SMT patch reflow soldering machine

Abstract

The utility model relates to the field of reflow soldering machines, and discloses an SMT (Surface Mount Technology) patch reflow soldering machine which comprises a base and a conveying belt, the top of the base is fixedly connected with a purification box and a cooling box, the top of the purification box is fixedly connected with a purification box, the top of the purification box is fixedly connected with an air pump, the output end of the air pump is fixedly connected with an exhaust pipe, and the exhaust pipe is fixedly connected with the conveying belt. A first filter plate is slidably connected to the middle of the purification box, a mechanical arm is fixedly connected to the middle of the purification box, a sleeve shell is fixedly connected to one side of the purification box, a second moving plate is slidably connected to the interior of the sleeve shell, and a first moving plate is rotatably connected to one side of the second moving plate. According to the air purifier disclosed by the utility model, under the mutual cooperation of the air pump, the button, the connecting rod, the movable plate I, the clamping block, the spring II, the telescopic rod II, the clamping block and the like, the filter plate I and the purification box can be conveniently separated, and further the filter plate I can be conveniently replaced or cleaned.

Description

Technical Field

[0001] The utility model relates to the field of reflow soldering machines, in particular to an SMT patch reflow soldering machine. Background Technique

[0002] During the production process of circuit boards, each patch component is assembled by surface mount technology. First, a solder paste is scraped onto the pin holes and welding parts of a PCB board by a printing machine; then, a mounter presses the patch components onto the corresponding welding positions of the PCB to fit with the solder paste; finally, the PCB board with components is sent into a reflow soldering machine for soldering.

[0003] Existing reflow soldering machines have certain drawbacks during use. These problems not only affect production efficiency but also pose threats to the environment and the safety of operators. First, during the soldering process, the reflow soldering machine generates a certain amount of welding exhaust gas, which contains harmful chemical components such as volatile organic compounds and solder fumes. When these exhaust gases are discharged into the air, they will pollute the environment, affect air quality, and pose potential hazards to the health of the surrounding environment and people. In addition, after the soldering is completed on the existing reflow soldering machine, the PCB board usually remains at a high temperature. When the PCB board is conveyed out of the machine, if no appropriate cooling measures or protection means are taken, operators are likely to be scalded when handling these high-temperature PCB boards, presenting significant safety hazards. Content of the Utility Model

[0004] To make up for the above deficiencies, the utility model provides an SMT patch reflow soldering machine, aiming to improve the problem in the prior art that the exhaust gas generated during soldering cannot be purified, resulting in environmental pollution and air quality deterioration when the exhaust gas is discharged into the air.

[0005] To achieve the above object, the utility model adopts the following technical solutions:

[0006] SMT chip reflow soldering machine, including a base and a conveyor belt. A purification box and a cooling box are fixedly connected to the top of the base. A purification box is fixedly connected to the top of the purification box. An air pump is fixedly connected to the top of the purification box. An exhaust pipe is fixedly connected to the output end of the air pump. A filter plate one is slidably connected to the middle of the purification box. A robotic arm is fixedly connected to the middle of the purification box. A sleeve is fixedly connected to one side of the purification box. A moving plate two is slidably connected to the inside of the sleeve. A moving plate one is rotatably connected to one side of the moving plate two. A clamping block is rotatably connected to the end of the moving plate one away from the moving plate two. A spring two and a telescopic rod two are fixedly connected to one side of the clamping block. A clamping groove is opened at the top of the filter plate one. The clamping groove is clamped with the clamping block. A connecting component is arranged on the side of the moving plate two away from the moving plate one. The connecting component is used to drive the moving plate two to move;

[0007] As a further description of the above technical solution:

[0008] The connecting component includes a connecting rod. The connecting rod is fixedly connected to one side of the moving plate two. A button is fixedly connected to the end of the connecting rod away from the moving plate two;

[0009] As a further description of the above technical solution:

[0010] A fixed pipe is fixedly connected to the top of the cooling box. A fixed rod and a filter plate two are fixedly connected to the middle of the fixed pipe. A double-headed motor is fixedly connected to the end of the fixed rod away from the fixed pipe. A fan is fixedly connected to one output end of the double-headed motor. A rotating rod is fixedly connected to the other output end of the double-headed motor. A movable plate is fixedly connected to the outer circumference of the rotating rod. A cleaning component is arranged at the bottom of the movable plate. The cleaning component is used to clean the surface of the filter plate two;

[0011] As a further description of the above technical solution:

[0012] The cleaning component includes a telescopic rod one. The telescopic rod one is fixedly connected to the bottom of the movable plate. A scraper is fixedly connected to the end of the telescopic rod one away from the movable plate. A spring one is fixedly connected to the top of the scraper. The end of the spring one away from the scraper is fixedly connected to the bottom of the movable plate;

[0013] As a further description of the above technical solution:

[0014] A support rod is fixedly connected to the top of the cooling box. A semiconductor refrigeration sheet is fixedly connected to the top of the support rod. A plurality of heat dissipation fins are fixedly connected to the top of the semiconductor refrigeration sheet;

[0015] As a further description of the above technical solution:

[0016] There are two second springs and two second telescopic rods. The two second springs are respectively sleeved on the outer perimeters of the two second telescopic rods.

[0017] As a further description of the above technical solution:

[0018] One side of the purification box is fixedly connected with a control panel, and both sides of the purification box are fixedly connected with transparent panels.

[0019] As a further description of the above technical solution:

[0020] The bottom of the base is fixedly connected with a plurality of support columns.

[0021] The utility model has the following beneficial effects:

[0022] 1. In the utility model, the air pump is used to pump the air inside the purification box, so that negative pressure is generated inside the purification box. When negative pressure is generated inside the purification box, the waste gas generated during welding is pumped, and then filtered and purified through the first filter plate. Thus, the waste gas can be prevented from being discharged into the air, and at the same time, environmental pollution is prevented. By pressing the button, the connecting rod is driven to move. When the connecting rod moves, the second moving plate is driven to move at the same time. When the second moving plate moves, the first moving plate is driven to move. When the first moving plate moves, the block is driven to move. When the block moves, the second spring and the second telescopic rod are squeezed, and at the same time, the block disengages from the card slot. When the block disengages from the card slot, the first filter plate and the purification box can be conveniently separated, and thus the first filter plate can be conveniently replaced or cleaned.

[0023] 2. In the utility model, the double-headed motor drives the fan and the rotating rod to rotate. When the fan rotates, the external air is pumped and blown towards the middle of the cooling box, so that the printed circuit board can be conveniently cooled, and thus harm to the staff is prevented, and at the same time, the safety is improved. When the rotating rod rotates, the movable plate is driven to rotate at the same time. When the movable plate rotates, the first telescopic rod and the first spring are driven to move at the same time. When the first telescopic rod and the first spring move at the same time, the scraping plate is driven to move. When the scraping plate moves, the surface of the second filter plate can be conveniently cleaned. Under the action of the second filter plate, the dust in the air can be filtered, and thus the influence of the dust in the air on the printed circuit board can be prevented. Description of the Drawings

[0024] Figure 1 is a three-dimensional schematic diagram of the SMT patch reflow soldering machine proposed by the utility model;

[0025] Figure 2 is a structural schematic diagram of the robotic arm of the SMT patch reflow soldering machine proposed by the utility model;

[0026] Figure 3 Schematic diagram of the structure of the air pump of the SMT patch reflow soldering machine proposed by the present utility model;

[0027] Figure 4 Schematic diagram of the structure of the fan of the SMT patch reflow soldering machine proposed by the present utility model;

[0028] Figure 5 Schematic diagram of the structure of the card slot of the SMT patch reflow soldering machine proposed by the present utility model.

[0029] Legend:

[0030] 1. Base; 2. Support column; 3. Conveyor belt; 4. Purification box; 5. Cooling box; 6. Control panel; 7. Transparent panel; 8. Purification box; 9. Air pump; 10. Exhaust pipe; 11. Fixed pipe; 12. Manipulator; 13. Sheath; 14. Filter plate 1; 15. Support rod; 16. Semiconductor refrigeration sheet; 17. Heat dissipation fins; 18. Fixed rod; 19. Double-head motor; 20. Fan; 21. Rotating rod; 22. Movable plate; 23. Telescopic rod 1; 24. Spring 1; 25. Filter plate 2; 26. Card slot; 27. Card block; 28. Spring 2; 29. Telescopic rod 2; 30. Movable plate 1; 31. Movable plate 2; 32. Connecting rod; 33. Button; 34. Scraper. Detailed implementation manners

[0031] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0032] Refer to Figure 1 , Figure 2 and Figure 5, an embodiment provided by the present utility model: an SMT patch reflow soldering machine, including a base 1 and a conveyor belt 3. A purification box 4 and a cooling box 5 are fixedly connected to the top of the base 1. A purification box 8 is fixedly connected to the top of the purification box 4. An air pump 9 is fixedly connected to the top of the purification box 8. An exhaust pipe 10 is fixedly connected to the output end of the air pump 9. A first filter plate 14 is slidably connected to the middle of the purification box 8. When the air pump 9 works, it will pump the air inside the purification box 8, causing negative pressure inside the purification box 8. After negative pressure is generated inside the purification box 8, it will pump the waste gas generated during welding, and then filter and purify it through the first filter plate 14, thereby preventing the waste gas from being discharged into the air and preventing environmental pollution. A robotic arm 12 is fixedly connected to the middle of the purification box 4. The robotic arm 12 can conveniently weld electronic components firmly to the printed circuit board. A sleeve 13 is fixedly connected to one side of the purification box 8. A second moving plate 31 is slidably connected to the inside of the sleeve 13. A first moving plate 30 is rotatably connected to one side of the second moving plate 31. When the second moving plate 31 moves, it will drive the first moving plate 30 to move. One end of the first moving plate 30 away from the second moving plate 31 is rotatably connected to a latch 27. When the first moving plate 30 moves, it will drive the latch 27 to move simultaneously. A second spring 28 and a second telescopic rod 29 are fixedly connected to one side of the latch 27. When the latch 27 moves, it will squeeze the second spring 28 and the second telescopic rod 29. A card slot 26 is opened at the top of the first filter plate 14. The card slot 26 is engaged with the latch 27. When the latch 27 squeezes the second spring 28 and the second telescopic rod 29, it will disengage from the card slot 26. When the latch 27 disengages from the card slot 26, it is convenient to separate the first filter plate 14 from the purification box 8, and thus it is convenient to replace or clean the first filter plate 14.

[0033] Refer to Figure 5 , a connecting component is provided on the side of the second moving plate 31 away from the first moving plate 30. The connecting component is used to drive the second moving plate 31 to move. The connecting component includes a connecting rod 32. The connecting rod 32 is fixedly connected to one side of the second moving plate 31. When the connecting rod 32 moves, it will squeeze the second moving plate 31. One end of the connecting rod 32 away from the second moving plate 31 is fixedly connected to a button 33. The button 33 can facilitate the staff to drive the connecting rod 32 to move.

[0034] Refer to Figure 3 and Figure 4, a fixed pipe 11 is fixedly connected to the top of the cooling box 5. A fixed rod 18 and a second filter plate 25 are fixedly connected to the middle of the fixed pipe 11. The fixed pipe 11 can conveniently support and fix the fixed rod 18 and the second filter plate 25. One end of the fixed rod 18 far from the fixed pipe 11 is fixedly connected to a double-headed motor 19. The fixed rod 18 can conveniently support the double-headed motor 19, so that the double-headed motor 19 can work better. One output end of the double-headed motor 19 is fixedly connected to a fan 20, and the other output end of the double-headed motor 19 is fixedly connected to a rotating rod 21. When the double-headed motor 19 works, it will drive the rotating rod 21 and the fan 20 to rotate at the same time. When the fan 20 rotates, it will draw the external air and blow it towards the middle of the cooling box 5, so as to conveniently dissipate heat from the printed circuit board, thereby preventing harm to the staff and improving safety at the same time.

[0035] Refer to Figure 4 , an activity plate 22 is fixedly connected to the outer periphery of the rotating rod 21. When the rotating rod 21 rotates, it will drive the activity plate 22 to rotate. A cleaning component is provided at the bottom of the activity plate 22. The cleaning component is used to clean the surface of the second filter plate 25. The cleaning component includes a first telescopic rod 23. The first telescopic rod 23 is fixedly connected to the bottom of the activity plate 22. One end of the first telescopic rod 23 far from the activity plate 22 is fixedly connected to a scraping plate 34. A first spring 24 is fixedly connected to the top of the scraping plate 34. One end of the first spring 24 far from the scraping plate 34 is fixedly connected to the bottom of the activity plate 22. When the activity plate 22 rotates, it will drive the first telescopic rod 23 and the first spring 24 to move at the same time. When the first telescopic rod 23 and the first spring 24 move, they will drive the scraping plate 34 to move at the same time. When the scraping plate 34 moves, it can conveniently clean the surface of the second filter plate 25. Under the action of the second filter plate 25, the dust in the air can be filtered, thereby preventing the dust in the air from affecting the printed circuit board.

[0036] Refer to Figure 3 and Figure 4 , a support rod 15 is fixedly connected to the top of the cooling box 5. A semiconductor refrigeration sheet 16 is fixedly connected to the top of the support rod 15. The support rod 15 can conveniently support and fix the semiconductor refrigeration sheet 16. The semiconductor refrigeration sheet 16 can conveniently refrigerate while the fan 20 rotates, so as to conveniently carry out further heat dissipation and refrigeration. A plurality of heat dissipation fins 17 are fixedly connected to the top of the semiconductor refrigeration sheet 16. The heat dissipation fins 17 can conveniently dissipate heat from the semiconductor refrigeration sheet 16, so that the semiconductor refrigeration sheet 16 can refrigerate more effectively.

[0037] Refer to Figure 1 and Figure 5, there are two second springs 28 and two second telescopic rods 29. The two second springs 28 are respectively sleeved on the outer circumferences of the two second telescopic rods 29. One side of the purification box 4 is fixedly connected with a control panel 6, which can facilitate the staff to control the overall device to work. Both sides of the purification box 4 are fixedly connected with transparent panels 7, which can facilitate the staff to observe the working conditions at any time. The bottom of the base 1 is fixedly connected with a plurality of support columns 2, and the plurality of support columns 2 can facilitate more firm support and fixation of the base 1.

[0038] Working principle: When it is necessary to purify the waste gas, the air pump 9 will work. When the air pump 9 works, it will pump the air inside the purification box 8, causing a negative pressure inside the purification box 8. After the negative pressure is generated inside the purification box 8, it will pump the waste gas generated during welding, and then filter and purify it through the first filter plate 14, thereby preventing the waste gas from being discharged into the air and preventing environmental pollution.

[0039] When it is necessary to replace or clean the first filter plate 14, press the button 33 to drive the connecting rod 32 to move. When the connecting rod 32 moves, it will drive the second moving plate 31 to move at the same time. When the second moving plate 31 moves, it will drive the first moving plate 30 to move. When the first moving plate 30 moves, it will drive the clamping block 27 to move. When the clamping block 27 moves, it will squeeze the second spring 28 and the second telescopic rod 29, and at the same time the clamping block 27 will disengage from the clamping groove 26, thereby facilitating the replacement or cleaning of the first filter plate 14.

[0040] When dissipating heat from the printed circuit board, the double-headed motor 19 will work. When the double-headed motor 19 works, it will drive the fan 20 and the rotating rod 21 to rotate. When the fan 20 rotates, it will pump the external air and blow it towards the middle of the cooling box 5, thereby facilitating the dissipation of heat from the printed circuit board, preventing harm to the staff, and improving safety at the same time. When the rotating rod 21 rotates, it will drive the movable plate 22 to rotate at the same time. When the movable plate 22 rotates, it will drive the first telescopic rod 23 and the first spring 24 to move at the same time. When the first telescopic rod 23 and the first spring 24 move at the same time, they will drive the scraping plate 34 to move. When the scraping plate 34 moves, it can facilitate the cleaning of the surface of the second filter plate 25. Under the action of the second filter plate 25, the dust in the air can be filtered.

[0041] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. SMT chip reflow soldering machine, including a base (1) and a conveyor belt (3), characterized in that: The top of the base (1) is fixedly connected with a purification box (4) and a cooling box (5). The top of the purification box (4) is fixedly connected with a purification box (8). The top of the purification box (8) is fixedly connected with an air pump (9). The output end of the air pump (9) is fixedly connected with an exhaust pipe (10). A first filter plate (14) is slidably connected to the middle of the purification box (8). A robotic arm (12) is fixedly connected to the middle of the purification box (4). A sleeve (13) is fixedly connected to one side of the purification box (8). A second moving plate (31) is slidably connected inside the sleeve (13). A first moving plate (30) is rotatably connected to one side of the second moving plate (31). One end of the first moving plate (30) away from the second moving plate (31) is rotatably connected to a clamping block (27). A second spring (28) and a second telescopic rod (29) are fixedly connected to one side of the clamping block (27). A clamping groove (26) is formed at the top of the first filter plate (14). The clamping groove (26) is engaged with the clamping block (27). A connecting component is arranged on the side of the second moving plate (31) away from the first moving plate (30). The connecting component is used to drive the second moving plate (31) to move.

2. The SMT chip reflow soldering machine according to claim 1, wherein: The connecting component includes a connecting rod (32). The connecting rod (32) is fixedly connected to one side of the second moving plate (31). One end of the connecting rod (32) away from the second moving plate (31) is fixedly connected with a button (33).

3. The SMT chip reflow soldering machine according to claim 1, characterized in that: A fixed pipe (11) is fixedly connected to the top of the cooling box (5). A fixed rod (18) and a second filter plate (25) are fixedly connected to the middle of the fixed pipe (11). One end of the fixed rod (18) away from the fixed pipe (11) is fixedly connected with a double-headed motor (19). A fan (20) is fixedly connected to one output end of the double-headed motor (19). A rotating rod (21) is fixedly connected to the other output end of the double-headed motor (19). A movable plate (22) is fixedly connected to the outer periphery of the rotating rod (21). A cleaning component is arranged at the bottom of the movable plate (22). The cleaning component is used to clean the surface of the second filter plate (25).

4. The SMT chip reflow soldering machine according to claim 3, wherein: The cleaning component includes a first telescopic rod (23). The first telescopic rod (23) is fixedly connected to the bottom of the movable plate (22). One end of the first telescopic rod (23) away from the movable plate (22) is fixedly connected with a scraping plate (34). A first spring (24) is fixedly connected to the top of the scraping plate (34). One end of the first spring (24) away from the scraping plate (34) is fixedly connected to the bottom of the movable plate (22).

5. The SMT chip reflow soldering machine according to claim 1, wherein: A support rod (15) is fixedly connected to the top of the cooling box (5). A semiconductor refrigeration sheet (16) is fixedly connected to the top of the support rod (15). A plurality of heat dissipation fins (17) are fixedly connected to the top of the semiconductor refrigeration sheet (16).

6. The SMT patch reflow soldering machine according to claim 1, wherein: Both the second spring (28) and the second telescopic rod (29) are provided with two. The two second springs (28) are respectively sleeved on the outer peripheries of the two second telescopic rods (29).

7. The SMT chip reflow soldering machine according to claim 1, wherein: One side of the purification box (4) is fixedly connected with a control panel (6), and transparent panels (7) are fixedly connected to both sides of the purification box (4).

8. The SMT chip reflow soldering machine according to claim 1, wherein: A plurality of support columns (2) are fixedly connected to the bottom of the base (1).

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