Middle frame assembly and electronic equipment
By setting grounding sections on the outer peripheral surface of the coaxial line and forming a grounding path with the middle frame body, the signal interference problem caused by the separation of the antenna main board and the sub-board is solved, and the signal quality of the electronic equipment is improved.
Patent Information
- Application Number
- CN202422338406.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-09-24
AI Technical Summary
In electronic devices, the separation of the antenna main board and the antenna sub-board leads to a longer coaxial length, affecting the antenna signal quality and reducing the user experience.
A grounding section is provided on part of the outer peripheral surface of the coaxial line, and a grounding path is formed with the middle frame body through the bracket assembly to reduce antenna signal interference.
Improves the antenna signal quality and improves the user experience.
Smart Images
Figure CN223218452U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of electronic devices, and in particular to a middle frame assembly and an electronic device. Background Art
[0002] The antenna module in the electronic device includes an antenna main board and an antenna sub-board which are separately arranged. The coaxial line is used to connect the antenna main board and the antenna sub-board, so that a signal path is formed between the antenna main board and the antenna sub-board. Utility Model Content
[0003] To overcome the problems existing in the related art, the present disclosure provides a middle frame assembly and an electronic device.
[0004] According to an embodiment of the present disclosure, a middle frame assembly is provided, including:
[0005] Middle frame body;
[0006] A bracket assembly connected to the middle frame body;
[0007] The coaxial line has a grounding section on a portion of its outer circumference, the grounding section is connected to the bracket assembly, and the grounding section forms a grounding path with the middle frame body through the bracket assembly.
[0008] In some embodiments, the bracket assembly includes a conductive bracket having a slot, the slot is formed by bending a portion of the conductive bracket, and the grounding section is disposed in the slot.
[0009] In some embodiments, the card slot includes a bottom wall and two inclined side walls, the two side walls are respectively provided on both sides of the bottom wall, and the two side walls and the bottom wall enclose the card slot;
[0010] Wherein, the width of the card slot gradually decreases from the bottom wall of the card slot to the opening of the card slot.
[0011] In some embodiments, the slot is interference fit with the grounding section.
[0012] In some embodiments, the diameter of the inscribed circle of the slot is 0.06 mm to 0.1 mm smaller than the diameter of the grounding segment.
[0013] In some embodiments, the conductive bracket is connected to the middle frame body via a fastener;
[0014] The surface of the conductive bracket has a plurality of protrusions, and the plurality of protrusions are arranged around the fastener. In the assembled state, the plurality of protrusions abut against the middle frame body, and / or the plurality of protrusions abut against the fastener.
[0015] In some embodiments, the bracket assembly further includes a bracket body, and the bracket body is integrally formed with the conductive bracket.
[0016] In some embodiments, the bracket body has an avoidance area, the avoidance area penetrates the bracket assembly along the thickness direction of the bracket body, and the card slot is located in the avoidance area.
[0017] In some embodiments, a receiving groove is provided on the top surface of the bracket body, the receiving groove is formed by a depression on the surface of the bracket body away from the conductive bracket, and the receiving groove is connected to the avoidance area and the clamping slot;
[0018] The coaxial line is disposed in the accommodating groove and the clamping groove.
[0019] According to a second aspect of the present disclosure, an electronic device is provided, including a device body and the middle frame assembly as described in the first aspect.
[0020] The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: by setting a grounding segment on part of the outer circumference of the coaxial line, the grounding segment is connected to the middle frame body through a bracket assembly to form a grounding path, thereby reducing the interference to the antenna signal in the coaxial line and helping to improve the signal quality.
[0021] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.
[0023] Figure 1 The figure is a schematic diagram of an electronic device according to an exemplary embodiment.
[0024] Figure 2 The figure is a schematic diagram showing a middle frame assembly according to an exemplary embodiment.
[0025] Figure 3 FIG. 1 is an exploded view of a middle frame assembly according to an exemplary embodiment.
[0026] Figure 4 is a schematic diagram showing a conductive bracket according to an exemplary embodiment.
[0027] Figure 5 It is a schematic diagram showing the matching between the card slot and the coaxial line according to an exemplary embodiment.
[0028] Figure 6 yes Figure 2Cross-sectional view along the AA direction.
[0029] Figure 7 is a schematic diagram showing a conductive bracket according to an exemplary embodiment. DETAILED DESCRIPTION
[0030] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
[0031] In related technologies, for example, the antenna main board and the antenna sub-board are respectively arranged at the top and bottom of the electronic device, resulting in a longer distance between the antenna main board and the antenna sub-board. Correspondingly, the length of the coaxial line used to electrically connect the antenna main board and the antenna sub-board is also longer. The longer coaxial line causes the antenna signal to be reduced, affecting the user experience.
[0032] To address the problems in the related art, embodiments of the present disclosure provide a middle frame assembly and electronic device. The middle frame assembly includes a middle frame body, a bracket assembly, and a coaxial line. The bracket assembly is connected to the middle frame body, and the coaxial line is disposed on the bracket assembly. A grounding segment is provided on a portion of the outer periphery of the coaxial line. The grounding segment is connected to the bracket assembly and forms a grounding path with the middle frame body through the bracket assembly. In the present disclosure, by providing a grounding segment on a portion of the outer periphery of the coaxial line, and connecting the grounding segment to the middle frame body through the bracket assembly to form a grounding path, interference with antenna signals in the coaxial line is reduced, thereby improving signal quality.
[0033] According to an exemplary embodiment of the present disclosure, Figure 1 As shown, an embodiment of the present disclosure provides a middle frame assembly 100, which is applied to electronic devices, such as smart phones, tablet computers, laptop computers, and smart wearable devices.
[0034] like Figure 1 As shown, the middle frame assembly 100 includes a middle frame body 10. The middle frame body 10 has the function of strengthening the body structure of the electronic device and protecting internal components, such as the motherboard, battery, antenna module, camera module, and speaker assembly. The middle frame body 10 can be made of metal materials such as aluminum alloy and titanium alloy, or plastic materials.
[0035] like Figure 1 and Figure 2As shown, the middle frame assembly 100 further includes a bracket assembly 20, which is connected to the middle frame body 10. The bracket assembly 20 can be any bracket between the antenna main board 201 and the antenna sub-board 202, such as a speaker bracket, main board, small board, battery compartment, etc.
[0036] like Figure 1 and Figure 2 As shown, the middle frame assembly 100 also includes a coaxial line 30, which is mounted on the bracket assembly 20. The coaxial line 30 is a broadband microwave transmission line consisting of two coaxial cylindrical conductors, with air or a high-frequency dielectric filling the space between the inner and outer conductors. In the field of electronic equipment, the coaxial line 30 is generally used for high-frequency transmission, such as connecting the antenna main board 201 and the antenna sub-board 202 to transmit antenna signals.
[0037] See Figure 5 A grounding segment 32 is formed on a portion of the outer circumference of the coaxial line 30 . A portion of the structure of the bracket assembly 20 (the conductive bracket 21 , which will be described in detail later) is conductive. The conductive bracket 21 is connected to the grounding segment 32 and the middle frame body 10 , respectively, so that the grounding segment 32 forms a grounding path with the middle frame body 10 through the bracket assembly 20 .
[0038] In one example, see Figure 5 The coaxial line 30 includes a main body 31 and a grounding section 32. The grounding section 32 can be a metal ring sleeved on the outside of the main body 31. The grounding section 32 is electrically connected to the wire in the main body 31, so that the grounding section 32 can electrically connect the main body 31 to the bracket assembly 20.
[0039] In another example (not shown in the drawings), the grounding segment can also be a convex column or a protrusion evenly distributed along the circumferential direction of the main body. In the radial direction of the main body, the radial inner side of the grounding segment is electrically connected to the main body, and the radial outer side of the grounding segment can be electrically connected to the bracket body, so that the wire in the coaxial line is electrically connected to the bracket assembly.
[0040] In the embodiment of the present disclosure, a grounding section is provided on part of the outer circumference of the coaxial line. The grounding section is connected to the middle frame body through the bracket assembly 20 to form a grounding path, thereby reducing interference to the antenna signal in the coaxial line and improving signal quality.
[0041] In an exemplary embodiment, Figure 1 and Figure 2As shown, an embodiment of the present disclosure provides a middle frame assembly 100, which includes a middle frame body 10, a bracket assembly 20 and a coaxial line 30. The bracket assembly 20 is connected to the middle frame body 10, and the coaxial line 30 is arranged on the bracket assembly 20. Part of the outer periphery of the coaxial line 30 is provided with a grounding section 32. The grounding section 32 is connected to the bracket assembly 20 and forms a grounding path with the middle frame body 10 through the bracket assembly 20.
[0042] like Figures 2 to 4 As shown, the bracket assembly 20 includes a conductive bracket 21 . The conductive bracket 21 has a slot 211 . The slot 211 is formed by bending a portion of the conductive bracket 21 .
[0043] In some embodiments, see Figures 2 to 5 The slot 211 includes a bottom wall 2111 and two inclined side walls 2112. The two side walls 2112 are respectively arranged on both sides of the bottom wall 2111. The two side walls 2112 and the bottom wall 2111 are combined to form the slot 211. The grounding section 32 of the coaxial line 30 can abut against the side walls 2112 and the bottom wall 2111, thereby being confined in the slot 211.
[0044] Among them, see Figure 5 , from the bottom wall 2111 of the slot 211 to the opening direction of the slot 211 ( Figure 3 In the z-direction (as shown in FIG), the width of the slot 211 gradually decreases. For example, the slot 211 may be trapezoidal in shape, with the short side of the trapezoid forming the opening of the slot 211. In this embodiment, by gradually reducing the width of the slot 211, the bottom wall 2111 and the two side walls 2112 can limit the grounding segment 32 from three different directions, thereby reducing or preventing the grounding segment 32 from falling out of the slot 211 and improving assembly reliability. Furthermore, because the slot 211 is formed by bending the structure in the conductive bracket 21, there is no need to add a fixing structure within the electronic device, thereby not affecting the internal space stacking of the electronic device.
[0045] It can be understood that the width of the slot 211 is the distance between the two opposite side walls 2112. In one example, see Figure 5, the side walls 2112 can be bent into a state inclined relative to the bottom wall 2111, such that the distance between the two side walls 2112 gradually decreases, thereby gradually reducing the width of the card slot 211. The angle between the side wall 2112 and the bottom wall 2111 can be any value between 45° and 75°, such as 52°, 60°, 71° or 75°. In another example (not shown in the drawings), the thickness of the side wall can be adjusted such that the thickness of the side of the side wall away from the bottom wall gradually increases, so as to... In yet another example (not shown in the drawings), the side wall 2112 can be bent to an inclined state and the thickness of the side wall 2112 can be adjusted.
[0046] In some other embodiments (not shown in the drawings), the card slot includes a bottom wall, side walls and a top wall. The side walls and the top wall form an "L"-shaped bent structure, and the bottom wall and the bent portions enclose to form a "匚"-shaped structure. It can be understood that the width of the card slot provided in this example also gradually decreases. The width is the distance between the top wall and the bottom wall, and the gradually shrinking direction is from the side wall to the opening.
[0047] Among them, referring to Figure 5 , in the assembled state, the card slot 211 and the grounding section 32 are in interference fit. The interference fit means that the card slot 211 and the grounding section 32 are tightly fitted. For example, the card slot 211 presses against and adheres to the grounding section 32 to prevent the grounding section 32 from disengaging from the card slot 211. Exemplarily, the diameter of the inscribed circle of the card slot 211 is 0.06 mm - 0.1 mm smaller than the diameter of the grounding section 32 in the natural state.
[0048] In some optional embodiments, referring to Figure 5 , two flaring structures 2113 are provided at the opening of the card slot 211. For example, the side wall 2112 can be bent twice to form the flaring structures 2113. In the direction from the bottom wall 2111 of the card slot 211 to the opening of the card slot 211, the distance between the two flaring structures 2113 gradually increases. The flaring structures 2113 have a guiding function, which facilitates the head axis body to be snapped into the card slot 211 during assembly.
[0049] Among them, as Figure 3 and Figure 6 shown, the conductive bracket 21 is connected to the middle frame body 10 through fasteners 40 (such as screws). Exemplarily, a plurality of mounting holes 20a are provided on the conductive bracket 21, and a plurality of threaded holes are provided on the middle frame body 10. The plurality of threaded holes correspond to the plurality of mounting holes 20a one by one, and the inner diameter of the mounting holes 20a is larger than the inner diameter of the threaded holes. The fastener 40 passes through the mounting holes 20a and is in threaded fit with the threaded holes.
[0050] In some embodiments, referring to Figure 4 , Figure 6 and Figure 7The surface of the conductive bracket 21 has multiple protrusions 212. These protrusions 212 surround the fastener 40, specifically the mounting hole 20a. When assembled, the fastener 40 applies pressure to the conductive bracket 21, squeezing the protrusions 212 and ensuring electrical connection between the conductive bracket 21 and the middle frame body 10. The protrusions 212 can be formed using a stamping process, such as by stamping the area surrounding the mounting hole of the conductive bracket 21. Stamping can also create protrusions 212 that are more susceptible to deformation. Providing these protrusions 212 increases the contact area between the fastener 40 and the conductive bracket 21, improving connection stability. Furthermore, the protrusions 212 disperse stress generated when the fastener 40 is tightened, improving stress distribution.
[0051] In one example, see Figure 4 and Figure 6 The plurality of protrusions 212 protrude toward the side of the conductive bracket 21 facing away from the middle frame body 10 , so that the protrusions 212 can abut against the head of the fastener 40 .
[0052] In another example, see Figure 7 , a plurality of protrusions 212 protrude toward the side of the conductive bracket 21 facing the middle frame body 10 , so that the protrusions 212 abut against the middle frame body 10 .
[0053] In yet another example, combining Figure 4 and Figure 7 , a plurality of protrusions 212 are provided on both sides of the conductor support, in the thickness direction of the conductive support 21 ( Figure 3 In the z direction (as shown in FIG), the protrusions 212 disposed on both sides of the conductor support are staggered.
[0054] In an exemplary embodiment, Figure 1 and Figure 2 As shown, an embodiment of the present disclosure provides a middle frame assembly 100, which includes a middle frame body 10, a bracket assembly 20 and a coaxial line 30. The bracket assembly 20 is connected to the middle frame body 10, and the coaxial line 30 is arranged on the bracket assembly 20. Part of the outer periphery of the coaxial line 30 is provided with a grounding section 32. The grounding section 32 is connected to the bracket assembly 20 and forms a grounding path with the middle frame body 10 through the bracket assembly 20.
[0055] The middle frame assembly 100 provided in this embodiment may include various structural components of the middle frame assembly 100 provided in any of the above embodiments. Figure 2 and Figure 3 As shown, the bracket assembly 20 includes a conductive bracket 21 . The conductive bracket 21 has a slot 211 . The slot 211 is formed by bending a portion of the conductive bracket 21 . The grounding section 32 is disposed in the slot 211 .
[0056] In some embodiments, as Figure 3 and Figure 5 As shown, the bracket assembly 20 also includes a bracket body 22, which is integrally formed with the conductive bracket 21. The bracket body 22 can be made of a material such as plastic. The bracket assembly 20 can be manufactured using an injection molding process. For example, the conductive bracket 21 is first made of a metal material, and then the conductive bracket 21 is placed in a mold used to form the bracket body 22, thereby producing an integrally formed bracket assembly 20. The integrally formed bracket assembly 20 and the conductive material can be connected together through the adhesiveness of the plastic material. The integral molding process facilitates the production of precise, complex, and high-quality bracket assemblies 20.
[0057] Among them, see Figure 2 and Figure 3 The bracket body 22 has an escape area 221 that extends through the bracket body 22 along its thickness, and the latching slot 211 is located within the escape area 221. During the manufacturing process of the bracket assembly 20 provided in this embodiment, when the formed conductive bracket 21 is placed in a mold of the bracket body 22, the sidewalls 2112 of the mold fill the escape area 221, thereby preventing materials such as plastic from affecting the structure of the latching slot 211.
[0058] Among them, such as Figure 3 and Figure 5 As shown, a receiving groove 222 is provided on the top surface of the bracket body 22. The receiving groove 222 is formed by a surface depression of the bracket body 22 away from the conductive bracket 21. The receiving groove 222 is connected to the avoidance area 221 and the card slot 211. In the assembled state, the coaxial line 30 is arranged in the receiving groove 222 and the card slot 211.
[0059] In one exemplary embodiment, see Figure 5 , the depth of the accommodating groove 222 ( Figure 3 The diameter of the coaxial line 30 (shown in the z direction) is greater than or equal to the diameter of the coaxial line 30, so that the top surface of the coaxial line 30 does not exceed the top surface of the bracket assembly 20, does not occupy space in the electronic device, and is conducive to making the electronic device thin and light.
[0060] According to an exemplary embodiment of the present disclosure, Figure 1 As shown, the embodiments of the present disclosure further provide an electronic device, such as a smartphone, tablet computer, laptop computer, and smart wearable device. The electronic device includes a device body 200 and is applied with a middle frame assembly 100 provided in the embodiments of the present disclosure. The middle frame body 10 of the middle frame assembly 100 constitutes the middle frame of the electronic device, and the bracket assembly 20 and coaxial line 30 of the middle frame assembly 100 are located within the device body 200.
[0061] The electronic device provided by the disclosed embodiment has all the technical advantages of the middle frame assembly 100. A grounding segment 32 is provided on a portion of the outer circumference of the coaxial line 30. This grounding segment 32 is connected to the middle frame body 10 via the bracket assembly 20 to form a grounding path. This reduces interference with the antenna signal in the coaxial line 30, improving signal quality and enhancing the user experience.
[0062] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the embodiments disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow from the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.
[0063] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims
1. A middle frame assembly, characterized in that: include: Middle frame body; A bracket assembly connected to the middle frame body; The coaxial line has a grounding section on a portion of its outer circumference, the grounding section is connected to the bracket assembly, and the grounding section forms a grounding path with the middle frame body through the bracket assembly.
2. The middle frame assembly according to claim 1, characterized in that: The bracket assembly includes a conductive bracket, the conductive bracket has a slot, the slot is formed by bending a part of the conductive bracket structure, and the grounding section is arranged in the slot.
3. The middle frame assembly according to claim 2, characterized in that: The card slot includes a bottom wall and two inclined side walls, the two side walls are respectively arranged on both sides of the bottom wall, and the two side walls and the bottom wall enclose the card slot; Wherein, the width of the card slot gradually decreases from the bottom wall of the card slot to the opening of the card slot.
4. The middle frame assembly according to claim 2, characterized in that: The clamping slot is interference-fitted with the grounding section.
5. The middle frame assembly according to claim 4, characterized in that: The diameter of the inscribed circle of the slot is 0.06 mm to 0.1 mm smaller than the diameter of the grounding section.
6. The middle frame assembly according to claim 2, characterized in that: The conductive bracket is connected to the middle frame body through a fastener; The surface of the conductive bracket has a plurality of protrusions, and the plurality of protrusions are arranged around the fastener. In the assembled state, the plurality of protrusions abut against the middle frame body, and / or the plurality of protrusions abut against the fastener.
7. The middle frame assembly according to any one of claims 2 to 6, characterized in that: The bracket assembly further includes a bracket body, and the bracket body and the conductive bracket are integrally formed.
8. The middle frame assembly according to claim 7, characterized in that: The bracket body has an avoidance area, which penetrates the bracket assembly along the thickness direction of the bracket body, and the card slot is located in the avoidance area.
9. The middle frame assembly according to claim 8, characterized in that: The top surface of the bracket body is provided with a receiving groove, the receiving groove is formed by a depression on the surface of the bracket body away from the conductive bracket, and the receiving groove is connected with the avoidance area and the clamping slot; The coaxial line is disposed in the accommodating groove and the clamping groove.
10. An electronic device, characterized in that: It comprises a device body and a middle frame assembly as described in any one of claims 1 to 9.