Double-station full-automatic plane measuring instrument

Abstract

The utility model discloses a double-station full-automatic plane measuring instrument. The double-station full-automatic plane measuring instrument comprises a feeding unit, a measuring unit and a mechanical arm, the measuring unit comprises a measuring bottom plate; the high-precision optical flat is arranged above the measuring bottom plate; the number of the horizontal carrying tables is two, and the two horizontal carrying tables are connected to the upper end of the measuring bottom plate in a sliding mode. The measuring module is horizontally connected between the horizontal carrying table and the high-precision optical flat in a sliding manner; a temporary storage bracket is arranged on the measuring bottom plate; a U-shaped opening is formed in one end of the temporary storage bracket; the tail end of the mechanical arm is rotationally connected with a double-face suction cup. Two horizontal carrying tables used for placing wafers and a measuring module capable of switching measuring stations are arranged, and the feeding process and the measuring process are alternately carried out. And the mechanical arm and the temporary storage bracket turn over the wafer without manual assistance. And the high-precision optical flat is arranged to provide a reference for horizontal measurement of the wafer, so that the measurement precision of the wafer is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of detection equipment, and particularly relates to a double-station full-automatic planar measuring instrument. Background Art

[0002] The main purpose of wafer planar measurement is to ensure that the quality and performance of the wafer meet the strict requirements of semiconductor manufacturing. Specifically, it includes the following aspects: 1. Evaluate the flatness and uniformity of the wafer to ensure the accuracy and stability of subsequent manufacturing processes. If there are large undulations or non-uniformities on the wafer surface, it may lead to deviations in processes such as lithography and etching, affecting the performance and yield of the chip. 2. Detect defects and flaws on the wafer surface, such as scratches and particle contamination. These defects may further expand during subsequent manufacturing processes, affecting the reliability of the chip. 3. Measure parameters such as the thickness and warpage of the wafer to provide data support for the optimization of manufacturing processes. For example, by measuring the thickness distribution of the wafer, the parameters of processes such as thin film deposition can be adjusted to obtain a more uniform thin film thickness. 4. Monitor the process changes during wafer manufacturing, promptly discover problems and make adjustments, thereby improving production efficiency and product quality.

[0003] Chinese invention with publication number CN116067309A discloses a wafer flatness detector, belonging to the field of ultra-precision machining equipment. Four vibration isolators are symmetrically arranged and fixed on the detector bracket, the base is fixed on the four vibration isolators, the air-bearing turntable is fixed on the base, the three-point support assembly is fixed on the air-bearing turntable, the measuring disk is arranged on the three-point support assembly, two centering cylinder assemblies are respectively fixed on the base, both ends of the X-axis assembly are fixed on two columns, the two columns are fixed on the base, the X-axis aerostatic guide rail of the X-axis assembly is perpendicularly arranged to the axis of the air-bearing turntable, the non-contact sensor is fixed on the X-axis slide plate of the X-axis assembly through the fixed seat thereon, and the non-contact sensor moves along the X-axis aerostatic guide rail under the drive of the X-axis linear motor of the X-axis assembly to detect the flatness of the wafer.

[0004] In the actual application process, flatness detection needs to be carried out on both sides of the wafer. Therefore, after the detection of one side of the wafer is completed, the wafer needs to be turned over, and it is also necessary to ensure that the cleanliness of the wafer surface is not contaminated. In the above patent solution, manual assistance is required to turn over the wafer, which has high requirements for manual operation. At the same time, during the turning-over process, the detection process cannot be carried out, so the detection cycle of the wafer is long and the detection efficiency is low. Summary of the Utility Model

[0005] In order to overcome the technical problem in the prior art that when detecting the flatness of a wafer, it is necessary to detect both sides separately, and during the loading and unloading and turning-over processes of the wafer, the measurement process cannot be carried out, resulting in low measurement efficiency; an object of the present utility model is to provide a double-station full-automatic flatness measuring instrument. By setting two horizontal platforms that alternately perform the loading process and the measurement process below a measurement module, and simultaneously setting a temporary storage bracket to assist the robotic arm in turning over the wafer, it can automatically turn over and load and unload without manual assistance, improving the measurement efficiency while ensuring the surface cleanliness of the wafer.

[0006] To achieve the above object, the present utility model is implemented by the following technical solutions: A double-station full-automatic flatness measuring instrument includes a loading unit, a measurement unit, and a robotic arm disposed between the loading unit and the measurement unit; the measurement unit includes a measurement base plate; two high-precision flat crystals, which are respectively disposed above the measurement base plate; two horizontal platforms, which are respectively horizontally slidably connected to the upper end of the measurement base plate, and the two horizontal platforms can respectively slide selectively directly below the corresponding high-precision flat crystals; a measurement module, which is horizontally slidably connected between the horizontal platform and the high-precision flat crystal, the measurement module is located directly below the high-precision flat crystal, and the sliding direction of the horizontal platform is perpendicular to the sliding direction of the measurement module; wherein, a temporary storage bracket is disposed on the measurement base plate; the end of the temporary storage bracket facing the robotic arm is provided with a U-shaped opening; the end of the robotic arm is rotatably connected with a double-sided suction cup; the double-sided suction cup can selectively adsorb the upper end or the lower end of the wafer located on the temporary storage bracket.

[0007] When one of the horizontal platforms carries the wafer to measure the flatness below the measurement module, the other horizontal platform can perform the removal and replacement of the wafer, and the measurement process can be carried out continuously without interruption, improving the measurement efficiency of the wafer. At the same time, after the robotic arm adsorbs the upper end of the wafer and places it on the transfer bracket, it adsorbs and flips the wafer from the lower end again to complete the turning-over of the wafer, and then the other side of the wafer can be detected immediately without manual intervention, and the cleanliness of the wafer can also be ensured.

[0008] Further, the loading unit includes a loading and unloading base plate, a loading rack and an unloading rack disposed on the upper end of the loading and unloading base plate; the robotic arm is disposed between the loading rack and the unloading rack; openings for placing wafer boxes are provided at the upper ends of the loading rack and the unloading rack; wherein, an inclined surface is provided at the upper end of the loading rack; the inclined surface abuts against the upper end of the wafer box so that there is an included angle between the plane of the wafer in the wafer box and the horizontal plane.

[0009] The included angle facilitates the contact between the double-sided suction cup and the wafer and completes the adsorption, improving the adsorption stability and reducing the error rate.

[0010] Specifically, a guiding clamping plate is rotatably connected to the upper end of the blanking rack; the upper end of the wafer cassette is pressed between the upper end of the blanking rack and the guiding clamping plate; a plurality of slots are arranged in an array on the guiding clamping plate; the slots correspond one by one to the wafer slots in the wafer cassette.

[0011] The slots provide a guiding function for the insertion of the wafers, and at the same time, the guiding clamping plate stabilizes the position of the wafer cassette, facilitating the insertion of the wafers into the wafer cassette.

[0012] Further, the measuring module includes a vertical plate slidably connected above the measuring base plate and two horizontal measuring heads respectively arranged at the upper and lower ends of the vertical plate; wherein, the upper horizontal measuring head is used for measuring the flatness of the high-precision optical flat; the lower horizontal measuring head is used for measuring the flatness of the wafer.

[0013] The upper horizontal measuring head provides a reference for the lower horizontal measuring head through the high-precision optical flat, facilitating the monitoring of the accuracy of the measurement data and being beneficial to improving the measurement accuracy of the wafers.

[0014] Specifically, an electric adjustment table is arranged between the lower horizontal measuring head and the vertical plate; a manual adjustment table is arranged between the upper horizontal measuring head and the vertical plate; the electric adjustment table and the manual adjustment table are respectively used for adjusting the height of the corresponding horizontal measuring head.

[0015] Optionally, the measuring module further includes a thickness measuring head arranged at the lower end of the vertical plate; an electric adjustment table is arranged between the thickness measuring head and the vertical plate.

[0016] After the upper horizontal measuring head adjusts the distance from the high-precision optical flat through the manual adjustment table, no further adjustment is required in the follow-up; in order to adapt to wafers with different thicknesses, the electric adjustment table needs to adjust the height of the lower horizontal measuring head / thickness measuring head from time to time or intermittently.

[0017] Preferably, three positioning blocks are arranged at the upper end of the temporary storage bracket; the three positioning blocks are evenly distributed on the outer periphery of the inner bottom of the U-shaped opening; a guiding inclined surface is arranged on one side of the positioning block facing the inner bottom of the U-shaped opening.

[0018] Specifically, three groups of radial grooves are arranged at the upper end of the temporary storage bracket; the length direction of the radial grooves is arranged along the radial direction of the inner bottom of the U-shaped opening; the positioning blocks are slidably connected in the corresponding radial grooves; the positioning blocks can be selectively fixed in the radial grooves.

[0019] The guiding inclined planes provide a guiding function for the placement of the wafer. The lowest ends of the three guiding inclined planes are simultaneously in contact with the outer wall of the wafer, facilitating the positioning and adsorption of the robotic arm. At the same time, the position of the positioning block can be adjusted to be compatible with wafers of different diameters.

[0020] Further, two gantries with different heights are provided at the upper end of the measurement base plate. Among them, two high-precision flat crystals are provided at the upper end of the high gantry; two hollow openings respectively facing the corresponding high-precision flat crystals are provided at the lower end of the high gantry; a Y-direction linear module is provided on the side of the low gantry facing the high-precision flat crystal; the measurement module is provided on the moving end of the Y-direction linear module.

[0021] Further, the loading unit and the measurement unit respectively have independent frames and outer shells provided on the outer periphery of the frames; casters are respectively provided at the four corners of the lower end of the frames.

[0022] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0023] 1. Two horizontal platforms for placing wafers and a measurement module capable of switching measurement stations are provided, and the loading and measurement processes are carried out alternately, improving the measurement efficiency.

[0024] 2. A robotic arm and a temporary storage bracket are provided. The robotic arm not only loads and unloads the wafers, but also flips the wafers, eliminating the need for manual assistance, avoiding contamination of the wafers during the operation process, and at the same time improving the loading and unloading and flipping efficiency, that is, further improving the measurement efficiency.

[0025] 3. High-precision flat crystals and two horizontal measurement heads are provided. The high-precision flat crystals provide a reference for the horizontal measurement of the wafers, and can monitor and judge the data accuracy during the measurement process, thereby improving the measurement accuracy of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic structural diagram of the present utility model with the outer shell hidden;

[0027] Figure 2 is a schematic structural diagram of the loading unit and the robotic arm of the present utility model;

[0028] Figure 3 is a schematic structural diagram of the measurement unit of the present utility model;

[0029] Figure 4 is a schematic structural diagram of the loading rack of the present utility model;

[0030] Figure 5 is a schematic structural diagram of the unloading rack of the present utility model;

[0031] Figure 6It is a schematic structural diagram of the measurement base plate and the gantry of the present utility model;

[0032] Figure 7 It is a schematic structural diagram of the temporary storage bracket and the positioning block of the present utility model;

[0033] Figure 8 It is a schematic structural diagram of the measurement module of the present utility model.

[0034] In the figure: 11, frame; 12, casters; 13, housing; 21, loading and unloading base plate; 22, robotic arm; 221, double-sided suction cup; 23, loading rack; 231, inclined surface; 24, unloading rack; 25, guiding buckle plate; 251, slot; 31, measurement base plate; 32, vibration isolator; 33, horizontal stage; 34, X-direction linear module; 35, gantry; 41, measurement module; 42, Y-direction linear module; 43, high-precision flat crystal; 44, horizontal measurement head; 45, thickness measurement head; 46, electric adjustment table; 47, manual adjustment table; 51, temporary storage bracket; 511, radial groove; 512, U-shaped opening; 52, positioning block; 521, guiding inclined surface; 61, wafer; 62, wafer cassette. Detailed implementation manners

[0035] Next, in combination with the accompanying drawings and specific implementation manners, the present utility model will be further described. It should be noted that, on the premise of no conflict, the following described embodiments or technical features can be arbitrarily combined to form new embodiments.

[0036] In the description of the present utility model, it should be noted that for orientation terms, if there are terms such as "center", "horizontal", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the orientation and position relationships indicated are based on the orientation or position relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of the present utility model.

[0037] In addition, if there are terms "first" and "second", they are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0038] In the present utility model, unless otherwise clearly defined and limited, terms such as "arranged", "installed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may also be a mechanical connection; it may be directly connected, or connected through an intermediate medium, and it may be internally connected and communicated between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0039] See Figures 1 - 8 , a double-station full-automatic planar measuring instrument, including a loading unit, a measuring unit, and a robotic arm 22 arranged between the loading unit and the measuring unit; the loading unit and the measuring unit respectively have independent frames 11 and shells 13 arranged on the outer periphery of the frames 11; casters 12 are respectively arranged at the four corners of the lower end of the frame 11.

[0040] The loading unit includes a loading and unloading bottom plate 21 arranged on the corresponding frame 11, and a loading rack 23 and an unloading rack 24 arranged at the upper end of the loading and unloading bottom plate 21; the robotic arm 22 is arranged between the loading rack 23 and the unloading rack 24; openings for placing a wafer cassette 62 are arranged at the upper ends of the loading rack 23 and the unloading rack 24; the wafer cassette 62 is a semi-circular shell, and a semi-circular cover body is detachably connected to the upper end.

[0041] There are three independent loading racks 23; an inclined surface 231 is arranged at the upper end of the loading rack 23; the inclined surface 231 abuts against the upper end of the wafer cassette 62 so that there is an included angle between the wafer plane in the wafer cassette 62 and the horizontal plane.

[0042] There are three such openings on the unloading rack 24; three guiding buckle plates 25 are rotatably connected to the upper end of the unloading rack 24; the upper end of the wafer cassette 62 is pressed between the upper end of the unloading rack 24 and the guiding buckle plates 25; a plurality of slots 251 are arranged in an array on the guiding buckle plates 25; the slots 251 correspond one-to-one to the wafer slots in the wafer cassette 62.

[0043] The measurement unit includes a measurement base plate 31 which is arranged on the corresponding other frame 11; a gantry 35, with two gantries 35 having different heights and respectively arranged at the upper end of the measurement base plate 31; two high-precision flat crystals 43 which are respectively arranged at the lower end of the gantry 35; two X-direction linear modules 34 which are respectively arranged at the upper end of the measurement base plate 31; two horizontal platforms 33 which are respectively arranged on the moving ends of the corresponding X-direction linear modules 34, and the two horizontal platforms 33 can respectively slide selectively directly below the corresponding high-precision flat crystals 43; a Y-direction linear module 42 which is arranged on the side wall of the lower gantry 35; a measurement module 41 which is arranged on the moving end of the Y-direction linear module 42, the measurement module 41 is horizontally slidably connected between the horizontal platform 33 and the high-precision flat crystal 43, and the measurement module 41 is located directly below the high-precision flat crystal 43; the sliding direction of the horizontal platform 33 is perpendicular to the sliding direction of the measurement module 41.

[0044] Vibration isolators 32 are respectively arranged at the four corners of the lower end of the measurement base plate 31; the lower ends of the vibration isolators 32 are arranged on the corresponding frame 11.

[0045] Two hollow openings which are respectively opposite to the corresponding high-precision flat crystals 43 are arranged at the lower end of the upper gantry 35; the Y-direction linear module 42 is arranged on the side of the lower gantry 35 facing the high-precision flat crystal 43.

[0046] The measurement module 41 includes a vertical plate arranged on the moving end of the Y-direction linear module 42 and two horizontal measurement heads 44 respectively arranged at the upper and lower ends of the vertical plate; among them, the upper horizontal measurement head 44 is used to measure the flatness of the high-precision flat crystal 43; the lower horizontal measurement head 44 is used to measure the flatness of the wafer; the horizontal measurement head 44 is a non-contact displacement sensor.

[0047] An electric adjustment table 46 is arranged between the lower horizontal measurement head 44 and the vertical plate; a manual adjustment table 47 is arranged between the upper horizontal measurement head 44 and the vertical plate; the electric adjustment table 46 and the manual adjustment table 47 are respectively used to adjust the height of the corresponding horizontal measurement head 44.

[0048] Optionally, the measurement module 41 further includes a thickness measurement head 45 arranged at the lower end of the vertical plate; an electric adjustment table 46 is arranged between the thickness measurement head 45 and the vertical plate; the thickness measurement head 45 is a contact displacement sensor.

[0049] On one side of the gantry 35 facing the loading unit, a temporary storage bracket 51 is provided; at one end of the temporary storage bracket 51 facing the robotic arm 22, a U-shaped opening 512 is provided; the end of the robotic arm 22 is rotatably connected to a double-sided suction cup 221; the double-sided suction cup 221 can selectively adsorb the upper or lower end of the wafer 61 located on the temporary storage bracket 51.

[0050] Three positioning blocks 52 are provided at the upper end of the temporary storage bracket 51; the three positioning blocks 52 are evenly distributed on the outer periphery of the inner bottom of the U-shaped opening 512; on one side of the positioning block 52 facing the inner bottom of the U-shaped opening 512, a guiding inclined surface 521 is provided.

[0051] Three pairs of radial grooves 511 are provided at the upper end of the temporary storage bracket 51; the length direction of the radial grooves 511 is arranged along the radial direction of the inner bottom of the U-shaped opening 512; the positioning blocks 52 are slidably connected in the corresponding radial grooves 511; the positioning blocks 52 can be selectively fixed in the radial grooves 511.

[0052] Working process: The robotic arm 22 picks up the wafer 61 on the loading rack 23 and places it on the horizontal stage 33. The horizontal stage 33 moves the wafer 61 to the lower end of the measuring module 41, and through the combined movement of the X-direction linear module 34 and the Y-direction linear module 42, the flatness of each part of the wafer 61 is measured by the horizontal measuring head 44. During this process, the robotic arm 22 picks up the wafer 61 on the loading rack 23 and places it on another horizontal stage 33. After one wafer 61 is measured, the measuring module 41 immediately moves above another horizontal stage 33 to measure another wafer.

[0053] In addition, the robotic arm 22 places the picked-up wafer 61 on the temporary storage bracket 51, picks up the wafer 61 from the lower end of the temporary storage bracket 51, turns over the wafer 61 through the flipping of the robotic arm 22, and then can be placed on the horizontal stage 33 again to measure the other side of the wafer.

[0054] The above are only specific embodiments of the present invention, but the technical features of the present invention are not limited thereto. Any changes or modifications made by those skilled in the art within the scope of the present invention are covered by the patent scope of the present invention.

Claims

1. A double-station full-automatic planar measuring instrument, characterized in that: It includes a loading unit, a measuring unit, and a robotic arm disposed between the loading unit and the measuring unit; the measuring unit includes a measuring base plate; Two high-precision flat crystals, which are respectively disposed above the measuring base plate; Two horizontal platforms, which are respectively horizontally slidably connected to the upper end of the measuring base plate, and the two horizontal platforms can respectively slide selectively directly below the corresponding high-precision flat crystal; A measuring module, which is horizontally slidably connected between the horizontal platform and the high-precision flat crystal, the measuring module is located directly below the high-precision flat crystal, and the sliding direction of the horizontal platform is perpendicular to the sliding direction of the measuring module; Wherein, a temporary storage bracket is disposed on the measuring base plate; one end of the temporary storage bracket facing the robotic arm is provided with a U-shaped opening; a double-sided suction cup is rotatably connected to the end of the robotic arm; the double-sided suction cup can selectively adsorb the upper end or the lower end of the wafer located on the temporary storage bracket.

2. The measuring instrument according to claim 1, characterized in that: The loading unit includes a loading and unloading base plate, a loading rack and an unloading rack disposed on the upper end of the loading and unloading base plate; the robotic arm is disposed between the loading rack and the unloading rack; openings for placing wafer boxes are disposed on the upper ends of the loading rack and the unloading rack; wherein, an inclined surface is disposed on the upper end of the loading rack; the inclined surface abuts against the upper end of the wafer box to make an angle between the plane of the wafer in the wafer box and the horizontal plane.

3. The measuring instrument according to claim 2, characterized in that: A guiding buckle plate is rotatably connected to the upper end of the unloading rack; the upper end of the wafer box is pressed between the upper end of the unloading rack and the guiding buckle plate; a plurality of slots are arrayed on the guiding buckle plate; the slots correspond one by one to the wafer slots in the wafer box.

4. The measuring instrument according to any one of claims 1-3, characterized in that: The measuring module includes a vertical plate slidably connected above the measuring base plate and two horizontal measuring heads respectively disposed at the upper and lower ends of the vertical plate; wherein, the horizontal measuring head located above is used for measuring the flatness of the high-precision flat crystal; the horizontal measuring head located below is used for measuring the flatness of the wafer.

5. The measuring instrument according to claim 4, characterized in that: An electric adjusting table is disposed between the horizontal measuring head located below and the vertical plate; a manual adjusting table is disposed between the horizontal measuring head located above and the vertical plate; the electric adjusting table and the manual adjusting table are respectively used for adjusting the height of the corresponding horizontal measuring head.

6. The measuring instrument according to claim 5, characterized in that: The measuring module further includes a thickness measuring head disposed at the lower end of the vertical plate; the electric adjusting table is disposed between the thickness measuring head and the vertical plate.

7. The measuring instrument according to any one of claims 1-3, characterized in that: Three positioning blocks are disposed on the upper end of the temporary storage bracket; the three positioning blocks are evenly distributed on the outer periphery of the inner bottom of the U-shaped opening; a guiding inclined surface is disposed on one side of the positioning block facing the inner bottom of the U-shaped opening.

8. The measuring instrument according to claim 7, characterized in that: Three groups of radial grooves are disposed on the upper end of the temporary storage bracket; the length direction of the radial grooves is along the radial direction of the inner bottom of the U-shaped opening; the positioning blocks are slidably connected in the corresponding radial grooves; the positioning blocks can be selectively fixed in the radial grooves.

9. The measuring instrument according to any one of claims 1-3, characterized in that: There are two gantries with different heights arranged at the upper end of the measurement base plate; among them, there are two high-precision parallel flats arranged at the upper end of the high gantry; there are two hollow openings respectively facing the corresponding high-precision parallel flats arranged at the lower end of the high gantry; a Y-direction linear module is arranged on the side of the low gantry facing the high-precision parallel flat; the measurement module is arranged on the moving end of the Y-direction linear module.

10. The measuring instrument according to any one of claims 1-3, characterized in that: The loading unit and the measurement unit respectively have independent frames and outer shells arranged on the outer periphery of the frames; casters are respectively arranged at the four corners of the lower end of the frames.

Images