Side light-emitting LED packaging structure

Abstract

The utility model relates to the technical field of LED packaging, and particularly discloses a side light-emitting LED packaging structure which comprises an installation substrate, two installation holes are formed in the middle portions of the two sides of the installation substrate respectively, a lens is in lap joint with one side of the top of the installation substrate, lap joint plates are fixedly connected to the two sides of the lens respectively, and the lap joint plates are fixedly connected to the two sides of the installation substrate respectively. The two sides of the surfaces of the two lap joint plates are in threaded connection with fixing bolts. Due to the arrangement of the mounting substrate, the lens, the first reflecting plate, the second reflecting plate and the solid sealing layer, during use, the LED chip is connected with a power supply, the LED chip emits light rays, the light rays firstly meet the first reflecting plate and the second reflecting plate on the inner wall of the lens, and the reflecting plates guide the light rays which are possibly transmitted upwards or downwards to the side surface through the reflection effect, so that the light rays are transmitted to the side surface. The design of the lens enables light rays to be concentrated and effectively emitted from the side face, the utilization rate of the light rays and the lighting effect are improved, the efficient and uniform side face lighting effect is achieved, and an external protection structure is convenient to disassemble and assemble.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED packaging, and in particular relates to a side-emitting LED packaging structure. Background Art

[0002] A notable feature of side-emitting LEDs is that their light-emitting direction is different from that of conventional LEDs. Conventional LEDs usually emit light from the top surface, while side-emitting LEDs emit light from the side. This light-emitting method gives side-emitting LEDs unique advantages in specific application scenarios. Side-emitting LEDs are widely used in occasions requiring side lighting, such as LCD backlights, key backlights, indicator lights, etc. Their light-emitting direction is parallel to the PCB, which facilitates the propagation and distribution of light, thereby improving the lighting effect and uniformity.

[0003] In the Chinese patent with publication number CN214313237U, a packaging structure of a side-emitting LED is mentioned, which includes a supporting substrate, a plurality of LED chips, a driver chip, a packaging layer and a retaining wall. The supporting substrate is perpendicular to the mounting surface, and the plurality of LED chips are arranged on the supporting substrate and are electrically connected to the supporting substrate. The driver chip is flip-chip mounted on the supporting substrate, and the packaging layer covers the plurality of LED chips and the outside of the driver chip. The retaining wall is arranged on the supporting substrate and surrounds the packaging layer. The packaging structure of the side-emitting LED in the present utility model encapsulates the LED chip into a single-sided light-emitting body, so that the light irradiated to the surroundings is blocked by the retaining wall and propagated, and the light output angle is more concentrated and gathered, thereby improving the utilization rate of the light source and the light brightness. In addition, the flip-chip LED chip and driver chip are used, so that the final side-emitting LED product effectively reduces the product volume and realizes miniaturization of the product structure.

[0004] However, the above technical solution encapsulates the LED chip into a single-sided light-emitting body, so that the light irradiated to the surroundings is blocked by the retaining wall and the light output angle is more concentrated and gathered, thereby improving the utilization rate of the light source and providing higher light brightness. Although the above device can concentrate the light source to the side, this method is prone to the loss of the light source on the top, and the light on the side is prone to form fragmented strong light, so staff need to improve it. Utility Model Content

[0005] The purpose of the present invention is to provide a side-emitting LED packaging structure to solve the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A side-emitting LED package structure, comprising:

[0008] Install the baseboard;

[0009] Two mounting holes are provided in the middle of both sides of the mounting substrate, and a lens is overlapped on one side of the top of the mounting substrate;

[0010] Both sides of the lens are fixedly connected with a lap plate, both sides of the surfaces of the two lap plates are threadedly connected with fixing bolts, and one side of the surface of the fixing bolt is threadedly connected to the inner wall of the mounting hole, both sides of the top of the inner wall of the lens are fixedly connected with a first reflector, and both sides of the bottom of the inner wall of the lens are fixedly connected with a second reflector.

[0011] Preferably, a plurality of arc grooves are opened on one side of the top of the mounting substrate, a welding plate is fixedly connected to one side of the inner wall of the arc groove, a mounting plate is fixedly connected to one side of the top of the welding plate, and an LED chip is fixedly connected to one side of the top of the mounting plate.

[0012] Preferably, a phosphor frame is fixedly connected to one side of the top of the welding plate, and one side of the inner wall of the phosphor frame is sleeved on the surface of the LED chip.

[0013] Preferably, a plurality of connection holes are provided on one side of the bottom of the mounting substrate, and the connection holes correspond to the arc-shaped grooves.

[0014] Preferably, both sides of the bottom of the soldering plate are electrically connected with gold wires, the middle of the bottom of the soldering plate is fixedly connected with a heat absorbing rod, and the bottom end of the heat absorbing rod is fixedly connected with a heat dissipation plate.

[0015] Preferably, a fixing ring is sleeved on one side of the surface of the heat dissipation plate, and one side of the top of the heat dissipation plate is overlapped with the bottom of the connection hole, and a sealing ring is sleeved on one side of the surface of the fixing ring.

[0016] Preferably, a sealing layer is overlapped on one side of the top of the mounting substrate, and one side of the surface of the sealing layer is inserted into the inner wall of the lens.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] (1) By installing the substrate, mounting holes, lens, lap plate, fixing bolts, first reflector, second reflector and solid sealing layer, when in use, the LED chip is connected to the power supply, and the LED chip emits light. The light first encounters the first reflector and the second reflector on the inner wall of the lens. The reflector guides the light that may originally propagate upward or downward to the side through reflection. The design of the lens enables the light to be concentrated and effectively emitted from the side, thereby improving the utilization rate of light and the lighting effect. The solid sealing layer ensures the sealing of the packaging structure, prevents external dust, moisture, etc. from entering the interior and affecting the performance and life of the LED chip, thereby achieving efficient and uniform side lighting effect, and facilitating the disassembly and assembly of the external protective structure.

[0019] (2) Through the arrangement of the arc groove, welding plate, mounting plate, LED chip, phosphor frame, connecting hole, gold wire, heat absorbing rod, heat sink, fixing ring and sealing ring, when in use, the phosphor frame converts the light emitted by the LED chip to improve the color and uniformity of the light, the heat absorbing rod absorbs the heat generated when the LED chip is working, and the heat absorbing rod transfers the heat to the heat sink at the bottom, and the heat sink dissipates the absorbed heat into the air. A fixing ring is sleeved on one side of the surface of the heat sink to enhance the stability of the heat sink, and the sealing ring ensures the sealing between the heat sink and the mounting substrate to prevent dust and moisture from entering, thereby dissipating the heat generated by the LED chip in time, ensuring the stable operation and long life of the LED chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional diagram of the utility model;

[0021] Figure 2 This is a three-dimensional diagram of the sealing layer of the utility model;

[0022] Figure 3 A three-dimensional diagram of the lens of the present invention;

[0023] Figure 4 This is a three-dimensional diagram of the phosphor frame of the utility model;

[0024] Figure 5 A three-dimensional diagram of the fixing ring of the utility model;

[0025] Figure 6 A three-dimensional diagram of the heat absorbing rod of the present invention;

[0026] Figure 7 A three-dimensional diagram of the connection hole of the utility model;

[0027] In the figure: 1. Mounting substrate; 2. Mounting hole; 3. Lens; 4. Lap plate; 5. Fixing bolt; 6. First reflector; 7. Second reflector; 8. Arc groove; 9. Soldering plate; 10. Mounting plate; 11. LED chip; 12. Phosphor frame; 13. Connecting hole; 14. Gold wire; 15. Heat absorbing rod; 16. Heat dissipation plate; 17. Fixing ring; 18. Sealing ring; 19. Sealing layer. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] Example 1:

[0030] See also Figures 1 to 7 As shown, a side-emitting LED package structure includes:

[0031] Install substrate 1;

[0032] Two mounting holes 2 are provided in the middle of both sides of the mounting substrate 1, and a lens 3 is overlapped on one side of the top of the mounting substrate 1;

[0033] Both sides of the lens 3 are fixedly connected to the overlapping plates 4, and both sides of the surfaces of the two overlapping plates 4 are threadedly connected to the fixing bolts 5, and one side of the surface of the fixing bolts 5 is threadedly connected to the inner wall of the mounting hole 2, and the top of the inner wall of the lens 3 is fixedly connected to the first reflector 6 on both sides, and the bottom of the inner wall of the lens 3 is fixedly connected to the second reflector 7 on both sides, and the top of the mounting substrate 1 is overlapped with a sealing layer 19 on one side, and one side of the surface of the sealing layer 19 is inserted into the inner wall of the lens 3.

[0034] When in use, the mounting substrate 1 serves as the basis of the entire packaging structure. Two mounting holes 2 are preset in the middle of both sides for subsequent fixing of the lens 3. The lens 3 is fixedly connected to one side of the top of the mounting substrate 1. The lens 3 is designed to guide the light emitted by the LED chip 11 to be emitted from the side. Both sides of the lens 3 are fixedly connected with a jumper plate 4. These jumper plates 4 are provided with threaded holes for installing fixing bolts 5. The fixing bolts 5 are passed through the threaded holes of the jumper plate 4 and screwed into the mounting holes 2 on the mounting substrate 1, thereby firmly fixing the lens 3 on the mounting substrate 1. A first reflector 6 is provided on both sides of the top of the inner wall of the lens 3 for reflecting the light emitted by the LED chip 11 upward and guiding it to be emitted from the side. A second reflector 7 is provided on both sides of the bottom of the inner wall of the lens 3 to further ensure the effective reflection and lateral propagation of the light. A sealing layer 19 is provided on one side of the top of the mounting substrate 1. The sealing layer 19 is inserted into the inner wall of the lens 3 to seal and protect the internal components.

[0035] Example 2:

[0036] See also Figures 1 to 7As shown, one side of the top of the mounting substrate 1 is provided with multiple groups of arc grooves 8, one side of the inner wall of the arc groove 8 is fixedly connected to a welding plate 9, one side of the top of the welding plate 9 is fixedly connected to a mounting plate 10, one side of the top of the mounting plate 10 is fixedly connected to an LED chip 11, one side of the top of the welding plate 9 is fixedly connected to a phosphor frame 12, and one side of the inner wall of the phosphor frame 12 is sleeved on the surface of the LED chip 11, one side of the bottom of the mounting substrate 1 is provided with multiple groups of connection holes 13, and the connection holes 13 correspond to the arc grooves 8, both sides of the bottom of the welding plate 9 are electrically connected with gold wires 14, the middle part of the bottom of the welding plate 9 is fixedly connected to a heat absorbing rod 15, the bottom end of the heat absorbing rod 15 is fixedly connected to a heat sink 16, one side of the surface of the heat sink 16 is sleeved with a fixing ring 17, and one side of the top of the heat sink 16 is overlapped with the bottom of the connecting hole 13, and one side of the surface of the fixing ring 17 is sleeved with a sealing ring 18.

[0037] When in use, a plurality of arc grooves 8 are pre-opened on the top of the mounting substrate 1. The arc grooves 8 are convenient for fixing the welding plate 9 and ensuring its stability, and can be convenient for absorbing heat at the bottom. The welding plate 9 is fixed to one side of the inner wall of the arc groove 8. The welding plate 9 is an important component for connecting and supporting the LED chip 11 and needs to be firmly installed on the mounting substrate 1. A mounting plate 10 is provided on the top of the welding plate 9. The mounting plate 10 is convenient for installing the LED chip 11. A phosphor frame 12 is provided on the top of the welding plate 9. The phosphor frame 12 converts the LED chip 11 into a fluorescent powder. The light emitted by the chip 11 is improved in color and uniformity. A heat-absorbing rod 15 is provided at the bottom of the soldering plate 9. The heat-absorbing rod 15 absorbs the heat generated by the LED chip 11 when it is working, and the heat-absorbing rod 15 transfers the heat to the heat sink 16 at the bottom. The heat sink 16 dissipates the absorbed heat into the air. A fixing ring 17 is sleeved on one side of the surface of the heat sink 16 to enhance the stability of the heat sink 16. A sealing ring 18 is sleeved on the surface of the fixing ring 17 to ensure the sealing between the heat sink 16 and the mounting substrate 1 to prevent dust and moisture from entering.

[0038] Working principle: When the LED chip 11 is powered on, the LED chip 11 emits light. The light first encounters the first reflector 6 and the second reflector 7 on the inner wall of the lens 3. These reflectors guide the light that may originally propagate upward or downward to the side through reflection. The design of the lens 3 enables the light to be concentrated and effectively emitted from the side, thereby improving the utilization rate of the light and the lighting effect. The sealing layer 19 ensures the sealing of the packaging structure, preventing external dust, moisture, etc. from entering the interior and affecting the performance and life of the LED chip 11. The phosphor frame 12 converts the light emitted by the LED chip 11 to improve the color and uniformity of the light. The heat-absorbing rod 15 absorbs the heat generated when the LED chip 11 is working, and the heat-absorbing rod 15 transfers the heat to the heat sink 16 at the bottom end. The heat sink 16 dissipates the absorbed heat into the air. The fixing ring 17 is used to enhance the stability of the heat sink 16. The sealing ring 18 ensures the sealing between the heat sink 16 and the mounting substrate 1 to prevent dust and moisture from entering.

[0039] All standard parts used in this utility model can be purchased commercially, and special-shaped parts can be customized according to the description in the specification and drawings. The specific connection methods of each part adopt conventional means such as bolts, rivets, welding, etc. that are mature in the existing technology. The machinery, parts and equipment all adopt conventional models in the existing technology. In addition, the circuit connections adopt conventional connection methods in the existing technology and will not be described in detail here. Any matters not described in detail in this specification belong to the existing technology known to professional and technical personnel in this field.

[0040] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. "Multiple" means two or more, unless otherwise specifically defined.

[0041] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0042] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0043] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0044] In the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are involved. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

[0045] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A side-emitting LED packaging structure, characterized in that: include: Installing a substrate (1); Two mounting holes (2) are provided in the middle of both sides of the mounting substrate (1), and a lens (3) is overlapped on one side of the top of the mounting substrate (1); Both sides of the lens (3) are fixedly connected to a lap plate (4), both sides of the surfaces of the two lap plates (4) are threadedly connected to fixing bolts (5), and one side of the surface of the fixing bolt (5) is threadedly connected to the inner wall of the mounting hole (2), both sides of the top of the inner wall of the lens (3) are fixedly connected to a first reflector (6), and both sides of the bottom of the inner wall of the lens (3) are fixedly connected to a second reflector (7).

2. The side-emitting LED package structure according to claim 1, wherein: A plurality of arc-shaped grooves (8) are provided on one side of the top of the mounting substrate (1); a welding plate (9) is fixedly connected to one side of the inner wall of the arc-shaped groove (8); a mounting plate (10) is fixedly connected to one side of the top of the welding plate (9); and an LED chip (11) is fixedly connected to one side of the top of the mounting plate (10).

3. The side-emitting LED package structure according to claim 2, wherein: A phosphor powder frame (12) is fixedly connected to one side of the top of the welding plate (9), and one side of the inner wall of the phosphor powder frame (12) is sleeved on the surface of the LED chip (11).

4. The side-emitting LED package structure according to claim 1, wherein: A plurality of connection holes (13) are provided on one side of the bottom of the mounting substrate (1), and the connection holes (13) correspond to the arc-shaped grooves (8).

5. The side-emitting LED package structure according to claim 2, wherein: Both sides of the bottom of the soldering plate (9) are electrically connected to gold wires (14), the middle of the bottom of the soldering plate (9) is fixedly connected to a heat absorbing rod (15), and the bottom end of the heat absorbing rod (15) is fixedly connected to a heat dissipation plate (16).

6. The side-emitting LED package structure according to claim 5, characterized in that: A fixing ring (17) is sleeved on one side of the surface of the heat dissipation plate (16), and one side of the top of the heat dissipation plate (16) is overlapped with the bottom of the connection hole (13), and a sealing ring (18) is sleeved on one side of the surface of the fixing ring (17).

7. The side-emitting LED package structure according to claim 1, wherein: A sealing layer (19) is overlapped on one side of the top of the mounting substrate (1), and one side of the surface of the sealing layer (19) is plugged into the inner wall of the lens (3).

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