Tracking device and tracking type scanner

Abstract

According to the tracking device and the tracking type scanner, the tracking device comprises the tracking device assembly and the temperature control part, and the temperature control part can refrigerate or heat the tracking device assembly in an active mode so as to control the temperature of the tracking device assembly to be within the preset temperature range when the tracking device works. Therefore, the tracking device can enable the temperature of the tracking device assembly to be within a preset temperature range under a low-temperature or high-temperature environment working condition, so that the problem of pixel offset cannot be generated when the tracking device works, the scanning precision of a tracking type scanner applying the tracking device can be ensured when the tracking type scanner works, and the working efficiency of the scanner is improved. And the tracking device can be used in a large temperature range scene.

Description

Technical Field

[0001] The utility model belongs to the technical field related to scanning instruments, and in particular relates to a tracking device and a tracking scanner. Background Art

[0002] The tracking device is a key component of a tracking scanner. During operation, heat generated by the tracking device is primarily concentrated in the photosensitive chip, main control board, and LED light board. Currently, existing tracking devices typically use passive natural cooling to dissipate heat. This involves attaching thermal pads to heat-concentrating components on the tracking device. These pads transfer the heat generated by these components to an aluminum alloy heat sink with fins, which is then distributed and cooled by a fan.

[0003] Among them, the pixel sensors and pixel stabilizers used on the photosensitive chip are the main heat sources. Since the photosensitive chip is connected to the frame, part of the heat generated by the photosensitive chip will be transferred to the frame and lens, causing the internal and external parameter coefficients of the tracking device to fluctuate, thereby reducing the scanning accuracy of the tracking scanner equipped with the tracking device. Utility Model Content

[0004] In view of this, it is necessary to provide a tracking device and a tracking scanner for solving the above technical problems.

[0005] A tracking device, the tracking device comprising:

[0006] Tracking device assembly;

[0007] A temperature control unit is used to actively cool or heat the tracking device assembly so as to control the temperature of the tracking device assembly to be within a preset temperature range when the tracking device is working.

[0008] It can be understood that by using a temperature control unit to control the temperature of the tracking device assembly within a preset temperature range, the tracking device can maintain the temperature of the tracking device assembly within the preset temperature range in either low or high temperature environments, so that pixel offset problems will not occur when the tracking device is working, thereby ensuring the scanning accuracy of the tracking scanner using the tracking device and enabling the use of the tracking device in scenarios with a wide temperature range.

[0009] In one embodiment, the temperature control unit is configured as a TEC cooling plate.

[0010] It can be understood that configuring the temperature control unit as a TEC cooling plate allows the temperature control unit to be made of local materials, which has the effect of reducing costs.

[0011] In one embodiment, a controller is integrated on the TEC refrigeration plate, and the controller is used to control the power on / off of the TEC refrigeration plate;

[0012] When the TEC cooling plate is powered on, the current on the TEC cooling plate can be conducted in a forward direction or a reverse direction.

[0013] It can be understood that the controller is used to control the power on and off of the TEC refrigeration plate, which can achieve self-locking control of the TEC refrigeration plate, and prevent the TEC refrigeration plate from generating a large amount of water vapor due to heating operation when the ambient temperature is low, thereby playing a role of waterproof monitoring; and the forward or reverse conduction of the current when the TEC refrigeration plate is powered on can meet the use requirements of heating or cooling when the TEC refrigeration plate is working.

[0014] In one embodiment, the tracking device further comprises a temperature sensor, which is mounted on the frame and configured to detect the temperature of the frame and generate a feedback signal;

[0015] Wherein, the temperature control unit can control the temperature of the skeleton according to the feedback signal.

[0016] It can be understood that the temperature sensor on the skeleton is used to detect the temperature of the skeleton to control the operation of the temperature control unit. In this way, the temperature compensation point and the temperature feedback detection point of the skeleton can be the same control point, which has the effect of simplifying the structure and reducing costs.

[0017] In one embodiment, the tracking device assembly includes a frame and a lens, wherein the lens is mounted on the frame;

[0018] Wherein, the temperature of the skeleton when the tracking device is working can be controlled by the temperature control unit.

[0019] It can be understood that, through the above-mentioned structural setting, the temperature control unit can be used to control the temperature of the frame, which can prevent the problem of pixel offset caused by thermal expansion and contraction of the frame.

[0020] In one embodiment, the tracking device assembly further comprises a tube hoop, and the lens can be mounted on the frame through the tube hoop;

[0021] Wherein, the temperature of the sleeve hoop when the tracking device is working can be controlled by the temperature control unit.

[0022] It can be understood that, through the above-mentioned structural setting, the temperature control unit can be used to control the temperature of the tube hoop, which can prevent the problem of pixel offset caused by thermal expansion and contraction of the tube hoop from occurring.

[0023] In one embodiment, the tracking device assembly includes a frame, a lens, and a circuit board, wherein the circuit board is mounted on the frame and electrically connected to the lens for controlling the operation of the lens;

[0024] Wherein, the temperatures of the skeleton and the circuit board when the tracking device is working can be controlled by the temperature control unit.

[0025] It can be understood that, through the above-mentioned structural setting, the temperature control unit can be used to control the temperature of the circuit board, so that the circuit board's control over the lens operation is not affected by the external ambient temperature.

[0026] In one embodiment, a photosensitive chip and a computing power chip are integrated on the circuit board, and the photosensitive chip and the computing power chip are thermally connected to the temperature control unit respectively.

[0027] In one embodiment, the tracking device assembly includes a frame, a circuit board, and a heat dissipation component, wherein the heat dissipation component is mounted on the frame and thermally connected to the circuit board for dissipating heat from the circuit board;

[0028] Wherein, the temperature control unit is installed on the heat dissipation component.

[0029] It can be understood that the temperature control unit is assembled to the heat dissipation component so that the temperature control unit can control the temperature of the circuit board and realize the temperature control of the skeleton. This ensures that the overall temperature of the skeleton is within the preset temperature range and does not cause pixel offset problems due to thermal expansion and contraction of the skeleton.

[0030] The present application also provides a tracking scanner, comprising the tracking device described above.

[0031] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0032] The tracking device and tracking scanner claimed for protection in the present application use a temperature control unit to control the temperature of the tracking device assembly within a preset temperature range. This allows the tracking device assembly to maintain a temperature within the preset temperature range in either low or high temperature operating conditions, preventing pixel offset issues from occurring during operation of the tracking device. This ensures the scanning accuracy of the tracking scanner equipped with the tracking device and enables the use of the tracking device in scenarios with a wide temperature range. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0034] Figure 1 A schematic diagram of the structure of a tracking device provided in one embodiment of the present application.

[0035] Figure 2 This is the working principle diagram when the medium temperature control in this application is configured as a TEC cooling plate.

[0036] Figure 3 Schematic diagram of heat transfer between the temperature control unit, computing chip, photosensitive chip, frame and lens in this application.

[0037] Figure 4 This is the working logic diagram of the TEC cooling plate in this application.

[0038] Figure numerals: 100, tracking device; 10, tracking device assembly; 11, frame; 12, lens; 121, tube hoop; 13, circuit board; 131, photosensitive chip; 132, computing power chip; 14, heat dissipation component; 20, temperature control unit; 21, TEC cooling plate; 101, flexible thermal conductor. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0040] It should be noted that when an element is referred to as being “provided on” another element, it may be directly provided on the other element or there may be an intermediate element. When an element is considered to be “provided on” another element, it may be directly provided on the other element or there may be an intermediate element. When an element is considered to be “fixed to” another element, it may be directly fixed to the other element or there may be an intermediate element.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification are intended solely for the purpose of describing specific embodiments and are not intended to limit this invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0042] like Figure 1 As shown, the tracking device 100 provided in one embodiment of the present application includes a tracking device assembly 10 and a temperature control unit 20. The temperature control unit 20 can actively cool or heat the tracking device assembly 10, so as to control the temperature of the tracking device assembly 10 to be within a preset temperature range when the tracking device 100 is in operation. For example, the preset temperature range can be set according to the temperature range of the tracking device assembly 10 when it is factory calibrated, or it can be set according to other temperature ranges. It is only necessary to control the temperature of the tracking device assembly 10 within the preset temperature range that ensures its accuracy. This embodiment does not limit this. The temperature control unit 20 can be a TEC cooling plate 21, or it can be set as other elements or combinations thereof that can actively cool and / or heat. This embodiment does not limit this.

[0043] In this way, the tracking device 100 can keep the temperature of the tracking device assembly 10 within a preset temperature range in low or high temperature environments, so that there will be no pixel offset problem when the tracking device 100 is working, thereby ensuring the scanning accuracy of the tracking scanner using the tracking device 100 and enabling the use of the tracking device 100 in scenarios with a wide temperature range.

[0044] It should be noted that the aforementioned low-temperature environmental conditions specifically refer to environmental conditions with an ambient temperature below 20°C and above 13°C, and the high-temperature environmental conditions specifically refer to environmental conditions with an ambient temperature above 20°C. When the tracking device 100 of the present application is in operation, if the heat dissipation from the heat dissipation assembly 14 to the circuit board 13 is insufficient to maintain the temperature of the frame 11 within a preset temperature range, the temperature control unit 20 is activated to cool the frame 11. If the heat dissipation from the heat dissipation assembly 14 to the circuit board 13 is sufficient to maintain the temperature of the frame 11 within the preset temperature range, the temperature control unit 20 may be deactivated, thereby saving energy.

[0045] like Figure 1 As shown, the tracking device assembly 10 includes a frame 11 and a lens 12, with the lens 12 mounted on the frame 11. The temperature of the frame 11 during operation of the tracking device 100 can be controlled by a temperature control unit 20. In other words, the temperature control unit 20 can be used to control the temperature of the frame 11, thereby preventing pixel shift caused by thermal expansion and contraction of the frame 11.

[0046] like Figure 1 As shown, the tracking device assembly 10 further includes a collar 121, through which the lens 12 can be mounted on the frame 11. Furthermore, the temperature of the collar 121 during operation of the tracking device 100 can be controlled by a temperature control unit 20. In other words, the temperature control unit 20 can also be used to control the temperature of the collar 121 to prevent pixel shift caused by thermal expansion and contraction of the collar 121.

[0047] like Figure 1 As shown, the tracking device assembly 10 also includes a circuit board 13. The circuit board 13 is mounted on the frame 11 and electrically connected to the lens 12, and is used to control the operation of the lens 12. Furthermore, the temperature of the circuit board 13 during operation of the tracking device 100 can be controlled by a temperature control unit 20. In other words, the temperature control unit 20 can also be used to control the temperature of the circuit board 13, thereby ensuring that the circuit board 13's control of the lens 12 is not affected by the ambient temperature.

[0048] like Figure 1 、 Figure 3 As shown, a photosensitive chip 131 is integrated on the circuit board 13. The photosensitive chip 131 is thermally connected to the temperature control unit 20 and the frame 11, respectively. This allows the heat generated by the photosensitive chip 131 during operation of the tracking device 100 to be transferred simultaneously to the temperature control unit 20 and the frame 11. In other words, the temperature control unit 20 can control the temperature change of the photosensitive chip 131 during operation. It should be noted that the heat generated by the photosensitive chip 131 during operation can also be transferred to the heat dissipation assembly 14, which dissipates the heat from the photosensitive chip 131.

[0049] As preferably, Figure 1 As shown, the photosensitive chip 131 is thermally connected to the temperature control unit 20 and / or the frame 11 using a flexible thermal conductor 101. The flexible thermal conductor 101 can be configured as nanocarbon copper foil or graphene copper foil. By utilizing the material properties of the nanocarbon copper foil or graphene copper foil, rapid temperature transfer between the photosensitive chip 131 and the temperature control unit 20 and / or the frame 11 can be achieved. Here, the photosensitive chip 131 is thermally connected to both the temperature control unit 20 and the frame 11 using graphene copper foil.

[0050] like Figure 1 As shown, a computing power chip 132 is also integrated on the circuit board 13. The computing power chip 132 is thermally connected to the temperature control unit 20, so that the temperature control unit 20 can control the temperature change of the computing power chip 132 when working.

[0051] It should be noted that if Figure 3As shown, the heat transfer path between the photosensitive chip 131, computing chip 132, frame 11, and lens 12 within the tracking device 100 of the present application is, in order: environment, computing chip 132, photosensitive chip 131, frame 11, lens 12, and environment. Convection and radiation are used to exchange heat between the photosensitive chip 131 and the environment, conduction is used to exchange heat between the photosensitive chip 131, frame 11, and lens 12, and convection and radiation are used to exchange heat between the lens 12 and the environment. Furthermore, the aforementioned heat transfer path is indirectly affected by heating from the environment by other components of the tracking device 100, such as the mainboard and LED board. Since the thermal conductivity and convection heat transfer coefficients of air are very small, the heat effect of this portion can be ignored. Here, the temperature change at the photosensitive chip 131 is the primary factor affecting the deformation of the frame 11 and lens 12. Therefore, a temperature control unit 20 is used to control the temperature of the photosensitive chip 131, thereby ensuring that the temperature of the frame 11 remains within a preset temperature range.

[0052] like Figure 1 As shown, the tracking device assembly 10 also includes a heat sink assembly 14, which is mounted on the frame 11 and thermally connected to the circuit board 13 for dissipating heat from the circuit board 13. Here, a temperature control unit 20 is mounted on the heat sink assembly 14. By controlling the temperature of the heat sink assembly 14, the temperature control unit 20 can control the temperature of the frame 11, the sleeve 121, and the circuit board 13, thereby ensuring that the temperature of the entire tracking device assembly 10 remains within a preset temperature range. Of course, in other embodiments, the temperature control unit 20 can also be mounted on the frame 11, or on other components of the tracking device 100 that are thermally connected to the frame 11.

[0053] like Figure 2 As shown, the temperature control unit 20 is configured as a TEC refrigeration plate 21. By utilizing the structural characteristics of the TEC refrigeration plate 21, the tracking device 100 can control the direction of current flow when the TEC refrigeration plate 21 is energized, thereby controlling whether the TEC refrigeration plate 21 cools or heats the frame 11 during operation. This not only facilitates the control of the TEC refrigeration plate 21, but also allows the temperature control unit 20 to be made from locally available materials, thereby reducing costs. Of course, in other embodiments, the temperature control unit 20 can also be configured as other semiconductor refrigeration plates or other accessories that can actively perform cooling or heating operations.

[0054] In one embodiment, a controller (not shown) is integrated with the TEC cooling element 21. The controller is used to control the power on and off of the TEC cooling element 21. This provides self-locking control of the TEC cooling element, preventing the TEC cooling element 21 from operating in low ambient temperatures, thereby providing waterproof monitoring. Specifically, when the ambient temperature of the TEC cooling element 21 falls below 13°C, the controller disconnects the TEC cooling element from power.

[0055] In one embodiment, the tracking device 100 further includes a temperature sensor (not shown), which is mounted on the skeleton 11 and is used to detect the temperature of the skeleton 11 and generate a feedback signal; wherein the temperature control unit 20 is capable of controlling the temperature of the skeleton 11 based on the feedback signal. In other words, the tracking device 100 uses the temperature compensation point and the temperature feedback detection point of the skeleton 11 as the same control point, which simplifies the structure and reduces costs. It should be noted that there is a linear relationship between the temperature of the skeleton 11 and the amount of deformation of the skeleton 11 due to thermal expansion and contraction, wherein the deformation of the skeleton 11 specifically includes deformation in the horizontal direction and deformation in the rotational direction.

[0056] like Figure 4 As shown, when the tracking device 100 of the present application is in operation, when the ambient temperature is above 20°C, the TEC refrigeration plate 21 conducts a forward current, controlling the TEC refrigeration plate 21 to cool the frame 11, thereby controlling the temperature of the frame 11 within a preset temperature range. During this process, the heat dissipation component 14 simultaneously dissipates heat from the circuit board 13, thereby preventing the frame 11 from expanding and deforming due to excessive temperature. When the ambient temperature is below 20°C and above 13°C, the TEC refrigeration plate 21 conducts a reverse current, controlling the TEC refrigeration plate 21 to heat the frame 11, thereby controlling the temperature of the frame 11 within a preset temperature range. During this process, the heat dissipation component 14 stops dissipating heat from the circuit board 13 by air cooling, thereby preventing the frame 11 from shrinking and deforming due to excessively low temperature.

[0057] In addition, the present application also provides a tracking scanner, including the tracking device 100 described above.

[0058] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] Those skilled in the art should recognize that the above embodiments are merely intended to illustrate the present invention and are not intended to limit the present invention. As long as they are within the spirit of the present invention, appropriate changes and modifications to the above embodiments are within the scope of protection claimed by the present invention.

Claims

1. A tracking device, characterized in that: The tracking device (100) comprises: Tracking device assembly (10); A temperature control unit (20) is used to cool or heat the tracking device assembly (10) in an active manner, so as to control the temperature of the tracking device assembly (10) to be within a preset temperature range when the tracking device (100) is working.

2. The tracking device according to claim 1, wherein The temperature control unit (20) is configured as a TEC refrigeration plate (21).

3. The tracking device according to claim 2, characterized in that A controller is integrated on the TEC refrigeration plate (21), and the controller is used to control power on / off of the TEC refrigeration plate (21); When the TEC refrigeration plate (21) is energized, the current on the TEC refrigeration plate (21) can be conducted in a forward direction or a reverse direction.

4. The tracking device according to claim 1, wherein: The tracking device (100) further includes a temperature sensor, which is mounted on the tracking device assembly (10) and is used to detect the temperature of the tracking device assembly (10) and generate a feedback signal; The temperature control unit (20) is capable of controlling the temperature of the tracking device assembly (10) according to the feedback signal.

5. The tracking device according to claim 1, wherein: The tracking device assembly (10) comprises a frame (11) and a lens (12), wherein the lens (12) is mounted on the frame (11); The temperature of the skeleton (11) when the tracking device (100) is working can be controlled by the temperature control unit (20).

6. The tracking device according to claim 5, characterized in that The tracking device assembly (10) further includes a tube hoop (121), and the lens (12) can be mounted on the frame (11) through the tube hoop (121); The temperature of the sleeve hoop (121) when the tracking device (100) is working can be controlled by the temperature control unit (20).

7. The tracking device according to claim 1, wherein: The tracking device assembly (10) comprises a frame (11), a lens (12) and a circuit board (13), wherein the circuit board (13) is mounted on the frame (11) and electrically connected to the lens (12) for controlling the operation of the lens (12); The temperatures of the skeleton (11) and the circuit board (13) when the tracking device (100) is working can be controlled by the temperature control unit (20).

8. The tracking device according to claim 7, characterized in that A photosensitive chip (131) and a computing chip (132) are integrated on the circuit board (13), and the photosensitive chip (131) and the computing chip (132) are thermally connected to the temperature control unit (20) respectively.

9. The tracking device according to claim 1, wherein: The tracking device assembly (10) comprises a frame (11), a circuit board (13) and a heat dissipation component (14); the heat dissipation component (14) is mounted on the frame (11) and thermally connected to the circuit board (13) for dissipating heat from the circuit board (13); Wherein, the temperature control unit (20) is installed on the heat dissipation component (14).

10. A tracking scanner, characterized in that: The tracking device (100) comprises any one of claims 1 to 9.

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