Refrigerator

Abstract

The embodiment of the utility model belongs to the technical field of refrigeration equipment, and provides a refrigerator. According to the semiconductor refrigeration device of the refrigerator, the semiconductor refrigeration piece is arranged, the cold end is constructed to release cold energy towards the storage chamber so as to absorb heat of the storage chamber, and the influence of defrosting heat on the temperature of the storage chamber is reduced; the hot end of the semiconductor chilling plate is in contact with the circulating channel and exchanges heat, so that the heat exchange medium is heated; part of the circulation channel is located in the evaporation bin and used for exchanging heat with the evaporator for defrosting. Part of the circulation channel is exposed to the outer surface of the box body, and the fluid driving device is configured to continue to operate after the semiconductor chilling plate is powered off, so that the fluid driving device continues to drive the heat exchange medium to circularly flow in the circulation channel after defrosting is completed, and the heat exchange medium exchanges heat with outside air; therefore, the temperature of the heat exchange medium in the circulation channel is reduced, the influence of the residual heat of the heat exchange medium on subsequent refrigeration of the refrigeration system is reduced, and the influence on the refrigeration efficiency of the refrigeration system is reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of refrigeration equipment, and particularly to a refrigerator. Background Art

[0002] As a refrigeration equipment, after a refrigerator operates for a period of time, water vapor in the air is likely to adhere to the evaporator and form frost. Therefore, after the compressor accumulates a certain working time, a defrosting program needs to be started to melt the frost layer on the evaporator.

[0003] In the related art, a heating structure is usually arranged below the evaporator, and the evaporator is heated by electricity to melt the frost layer on it. However, the heat generated by the heating structure enters the storage compartment through the air duct, resulting in an increase in the temperature of the storage compartment and affecting the storage quality of items. Summary of the Utility Model

[0004] The embodiments of the present application provide a refrigerator, which reduces the influence of defrosting heat on the temperature of the storage compartment while defrosting.

[0005] In a first aspect, the embodiments of the present application provide a refrigerator, which includes:

[0006] A box body, which is configured to form a storage compartment;

[0007] A door body, which is rotatably connected to the box body and is used to open or close the storage compartment;

[0008] An air duct structure, which is arranged in the storage compartment;

[0009] The air duct structure and the storage compartment jointly enclose an evaporation chamber, and the evaporation chamber is communicated with the storage compartment;

[0010] A refrigeration system, which is arranged in the box body and is used to provide cold for the storage compartment; the refrigeration system includes:

[0011] An evaporator, which is installed in the evaporation chamber;

[0012] A thermoelectric refrigeration device, which includes:

[0013] A thermoelectric refrigeration chip, which has a cold end and a hot end, and the cold end is configured to release cold to the storage compartment;

[0014] A circulation channel, which is used to accommodate a heat exchange medium; a part of the circulation channel is used to contact and exchange heat with the hot end, and a part of the circulation channel is located in the evaporation chamber and is used to exchange heat with the evaporator for defrosting;

[0015] A fluid driving device is arranged on the circulation channel, and the fluid driving device is used to drive the heat exchange medium to circulate in the circulation channel;

[0016] Wherein, a part of the circulation channel is exposed to the outer surface of the box body; the fluid driving device is configured to continue operating after the semiconductor refrigeration chip is powered off.

[0017] The refrigerator according to the embodiment of the present application is provided with a semiconductor refrigeration device for defrosting the evaporator. Among them, the semiconductor refrigeration device is provided with a semiconductor refrigeration chip, and the cold end is configured to release cold to the storage compartment, thereby absorbing the heat of the storage compartment and reducing the influence of defrosting heat on the temperature of the storage compartment; the hot end of the semiconductor refrigeration chip is in contact with the circulation channel and exchanges heat, thereby heating the heat exchange medium; a part of the circulation channel is located in the evaporation chamber and is used for heat exchange and defrosting with the evaporator. The semiconductor refrigeration device drives the heat exchange medium to circulate in the circulation channel by arranging a fluid driving device on the circulation channel, so as to realize defrosting. Moreover, a part of the circulation channel is exposed to the outer surface of the box body, and the fluid driving device is configured to continue operating after the semiconductor refrigeration chip is powered off. In this way, the fluid driving device continues to drive the heat exchange medium to circulate in the circulation channel after defrosting is completed, and the heat exchange medium exchanges heat with the outside air when passing through the exposed part of the circulation channel, thereby reducing the temperature of the heat exchange medium in the circulation channel and reducing the influence of the residual heat of the heat exchange medium on the subsequent refrigeration of the refrigeration system, and further reducing the influence on the refrigeration efficiency of the refrigeration system. Moreover, it is also beneficial to reduce the possibility of sintering damage of the semiconductor refrigeration chip.

[0018] In some embodiments of the present application, the circulation channel includes:

[0019] A first pipeline configured to convey the heat exchange medium after heat exchange with the hot end to the evaporation chamber; at least a part of the first pipeline is arranged in the evaporation chamber for melting the frost on the evaporator;

[0020] A second pipeline configured to convey the heat exchange medium after heat exchange with the evaporation chamber back to the hot end;

[0021] The fluid driving device is respectively connected to the first pipeline and the second pipeline and drives the heat exchange medium to circulate in the first pipeline and the second pipeline;

[0022] At least a part of one of the first pipeline and the second pipeline is exposed to the outer surface of the box body.

[0023] The above technical solution has the following advantages or technical effects: In the embodiment of the present application, the circulation channel is provided with a first pipeline to convey the heat exchange medium after heat exchange with the hot end to the evaporation chamber to melt the frost layer on the evaporator; the second pipeline is provided to convey the heat exchange medium after heat exchange with the evaporation chamber back to the hot end for heat exchange. The arrangement of the first pipeline and the second pipeline can not only realize the circulation of the heat exchange medium, but also facilitate the arrangement of the pipeline, making the structure of the semiconductor refrigeration device simple.

[0024] In some embodiments of the present application, the box body includes a back plate located on the back side of the storage compartment;

[0025] A receiving groove is formed on the back plate, and the notch of the receiving groove faces the rear side of the refrigerator;

[0026] Part of at least one of the first pipe and the second pipe is arranged in the receiving groove.

[0027] The above technical solution has the following advantages or technical effects: By providing a receiving groove on the back plate in the embodiment of the present application, part of the first pipe and the second pipe can be embedded in the receiving groove and exposed on the outer surface of the box body, avoiding the first pipe and the second pipe protruding from the rear surface of the back plate and being easily damaged.

[0028] In some embodiments of the present application, a first opening is provided on the side wall of the storage compartment;

[0029] The first pipe enters the evaporation chamber through the first opening and exits the evaporation chamber through the first opening;

[0030] The part of the first pipe located in the evaporation chamber is in contact with the evaporator.

[0031] The above technical solution has the following advantages or technical effects: By providing a first opening on the side wall of the storage compartment in the embodiment of the present application, the first pipe can enter and exit the evaporation chamber through the same first opening, which can reduce the opening positions on the side wall of the storage compartment and is beneficial to ensuring the heat preservation performance of the storage compartment. The part of the first pipe located in the evaporation chamber is in contact with the evaporator, which can not only limit the first pipe but also improve the heat exchange efficiency between the first pipe and the evaporator and improve the defrosting efficiency.

[0032] In some embodiments of the present application, the part of the first pipe located in the evaporation chamber is located at the bottom end of the evaporator.

[0033] The above technical solution has the following advantages or technical effects: Since the bottom end of the evaporator is where frost is likely to accumulate, arranging the first pipe at the bottom end of the evaporator can directly heat it and improve the defrosting efficiency. Moreover, the heat in the first pipe naturally diffuses upward, reducing the defrosting time and improving the defrosting efficiency.

[0034] In some embodiments of the present application, the first opening is located on the top side wall of the storage compartment.

[0035] The above technical solution has the following advantages or technical effects: The first opening is located on the top side wall of the storage compartment. With this arrangement, it is convenient for the first pipe and the second pipe to extend out to the outer surface of the box shell through the same opening on the box shell, reducing the openings on the box shell.

[0036] In some embodiments of the present application, the box body is provided with a second opening, and a part of the circulation channel extends to the outside of the box body through the second opening.

[0037] The above technical solution has the following advantages or technical effects: By providing a second opening on the box body, a part of the circulation channel extends out of the box body through the second opening, which facilitates the heat exchange medium in this part of the circulation channel to exchange heat with the outside air, increases the heat exchange area between the heat exchange medium and the outside air, and does not require a too large opening.

[0038] In some embodiments of the present application, the circulation channel further includes a heat exchange channel, and the heat exchange channel has:

[0039] An outlet end, the outlet end of the heat exchange channel is communicated with the first pipeline;

[0040] An inlet end, the inlet end of the heat exchange channel is communicated with the second pipeline;

[0041] The semiconductor refrigeration device further includes:

[0042] A heat exchange joint, the heat exchange joint is fixed to the hot end and contacts the hot end;

[0043] The heat exchange joint is configured to form the heat exchange channel.

[0044] The above technical solution has the following advantages or technical effects: The circulation channel in the embodiment of the present application realizes contact and heat exchange with the hot end by providing a heat exchange channel, and uses the heat exchange joint to form the heat exchange channel, which is convenient for connecting with the first pipeline and the second pipeline, so as to realize the connection between the heat exchange channel and the first pipeline and the second pipeline.

[0045] In some embodiments of the present application, the box body is further configured to form a compressor compartment, the compressor compartment is located below the air duct structure and behind the storage compartment;

[0046] The fluid driving device is installed in the compressor compartment.

[0047] The above technical solution has the following advantages or technical effects: The fluid driving device is installed in the compressor compartment. With this arrangement, it is convenient for the installation and maintenance of the fluid driving device, and the noise generated by the operation of the fluid driving device on the user can also be reduced. Moreover, the fluid driving device is installed in the compressor compartment, which is convenient for at least part of the circulation channel to be exposed on the outer surface of the box body, facilitating the layout of the circulation channel.

[0048] In some embodiments of the present application, the semiconductor refrigeration device further includes:

[0049] A fin, the fin is connected to and in contact with the cold end, and at least part of the fin is located inside the storage compartment.

[0050] The above technical solution has the following advantages or technical effects: In the embodiment of the present application, by providing a fin connected to and in contact with the cold end, and at least part of the fin is located inside the storage compartment, the contact area between the cold end of the thermoelectric cooler and the air inside the storage compartment can be increased, thereby improving the heat exchange efficiency.

[0051] In some embodiments of the present application, the top end of the rear wall of the storage compartment protrudes upward from the opening of the storage compartment to form a protruding wall;

[0052] The fin is mounted on the protruding wall;

[0053] The thermoelectric cooling device further includes:

[0054] A gas driving device, located inside the storage compartment; the gas driving device is fixed to the side of the fin facing the front side of the refrigerator.

[0055] The above technical solution has the following advantages or technical effects: In the embodiment of the present application, by providing a gas driving device on the front side of the fin to drive the air flow in the storage compartment, the heat exchange efficiency between the air inside the storage compartment and the fin is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the embodiments of the present application or the implementation manners in the related art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the related art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0057] Figure 1 It is a schematic structural diagram of a refrigerator provided by some embodiments of the present application;

[0058] Figure 2 It is a schematic structural diagram of a refrigerator provided by some embodiments of the present application;

[0059] Figure 3 It is an exploded view of a refrigerator provided by some embodiments of the present application;

[0060] Figure 4 It is an exploded view of a box liner, a thermoelectric cooling device, and an air duct structure provided by some embodiments of the present application;

[0061] Figure 5 It is a front view of a box liner, a thermoelectric cooling device, and an air duct structure provided by some embodiments of the present application;

[0062] Figure 6 For Figure 5The A-A cross-sectional view in;

[0063] Figure 7 is Figure 6 the enlarged schematic view of the P area in;

[0064] Figure 8 is Figure 5 the B-B cross-sectional view in;

[0065] Figure 9 is Figure 8 the enlarged schematic view of the Q area in;

[0066] Figure 10 the structural schematic view of the heat exchange joint provided by some embodiments of the present application;

[0067] Figure 11 is Figure 10 the C-C cross-sectional view in.

[0068] Explanation of reference numerals:

[0069] 100: box body; 101: storage room; 102: evaporation chamber; 103: compressor chamber; 110: box shell; 111: back panel; 1111: receiving groove; 1112: second opening; 112: side panel; 113: top panel; 120: box liner; 121: top side wall; 1211: first opening; 1212: mounting sleeve; 1213: limiting sleeve; 122: protruding wall; 1221: mounting opening; 130: compressor cover;

[0070] 200: door body;

[0071] 300: air duct structure; 302: avoidance passage; 310: front air duct shell; 320: rear air duct shell; 330: air duct plate; 340: fan;

[0072] 410: evaporator; 420: compressor; 430: condenser;

[0073] 500: semiconductor refrigeration device; 510: semiconductor refrigeration chip; 520: circulation channel; 521: first pipeline; 5211: first pipe section; 5212: second pipe section; 5213: third pipe section; 522: second pipeline; 523: heat exchange channel; 530: fluid driving device; 540: heat exchange joint; 541: outlet end; 542: inlet end; 550: fin; 560: adhesive layer; 570: gas driving device. Detailed implementation manners

[0074] To make the objectives, embodiments, and advantages of this application clearer, the following will clearly and completely describe the exemplary embodiments of this application in conjunction with the accompanying drawings in the exemplary embodiments of this application. Obviously, the described exemplary embodiments are only a part of the embodiments of this application, rather than all of the embodiments.

[0075] It should be noted that the brief description of the terms in this application is only for the convenience of understanding the embodiments described next, rather than intending to limit the embodiments of this application. Unless otherwise specified, these terms should be understood in their ordinary and common meanings.

[0076] In addition, the terms "comprising" and "having" and any variations thereof are intended to cover but not exclude inclusion. For example, a product or device comprising a series of components does not necessarily have to be limited to those components clearly listed, but may include other components not clearly listed or inherent to these products or devices.

[0077] In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0078] The terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0079] In the description of this application, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0080] As a refrigeration device, after a refrigerator operates for a period of time, water vapor in the air is likely to adhere to the evaporator and frost. Therefore, after the compressor accumulates a certain working time, a defrosting program needs to be started.

[0081] In the related art, a heating structure is usually arranged below the evaporator, and the heating structure is energized to generate heat to melt the frost layer on the evaporator.

[0082] However, the heat generated by the heating structure melts the frost layer. The high-temperature water vapor has a low density and flows upward, entering the storage compartment through the air duct, resulting in an upward temperature fluctuation in the storage compartment and affecting the storage quality of the items.

[0083] In order to avoid the heat generated by the heating structure from affecting the temperature of the storage compartment, one way is to set up a shielding structure to cut off the air duct connecting the evaporator chamber and the storage compartment to block the high-temperature water vapor from entering the storage compartment. However, the shielding structure is located in the air duct between the evaporator chamber and the storage compartment, and there is a risk of frosting.

[0084] The R & D personnel of this application continued to research and considered defrosting by means other than electric heating defrosting, which can not only generate heat to melt the frost layer but also not affect the temperature of the storage compartment. In addition to setting up a structure to block heat transfer to not affect the temperature of the storage compartment, cold can also be generated to offset the influence of defrosting heat on the temperature of the storage compartment.

[0085] The method of using the refrigerator's own refrigeration system to generate cold is obviously not feasible. Then, another structure needs to be set up, which can not only generate heat to melt the frost layer but also generate cold to offset the influence of defrosting efficiency on the temperature of the storage compartment. The R & D personnel of this application thought of using the thermoelectric refrigeration principle to solve this temperature problem. While the thermoelectric refrigeration structure is energized for refrigeration, the heat generated at its hot end is used to melt the frost layer on the evaporator, and the cold generated at its cold end is used to compensate the storage compartment.

[0086] Among them, the cold at the cold end of the thermoelectric refrigeration structure can be introduced into the storage compartment through fins, and the heat transfer efficiency is high. And how to introduce the heat at the hot end of the thermoelectric refrigeration structure to the evaporator? One way is to use air duct heat transfer, but additional air ducts need to be arranged, which not only occupies the volume of the storage compartment but also uses the air in the air duct as a heat transfer medium, and the heat transfer efficiency is low. Generally, the heat released at the hot end of the thermoelectric refrigeration structure is greater than the heat absorbed at the cold end, and using air as a heat transfer medium has low efficiency, resulting in energy waste.

[0087] Therefore, the R & D personnel of this application designed a pipeline to use liquid medium for heat transfer, which not only occupies a small volume but also has a high heat transfer efficiency. However, after defrosting, the liquid medium in the pipeline is still relatively hot, and this part of the waste heat affects the refrigeration efficiency of the refrigerator.

[0088] Therefore, in the embodiment of this application, part of the pipeline containing the liquid medium is exposed outside the refrigerator body, and a fluid driving device is used to drive the liquid medium to circulate in the pipeline, so as to use the pipeline exposed outside the box body for heat dissipation and reduce the influence of the waste heat of the liquid medium in the pipeline on the refrigeration of the refrigerator.

[0089] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0090] First of all, it should be noted that in the embodiments of the present application, when the user faces the door body of the refrigerator, the width direction of the refrigerator is the left-right direction, corresponding to the X-axis direction in the accompanying drawings; the depth direction of the refrigerator, that is, the depth direction of the compartment, is the front-back direction, corresponding to the Y-axis direction in the accompanying drawings; the height direction of the refrigerator is the up-down direction, corresponding to the Z-axis direction in the accompanying drawings.

[0091] Combined Figure 1 and Figure 2 , the refrigerator in the embodiments of the present application may include a box body 100. The box body 100 is constructed to form a storage compartment 101 for storing items.

[0092] The box body 100 may include an inner liner 120 and an outer casing 110. The inner liner 120 may be constructed with the storage compartment 101. The outer casing 110 may be connected to the outside of the inner liner 120 to form the appearance of the refrigerator. The box body 100 may further include a box insulation layer, and the box insulation layer may be disposed between the inner liner 120 and the outer casing 110. The box insulation layer can insulate the storage compartment 101 to minimize the heat exchange between the storage compartment 101 and the outside of the refrigerator, which is beneficial to ensuring the refrigeration effect of the refrigerator.

[0093] In some embodiments, the outer casing 110 may include a back panel 111, side panels 112, and a top panel 113. There are two side panels 112, and the two side panels 112 are oppositely disposed along the width direction of the refrigerator. The back panel 111 is disposed at the rear ends of the two side panels 112, and the top panel 113 is disposed at the tops of the back panel 111 and the two side panels 112.

[0094] The outer casing 110 may further include a bottom panel, and the bottom panel is disposed at the bottom ends of the back panel 111 and the two side panels 112. In this way, the back panel 111, the two side panels 112, the top panel 113, and the bottom panel jointly enclose the outer casing 110 with an open front side, so that the inner liner 120 is installed in the outer casing 110 from the open front side of the outer casing 110.

[0095] In some embodiments, the top panel 113 and the two side panels 112 may be an integral structure, which can simplify the structure of the outer casing 110 and facilitate the assembly of the outer casing 110. Exemplarily, the top panel 113 and the two side panels 112 may be formed by bending the same plate-shaped material.

[0096] In some embodiments of the present application, the inner container 120 includes a top side wall 121, a bottom side wall, a left side wall, a right side wall, and a rear side wall. The top side wall 121 and the bottom side wall are disposed opposite to each other in the height direction of the refrigerator. The left side wall and the right side wall are disposed opposite to each other in the width direction of the refrigerator. The rear side wall is disposed at the rear of the top side wall 121, the bottom side wall, the left side wall, and the right side wall. In this way, the top side wall 121, the bottom side wall, the left side wall, the right side wall, and the rear side wall jointly enclose the inner container 120 with an opening at the front side. The front side opening of the inner container 120 is an access opening for facilitating the user to access items.

[0097] When the inner container 120 is installed in the outer casing 110, the top side wall 121 of the inner container 120 is opposite to the top plate 113 of the outer casing 110, the rear side wall of the inner container 120 is opposite to the rear plate 111 of the outer casing 110, the bottom side wall of the inner container 120 is opposite to the bottom plate of the outer casing 110, and the left side wall and the right side wall of the inner container 120 are opposite to the side plates 112 of the outer casing 110.

[0098] In some embodiments of the present application, the number of storage compartments 101 can be multiple. At least one of the multiple storage compartments 101 can be set as a refrigerating compartment. The internal temperature of the refrigerating compartment can be maintained between about 0°C and 5°C to store items in a refrigerating mode. At least one of the multiple storage compartments 101 can be set as a freezing compartment. The internal temperature of the freezing compartment can be maintained between about -30°C and 0°C to store items in a freezing mode. In some possible implementation manners, the storage compartment 101 can also be set as a vacuum chamber or a variable temperature chamber, etc., which will not be elaborated in the embodiments of the present application.

[0099] The number of storage compartments 101 can be two. For example Figure 1 As shown, the two storage compartments 101 can be stacked vertically. The two storage compartments 101 can also be arranged side by side horizontally. One of the storage compartments 101 can be set as a refrigerating compartment, and the other storage compartment 101 can be set as a freezing compartment.

[0100] In some embodiments, the box body 100 includes two inner containers 120. One of the inner containers 120 is configured to form a refrigerating compartment, and the other inner container 120 is configured to form a freezing compartment. In this way, the freezing compartment and the refrigerating compartment are separated from each other, which is convenient for forming different storage temperatures.

[0101] Referring to Figure 2 and Figure 3 , the box body 100 is further configured to form a compressor compartment 103, and the compressor compartment 103 is located at the rear of the storage compartment 101 for freezing.

[0102] Exemplarily, the cabinet 100 may further include a compressor cover 130, which is located at the bottom end of the rear side of the inner cabinet 120. Exemplarily, the compressor cover 130 is located at the bottom end of the rear side of the inner cabinet 120 that forms the refrigerating compartment. The compressor cover 130 is configured to form a compressor compartment 103, which facilitates the installation of at least part of the structure of the refrigeration system of the refrigerator.

[0103] In some embodiments, the compressor cover 130 is configured to form a rearward installation opening, which facilitates the installation and maintenance of the components inside the compressor cover 130. The cabinet 100 may further include a rear cover plate that covers the installation opening. The rear cover plate is generally arranged with a plurality of openings, which facilitates the heat dissipation of the components inside the compressor compartment 103.

[0104] In some embodiments, the rear cover plate is in the same plane as the rear back plate 111 of the cabinet shell 110, and together they form the rear appearance of the refrigerator.

[0105] The refrigerator according to the embodiment of the present application may further include a door body 200, which is rotatably connected to the cabinet 100 and is used to open or close the storage compartment 101.

[0106] The number of the door bodies 200 may be correspondingly set according to the number of the storage compartments 101. A plurality of storage compartments 101 may be correspondingly provided with one door body 200. Or, as Figure 1 shown, each storage compartment 101 may be correspondingly provided with two door bodies 200, and the two door bodies 200 may rotate in opposite directions to open or close the storage compartment 101. Or, each storage compartment 101 may be correspondingly provided with one door body 200.

[0107] The door body 200 may include a door inner liner and a door shell. The door inner liner may face the storage compartment 101 when the door body 200 is in the closed state. The door shell may be connected to the outside of the door inner liner to form the appearance of the refrigerator. The door shell may be rotatably connected to the cabinet 100. The door body 200 may further include a door heat insulation layer, which may be provided between the door inner liner and the door shell. The door heat insulation layer can keep the storage compartment 101 warm to minimize the heat exchange between the storage compartment 101 and the outside of the refrigerator, which is beneficial to ensuring the refrigeration effect of the refrigerator.

[0108] The refrigerator according to the embodiment of the present application may further include a refrigeration system for providing cold air to the storage compartment 101. Exemplarily, the refrigeration system may be provided inside the cabinet 100.

[0109] Refer to Figure 3 and Figure 4, the refrigeration system may include a compressor 420, a condenser 430, a throttler, and an evaporator 410 that are connected in a cycle. When the refrigeration system operates, the compressor 420 compresses the refrigerant vapor to generate high-temperature and high-pressure refrigerant vapor, and transports the refrigerant vapor into the condenser 430. The condenser 430 liquefies the high-temperature and high-pressure refrigerant vapor to generate low-temperature and high-pressure refrigerant liquid, and transports it to the throttler. After the throttler reduces the pressure of the refrigerant liquid, the high-pressure and low-temperature refrigerant liquid is transformed into low-pressure and low-temperature refrigerant liquid, and is transported to the evaporator 410. After receiving the low-pressure and low-temperature refrigerant liquid, the evaporator 410 boils it under isobaric conditions, absorbs heat and vaporizes to form refrigerant vapor, so as to reduce the temperature in the storage compartment 101.

[0110] Among them, the compressor 420 can be installed in the compressor compartment 103. Such a setting not only helps to lower the center of gravity of the refrigerator, improve the stability of the refrigerator, and reduce the risk of tipping; but also facilitates the heat dissipation and maintenance of the compressor 420; and can also reduce the impact of the noise generated by the operation of the compressor 420 on the user.

[0111] The condenser 430 can be installed in the compressor compartment 103. In this way, the space of the compressor compartment 103 can be effectively utilized, so that there is more storage space inside the refrigerator; and the mass of the condenser 430 is relatively large, and installing it in the compressor compartment 103 is beneficial to lowering the center of gravity of the refrigerator and improving the overall stability. The condenser 430 releases heat when the refrigeration system operates. The condenser 430 is installed in the compressor compartment 103, which is convenient for heat dissipation.

[0112] In some embodiments, a cooling fan 340 can also be installed in the compressor compartment 103 to dissipate heat from the compressor 420 and the condenser 430.

[0113] In some embodiments of the present application, the refrigerator further includes an air duct structure 300, and the air duct structure 300 is located above the compressor compartment 103. The air duct structure 300 is configured to form an air duct, and the air duct is used to introduce the low-temperature air cooled by the evaporator 410 into the storage compartment 101.

[0114] The air duct structure 300 is disposed in the storage compartment 101. Exemplarily, the air duct structure 300 is located at the rear side inside the inner liner 120, reducing the impact on the storage volume inside the inner liner 120.

[0115] As Figure 4 shown, the rear side wall of the inner liner 120 protrudes backward to form a recess inside the inner liner 120, and the air duct structure 300 is installed in the recess. In this way, not only can the rear side space between the inner liner 120 and the outer shell 110 be fully utilized, but also the impact on the storage volume caused by installing the air duct structure 300 in the inner liner 120 can be reduced.

[0116] The air duct structure 300 and the compartment wall of the storage compartment 101 jointly enclose to form an evaporation chamber 102. Exemplarily, the air duct structure 300 and the side wall of the box liner 120 jointly enclose to form an evaporation chamber 102.

[0117] The evaporation chamber 102 is used to accommodate the evaporator 410. The refrigerant in the evaporator 410 evaporates and absorbs heat, reducing the air temperature in the evaporation chamber 102. The evaporation chamber 102 is communicated with the storage compartment 101 through an air duct, so that the low-temperature air in the evaporation chamber 102 is introduced into the storage compartment 101, realizing a low-temperature storage environment in the storage compartment 101.

[0118] Combined with Figure 5 and Figure 6 In some embodiments, the air duct structure 300 includes an air duct front shell 310, an air duct rear shell 320, and an air duct plate 330. Among them, the air duct front shell 310 and the air duct rear shell 320 are fixedly connected to form a cavity, and the air duct plate 330 is installed in the cavity formed by the air duct front shell 310 and the air duct rear shell 320. Moreover, grooves are formed on the air duct plate 330, and together with the air duct front shell 310 and the air duct rear shell 320, they jointly form an air duct.

[0119] Combined with Figure 8 The air duct structure 300 further includes a blower 340. The blower 340 is installed in the air duct and is configured to drive the low-temperature air in the evaporation chamber 102 into the storage compartment 101 and make the air in the storage compartment 101 flow back into the evaporation chamber 102.

[0120] During the operation of the refrigeration system, since the evaporator 410 absorbs heat and vaporizes the refrigerant, its own temperature is relatively low, and the water vapor in the storage compartment 101 is easily condensed on the evaporator 410 to form frost.

[0121] For this reason, combined with Figure 3 and Figure 4 Some embodiments of the refrigerator in this application may further include a thermoelectric refrigeration device 500. The thermoelectric refrigeration device 500 is configured to defrost the evaporator 410, and releases cold in the storage compartment 101 during the defrosting process, reducing the influence of the defrosting heat on the storage temperature in the storage compartment 101 and ensuring the storage quality of the items.

[0122] In some embodiments, the thermoelectric refrigeration device 500 includes a thermoelectric cooling chip 510, which has a cold end and a hot end. The thermoelectric cooling chip 510 is usually composed of two different types of semiconductor materials, namely N-type and P-type semiconductors. Based on the Peltier effect, when an electric current passes through the junction of two different conductors or semiconductor materials, the hot end releases heat and the cold end absorbs heat.

[0123] The cold end of the semiconductor refrigeration chip 510 is configured to release cold to the storage compartment 101. Among them, the cold end can be located inside the box liner 120 to directly absorb the heat in the storage compartment 101; or, the cold end can be located outside the box liner 120, and the cold end extends into the storage compartment 101 through a heat conduction structure to release cold to the storage compartment 101. The heat conduction structure includes but is not limited to thermal conductive glue, fins 550, etc.

[0124] Combined Figure 4 , in some embodiments, the cold end of the semiconductor refrigeration chip 510 is bonded to the side wall of the box liner 120, and the connection method is simple and reliable. Among them, the cold end of the semiconductor refrigeration chip 510 can be bonded to the top side wall 121 of the box liner 120, and the cold end of the semiconductor refrigeration chip 510 can also be bonded to the rear side wall of the box liner 120.

[0125] Exemplarily, the cold end of the semiconductor refrigeration chip 510 is bonded to the side wall of the box liner 120 through an adhesive layer 560. The adhesive layer 560 can be thermal conductive glue, which is beneficial to improving the heat transfer efficiency.

[0126] An installation opening 1221 is provided on the side wall of the box liner 120, and the installation opening 1221 is opposite to at least part of the cold end of the semiconductor refrigeration chip 510, so that at least part of the cold end of the semiconductor refrigeration chip 510 is exposed into the storage compartment 101 through the installation opening 1221, which is convenient for directly absorbing the heat in the storage compartment 101.

[0127] In some embodiments, at least part of the semiconductor refrigeration chip 510 is located in the installation opening 1221 to reduce the installation space occupied by the semiconductor refrigeration chip 510.

[0128] In some embodiments of the present application, the top end of the rear wall of the storage compartment 101 protrudes upward to form a protruding wall 122. Exemplarily, the top end of the rear side wall of the box liner 120 extends upward to form a protruding wall 122.

[0129] The protruding wall 122 is opposite to the back plate 111 of the box shell 110, and the protruding wall 122 is located above the air duct structure 300. The protruding wall 122 protrudes upward from the opening of the storage compartment 101. In this way, at the opening of the storage compartment 101, the possibility of seeing the protruding wall 122 is small, so that the protruding wall 122 is hidden in the storage compartment 101.

[0130] The installation opening 1221 is provided on the protruding wall 122, so that the cold end of the semiconductor refrigeration chip 510 is hidden in the storage compartment 101, that is, it is not easy to see the semiconductor refrigeration chip 510 at the opening of the storage compartment 101, ensuring the regularity in the storage compartment 101. Moreover, it is convenient for the arrangement of the circulation channel 520 described later and the exposure to the outer surface of the box body 100.

[0131] CombinedFigure 8 and Figure 9 In some embodiments, the semiconductor refrigeration device 500 further includes: a fin 550. The fin 550 is connected to and in contact with the cold end. At least a part of the fin 550 is located in the storage compartment 101. Thus, at least a part of the fin 550 being located in the storage compartment 101 can increase the contact area between the cold end of the semiconductor refrigeration chip 510 and the air in the storage compartment 101, thereby improving the heat exchange efficiency.

[0132] Exemplarily, the fin 550 can be adhesively bonded to the cold end of the semiconductor refrigeration chip 510 with a thermally conductive adhesive, which can not only ensure the contact between the fin 550 and the cold end of the semiconductor refrigeration chip 510, but also make the contact between the fin 550 and the cold end of the semiconductor refrigeration chip 510 stable and reliable.

[0133] In some embodiments, the fin 550 is installed on the protruding wall 122 of the inner liner 120. For example, the fin 550 is fixed to the protruding wall 122 of the inner liner 120 by fasteners. For another example, the fin 550 is snap - connected to the protruding wall 122 of the inner liner 120. Thus, the stability and reliability of the installation of the fin 550 can be improved.

[0134] By installing the fin 550 on the protruding wall 122 of the inner liner 120, the possibility of seeing the fin 550 from the opening of the storage compartment 101 is relatively small, so that the fin 550 is hidden in the storage compartment 101.

[0135] Continue to refer to Figure 8 and Figure 9 In some embodiments, the semiconductor refrigeration device 500 further includes: a gas driving device 570. The gas driving device 570 is located in the storage compartment 101 and is fixed to one side of the fin 550 facing the front side of the refrigerator. The gas driving device 570 is configured to drive the air flow in the storage compartment 101, thereby improving the heat exchange efficiency between the air in the storage compartment 101 and the fin 550.

[0136] Among them, the gas driving device 570 can be a blower 340, such as an axial - flow blower 340. The blower 340 can be fixed to the front side of the fin 550. The number of blowers 340 can be set according to actual needs. For example, four blowers 340 are arranged at intervals along the length direction of the fin 550.

[0137] Through the above settings, the cold end of the semiconductor refrigeration chip 510 is connected to the fin 550, and at least a part of the fin 550 is located in the storage compartment 101. Heat exchange is carried out between the fin 550 and the air in the storage compartment 101 to ensure the preservation temperature in the storage compartment 101; and the gas driving device 570 is used to drive the air flow in the storage compartment 101 to improve the heat exchange efficiency between the air in the storage compartment 101 and the fin 550.

[0138] Continue to refer to Figure 4 In some embodiments, the semiconductor refrigeration device 500 further includes a circulation channel 520 for containing a heat exchange medium. A part of the circulation channel 520 is used for heat exchange in contact with the hot end of the semiconductor refrigeration chip 510, and a part of the circulation channel 520 is located in the evaporation chamber 102 for heat exchange and defrosting with the evaporator 410. These two parts are different parts of the circulation channel 520.

[0139] Wherein, at least part of the circulation channel 520 can be formed by a pipeline, which is convenient for the layout of the circulation channel 520. At least part of the circulation channel 520 can be formed by the box body 100 or the air duct structure 300, which is convenient for using the existing structure of the refrigerator and reducing the length of the additionally arranged pipeline.

[0140] In some embodiments of the present application, the circulation channel 520 is formed by a joint inner channel and a pipeline, which is convenient for the layout of the pipeline.

[0141] In some embodiments of the present application, the heat exchange medium in the circulation channel 520 is a liquid heat exchange medium, such as liquid oil, etc. Exemplarily, the heat exchange medium in the circulation channel 520 is liquid oil, which has high stability, high specific heat capacity, and high heat transfer efficiency. Moreover, the freezing point of the liquid oil is relatively low, and the liquid oil can still remain liquid even when the evaporator 410 absorbs heat.

[0142] Continue to refer to Figure 4 In some embodiments, a fluid driving device 530 is arranged on the circulation channel 520. The fluid driving device 530 is used to drive the heat exchange medium to circulate in the circulation channel 520, so that the heat exchange medium is heated after heat exchange with the hot end, and then the frost layer of the evaporator 410 is melted after heat exchange with the evaporator 410.

[0143] Wherein, the circulation channel 520 can be divided into at least two sections, so that the fluid driving device 530 is connected between these two sections of channels, so that the fluid driving device 530 is arranged on the circulation channel 520.

[0144] Wherein, the fluid driving device 530 can be a hydraulic motor, a pump, etc. Exemplarily, the fluid driving device 530 can be a plunger pump. The plunger pump can generate a relatively high pressure, which is convenient for the flow of the heat exchange medium in a long pipeline, and the flow rate of the plunger pump is stable, which is beneficial to the stable defrosting.

[0145] In some embodiments, the circulation channel 520 includes a defrosting section for melting the frost layer on the evaporator. Among them, the fluid driving device 530 can be located upstream of the defrosting section, that is, the heat exchange medium after heat exchange with the hot end flows towards the defrosting section after being accelerated and pressurized by the fluid driving device 530. The fluid driving device 530 can be located downstream of the defrosting section, that is, the heat exchange medium first flows through the evaporator for defrosting after heat exchange with the hot end, and then flows through the fluid driving device 530. In this way, the heat loss of the heat exchange medium flowing through the fluid driving device 530 can be reduced, and the defrosting efficiency can be improved.

[0146] In some embodiments, the fluid driving device 530 is installed in the compressor compartment 103. Such a setting facilitates the installation and maintenance of the fluid driving device 530, and can also reduce the impact of the noise generated by the operation of the fluid driving device 530 on the user. Moreover, the fluid driving device 530 is installed in the compressor compartment 103, which facilitates at least part of the circulation channel 520 to be exposed to the outer surface of the box body 100, and is conducive to the layout of the circulation channel 520.

[0147] Exemplarily, the fluid driving device 530 is located on the side of the condenser 430 facing away from the compressor 420. Such a setting can reduce the mutual influence of the noise generated during the operation of the compressor 420 and the fluid driving device 530.

[0148] In some embodiments, the fluid driving device 530 can be fixed to the compressor cover 130 through fasteners, and the installation is stable and reliable.

[0149] When it is necessary to defrost the evaporator 410, the semiconductor refrigeration chip 510 is configured to be powered on, and the gas driving device 570 is configured to be started to drive the air in the storage room 101 to flow through the fins 550. The cold end of the semiconductor refrigeration chip 510 exchanges heat with the air in the storage room 101 through the fins 550 to absorb the heat in the storage room 101; the fluid driving device 530 is configured to be started to drive the heat exchange medium in the circulation channel 520 to circulate, and after heat exchange with the hot end, it exchanges heat with the evaporator 410 to melt the frost on the evaporator 410.

[0150] Of course, when defrosting the evaporator 410, the compressor 420 and the fan 340 in the air duct structure 300 are kept closed.

[0151] In some embodiments, a temperature sensor is provided on the circulation channel 520 for monitoring the temperature of the heat exchange medium. The temperature sensor can be provided on the pipeline that returns after heat exchange with the evaporator 410.

[0152] When it is monitored that the temperature of the temperature sensor shows a continuous upward trend within several consecutive time intervals, it can be determined that the defrosting of the frost layer on the evaporator 410 is completed, then the semiconductor refrigeration chip 510 is configured to be powered off, and the gas driving device 570 is configured to be shut down.

[0153] In some embodiments, if the cumulative energization duration of the thermoelectric cooler 510 is greater than the set maximum defrost time, it is considered that the thermoelectric cooler 510 may be damaged, and then the controller of the refrigerator issues a fault prompt to the user.

[0154] Continue to refer to Figure 2 and Figure 3 , a part of the circulation channel 520 is exposed to the outer surface of the cabinet 100, and the fluid driving device 530 is configured to continue operating after the thermoelectric cooler 510 is powered off. In this way, the fluid driving device 530 continues to drive the heat exchange medium to circulate in the circulation channel 520 after defrosting is completed, and the heat exchange medium exchanges heat with the outside air when passing through the exposed part of the circulation channel 520, thereby reducing the temperature of the heat exchange medium in the circulation channel 520, reducing the influence of the residual heat of the heat exchange medium on the refrigeration of the subsequent refrigeration system, and further reducing the influence on the refrigeration efficiency of the refrigeration system. Moreover, it is also beneficial to reduce the possibility of sintering damage of the thermoelectric cooler 510.

[0155] In some embodiments, the closing time of the fluid driving device 530 can be determined by setting the duration for which the fluid driving device 530 continues to operate after the thermoelectric cooler 510 is powered off. Such a setting makes the control logic of the refrigerator controller and the fluid driving device 530 simple.

[0156] In other embodiments, the closing timing of the fluid driving device 530 can be determined by monitoring the temperature of the heat exchange medium. For example, by setting a temperature sensor outside the circulation channel 520, when the temperature of the monitored heat exchange medium drops to the set temperature, the fluid driving device 530 is controlled to close. Such a setting can ensure that the residual heat of the heat exchange medium is dissipated to the outside air, and ensure that the influence of the residual heat of the heat exchange medium on refrigeration is reduced.

[0157] In some embodiments of the present application, the cabinet 100 is provided with a second opening 1112, and a part of the circulation channel 520 extends to the outside of the cabinet 100 through the second opening 1112. Without setting a large opening, a relatively long length of the circulation channel 520 can be exposed to the outer surface of the cabinet 100, which is convenient for the heat exchange medium to dissipate heat to the outside atmosphere.

[0158] Of course, in some embodiments, the cabinet 100 can be provided with a second opening 1112, and a part of the circulation channel 520 is opposite to the second opening 1112, so that a part of the circulation channel 520 is exposed through the second opening 1112.

[0159] A part of the circulation channel 520 is exposed to the outer surface of the cabinet shell 110, which is conducive to the heat exchange medium dissipating heat to the outside air.

[0160] Exemplarily, as Figure 3 shown, a second opening 1112 is provided on the housing 110, and a part of the circulation channel 520 passes through the second opening 1112 to the outside of the housing 110, so that a part of the circulation channel 520 is exposed to the outer surface of the housing 110.

[0161] Combined with Figure 7 and Figure 9 , in some embodiments, the circulation channel 520 may include a heat exchange channel 523, and the heat exchange channel 523 is in contact with the hot end of the thermoelectric cooler 510 for heat exchange with the hot end of the thermoelectric cooler 510 to heat the heat exchange medium.

[0162] Wherein, the heat exchange channel 523 has an outlet end 541 and an inlet end 542. The outlet end 541 is used to export the heated heat exchange medium, and the inlet end 542 is used to import the heat exchange medium to be heated.

[0163] Combined with Figure 10 and Figure 11 , in some embodiments, the thermoelectric cooling device 500 may further include a heat exchange joint 540, and the heat exchange joint 540 is configured to form the heat exchange channel 523. The heat exchange joint 540 is fixed to the hot end of the thermoelectric cooler 510 and is in contact with the hot end, facilitating a large contact area with the hot end and being conducive to improving the heat exchange efficiency.

[0164] In some embodiments, the heat exchange joint 540 and the hot end are bonded by a thermal conductive adhesive, which can not only realize the connection between the heat exchange joint 540 and the hot end, but also ensure the contact between the heat exchange joint 540 and the hot end. The structure is simple and the connection is stable; moreover, the thermal conductive adhesive is conducive to improving the heat conduction efficiency between the hot end and the heat exchange joint 540.

[0165] In some embodiments, the heat exchange channel 523 in the heat exchange joint 540 is arranged in an S shape in a first plane, wherein the first plane is parallel to the end face of the hot end. In this way, the contact area between the heat exchange channel 523 and the hot end can be increased, so that the heat exchange medium can fully exchange heat with the hot end, thereby increasing the temperature of the heat exchange medium, and reducing the possibility of sintering damage caused by the failure of the heat of the hot end to be dissipated in time.

[0166] In some embodiments, the inlet end 542 and the outlet end 541 of the heat exchange channel 523 may be arranged on different sides of the heat exchange joint 540. For example, the inlet end 542 is arranged on the left side of the heat exchange joint 540, and the outlet end 541 is arranged on the right side of the heat exchange joint 540. In this way, there is sufficient pipeline connection space for the inlet end 542 and the outlet end 541, avoiding mutual interference.

[0167] In some other embodiments, as Figure 11As shown, the inlet end 542 and the outlet end 541 of the heat exchange channel 523 are arranged on the same side of the heat exchange joint 540. For example, the inlet end 542 and the outlet end 541 are respectively arranged on the right side of the heat exchange joint 540. Such an arrangement facilitates the pipes connected to the inlet end 542 and the outlet end 541 to pass through the outer side of the box body 100 via the same opening.

[0168] Combined with Figure 6 and Figure 7 , in some embodiments, the circulation channel 520 may include: a first pipe 521 configured to transport the heat exchange medium after heat exchange with the hot end to the evaporation chamber 102. At least a part of the first pipe 521 is arranged in the evaporation chamber 102 for melting the frost layer of the evaporator 410.

[0169] In some embodiments of the present application, the first pipe 521 has a first end and a second end. The first end of the first pipe 521 is connected to the outlet end 541 of the heat exchange joint 540, so that the first pipe 521 is in communication with the outlet end 541 of the heat exchange channel 523.

[0170] In some embodiments, the circulation channel 520 may include a second pipe 522 configured to transport the heat exchange medium after heat exchange with the evaporation chamber 102 back to the hot end.

[0171] In some embodiments of the present application, the second pipe 522 has a first end and a second end. The first end of the second pipe 522 is connected to the inlet end 542 of the heat exchange joint 540, so that the second pipe 522 is in communication with the inlet end 542 of the heat exchange channel 523.

[0172] The fluid driving device 530 is respectively connected to the first pipe 521 and the second pipe 522 and drives the heat exchange medium to circulate in the first pipe 521 and the second pipe 522. Among them, the second end of the first pipe 521 is in communication with the inlet of the fluid driving device 530. The second end of the second pipe 522 is in communication with the outlet of the fluid driving device 530.

[0173] At least a part of the first pipe 521 and the second pipe 522 is exposed to the outer surface of the box body 100. Thus, under the drive of the fluid driving device 530, the heat exchange medium can circulate in the first pipe 521, the second pipe 522 and the heat exchange channel 523, and exchange heat with the outside air through at least one of the first pipe 521 and the second pipe 522 exposed to the outer surface of the box body 100 to reduce the temperature of the heat exchange medium.

[0174] In some embodiments of the present application, at least a part of the first pipe 521 and at least a part of the second pipe 522 are both exposed to the outer surface of the box body 100, improving the heat dissipation efficiency of the heat exchange medium.

[0175] In the embodiments of the present application, the circulation channel 520 is configured to convey the heat exchange medium after heat exchange with the hot end to the evaporation chamber 102 through the first pipeline 521 to melt the frost layer on the evaporator 410; and convey the heat exchange medium after heat exchange with the evaporation chamber 102 back to the hot end for heat exchange through the second pipeline 522. The arrangements of the first pipeline 521 and the second pipeline 522 can not only achieve the circulation of the heat exchange medium, but also facilitate the pipeline layout, making the structure of the semiconductor refrigeration device 500 simple.

[0176] Continue to refer to Figure 2 and Figure 3 , the back panel 111 of the cabinet 110 is located on the back side of the storage compartment 101, forming the appearance of the rear side of the refrigerator. Among them, a receiving groove 1111 is formed on the back panel 111, and the notch of the receiving groove 1111 faces the rear side of the refrigerator. At least a part of one of the first pipeline 521 and the second pipeline 522 is arranged in the receiving groove 1111.

[0177] Exemplarily, the rear surface of the back panel 111 is recessed forward to form the receiving groove 1111. In this way, the method of forming the receiving groove 1111 is simple, and the thickness of the part of the receiving groove 1111 is not reduced, which is beneficial to ensuring the overall structural strength of the back panel 111.

[0178] Exemplarily, a groove is formed on the rear surface of the back panel 111.

[0179] In this way, at least a part of the first pipeline 521 and the second pipeline 522 can be embedded in the receiving groove 1111 and exposed outside the outer surface of the cabinet 100, avoiding the first pipeline 521 and the second pipeline 522 protruding from the rear surface of the back panel 111 and being easily damaged.

[0180] In some embodiments, the cabinet 110 may further include a cover, which is fixed to the outside of the receiving groove 1111. A plurality of through holes are arranged on the cover, and the through holes communicate the receiving groove 1111 with the outside atmosphere. In this way, it can not only enable at least one of the first pipeline 521 and the second pipeline 522 to exchange heat with the outside air, but also play a role in shielding the first pipeline 521 and the second pipeline 522, keeping the rear side of the refrigerator regular.

[0181] In the above method, by providing the receiving groove 1111 on the rear surface of the back panel 111, at least a part of one of the first pipeline 521 and the second pipeline 522 is exposed to dissipate heat. In some other implementation manners, at least a part of one of the first pipeline 521 and the second pipeline 522 extends into the compressor compartment 103 and faces the rear cover plate of the compressor compartment 103. In this way, heat can be dissipated to the outside air through the openings on the rear cover plate, without exposing a part of the structures of the first pipeline 521 and the second pipeline 522, which is beneficial to ensuring the regularity of the appearance of the refrigerator.

[0182] Reference Figure 4 The side wall of the storage compartment 101 is provided with a first opening 1211. Exemplarily, the side wall of the box 120 is provided with a first opening 1211.

[0183] The first pipe 521 enters the evaporation chamber 102 through the first opening 1211 and passes through the evaporation chamber 102 through the first opening 1211 . This can reduce the number of openings on the liner 120 , which helps ensure the thermal insulation performance of the liner 120 .

[0184] In some embodiments, a mounting sleeve 1212 is installed at the edge of the first opening 1211. Two limiting sleeves 1213 are installed within the mounting sleeve 1212. The first pipe 521 enters the evaporation chamber 102 through one limiting sleeve 1213 and extends out of the evaporation chamber 102 through the other limiting sleeve 1213. This allows the first pipe 521 to enter and exit the evaporation chamber 102 through the same opening, while also separating the portions of the first pipe 521 that enter and exit the evaporation chamber 102, thereby reducing temperature loss of the heat exchange medium used for defrosting.

[0185] In some embodiments, the first opening 1211 is located on the top side wall 121 of the storage compartment 101. This arrangement allows the same opening on the lens box shell 110 of the first pipe 521 and the second pipe 522 to be exposed to the outer surface of the box shell 110, thereby reducing the number of openings on the box shell 110.

[0186] In some embodiments, at least a portion of the air duct structure 300 is located between the first opening 1211 and the evaporation chamber 102 . Therefore, an opening is provided on the air duct structure 300 to allow the first pipe 521 to enter the evaporation chamber 102 through the air duct structure 300 .

[0187] In some embodiments, combined Figure 6 and Figure 7 The air duct structure 300 is constructed to form an avoidance channel 302, which is staggered from the air duct. The first pipe 521 enters the evaporation chamber 102 through the avoidance channel 302, so that at least a portion of the first pipe 521 is located within the avoidance channel 302. This arrangement shortens the length of the first pipe 521, allowing it to enter and exit the evaporation chamber 102 over the shortest possible distance. Furthermore, the avoidance channel 302, where the first pipe 521 is located, is staggered from the air duct, preventing the arrangement of the first pipe 521 from increasing wind resistance within the air duct.

[0188] In some embodiments, the avoidance channel 302 may be located on one side of the air duct structure 300 along the width direction of the refrigerator, so that it can be staggered with the air duct without affecting the arrangement of the existing air duct.

[0189] Combine Figure 7, the air duct rear shell 320 and the air duct plate 330 of the air duct structure 300 jointly enclose an avoidance channel 302, and through holes are provided on the air duct rear shell 320 so that the first pipe 521 can enter and exit the evaporation chamber 102.

[0190] In some embodiments, the portion of the first pipe 521 located in the evaporation chamber 102 contacts the evaporator 410. Exemplarily, the first pipe 521 can contact the fin of the evaporator 410, which can not only limit the first pipe 521, but also improve the heat exchange efficiency between the first pipe 521 and the evaporator 410 and the melting efficiency of the frost layer.

[0191] In some embodiments, the portion of the first pipe 521 located in the evaporation chamber 102 is located at the bottom end of the evaporator 410. Since the bottom end of the evaporator 410 is where the frost layer is likely to accumulate, setting the first pipe 521 at the bottom end of the evaporator 410 can directly heat it, improving the defrosting efficiency. Moreover, the heat in the first pipe 521 naturally diffuses upward, reducing the defrosting duration and improving the defrosting efficiency.

[0192] Continue to refer to Figure 6 and Figure 7 , in some embodiments, the first pipe 521 includes a first pipe section 5211, a second pipe section 5212, and a third pipe section 5213 that are connected in sequence. Among them, the first pipe section 5211 is connected to the outlet end 541 of the heat exchange joint 540, the third pipe section 5213 is connected to the inlet of the fluid driving device 530, and the second pipe section 5212 is located at the bottom end of the evaporator 410 and is used to melt the frost on the evaporator 410. That is, the second pipe section 5212 is the defrosting section of the circulation channel 520.

[0193] The first pipe section 5211 enters the evaporation chamber 102 through the first opening 1211 and the avoidance channel 302 of the air duct structure 300, and the heat exchange medium in the first pipe section 5211 has not been defrosted; the third pipe section 5213 passes through the first opening 1211 and the avoidance channel 302 of the air duct structure 300 and exits the evaporation chamber 102, and the heat exchange medium in the third pipe section 5213 has been defrosted. Among them, after the third pipe section 5213 exits through the first opening 1211, it can exit to the outside of the box body 100 through the second opening 1112. Then it penetrates into the compressor chamber 103 and is connected to the fluid driving device 530.

[0194] Combined with Figure 4 , the diameter of the second pipe section 5212 can be less than or equal to the diameter of the evaporation pipe of the evaporator 410, reducing the influence of the setting of the second pipe section 5212 on the heat exchange between the evaporator 410 and the air flow.

[0195] In some embodiments, the projection of the second pipe segment 5212 on the horizontal plane may be located within the projection range of the evaporation pipe on the horizontal plane, reducing the influence of the arrangement of the second pipe segment 5212 on the heat exchange between the evaporator 410 and the air flow. Among them, the horizontal plane may correspond to the XY plane in the appendix. Figure 4 in the XY plane.

[0196] In some embodiments, at least a part of the second pipe segment 5212 forms a downward-bent structure, so that the water dripping onto the second pipe segment 5212 can quickly drip downward to the drainage structure, avoiding water droplets staying on the second pipe segment 5212.

[0197] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

[0198] For the sake of convenience of explanation, the above description has been made in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. According to the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are for better explaining the principles and practical applications, so that those skilled in the art can better use the embodiments and various different modified embodiments suitable for specific use considerations.

Claims

1. A refrigerator, characterized in that, Comprising: A box body (100) configured to form a storage compartment (101); A door body (200) rotatably connected to the box body (100) for opening or closing the storage compartment (101); An air duct structure (300) disposed within the storage compartment (101); The air duct structure (300) and the storage compartment (101) jointly enclose an evaporation chamber (102), and the evaporation chamber (102) communicates with the storage compartment (101); A refrigeration system disposed within the box body (100) for providing cooling capacity to the storage compartment (101); the refrigeration system includes: An evaporator (410) installed within the evaporation chamber (102); A thermoelectric refrigeration device (500), including: A thermoelectric refrigeration chip (510) having a cold end and a hot end, the cold end being configured to release cooling capacity towards the storage compartment (101); A circulation channel (520) for containing a heat exchange medium; a part of the circulation channel (520) is used for heat exchange in contact with the hot end, and a part of the circulation channel (520) is located within the evaporation chamber (102) for heat exchange defrosting with the evaporator (410); A fluid driving device (530) is provided on the circulation channel (520), and the fluid driving device (530) is used to drive the heat exchange medium to circulate within the circulation channel (520); Wherein, a part of the circulation channel (520) is exposed on the outer surface of the box body (100); the fluid driving device (530) is configured to continue operating after the thermoelectric refrigeration chip (510) is powered off.

2. The refrigerator according to claim 1, wherein, The circulation channel (520) includes: A first pipe (521) configured to convey the heat exchange medium after heat exchange with the hot end to the evaporation chamber (102); at least a part of the first pipe (521) is arranged within the evaporation chamber (102) for melting the frost on the evaporator (410); A second pipe (522) configured to convey the heat exchange medium after heat exchange with the evaporation chamber (102) back to the hot end; The fluid driving device (530) is respectively connected to the first pipe (521) and the second pipe (522) and drives the heat exchange medium to circulate within the first pipe (521) and the second pipe (522); At least a part of one of the first pipe (521) and the second pipe (522) is exposed on the outer surface of the box body (100).

3. The refrigerator according to claim 2, wherein The box body (100) includes a back panel (111) located on the back side of the storage compartment (101); A receiving groove (1111) is formed on the back panel (111), and the notch of the receiving groove (1111) faces the rear side of the refrigerator; At least a part of one of the first pipe (521) and the second pipe (522) is arranged within the receiving groove (1111).

4. The refrigerator according to claim 2, wherein, A first opening (1211) is provided on the side wall of the storage compartment (101); The first pipe (521) enters the evaporation chamber (102) through the first opening (1211) and exits the evaporation chamber (102) via the first opening (1211); The part of the first pipe (521) located within the evaporation chamber (102) is in contact with the evaporator (410).

5. The refrigerator according to claim 4, characterized in that, The portion of the first pipe (521) located within the evaporation chamber (102) is positioned at the bottom end of the evaporator (410).

6. The refrigerator according to any one of claims 2-5, characterized in that, The circulation channel (520) further includes a heat exchange channel (523), and the heat exchange channel (523) has: An outlet end (541), and the outlet end (541) of the heat exchange channel (523) communicates with the first pipe (521); An inlet end (542), and the inlet end (542) of the heat exchange channel (523) communicates with the second pipe (522); The semiconductor refrigeration device (500) further includes: A heat exchange joint (540), and the heat exchange joint (540) is fixed to the hot end; The heat exchange joint (540) is configured to form the heat exchange channel (523).

7. The refrigerator according to any one of claims 1-5, characterized in that, The box body (100) is provided with a second opening (1112), and a part of the circulation channel (520) extends to the outside of the box body (100) through the second opening (1112).

8. The refrigerator according to any one of claims 1-5, characterized in that, The box body (100) is further configured to form a compressor chamber (103), and the compressor chamber (103) is located below the air duct structure (300) and at the rear side of the storage compartment (101); The fluid driving device (530) is installed within the compressor chamber (103).

9. The refrigerator according to any one of claims 1-5, characterized in that, The semiconductor refrigeration device (500) further includes: Fins (550), the fins (550) are connected to the cold end, and at least a part of the fins (550) is located within the storage compartment (101).

10. The refrigerator according to claim 9, characterized in that, The top end of the rear wall of the storage compartment (101) protrudes upward from the opening of the storage compartment (101) to form a protruding wall (122); The fins (550) are installed on the protruding wall (122); The semiconductor refrigeration device (500) further includes: A gas driving device (570), located within the storage compartment (101); The gas driving device (570) is fixed to the side of the fins (550) facing the front side of the refrigerator.

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