MIFI with efficient and convenient heat conduction treatment mode

Abstract

The utility model provides an efficient and convenient MIFI with a heat conduction processing mode, which belongs to the technical field of heat conduction and comprises a lower shell. The upper shell is arranged at the upper end of the lower shell, and the lower shell and the upper shell are clamped through a buckle; the graphite cooling fins are in threaded connection with the lower inner wall of the lower shell through bolts, and a circuit board is connected between the graphite cooling fins and the lower shell; according to the scheme, through the mainboard heating points, IC heat is conducted to the mainboard shielding cover through the heat conduction gel and then conducted to the heat dissipation aluminum sheet through the heat conduction silica gel outside, the heat of one point is converted into multiple faces through transmission, and then the heat is dissipated as soon as possible; and synchronously, on the other side of the mainboard, the heat dissipation area is enlarged through the graphite heat dissipation fins, so that heat dissipation is facilitated as soon as possible, the MIFI product fully gets rid of negative effects caused by high heat, and the high network speed performance of the product is fully exerted.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat conduction, and in particular relates to a MIFI with an efficient and convenient heat conduction treatment method. Background Art

[0002] With the widespread adoption of 5G communication technology and e-commerce platforms, demand for high-speed internet is increasing. This high speed places higher demands on all aspects of product performance. Due to data processing efficiency issues within the control cabinet ICs of various communication solutions, high internet speeds also lead to high power consumption, which in turn causes product overheating. MIFI products, for self-protection, often have built-in high-temperature protection mechanisms. These mechanisms reduce internet speeds in high temperatures, thereby reducing power consumption and, consequently, temperatures. While this mechanism protects MIFI products, it also introduces fluctuations in internet speeds, resulting in a poor user experience. Utility Model Content

[0003] The purpose of the present invention is to provide a MIFI with an efficient and convenient heat conduction treatment method, aiming to solve the problem that MIFI products in the prior art provide high network speed while solving the problem of high heat caused by high power consumption.

[0004] To achieve the above objectives, the present invention provides the following technical solutions:

[0005] An efficient and convenient MIFI heat conduction treatment method includes:

[0006] lower shell;

[0007] An upper shell, the upper shell being arranged at the upper end of the lower shell, the lower shell and the upper shell being connected to each other by snap fastening;

[0008] A graphite heat sink, wherein the graphite heat sink is threadedly connected to the lower inner wall of the lower shell by bolts, and a circuit board is connected between the graphite heat sink and the lower shell;

[0009] A mainboard module chip is connected to a circuit board, and a shielding cover is connected to the upper end of the mainboard module chip.

[0010] As a preferred solution of the present invention, thermal conductive silicone grease is provided between the mainboard module chip and the shielding cover.

[0011] As a preferred solution of the present invention, the lower end of the upper shell is fixedly connected to a positioning seat, the positioning seat is triangularly distributed, the upper shell and the positioning seat are connected to a heat-conducting aluminum plate, and the heat-conducting aluminum plate and the upper shell are connected by glue.

[0012] As a preferred solution of the present invention, the upper shell is provided with buttons and a display screen.

[0013] As a preferred solution of the present invention, a heat dissipation port is provided at the lower end of the lower shell.

[0014] As a preferred solution of the present invention, the shielding cover is fitted with the heat-conducting aluminum plate, and thermally conductive silicone grease is provided between the shielding cover and the heat-conducting aluminum plate.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. In this solution, the heat of the IC is transferred to the motherboard shielding cover through the thermal conductive gel through the hot spot of the motherboard, and then exported to the heat dissipation aluminum sheet through the external thermal conductive silicone, converting the heat of a "point" into multiple "surfaces" through transfer, so that the heat can be dissipated as quickly as possible; at the same time, on the other side of the motherboard, the heat dissipation area is expanded through the graphite heat sink, which facilitates the rapid dissipation of heat, allowing MIFI products to fully get rid of the negative effects of high heat and give full play to the high network speed performance of the product.

[0017] 2. In this solution, the connection between the graphite heat sink and the circuit board, as well as the thermal grease between the shield and the mainboard module chip, ensures that heat within the device is quickly transferred to the heat dissipation vents in the lower housing, effectively reducing the device's operating temperature. The lower and upper housings are connected by snaps, making assembly and disassembly of the device simple and quick. This design facilitates regular cleaning of the heat sink and replacement of the thermal grease, ensuring the long-term effectiveness of the cooling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0019] Figure 1 It is a three-dimensional diagram of the utility model;

[0020] Figure 2 It is an exploded view of the utility model;

[0021] Figure 3 For this utility model Figure 2 Exploded view of the middle and lower shell;

[0022] Figure 4 For this utility model Figure 2 A three-dimensional view of the upper and middle shell.

[0023] In the figure: 1. Lower housing; 101. Heat dissipation vent; 102. Graphite heat sink; 103. Circuit board; 104. Motherboard module chip; 105. Shielding cover; 2. Upper housing; 201. Button; 202. Display screen; 203. Positioning seat; 204. Thermal conductive aluminum plate. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] Example 1

[0026] See also Figure 1-4 , the utility model provides the following technical solutions:

[0027] An efficient and convenient MIFI heat conduction treatment method includes:

[0028] Lower housing 1;

[0029] The upper shell 2 is arranged at the upper end of the lower shell 1, and the lower shell 1 and the upper shell 2 are connected to each other by snap fastening;

[0030] A graphite heat sink 102 is threadedly connected to the lower inner wall of the lower housing 1 by bolts, and a circuit board 103 is connected between the graphite heat sink 102 and the lower housing 1;

[0031] The mainboard module chip 104 is connected to the circuit board 103 , and the upper end of the mainboard module chip 104 is connected to a shielding cover 105 .

[0032] In a specific embodiment of the present invention, the lower shell 1 serves as the bottom shell of the entire device and is designed with a heat dissipation vent 101 for discharging heat generated inside the device. The lower shell 1 is connected to the upper shell 2 by a snap fastener, which is convenient for disassembly and maintenance. The upper shell 2 is arranged at the upper end of the lower shell 1 and is snap-fitted to the lower shell 1 by a snap fastener, forming a complete shell of the device. The design of the upper shell 2 takes into account aesthetics and ease of operation, and is usually provided with operating interfaces such as buttons 201 and a display screen 202. The graphite heat sink 102 is threadedly connected to the lower inner wall of the lower shell 1 by bolts and is used to conduct the heat generated by the mainboard module chip 104 to the outside of the lower shell 1. The graphite heat sink 102 has good thermal conductivity and can effectively conduct heat from the heat source to the heat dissipation vent 101. The circuit board 103 is connected between the graphite heat sink 102 and the lower shell 1 and is used to carry core electronic components such as the mainboard module chip 104. The design of the circuit board 103 needs to take into account the installation position of the heat sink to ensure the heat dissipation effect. The mainboard module chip 104, connected to the circuit board 103, is the core component of the device, responsible for data processing and communication functions. A shielding cover 105 is connected to the upper end of the mainboard module chip 104 to reduce electromagnetic interference and also aid in heat dissipation. Shielding cover 105 is connected to the upper end of the mainboard module chip 104 to protect the chip from electromagnetic interference. Thermal grease is placed between shielding cover 105 and mainboard module chip 104 to improve heat conduction efficiency.

[0033] For details, please refer to Figure 1-4 Thermal conductive silicone grease is provided between the mainboard module chip 104 and the shielding cover 105 .

[0034] In this embodiment, thermal grease is disposed between the mainboard module chip 104 and the shielding cover 105 to improve the efficiency of heat conduction between the two. Thermal grease is a material with excellent thermal conductivity that can fill the gap between the surface of the mainboard module chip 104 and the shielding cover 105, thereby improving the efficiency of heat conduction and ensuring that the heat generated by the chip can be quickly transferred to the shielding cover 105 and dissipated through the shielding cover 105. The thermal grease fills the tiny gap between the mainboard module chip 104 and the shielding cover 105, reducing the presence of air and thus significantly improving the efficiency of heat conduction. This helps to quickly conduct the heat generated by the chip to the shielding cover 105, and then dissipate it into the air through the shielding cover 105, thereby effectively reducing the operating temperature of the chip. By providing thermal grease between the mainboard module chip 104 and the shielding cover 105, it is ensured that the heat generated by the chip can be stably transferred to the heat dissipation structure under long-term operation, thereby ensuring the stable operation of the device.

[0035] For details, please refer to Figure 1-4The lower end of the upper shell 2 is fixedly connected with a positioning seat 203, and the positioning seat 203 is triangularly distributed. The upper shell 2 and the positioning seat 203 are connected with a heat-conducting aluminum plate 204, and the heat-conducting aluminum plate 204 is connected to the upper shell 2 by adhesive.

[0036] In this embodiment, the positioning base 203 is fixedly connected to the lower end of the upper shell 2 and is arranged in a triangular shape. The positioning base 203 is designed to ensure precise alignment between the upper shell 2 and the lower shell 1, and also provides a stable support for the heat-conducting aluminum plate 204.

[0037] Thermal conductive aluminum plate 204:

[0038] The heat-conducting aluminum plate 204 is connected to the positioning seat 203 and is connected to the upper shell 2 by adhesive. The heat-conducting aluminum plate 204 has good thermal conductivity and can further conduct the heat transferred from the shielding cover 105 to the upper shell 2, and dissipate it to the external environment through the upper shell 2. The heat-conducting aluminum plate 204 fits well with the shielding cover 105, and thermal grease is provided between the two to ensure that heat can be efficiently conducted from the shielding cover 105 to the heat-conducting aluminum plate 204. The heat-conducting aluminum plate 204 further conducts heat to the upper shell 2, and dissipates it to the external environment through the upper shell 2, thereby improving the heat dissipation efficiency of the entire system. The triangular distribution design of the positioning seat 203 provides a stable support, ensuring a tight connection between the heat-conducting aluminum plate 204 and the upper shell 2. This design not only improves the installation stability of the heat-conducting aluminum plate 204, but also ensures good contact between it and the shielding cover 105, thereby enhancing the heat conduction effect.

[0039] For details, please refer to Figure 1-4 The upper shell 2 is provided with a button 201 and a display screen 202.

[0040] In this embodiment, a button 201 is located on the upper housing 2 and is used to perform basic device operations, such as power on / off and mode selection. The design of button 201 should take into account user convenience, ensuring that users can easily access and operate the device. A display screen 202 is also located on the upper housing 2 and is used to display device status information, such as signal strength, battery level, and operating mode. The design of display screen 202 should consider visibility and clarity, ensuring that users can clearly see the current status of the device.

[0041] For details, please refer to Figure 1-4 A heat dissipation port 101 is provided at the lower end of the lower shell 1 .

[0042] In this embodiment, a heat dissipation vent 101 is provided at the lower end of the lower housing 1 to dissipate heat from the device. The design of heat dissipation vent 101 must take into account air flow and dust and water resistance, ensuring effective heat dissipation from within the device while preventing dust and moisture from entering. Heat dissipation vent 101 is designed so that heat from within the device is conducted to the lower housing 1 via the graphite heat sink 102 and then discharged to the external environment through heat dissipation vent 101.

[0043] For details, please refer to Figure 1-4 The shielding cover 105 is fitted with the heat-conducting aluminum plate 204 , and thermal grease is provided between the shielding cover 105 and the heat-conducting aluminum plate 204 .

[0044] In this embodiment: the shielding cover 105 is fitted with the thermally conductive aluminum plate 204 to ensure close contact between the two, thereby improving the heat conduction efficiency. The function of the shielding cover 105 is to protect the mainboard module chip 104, reduce electromagnetic interference, and it itself is also an important heat dissipation component. Thermal conductive silicone grease is provided between the shielding cover 105 and the thermally conductive aluminum plate 204. Thermal conductive silicone grease is a material with good thermal conductivity that can fill the tiny gap between the shielding cover 105 and the thermally conductive aluminum plate 204, reduce the air layer, and thus significantly improve the heat conduction efficiency. The use of thermal conductive silicone grease ensures that the heat generated by the shielding cover 105 can be quickly conducted to the thermally conductive aluminum plate 204, and further dissipated to the upper shell 2 through the thermally conductive aluminum plate 204, and finally dissipated to the external environment through the upper shell 2.

[0045] The working principle and use process of the utility model: First, confirm that the lower shell 1 and the upper shell 2 have been connected by snap fasteners, check whether the graphite heat sink 102 has been connected to the lower inner wall of the lower shell 1 by bolt threads, and is firmly connected to the circuit board 103, confirm that the motherboard module chip 104 has been installed on the circuit board 103, and the shielding cover 105 has been installed on the upper end of the motherboard module chip 104, check whether thermal grease has been applied between the shielding cover 105 and the thermal conductive aluminum plate 204, and ensure that the two are tightly fitted, confirm that the positioning seat 203 has been fixedly connected to the lower end of the upper shell 2, and the thermal conductive aluminum plate 20 4 has been connected to the upper housing 2 with adhesive. Check whether there is a heat dissipation vent 101 at the lower end of the lower housing 1. Ensure that the heat dissipation vent 101 is unobstructed for heat dissipation. Confirm that the buttons 201 and display 202 on the upper housing 2 are functioning properly, that the button 201 can operate normally, and that the display 202 can clearly display device status information. Use button 201 to start the device and observe whether the display 202 displays the startup information. Follow the prompts on the display 202 to connect to the desired network, such as Wi-Fi or cellular network. Use the buttons 201 and display 202 to perform daily operations, such as switching working modes and adjusting settings.

[0046] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. An efficient and convenient MIFI with heat conduction treatment method, characterized in that: include: Lower housing (1); An upper shell (2), the upper shell (2) being arranged at the upper end of the lower shell (1), the lower shell (1) and the upper shell (2) being connected to each other via a snap fastener; A graphite heat sink (102), the graphite heat sink (102) being threadedly connected to the lower inner wall of the lower shell (1) via bolts, and a circuit board (103) being connected between the graphite heat sink (102) and the lower shell (1); A mainboard module chip (104) is connected to a circuit board (103), and a shielding cover (105) is connected to the upper end of the mainboard module chip (104).

2. The MIFI with an efficient and convenient heat conduction treatment method according to claim 1, characterized in that: Thermal conductive silicone grease is provided between the mainboard module chip (104) and the shielding cover (105).

3. The MIFI with an efficient and convenient heat conduction treatment method according to claim 2, characterized in that: The lower end of the upper shell (2) is fixedly connected to a positioning seat (203), the positioning seat (203) is triangularly distributed, the upper shell (2) and the positioning seat (203) are connected to a heat-conducting aluminum plate (204), and the heat-conducting aluminum plate (204) and the upper shell (2) are connected by glue.

4. The MIFI with an efficient and convenient heat conduction treatment method according to claim 3, characterized in that: The upper housing (2) is provided with buttons (201) and a display screen (202).

5. The MIFI with an efficient and convenient heat conduction treatment method according to claim 4, characterized in that: A heat dissipation opening (101) is provided at the lower end of the lower shell (1).

6. The MIFI with an efficient and convenient heat conduction treatment method according to claim 5, characterized in that: The shielding cover (105) is fitted with the heat-conducting aluminum plate (204), and heat-conducting silicone grease is provided between the shielding cover (105) and the heat-conducting aluminum plate (204).

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