High-brightness flip COB packaging structure

Abstract

The utility model discloses a high brightness flip COB packaging structure, relates to the COB packaging structure technology field, and comprises a substrate, the surface of the substrate is provided with a plurality of empty grooves, the empty grooves are arranged in a matrix mode, the inner parts of the empty grooves are fixedly connected with colloids, the colloids are shaped like a Chinese character'hui ', the inner parts of the colloids are provided with heat conduction wires, and the heat conduction wires are fixedly connected in the empty grooves. An empty groove is formed in the substrate, LED chip sets are inserted into the empty groove, a square groove is formed in the bottom of the substrate, the top of the substrate is fixedly connected with a positive electrode and a negative electrode, the positive electrode and the negative electrode are arranged on the two sides of the substrate respectively, a copper sheet is arranged above the substrate, the two ends of the copper sheet are fixedly connected to the LED chip sets and the substrate respectively, and the LED chip sets are electrically connected through the copper sheet. The technical problems that a large amount of heat is generated when the LED chip set works, and if the heat cannot be discharged in time, the device is possibly damaged are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of COB packaging structures, in particular to a high-brightness flip-chip COB packaging structure. Background Art

[0002] With the continuous development of display technology, the resolution and display effect of LED displays have become the focus of the industry. In order to meet the market demand for high definition, high brightness and high stability, packaging technology has been continuously innovated, among which flip-chip COB packaging technology has come into being. COB (Chip on Board) technology originated in the 1960s. It is an "electrical design" that is committed to simplifying the packaging structure of ultra-fine electronic components and improving the stability of the final product. As an upgraded product of COB technology, flip-chip COB further improves the packaging efficiency and display effect while maintaining its advantages. Flip-chip COB packaging technology directly packages the chip on the PCB substrate, eliminating the traditional wire bonding process, making the packaging structure simpler and reducing the packaging cost.

[0003] A search revealed a patent document (grant announcement number CN204497266U) that includes a substrate and at least one LED chipset. The substrate's front surface is defined by cavities corresponding to the number of LED chipsets. Each LED chipset is flip-chip bonded to the bottom of the corresponding cavity using a COB (chip-on-board) method. Electrical connections are established between the LED chipsets and between the chipsets and the external circuitry via copper sheets. Each LED chipset is filled with a filler compound and capped with a transparent ceramic phosphor sheet. This packaging structure improves light quality and thermal conductivity, and can produce ultra-bright white light.

[0004] However, the above device still has shortcomings:

[0005] The LED chipset generates a lot of heat when working. If this heat cannot be discharged in time, it may cause damage to the device. Utility Model Content

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a high-brightness flip-chip COB package structure, which solves the problem that the LED chipset generates a large amount of heat during operation, which may cause damage to the device if the heat cannot be discharged in time.

[0007] To achieve the above-mentioned purpose, the present invention proposes a high-brightness flip-chip COB packaging structure, including a substrate, a surface of which is provided with a plurality of empty grooves, the empty grooves being arranged in a matrix, a colloid being fixedly connected to the inside of the empty grooves, the colloid being in a U-shaped shape, a thermal wire being arranged inside the colloid, and the thermal wire being fixedly connected in the empty grooves.

[0008] Preferably, an LED chipset is inserted into the empty slot.

[0009] Preferably, a square groove is provided at the bottom of the base plate.

[0010] Preferably, a positive electrode and a negative electrode are fixedly connected to the top of the substrate, and the positive electrode and the negative electrode are respectively arranged on both sides of the substrate.

[0011] Preferably, a copper sheet is provided above the substrate, and two ends of the copper sheet are fixedly connected to the LED chip group and the substrate respectively, and several LED chip groups are electrically connected by the copper sheet.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] This can be achieved through the setting of colloid and thermal wire. The LED chipset is vacated by the colloid. Secondly, the colloid is in the shape of a U.S. letter "U". The hollow design reduces the direct contact area between the colloid and the LED chipset, allowing the heat generated by the LED chipset to dissipate faster. The setting of the thermal wire can achieve a better heat conduction effect, allowing heat to be transferred away from the LED chipset faster, avoiding overheating of the LED chipset.

[0014] The benefit of this design is that the U-shaped hollow design of the colloid significantly reduces the direct contact area with the LED chipset. This design creates a low-thermal-resistance channel, allowing the heat generated by the LED chipset to dissipate more easily through the gaps in the colloid, rather than accumulating on the contact surface. This greatly increases the rate of heat loss, thereby reducing the operating temperature of the LED chipset. The provision of thermal filaments further enhances the heat conduction effect. As an efficient heat conduction medium, the thermal filaments can quickly absorb the heat generated by the LED chipset and conduct it along its path to a wider heat dissipation area. This design ensures that heat can be quickly transferred from the LED chipset to the heat dissipation structure, thereby avoiding localized heat accumulation and overheating. Due to the optimized heat dissipation efficiency and heat conduction path, the operating temperature of the LED chipset is effectively controlled. This greatly reduces the risk of damage to the LED chipset due to overheating and extends the service life of the LED product. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the top structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the bottom structure of the utility model;

[0018] Figure 4For the present utility model Figure 2 is a schematic structural view of part A in

[0019] In the figure: 1, substrate; 101, empty slot; 102, colloid; 103, heat-conducting wire; 104, square slot; 2, positive electrode; 3, negative electrode; 4, LED chip group; 5, copper sheet. Specific embodiments

[0020] Next, the technical solutions of the present utility model will be clearly and completely described in conjunction with the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0021] As Figure 1-4 shown, a high-brightness flip-chip COB packaging structure includes a substrate 1, and a positive electrode 2 and a negative electrode 3 are fixedly connected to the top of the substrate 1. The positive electrode 2 and the negative electrode 3 are respectively arranged on both sides of the substrate 1.

[0022] A plurality of empty slots 101 are formed on the surface of the substrate 1, and an LED chip group 4 is inserted into the empty slots 101.

[0023] [[ID=二十一]]The empty slots 101 are arranged in a matrix, and a colloid 102 is fixedly connected inside the empty slots 101. The colloid 102 can adopt epoxy resin. The epoxy resin colloid can form a hard sealing layer after curing, effectively preventing impurities such as moisture and dust from invading the inside of the package, and protecting the LED chips from the influence of the external environment. Its high strength and hardness make it excellent in sealing performance.

[0024] The colloid 102 is in a square frame shape, and a heat-conducting wire 103 is arranged inside the colloid 102. The heat-conducting wire 103 is fixedly connected in the empty slot 101. By using the colloid 102 to lift the LED chip group 4, and secondly, the colloid 102 is in a square frame shape, the hollow design makes the contact area between the colloid 102 and the LED chip group 4 smaller, enabling the heat generated by the LED chip group 4 to dissipate faster. The setting of the heat-conducting wire 103 can achieve a better heat conduction effect, enabling the heat to be transferred away from the LED chip group 4 faster, and avoiding the occurrence of overheating of the LED chip group 4.

[0025] The U-shaped hollow design of the colloid 102 significantly reduces the direct contact area with the LED chipset 4. This design creates a low thermal resistance channel, allowing the heat generated by the LED chipset 4 to be more easily dissipated outward through the gaps in the colloid 102, rather than accumulating on the contact surface. This greatly increases the heat loss rate, thereby reducing the operating temperature of the LED chipset 4. The provision of the thermal wire 103 further enhances the heat conduction effect. As an efficient heat conduction medium, the thermal wire 103 can quickly absorb the heat generated by the LED chipset 4 and conduct it along its path to a wider heat dissipation area. This design ensures that heat can be quickly transferred from the LED chipset 4 to the heat dissipation structure, thereby avoiding local heat accumulation and overheating. Due to the optimization of the heat dissipation efficiency and the heat conduction path, the operating temperature of the LED chipset 4 is effectively controlled. This greatly reduces the risk of damage to the LED chipset 4 due to overheating and extends the service life of the LED product.

[0026] A square groove 104 is provided at the bottom of the substrate 1. By providing the square groove 104, the substrate 1 becomes thinner, so that heat can be better dissipated. A copper sheet 5 is provided above the substrate 1. The two ends of the copper sheet 5 are fixedly connected to the LED chip group 4 and the substrate 1 respectively. Several LED chip groups 4 are electrically connected by the copper sheet 5.

[0027] Working principle: The LED chipset 4 is vacated by the colloid 102. Secondly, the colloid 102 is in the shape of a U-shaped triangle. The hollow design reduces the direct contact area between the colloid 102 and the LED chipset 4, allowing the heat generated by the LED chipset 4 to dissipate faster. The setting of the thermal wire 103 can achieve a better heat conduction effect, allowing heat to be transferred from the LED chipset 4 more quickly, avoiding overheating of the LED chipset 4.

[0028] The above embodiments are only used to illustrate the technical method of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical method of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical method of the present invention.

Claims

1. A high brightness flip chip COB packaging structure, characterized in that: It includes a substrate (1), on the surface of the substrate (1), a number of empty slots (101) are provided. The empty slots (101) are arranged in a matrix. Inside the empty slots (101), a colloid (102) is fixedly connected. The colloid (102) is in a shape of a double square frame. Inside the colloid (102), a heat conducting wire (103) is provided. The heat conducting wire (103) is fixedly connected in the empty slot (101).

2. The high-brightness flip-chip COB packaging structure according to claim 1, characterized in that: An LED chip group (4) is inserted into the inside of the empty slot (101).

3. The high-brightness flip-chip COB packaging structure according to claim 2, characterized in that: A square slot (104) is provided at the bottom of the substrate (1).

4. The high-brightness flip-chip COB packaging structure according to claim 1, characterized in that: A positive electrode (2) and a negative electrode (3) are fixedly connected to the top of the substrate (1). The positive electrode (2) and the negative electrode (3) are respectively arranged on both sides of the substrate (1).

5. The high-brightness flip-chip COB packaging structure according to claim 1, characterized in that: A copper sheet (5) is provided above the substrate (1). Both ends of the copper sheet (5) are respectively fixedly connected to the LED chip group (4) and the substrate (1). A number of the LED chip groups (4) are all electrically connected by the copper sheet (5).

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