Square dispensing head for coating and bonding chips

Abstract

The utility model relates to the technical field of chip coating, and provides a square dispensing head for coating and bonding a chip, which comprises a dispensing head main body, a connecting screw rod is arranged at the top end of the dispensing head main body, a positioning block is arranged on the outer side wall of the connecting screw rod, and the top end of the connecting screw rod is in threaded connection with a connecting screw sleeve. The top end of the connecting thread sleeve is in threaded connection with a liquid injection pipe, a square dispensing head is installed at the bottom end of the dispensing head main body, the square dispensing head is installed at the bottom end of the dispensing head main body in a square shape, and a supporting piece is further installed between the dispensing head main body and the square dispensing head; the design size of the square dispensing head is larger, so that each chip only needs to be dipped in glue once, the production efficiency is greatly improved, the precision is high, the square dispensing head can control the shape of the glue more accurately, the glue point is closer to a square shape, the area occupied by an IC wafer is reduced, and a larger operation space is provided for the subsequent process.

Description

Technical Field

[0001] The utility model relates to the technical field of chip coating, in particular to a square dispensing head for coating and bonding chips. Background Art

[0002] The electronic semiconductor packaging industry primarily uses two methods for attaching chips to lead frames: gluing and flip-chip metal bonding. Gluing requires applying a dot of glue to the lead frame tailored to the chip size. The chip is then secured to the dot by transferring the chip. Glues used in the industry are generally categorized as insulating resin glue and conductive silver paste, while the glue application methods include injection and dispensing. The needle designed in this patent is primarily used for chip bonding using the coating method.

[0003] In addition to bonding RGB chips inside lamp beads so that the lamp beads can light up, the industry has developed integrated lamp-driver products, which encapsulate the LED driver chip and RGB chip together. Such products can optimize component size and reduce the cost of drivers and other devices required for lamp bead mounting. For example, according to the patent with publication number CN201910894930.9, the current dispensing heads used in the LED packaging industry are round and fixed in size. The angle of the needle can be changed to accommodate LED chips of different sizes. However, the maximum size of an LED chip does not exceed 350um, and IC wafers have more stringent requirements for the size of glue dots. Conventional-sized dispensing heads are not suitable for bonding IC wafers inside integrated lamp-driver products. The glue dots for a single operation are small, and the efficiency of multiple operations is low. This patent solves the efficiency and yield issues of bonding IC wafers inside LED package brackets during the production process.

[0004] Therefore, those skilled in the art have proposed a square dispensing head for coating and bonding chips to solve the problems raised in the background art. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a square dispensing head for coating and bonding chips, so as to solve the problems that the conventional size dispensing head in the existing technology is not suitable for bonding IC wafers in integrated lamp driver products, the glue dots in a single operation are small, and the efficiency of multiple operations is low.

[0006] A square dispensing head for coating and bonding chips includes a dispensing head body, a connecting screw is installed at the top of the dispensing head body, a positioning block is installed on the outer wall of the connecting screw, the top of the connecting screw is threadedly connected to a connecting screw sleeve, the top of the connecting screw sleeve is threadedly connected to an injection tube, and a square dispensing head is installed at the bottom end of the dispensing head body.

[0007] Preferably, the square dispensing head is installed in a square shape at the bottom end of the dispensing head body, and a support is installed between the dispensing head body and the square dispensing head.

[0008] Preferably, the connecting screw sleeve is used to limit the position between the injection tube and the connecting screw rod. The setting of the connecting screw sleeve can facilitate the cleaning of the injection tube and the connecting screw rod.

[0009] Preferably, the positioning block is used to determine whether the dispensing head body is installed in a correct position.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] 1. High efficiency: The larger square dispensing head design allows each chip to be dipped in glue only once, significantly improving production efficiency.

[0012] 2. High precision: The square dispensing head can control the shape of the glue more accurately, making the glue dots closer to a square, thereby reducing the area occupied by the IC wafer and providing more operating space for subsequent processes.

[0013] 3. High Performance: This technology ensures the integrity of the adhesive bond in a single pass, achieving a die bonding speed of up to 37k / h. Furthermore, this technology avoids gaps or bubbles in the adhesive when filling the bottom of the die, thereby improving die bonding reliability.

[0014] 4. Long life: As the force-bearing area of the dispensing head increases, the pressure per unit area decreases, which significantly extends the service life of the dispensing head.

[0015] 5. Reduce costs: By applying this patented technology, enterprises can improve machine efficiency, reduce labor costs, and improve product quality, thereby effectively reducing the production costs of applicable product types and bringing significant benefits to the enterprise. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0017] Figure 2 For this utility model Figure 1 Schematic diagram of explosion structure in ;

[0018] Figure 3 For this utility model Figure 1 Schematic diagram of the front view structure.

[0019] In the figure: 1. Dispensing head body; 2. Connecting screw; 3. Positioning block; 4. Connecting screw sleeve; 5. Liquid injection tube; 6. Square dispensing head. DETAILED DESCRIPTION

[0020] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0021] As attached Figure 1-3 As shown: Example 1: The utility model provides a square dispensing head for coating and bonding chips, including a dispensing head main body 1, a connecting screw 2 is installed at the top of the dispensing head main body 1, a positioning block 3 is installed on the outer wall of the connecting screw 2, the top of the connecting screw 2 is threadedly connected to a connecting screw sleeve 4, the top of the connecting screw sleeve 4 is threadedly connected to a liquid injection tube 5, and a square dispensing head 6 is installed at the bottom end of the dispensing head main body 1. The square dispensing head 6 is square and installed at the bottom end of the dispensing head main body 1, and a support is also installed between the dispensing head main body 1 and the square dispensing head 6.

[0022] Specifically, by providing the connecting screw sleeve 4 , the liquid injection tube 5 and the connecting screw 2 can be easily disassembled, and the liquid injection tube 5 and the dispensing head body 1 can be easily cleaned.

[0023] The connecting screw sleeve 4 is used to limit the position between the injection tube 5 and the connecting screw 2. The setting of the connecting screw sleeve 4 can facilitate the cleaning of the injection tube 5 and the connecting screw 2. The positioning block 3 is used to determine whether the installation position of the dispensing head body 1 is correct.

[0024] As can be seen from the above, the positioning block 3 is used to confirm the direction of the entire dispensing head to ensure the same direction during replacement;

[0025] The square dispensing head 6 contacts the surface of the glue / bracket and absorbs the glue so that the glue adheres to the surface of the bracket.

[0026] When the equipment needs to be cleaned, the liquid injection pipe 5 and the connecting screw sleeve 4 can be disassembled to facilitate cleaning of the interior.

[0027] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include one or more of such features. "Multiple" means two or more, unless otherwise specifically defined.

[0028] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0029] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0030] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art may combine and combine the different embodiments or examples and the features of different embodiments or examples described in this specification without contradiction.

[0031] In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

[0032] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A square dispensing head for coating and bonding chips, characterized by: The invention comprises a dispensing head body (1), wherein a connecting screw (2) is installed at the top end of the dispensing head body (1), a positioning block (3) is installed on the outer wall of the connecting screw (2), a connecting screw sleeve (4) is threadedly connected to the top end of the connecting screw sleeve (4), a liquid injection tube (5) is threadedly connected to the top end of the connecting screw sleeve (4), and a square dispensing head (6) is installed at the bottom end of the dispensing head body (1).

2. A square dispensing head for coating and bonding chips as claimed in claim 1, characterized in that: The square dispensing head (6) is installed in a square shape at the bottom end of the dispensing head body (1), and a support is also installed between the dispensing head body (1) and the square dispensing head (6).

3. A square dispensing head for coating and bonding chips as claimed in claim 1, characterized in that: The connecting screw sleeve (4) is used for limiting the position between the liquid injection pipe (5) and the connecting screw rod (2). The provision of the connecting screw sleeve (4) can facilitate cleaning of the liquid injection pipe (5) and the connecting screw rod (2).

4. A square dispensing head for coating and bonding chips as claimed in claim 1, characterized in that: The positioning block (3) is used to determine whether the installation position of the dispensing head body (1) is correct.

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