Floor heating laying heat conduction structure

Abstract

The utility model relates to a floor heating laying heat conduction structure which is characterized in that the floor heating laying heat conduction structure comprises a heat preservation plate laid on the flat ground, a heat conduction plate is arranged on the heat preservation plate and made of metal materials, a bending groove where a heating source can be embedded is formed in the heat conduction plate, and the heating source can be a floor heating pipe or an electric heating film. For example, current graphene electric floor heating is adopted; curing agents are filled in gaps of the bending grooves, and a floor layer is laid on the heat conducting plate. The novel laying structure is energy-saving, less in laying labor and fast in temperature rise, the indoor space is saved to the greatest extent, the height of the internal space is increased, and the novel laying structure also has an obvious advantage in cost.

Description

Technical Field

[0001] The utility model relates to the technical field of floor heating, in particular to a floor heating laying heat-conducting structure. Background Art

[0002] To combat the harsh winter weather, more and more people are installing heating systems in their homes. Floor heating is popular for its ease of installation, rapid heating, and ability to maintain a consistent temperature throughout the entire room. Water heating involves laying pipes beneath the floor, circulating hot water or steam through the pipes. This unique two-way circulation of the thermal fluid within the pipes heats the floor to a specific temperature, which is then evenly radiated from the floor into the room, providing continuous heating. Water heating offers the advantages of easy operation, uniform heating, and environmental safety.

[0003] Traditional floor heating usually uses a 5-8 cm thick concrete layer to bury the floor heating pipes. With such a thick concrete layer, it takes 8 meters to heat 100 square meters per time for an average temperature increase of 20 degrees Celsius. 3 Natural gas, firstly, heats up slowly. Once it reaches the set temperature, it will continue to heat up, exceeding the comfortable temperature. Secondly, it is very wasteful. Such a thick concrete layer will also bring difficulties to the design of the house and reduce the height of the interior space. Summary of the Invention

[0004] The purpose of the present invention is to provide a heat-conducting structure for laying floor heating so as to solve the problems raised in the above-mentioned background technology.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical measures: a floor heating heat-conducting structure, which is characterized in that: it includes an insulation board laid on a flat ground, a heat-conducting plate is arranged on the insulation board, the heat-conducting plate is made of metal material, and a bending groove that can be embedded with a heat source is provided on the heat-conducting plate. The heat source can be a floor heating pipe or an electric heating film, such as the current graphene electric floor heating; the gap in the bending groove is filled with a curing agent, and the floor layer is laid on the heat-conducting plate.

[0006] Compared with the existing technology, the advantages of the present invention are: by placing the heat source in the bending groove of the metal heat conducting plate and fixing it with a curing agent, the metal heat conducting plate and the heat source form a heating whole, and then laying the floor on it. This new laying method is not only energy-saving, but also requires less labor for laying, heats up quickly, saves indoor space to the maximum extent, increases the height of the internal space, and also has obvious advantages in cost.

[0007] Here, the insulation board may be a hard insulation board or a soft insulation board or a combination thereof.

[0008] As an improvement of the present utility model, the material of the rigid insulation board can be polystyrene. The purpose of choosing this design is that polystyrene has good heat insulation performance, high strength, pressure resistance and other advantages. At the same time, it also has advantages such as anti-aging, corrosion resistance, water absorption resistance, and non-expansion, and is more suitable as the preferred material for the rigid insulation board. Of course, other materials with the same performance can also be used to achieve the same or better technical effects.

[0009] As an improvement of the present utility model, the material of the soft insulation board can be polyurethane. The purpose of choosing this design is that the polyurethane insulation board is a material with good heat insulation performance. It can effectively reduce the heat transfer between the inside and outside of the building, reduce energy consumption. At the same time, the polyurethane insulation board has the characteristics of light weight and high strength, and is suitable for the insulation of building walls, roofs, floors, etc. This material not only has good heat insulation performance, but also has excellent durability, which can effectively improve the heat insulation effect of the building. Of course, other materials with the same performance can also be used to achieve the same or better technical effects.

[0010] As an improvement of the present utility model, the curing agent can be selected as concrete. The purpose of choosing this design is that it is economical and affordable. Compared with other curing agents, the price of concrete is relatively affordable. Of course, other materials with the same performance can also be used to achieve the same or better technical effects.

[0011] As an improvement of the present utility model, the floor can be a hardwood board or floor tiles. The heat transfer effect of the hardwood floor is good. The floor tiles can be fixed to the heat conduction board with a cement adhesive. After the floor tiles are bonded with the cement adhesive, the ground is flat and firm, and the heat can be quickly transferred to the surface of the floor tiles. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The drawings forming a part of the present utility model are used to provide a further understanding of the present utility model. The schematic embodiments and descriptions thereof of the present utility model are used to explain the present utility model and do not constitute an improper limitation of the present utility model.

[0013] In the drawings:

[0014] Figure 1 is a schematic structural diagram of the floor heating described in the present utility model.

[0015] Figure 2 is a cross-sectional schematic diagram of the heat conduction board described in the present utility model.

[0016] Figure 3 is a schematic structural diagram of the floor heating with hardwood boards laid described in the present utility model.

[0017] Figure 4 is a schematic structural diagram of the floor heating with floor tiles laid described in the present utility model.

[0018] Description of reference numerals: 1, reflective film; 2, rigid thermal insulation board; 3, soft thermal insulation board; 4, heat conduction board; 5, floor heating pipe; 6, bending groove; 7, curing agent; 8, hard wooden board; 9, floor tile; 10, cement adhesive; 11, ground. Specific embodiments

[0019] The preferred embodiments of the present utility model will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only for the purpose of illustrating and explaining the present utility model, and are not used to limit the present utility model.

[0020] Embodiment 1

[0021] Please refer to Figure 1 -4.

[0022] A heat conduction structure for floor heating laying provided in this embodiment includes a thermal insulation board 3 laid on a flat ground 11. A heat conduction board 4 is provided on the thermal insulation board 3. The heat conduction board 4 is made of a metal material. A bending groove 6 capable of embedding a heat source 5 is provided on the heat conduction board 4. The heat source 5 can be a floor heating pipe or an electric heating film, such as the current graphene electric floor heating; a curing agent 7 is filled in the gap of the bending groove 6, and a floor layer is laid on the heat conduction board 4. Here, during implementation, a reflective film 1 can also be laid on the flat ground 11 first, and then the thermal insulation board 3 is laid on the reflective film 1, thereby reflecting the infrared heat transfer of the floor heating and further achieving the effects of heat insulation, energy conservation.

[0023] The thermal insulation board 3 can be a rigid thermal insulation board or a soft thermal insulation board or a combination thereof. In this embodiment, a rigid thermal insulation board 2 is first laid on the reflective film 1. The rigid thermal insulation board 2 usually has a relatively high density and has good mechanical strength and durability. The rigid thermal insulation board used can be polystyrene. Since polystyrene has good heat insulation performance, high strength, pressure resistance and other advantages, at the same time, it also has the advantages of anti-aging, corrosion resistance, non-absorbing water, non-expanding, etc., and is more suitable as the preferred material for the rigid thermal insulation board 2.

[0024] A soft thermal insulation board 3 can be further laid on the rigid thermal insulation board 2. The material of the soft thermal insulation board 3 can be polyurethane, etc.; the soft thermal insulation board 3 has compressive strength, low thermal conductivity and excellent fire resistance. It can bear the weight of the heat source 5 and the backfill layer and is suitable for occasions with softness and flexibility; the material of the soft thermal insulation board 3 is polyurethane. Since the polyurethane thermal insulation board is a material with good heat insulation performance, it can effectively reduce the heat transfer between the inside and outside of the building and reduce energy consumption. At the same time, the polyurethane thermal insulation board has the characteristics of light weight and high strength and is suitable for the thermal insulation of building walls, roofs, floors, etc. This material not only has good heat insulation performance, but also has excellent durability, and can effectively improve the heat insulation effect of the building.

[0025] On the soft heat-insulating board 3, a metal heat-conducting board 4 is further laid, and a floor is laid on the metal heat-conducting board 4. The metal heat-conducting board 4 can be aluminum, stainless steel, copper, etc. Among them, the metal plate is made into several bending grooves 6. The depth and width of the bending grooves 6 should be able to embed the heat source 5, and there should be a certain gap for later filling with the curing agent 7. When the heat source 5 is a hydrothermal floor heating pipe, the hot water transfers heat to the curing agent 7 during the flowing process, the curing agent 7 conducts the heat to the metal heat-conducting board 4, and the metal heat-conducting board 4 then evenly transfers the heat to the floor in two ways of conduction and radiation. Herein, the curing agent 7 can be concrete. Concrete is economical and affordable. Compared with other curing agents 7, the price of concrete is relatively more affordable.

[0026] The floor can be selected according to the needs of the user, such as Figure 3 the shown hardwood board 8 or Figure 4 the shown floor tile 9. The hardwood floor can be directly laid, and the floor tile 9 can be fixed to the heat-conducting board 4 by using a cement adhesive 10. After the floor tile 9 is bonded with the cement adhesive 10, it is flat and firm, and can quickly transfer the heat to the surface of the floor tile 9.

[0027] The beneficial effect of this embodiment lies in: by sequentially laying a reflective film 1, a rigid heat-insulating board 2, a soft heat-insulating board 3, a heat-conducting board 4 and a floor on the ground. This new laying method is not only energy-saving, but also requires less labor for laying, has a fast heating speed, saves indoor space to the greatest extent, increases the height of the internal space, and also has an obvious cost advantage.

[0028] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0029] In the description of the present invention, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0030] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A heat conduction structure for floor heating, characterized in that: It includes a heat-insulating board (3) laid on a flat ground (11), a heat-conducting board (4) is arranged on the heat-insulating board (3), the heat-conducting board (4) is made of a metal material, a bending groove (6) capable of embedding a heat source (5) is arranged on the heat-conducting board (4), a curing agent (7) is filled in the gap of the bending groove (6), and a floor layer is laid on the heat-conducting board (4).

2. The heat conduction structure for floor heating laying according to claim 1, characterized in that: The heat-insulating board (3) is a rigid heat-insulating board or a soft heat-insulating board or a combination thereof.

3. The heat conduction structure for floor heating laying according to claim 2, characterized in that: The rigid heat-insulating board can adopt polystyrene, and the material of the soft heat-insulating board (3) can adopt polyurethane, etc.

4. The heat conduction structure for floor heating laying according to claim 1, characterized in that The curing agent (7) is concrete, etc.

5. The heat conduction structure for floor heating laying according to claim 1, characterized in that The floor is a hardwood board (8) or floor tiles (9).

6. The heat conduction structure for underfloor heating laying according to claim 1, characterized in that The floor tiles (9) are fixed to the heat-conducting board (4) by using a cement adhesive (10).

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