding process of the chip back cavity structure is achieved, effectively preventing problems such as overpressure damage and underpressure instability. The setting of the buffer pads further enhances the comprehensiveness of protection and ensures the smooth progress of the die bonding operation. The suction cup assembly 2 includes a support block 201, an electric push rod, a fixing plate 203, a slide table type cylinder 204, a first connecting block 205, and an electric vacuum suction cup 206. One end of the electric push rod is fixedly connected to the support block 201. The first connecting block 205 is fixedly connected to the output end of the slide table type cylinder 204. The electric vacuum suction cup 206 is arranged at the bottom end of the first connecting block 205. The fixing plate 203 is bolted to the slide table type cylinder 204. The output end of the electric push rod is fixedly connected to the fixing plate 203. A displacement sensor is provided on the first connecting block 205. By utilizing the linkage of the electric push rod and the slide table type cylinder, combined with the electric vacuum suction cup, the grasping and smooth movement of the chip are realized. The addition of the displacement sensor improves the positioning accuracy and ensures the accuracy of the die bonding position. The glue dropping assembly 3 includes a fixed block 301, a fixed box 302, a first lead screw, a first lead screw nut, a glue storage box 303, an infusion tube 304, a first electric telescopic rod 305, a second electric telescopic rod 306, a second connecting block 307, a glue spraying cylinder 308, and a peristaltic pump. The first electric telescopic rod 305 is fixedly connected to the first lead screw nut. The output end of the first electric telescopic rod 305 is provided with a second connecting block 307. The bottom end of the second connecting block 307 is provided with a second electric telescopic rod 306. The output end of the second electric telescopic rod 306 is provided with a glue spraying cylinder 308. The liquid inlet of the peristaltic pump is connected to the liquid outlet of the glue storage box 303. The liquid outlet of the peristaltic pump is connected to the liquid inlet of the infusion tube 304. The liquid outlet of the infusion tube 304 is connected to the glue spraying cylinder 308. A laser distance sensor is provided on the glue spraying cylinder 308. By flexibly adjusting the first and second electric telescopic rods, combined with the application of the peristaltic pump and the laser distance sensor, precise control of the glue amount and accurate positioning of the glue dropping position are achieved, improving the firmness of die bonding and production efficiency. The pressing component 5 includes a third electric telescopic rod 501, a sliding sleeve 502, a guide rail 503, a fourth electric telescopic rod 504, a fifth electric telescopic rod 505, a pressing block 506, a third connecting block 507, and a second CCD camera component. The output end of the third electric telescopic rod 501 is fixedly connected to the sliding sleeve 502. The guide rail 503 is slidably connected to the sliding sleeve 502.One side of the sliding sleeve 502 is fixedly connected to the fourth electric telescopic rod 504. The output end of the fourth electric telescopic rod 504 is fixedly connected to the third connecting block 507. The bottom end of the third connecting block 507 is provided with the fourth electric telescopic rod 504. The output end of the fourth electric telescopic rod 504 is fixedly connected to the pressing block 506. The second CCD photographing assembly is fixedly connected to the workbench 1. Integrating the third and fourth electric telescopic rods, combining the pressing block and the second CCD photographing assembly, not only realizes the stable pressing of the chip, but also ensures the double guarantee of the pressing effect and quality through real-time photographing and monitoring. The conveying assembly 6 includes the sixth electric telescopic rod 601, the support plate 602, the second lead screw, the second lead screw nut, the gripper robotic arm, the seventh electric telescopic rod, and the pressure receiving plate 603. The cross-sectional area of the support plate 602 in the horizontal direction fits the cross-sectional area of the slot 101 in the horizontal direction, and the output end of the sixth electric telescopic rod 601 is fixedly connected to the support plate 602. The second lead screw is arranged along the length direction of the pressing table 107. The output end of the seventh electric telescopic rod is fixedly connected to the pressure receiving plate 603. The position of the pressure receiving plate 603 is set at one end away from the workbench 1. One end of the pressing table 107 penetrates through the workbench 1 and abuts against the slot 101. The combination of the sixth electric telescopic rod and the support plate, cooperating with the second lead screw, the seventh electric telescopic rod and the gripper robotic arm, realizes the efficient conveying and stable fixation of the chip from the workbench to the pressing table, improving the automation and efficiency of the overall operation process.,

[0029] The working process of the present utility model: When using the die bonding device with the chip back cavity structure, first, the chip is placed in the placement cavity of the workbench 1 through the second robotic arm 106, and the substrate is placed on the support plate 602 through the first robotic arm 105. Subsequently, the chip is preliminarily fixed by the second electric push rod and the buffer pad in the second limiting component 104. At the same time, the first electric push rod drives the first push plate to fix the substrate to prevent it from moving. Then, the first CCD photographing component 4 accurately locates the positions of the chip and the substrate. Subsequently, the dispensing component 3 precisely controls the amount of glue through a peristaltic pump, and flexibly adjusts through the first and second electric telescopic rods to ensure that the glue spraying cylinder 308 releases glue at the accurate position, i.e., the chip groove position on the substrate. Then, the electric vacuum suction cup 206 in the suction cup component 2 precisely grabs the chip and moves it above the chip groove under the coordinated action of the electric push rod and the slide table type cylinder 204. After that, the chip is placed at the predetermined position. Subsequently, the conveying component 6 is activated, the sixth electric telescopic rod 601 moves downward, and at the same time, the gripping robotic arm and the seventh electric telescopic rod cooperate to grip the substrate. Then, the second lead screw drives the second lead screw nut to displace, and conveys the substrate to the top of the pressure receiving plate 603. At the same time, the second CCD photographing component works to measure the position of the chip. The third and fourth electric telescopic rods of the pressing component 5 cooperate to work, so that the pressing block 506 firmly presses the chip. At the same time, while the pressing component 5 is working, the first robotic arm 105 and the second robotic arm 106 can grab new substrates and chips and place them again, improving the overall efficiency.

[0030] The standard parts used in this application document can all be purchased from the market. The specific connection methods of each part all adopt conventional means such as bolts, rivets, and welding that are mature in the prior art. The machines, parts, and equipment all adopt conventional models in the prior art. The control method is controlled by a controller, and the control circuit of the controller can be realized by simple circuit connection by those skilled in the art, which belongs to the common general knowledge in this field. Therefore, the control method and circuit connection will not be explained in detail in this application document.

[0031] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A die bonding device for a chip back cavity structure, comprising a workbench (1), characterized in that: The interior of the workbench (1) is provided with a slot (101). Inside the slot (101), a first limiting component (102) is provided. The top of the workbench (1) is provided with a placement cavity (103). Inside the placement cavity (103), a second limiting component (104) is provided. One side of the slot (101) is provided with a first robotic arm (105). One side of the first robotic arm (105) is provided with a second robotic arm (106). One side of the second robotic arm (106) is provided with a suction cup assembly (2). The other side of the slot (101) is provided with a glue dripping assembly (3). The top of the workbench (1) is provided with a first CCD camera assembly (4). The workbench (1) is connected to a pressing table (107). The top of the pressing table (107) is provided with a pressing component (5). Inside the pressing table (107), a conveying component (6) is provided.

2. The die bonding device for a chip back cavity structure according to claim 1, wherein: The first limiting component (102) includes a first electric push rod, a first pressure sensor, and a first push plate. The output end of the first electric push rod is fixedly connected to the first push plate. The first pressure sensor is arranged on the first push plate. The second limiting component (104) includes two symmetrically arranged second electric push rods, a second pressure sensor, and a second push plate. The output end of the second electric push rod is fixedly connected to the second push plate. The second pressure sensor is arranged on the second push plate. Buffer pads are arranged on both the first push plate and the second push plate.

3. The die bonding device for a chip back cavity structure according to claim 1, characterized in that: The suction cup assembly (2) includes a support block (201), an electric push rod, a fixing plate (203), a slide table type cylinder (204), a first connecting block (205), and an electric vacuum suction cup (206). One end of the electric push rod is fixedly connected to the support block (201). The first connecting block (205) is fixedly connected to the output end of the slide table type cylinder (204). The electric vacuum suction cup (206) is arranged at the bottom end of the first connecting block (205). The fixing plate (203) is bolted to the slide table type cylinder (204). The output end of the electric push rod is fixedly connected to the fixing plate (203). A displacement sensor is arranged on the first connecting block (205).

4. The die bonding device for a chip back cavity structure according to claim 1, wherein: The epoxy resin dripping assembly (3) includes a fixed block (301), a fixed box (302), a first lead screw, a first lead screw nut, a glue storage box (303), an infusion tube (304), a first electric telescopic rod (305), a second electric telescopic rod (306), a second connecting block (307), a glue spraying cylinder (308), and a peristaltic pump. The first electric telescopic rod (305) is fixedly connected to the first lead screw nut. The output end of the first electric telescopic rod (305) is provided with a second connecting block (307). The bottom end of the second connecting block (307) is provided with a second electric telescopic rod (306). The output end of the second electric telescopic rod (306) is provided with a glue spraying cylinder (308). The liquid inlet of the peristaltic pump is connected to the liquid outlet of the glue storage box (303). The liquid outlet of the peristaltic pump is connected to the liquid inlet of the infusion tube (304). The liquid outlet of the infusion tube (304) is connected to the glue spraying cylinder (308). A laser distance sensor is provided on the glue spraying cylinder (308).

5. The die bonding device for a chip back cavity structure according to claim 1, characterized in that: The pressing assembly (5) includes a third electric telescopic rod (501), a sliding sleeve (502), a guide rail (503), a fourth electric telescopic rod (504), a fifth electric telescopic rod (505), a pressing block (506), a third connecting block (507), and a second CCD photographing assembly. The output end of the third electric telescopic rod (501) is fixedly connected to the sliding sleeve (502). The guide rail (503) is slidably connected to the sliding sleeve (502). One side surface of the sliding sleeve (502) is fixedly connected to the fourth electric telescopic rod (504). The output end of the fourth electric telescopic rod (504) is fixedly connected to the third connecting block (507). The bottom end of the third connecting block (507) is provided with a fourth electric telescopic rod (504). The output end of the fourth electric telescopic rod (504) is fixedly connected to the pressing block (506). The second CCD photographing assembly is fixedly connected to the workbench (1).

6. The die bonding device for a chip back cavity structure according to claim 1, characterized in that: The conveying assembly (6) includes a sixth electric telescopic rod (601), a support plate (602), a second lead screw, a second lead screw nut, a gripper robotic arm, a seventh electric telescopic rod, and a pressure receiving plate (603). The transverse cross-sectional area of the support plate (602) fits the transverse cross-sectional area of the slot (101). The output end of the sixth electric telescopic rod (601) is fixedly connected to the support plate (602). The second lead screw is arranged along the length direction of the pressing table (107). The output end of the seventh electric telescopic rod is fixedly connected to the pressure receiving plate (603). The pressure receiving plate (603) is arranged at one end far from the workbench (1).

7. The die bonding device for a chip back cavity structure according to claim 1, characterized in that: One end of the pressing table (107) penetrates through the workbench (1) and abuts against the slot (101).

Images