High and low temperature box equipment for chip detection

Abstract

The utility model relates to the technical field of chip detection, in particular to high and low temperature box equipment for chip detection. The technical problems that due to the fact that the internal space of a high-low temperature box is limited, only chips in a set of storage trays can be detected, continuous manual feeding and replacement are needed after detection is completed, a large amount of time is wasted, and meanwhile the detection efficiency is reduced are solved. According to the technical scheme, the high-low temperature box equipment for chip detection comprises a material disc lifting assembly, a movement assembly, a positioning assembly, a buffer assembly, a detection assembly and a material receiving assembly; compared with a traditional high-low temperature box for chip detection, the high-low temperature box for chip detection has the advantages that multiple groups of trays can be placed in the device at the same time through the cooperative use of the tray lifting structure and the receiving structure, and after one group of trays is detected, the trays can be pushed to move upwards to intercept and fix the detected trays, so that the detection efficiency is improved. And the remaining material tray is moved to the initial position to perform a new round of detection on the chip, so that the replacement time of the material tray is saved, and the detection efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip detection, in particular to a high and low temperature box device for chip detection. Background Art

[0002] Chip testing refers to a series of tests and evaluation processes for semiconductor chips to ensure that their performance, reliability and quality meet design requirements and industry standards. A high and low temperature chamber is a device used to simulate different temperature and humidity conditions. It is widely used in product testing and quality control in the electronics, semiconductor, optoelectronics, automotive, aerospace and other industries. In the field of chip testing, a high and low temperature chamber can be used to test the performance and reliability of chips under extreme temperature conditions. During the chip testing process, the chips need to be placed in a storage tray, and then the storage tray is placed in a high and low temperature chamber for testing. Due to the limited space inside the high and low temperature chamber, most of the time, only one group of chips in the storage tray can be tested, and manual loading and replacement are required, which wastes a lot of time and reduces the detection efficiency. Utility Model Content

[0003] In order to overcome the problem that during the chip testing process, the chips need to be placed in a storage tray and then placed in a high and low temperature box for testing, due to the limited space inside the high and low temperature box, most of the time only one group of chips in the storage tray can be tested, and manual loading and replacement are required, which wastes a lot of time and reduces the testing efficiency.

[0004] The technical solution of the utility model is: a high and low temperature box equipment for chip detection, including a lower camera light source, a support assembly, a material tray lifting assembly, a motion assembly, a positioning assembly, a buffer assembly, a detection assembly and a material receiving assembly; the bottom surface of the lower camera light source is provided with a support assembly, the top surface of the support assembly is provided with a material tray lifting assembly, the top surface of the support assembly is provided with a motion assembly, the side surface of the motion assembly is provided with a positioning assembly, the bottom surface of the positioning assembly is provided with a buffer assembly, the top surface of the support assembly is provided with a detection assembly, and the top surface of the material tray lifting assembly is provided with a material receiving assembly.

[0005] Preferably, the lower camera light source can provide light for the device, which is convenient for positioning and adsorbing the chip. The support component can provide support for the device and can collect unqualified chips. The material tray lifting component can provide support for multiple groups of material trays. After one group of material trays is inspected, the next group of material trays can be automatically loaded, saving manual replacement time. The motion component can drive the positioning component to move inside the device. The positioning component can position and adsorb the chip, which is convenient for picking up and placing the chip. The buffer component can provide buffering for the device during movement to avoid damage to the chip due to excessive pressure. The detection component can clamp and fix the chip to be tested, which is convenient for testing the chip. The material collecting component can provide support for the material tray after inspection, which is convenient for picking up after the inspection is completed.

[0006] Preferably, the support assembly includes a fixed base plate, a waste holder and a waste tray; the bottom surface of the lower camera light source is provided with a fixed base plate, the top surface of the fixed base plate is provided with a waste holder, and the top surface of the waste holder is provided with a waste tray. The fixed base plate is used to provide support for the entire device, the waste holder is used to provide support for the waste tray, and the waste tray is used to collect and inspect unqualified chips.

[0007] Preferably, the material tray lifting assembly includes a lifting base, a control box, a lifting arm, a support platform and a material storage tray; a lifting base is provided on the top surface of the fixed bottom plate, a control box is provided on the top surface of the lifting base, a lifting arm is provided on the output end of the control box, the lifting arm is provided on the inner side of the lifting base, a support platform is provided on the top surface of the lifting arm, a material storage tray is provided on the top surface of the support platform, and multiple groups of material storage trays are provided, and the chips to be tested are placed on the material storage trays, and when the material storage tray is placed on the support platform, the control box is used to drive the lifting arm to pull up, thereby pushing the material storage tray to rise.

[0008] Preferably, the motion component includes a support frame, a Y-axis motion module, an X-axis motion module and an X-axis drag chain; the top surface of the fixed base plate is provided with a support frame, the top surface of the support frame is provided with a Y-axis motion module, the top surface of the Y-axis motion module is provided with an X-axis motion module, and the top surface of the Y-axis motion module is provided with an X-axis drag chain. The Z-axis motion module is driven to move within the device through the movement of the Y-axis motion module and the X-axis motion module, and the position of the motion nozzle is adjusted to facilitate positioning and adsorption of the chip.

[0009] Preferably, the positioning component includes a positioning bracket, a Z-axis motion module, a positioning motor, a motion nozzle, a connecting air pipe and a visual positioning camera; a positioning bracket is provided on the side of the X-axis motion module, and the positioning bracket is provided on the bottom surface of the X-axis drag chain. There are four groups of positioning brackets, a Z-axis motion module is provided on the side of the positioning bracket, a positioning motor is provided on the top surface of the Z-axis motion module, a motion nozzle is provided at the output end of the positioning motor, a connecting air pipe is provided on the top surface of the positioning motor, and a visual positioning camera is provided on the side of the positioning bracket. The internal chip is photographed by the visual positioning camera to facilitate chip positioning, and the motion nozzle is driven to rise and fall by the movement of the Z-axis motion module, and is connected to the air pump by the connecting air pipe, and the positioned chip is adsorbed by the motion nozzle to facilitate chip movement.

[0010] Preferably, the buffer assembly includes a limit slide, a limit top plate, a buffer bottom plate, a buffer spring and a sliding plate; a limit slide is provided on the inner side of the Z-axis motion module, a limit top plate is provided on the top surface of the limit slide, a buffer bottom plate is provided on the bottom surface of the limit slide, a buffer spring is provided on the top surface of the buffer bottom plate, four groups of buffer springs are provided, a sliding plate is provided at the other end of the buffer spring, and the sliding plate is provided on the outer side of the limit slide. During the downward movement of the Z-axis motion module, the buffer bottom plate is brought into contact with the device, pushing the limit slide to slide in the Z-axis motion module, compressing the buffer spring, and using the elastic force of the buffer spring to offset and buffer the downward pressure to prevent the chip from being squeezed and damaged.

[0011] Preferably, the detection component includes a clamping base, a clamping support, a sliding support, a limiting rod, a test fixture base and a test tool; the top surface of the fixed base plate is provided with a clamping base, the top surface of the clamping base is provided with a clamping support, the side of the clamping support is provided with a sliding support, the side of the clamping support is provided with a limiting rod, the top surface of the sliding support is provided with a test fixture base, and the top surface of the test fixture base is provided with a test tool. The height of the test tool is adjusted by sliding the sliding support on the clamping support. After the adjustment is completed, the sliding support and the clamping support are fixed by the limiting rod, and the motion nozzle is driven to move by the Y-axis motion module and the X-axis motion module, and the adsorbed chip is placed in the test tool for clamping detection. After the detection is completed, the waste is placed into the waste tray for collection by the motion nozzle, and the qualified chips are placed back in the storage tray.

[0012] The lifting mechanism is a lifting mechanism that lifts up and down the support frame, and the lifting mechanism is a lifting mechanism that lifts up and down the support frame, and the lifting mechanism is a lifting mechanism that lifts up and down the support frame, and the lifting mechanism is a lifting mechanism that lifts and lowers the support frame

[0013] Beneficial effects of the utility model:

[0014] 1. Compared with the traditional high and low temperature box for chip testing, the chips need to be placed in the storage tray, and then the storage tray is placed in the high and low temperature box for testing. Due to the limited space inside the high and low temperature box, most of the time, only one group of chips in the storage tray can be tested, and manual loading and replacement are required, which wastes a lot of time and reduces the detection efficiency. By setting the tray lifting structure and the material receiving structure, multiple groups of trays can be placed in the device at the same time. After the inspection of one group of trays is completed, the tray can be pushed to move upward. The set material receiving structure can intercept and fix the inspected trays, and then the tray lifting structure drives the remaining trays back to the initial position for a new round of inspection until all trays are processed. This can save the time of manual replacement of trays and improve the inspection efficiency.

[0015] 2. Place the chips that need to be inspected on the stocking tray, place the stocking tray on the support table, and use the control box to drive the lifting arm to pull up, thereby pushing the stocking tray to rise. After the chips in a group of stocking trays are inspected in sequence, use the control box to drive the lifting arm to pull up, and push the stocking tray to rise through the support table, so that the top surface of the stocking tray pushes the rotating support block to rotate on the rotating shaft, and pushes the stocking tray to the inner side of the top receiving table. Under the action of gravity, the rotating support block rotates to its original position on the rotating shaft, and the receiving table is used to limit one end of the rotating support block. When the lifting arm is retracted to pull the support table to drive the remaining stocking trays back to the initial position, the restricted rotating support block intercepts the bottom of the stocking tray that has been inspected, thereby providing support for the stocking tray through the rotating support block and fixing it on the receiving table;

[0016] 3. Use the visual positioning camera to take pictures of the internal chip to facilitate chip positioning. The Y-axis motion module and the X-axis motion module are used to move the Z-axis motion module in the device to adjust the position of the motion nozzle. The Z-axis motion module is used to drive the motion nozzle to move up and down, so that the buffer base plate contacts the device, thereby pushing the limit slide bar to slide in the Z-axis motion module, compressing the buffer spring, and using the elastic force of the buffer spring to offset the downward pressure to prevent the chip from being squeezed and damaged. The positioned chip is adsorbed by the motion nozzle, and the adsorbed chip is placed in the test fixture for clamping and detection by driving the motion nozzle to move. After the detection is completed, the waste is placed in the waste tray for collection through the motion nozzle, and the qualified chips are placed back in the storage tray. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Shown is a schematic diagram of the three-dimensional structure of a high and low temperature box device for chip testing in the present invention;

[0018] Figure 2 Shown is a schematic diagram of the three-dimensional structure of a high and low temperature box equipment support assembly for chip testing in the present invention;

[0019] Figure 3 Shown is a schematic diagram of the three-dimensional structure of a high and low temperature box equipment tray lifting component for chip testing of the present invention;

[0020] Figure 4 Shown is a schematic diagram of the three-dimensional structure of the motion components of a high and low temperature box device for chip testing in the present invention;

[0021] Figure 5 Shown is a schematic diagram of the three-dimensional structure of a positioning component of a high and low temperature box equipment for chip testing of the present invention;

[0022] Figure 6 Shown is a schematic diagram of the three-dimensional structure of a high and low temperature box equipment detection component for chip detection in the present invention;

[0023] Figure 7 Shown is a schematic diagram of the three-dimensional structure of a high and low temperature box equipment receiving component for chip testing of the present invention;

[0024] Explanation of reference numerals: 1. Lower camera light source; 2. Support assembly; 3. Material tray lifting assembly; 4. Movement assembly; 5. Positioning assembly; 6. Buffer assembly; 7. Detection assembly; 8. Material receiving assembly; 201. Fixed bottom plate; 202. Waste bracket; 203. Waste tray; 301. Lifting base; 302. Control box; 303. Lifting arm; 304. Support table; 305. Material storage tray; 401. Support frame; 402. Y-axis movement module; 403. X-axis movement module; 404. X-axis drag chain; 501. Positioning bracket; 5 02. Z-axis motion module; 503. Positioning motor; 504. Motion nozzle; 505. Connecting air pipe; 506. Visual positioning camera; 601. Limiting slide bar; 602. Limiting top plate; 603. Buffering bottom plate; 604. Buffering spring; 605. Sliding plate; 701. Clamping base; 702. Clamping support; 703. Sliding support; 704. Limiting rod; 705. Test fixture base; 706. Test tooling; 801. Material tray bracket; 802. Material receiving table; 803. Rotating shaft; 804. Rotating support block. DETAILED DESCRIPTION

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0026] See also Figure 1 , the utility model provides an embodiment: a high and low temperature box equipment for chip detection, including a lower camera light source 1, a support component 2, a material tray lifting component 3, a moving component 4, a positioning component 5, a buffer component 6, a detection component 7 and a material receiving component 8; the bottom surface of the lower camera light source 1 is provided with a support component 2, the top surface of the support component 2 is provided with a material tray lifting component 3, the top surface of the support component 2 is provided with a moving component 4, the side surface of the moving component 4 is provided with a positioning component 5, the bottom surface of the positioning component 5 is provided with a buffer component 6, the top surface of the support component 2 is provided with a detection component 7, the top surface of the material tray lifting component 3 is provided with a material receiving component 8, the lower camera light source 1 can provide light source for the device, which is convenient for positioning and absorbing chips Attached, the support component 2 can provide support for the device and can collect unqualified chips. The material tray lifting component 3 can provide support for multiple groups of material trays. After the inspection of one group of material trays is completed, the next group of material trays can be automatically loaded, saving manual replacement time. The motion component 4 can drive the positioning component 5 to move inside the device. The positioning component 5 can position and adsorb the chip, which is convenient for picking up and placing the chip. The buffer component 6 can provide buffering for the device during movement to avoid damage to the chip due to excessive pressure. The detection component 7 can clamp and fix the chip that needs to be tested, which is convenient for testing the chip. The material collecting component 8 can provide support for the material tray after inspection, which is convenient for picking up after the inspection is completed.

[0027] See also Figure 2-7In this embodiment, the support assembly 2 includes a fixed base plate 201, a waste bracket 202 and a waste tray 203; the bottom surface of the lower camera light source 1 is provided with a fixed base plate 201, the top surface of the fixed base plate 201 is provided with a waste bracket 202, and the top surface of the waste bracket 202 is provided with a waste tray 203. The fixed base plate 201 provides support for the entire device, and the waste bracket 202 provides support for the waste tray 203. The waste tray 203 collects unqualified chips. The tray lifting assembly 3 includes a lifting base 301, a control box 302, a lifting arm 303, a support table 304 and a storage tray 305; the top surface of the fixed base plate 201 is provided with a lifting base 301, and the top surface of the lifting base 301 is provided with There is a control box 302, and the output end of the control box 302 is provided with a lifting arm 303, and the lifting arm 303 is provided on the inner side of the lifting base 301, and the top surface of the lifting arm 303 is provided with a support platform 304, and the top surface of the support platform 304 is provided with a storage tray 305, and the storage tray 305 is provided with multiple groups. The chips to be tested are placed on the storage tray 305, and the storage tray 305 is placed on the support platform 304. The control box 302 is used to drive the lifting arm 303 to pull up, thereby pushing the storage tray 305 to rise. The motion component 4 includes a support frame 401, a Y-axis motion module 402, an X-axis motion module 403 and an X-axis drag chain 404; the top surface of the fixed bottom plate 201 is provided with a support frame 401, a support The top surface of the frame 401 is provided with a Y-axis motion module 402, the top surface of the Y-axis motion module 402 is provided with an X-axis motion module 403, and the top surface of the Y-axis motion module 402 is provided with an X-axis drag chain 404. The Y-axis motion module 402 and the X-axis motion module 403 are used to move the Z-axis motion module 502 in the device, and the position of the motion nozzle 504 is adjusted to facilitate positioning and adsorption of the chip. The positioning component 5 includes a positioning bracket 501, a Z-axis motion module 502, a positioning motor 503, a motion nozzle 504, a connecting air pipe 505 and a visual positioning camera 506; the side of the X-axis motion module 403 is provided with a positioning bracket 501, and the positioning bracket 501 is provided on the X-axis drag chain There are four groups of positioning brackets 501 on the bottom surface of the chain 404, a Z-axis motion module 502 is provided on the side of the positioning bracket 501, a positioning motor 503 is provided on the top surface of the Z-axis motion module 502, a motion nozzle 504 is provided at the output end of the positioning motor 503, a connecting air pipe 505 is provided on the top surface of the positioning motor 503, a visual positioning camera 506 is provided on the side of the positioning bracket 501, and the visual positioning camera 506 is used to take pictures of the internal chip to facilitate positioning of the chip, and the motion nozzle 504 is driven to rise and fall by the movement of the Z-axis motion module 502, and is connected to the air pump by the connecting air pipe 505, and the positioned chip is adsorbed by the motion nozzle 504 to facilitate moving the chip.

[0028] The buffer assembly 6 includes a limited slide 601, a limited top plate 602, a buffer bottom plate 603, a buffer spring 604 and a sliding plate 605; the inner side of the Z-axis motion module 502 is provided with a limited slide 601, the top surface of the limited slide 601 is provided with a limited top plate 602, the bottom surface of the limited slide 601 is provided with a buffer bottom plate 603, the top surface of the buffer bottom plate 603 is provided with a buffer spring 604, the buffer spring 604 is provided with four groups, the other end of the buffer spring 604 is provided with a sliding plate 605, the sliding plate 605 is provided with On the outside of the limiting slide 601, during the downward movement of the Z-axis motion module 502, the buffer base 603 contacts the device, pushing the limiting slide 601 to slide within the Z-axis motion module 502, compressing the buffer spring 604. The elastic force of the buffer spring 604 offsets the downward pressure and prevents the chip from being squeezed and damaged. The detection assembly 7 includes a clamping base 701, a clamping support 702, a sliding support 703, a limiting rod 704, a test fixture base 705, and a test fixture 706; The top surface of the fixed base 201 is provided with a clamping base 701, the top surface of the clamping base 701 is provided with a clamping support 702, the side of the clamping support 702 is provided with a sliding support 703, the side of the clamping support 702 is provided with a limit rod 704, the top surface of the sliding support 703 is provided with a test fixture base 705, and the top surface of the test fixture base 705 is provided with a test fixture 706. By sliding the sliding support 703 on the clamping support 702, the height of the test fixture 706 can be adjusted. After the adjustment is completed, the limit rod 704 is provided. The positioning rod 704 fixes the sliding support 703 and the clamping support 702, and the Y-axis motion module 402 and the X-axis motion module 403 move to drive the motion nozzle 504 to move, and the adsorbed chip is placed in the test fixture 706 for clamping and testing. After the test is completed, the waste is placed in the waste tray 203 for collection through the motion nozzle 504, and the qualified chips are placed back in the storage tray 305. The receiving assembly 8 includes a tray bracket 801, a receiving platform 802, a rotating shaft 803 and a rotating support block 804;The top surface of the support frame 401 is provided with a material tray bracket 801, and the material tray bracket 801 is provided with two groups. A material receiving platform 802 is provided on the side of the material tray bracket 801, and a rotating shaft 803 is provided on the inner side of the material receiving platform 802, and the rotating shaft 803 is provided with two groups. A rotating support block 804 is provided on the outer side of the rotating shaft 803, and the rotating support block 804 is provided with two groups. After the chips in a group of material storage trays 305 are inspected in sequence, the control box 302 is used to drive the lifting arm 303 to pull up, and the material storage tray 305 is pushed up through the support platform 304, so that the top surface of the material storage tray 305 pushes the rotating support block 804 to move upward. The support block 804 rotates on the rotating shaft 803, pushing the material storage tray 305 to the inside of the material receiving platform 802 at the top. Under the action of gravity, the rotating support block 804 rotates on the rotating shaft 803 to its original position. The material receiving platform 802 restrains one end of the rotating support block 804. When the lifting arm 303 retracts and pulls the support platform 304 to drive the remaining material storage trays 305 back to their original position, the restrained rotating support block 804 intercepts the bottom of the material storage tray 305 that has been inspected. The rotating support block 804 thus provides support for the material storage tray 305 and secures it to the material receiving platform 802.

[0029] During operation, the fixed base plate 201 provides support for the entire device, and the waste support 202 provides support for the waste tray 203, which collects unqualified chips.

[0030] The chips to be tested are placed on the storage tray 305, and the storage tray 305 is placed on the support table 304. The control box 302 is used to drive the lifting arm 303 to pull up, thereby pushing the storage tray 305 to rise;

[0031] The height of the test fixture 706 is adjusted by sliding the sliding support 703 on the clamping support 702. After the adjustment is completed, the sliding support 703 and the clamping support 702 are fixed by the limiting rod 704.

[0032] The visual positioning camera 506 is used to take pictures of the internal chip to facilitate chip positioning. The Y-axis motion module 402 and the X-axis motion module 403 are used to move the Z-axis motion module 502 in the device to adjust the position of the motion nozzle 504.

[0033] The connecting air pipe 505 is connected to the air pump, and the Z-axis motion module 502 is moved to drive the motion nozzle 504 to move up and down, so that the buffer base 603 contacts the device, thereby pushing the limiting slide 601 to slide in the Z-axis motion module 502, compressing the buffer spring 604. The elastic force of the buffer spring 604 offsets the downward pressure to prevent the chip from being squeezed and damaged. The positioned chip is then adsorbed by the motion nozzle 504, making it easier to move the chip.

[0034] The moving nozzle 504 is driven to move and the adsorbed chips are placed in the test fixture 706 for clamping and testing. After the test is completed, the moving nozzle 504 is used to place the waste into the waste tray 203 for collection, and the qualified chips are placed back into the storage tray 305.

[0035] After the chips in a group of storage trays 305 are inspected in sequence, the control box 302 is used to drive the lifting arm 303 to pull up, and the storage tray 305 is pushed up by the support platform 304, so that the top surface of the storage tray 305 pushes the rotating support block 804 to rotate on the rotating shaft 803, and the storage tray 305 is pushed to the inner side of the top receiving platform 802. Under the action of gravity, the rotating support block 804 rotates on the rotating shaft 803 to its original position;

[0036] The material receiving platform 802 is used to limit one end of the rotating support block 804. When the lifting arm 303 contracts and pulls the support platform 304 to drive the remaining material storage trays 305 back to the initial position, the restricted rotating support block 804 will intercept the bottom of the material storage tray 305 that has been inspected, thereby providing support for the material storage tray 305 through the rotating support block 804 and fixing it on the material receiving platform 802.

[0037] Through the above steps, the lower camera light source 1 is used to provide light for the device, which is convenient for positioning and adsorbing the chip. The support component 2 provides support for the device and collects unqualified chips. The material tray lifting component 3 is used to provide support for multiple groups of material trays. After one group of material trays is inspected, the next group of material trays is automatically loaded, saving manual replacement time. The positioning component 5 is driven by the motion component 4 to move inside the device. The positioning component 5 is used to position and adsorb the chip, which is convenient for picking up and placing the chip. The buffer component 6 provides buffering for the device during movement to avoid damage to the chip due to excessive pressure. The chip to be tested is clamped and fixed by the detection component 7, which is convenient for chip detection. The material receiving component 8 provides support for the material tray after inspection, which is convenient for picking up after the inspection is completed.

[0038] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the purpose of the present invention.

Claims

1. A high and low temperature box device for chip detection, comprising a lower camera light source (1); characterized in that: The invention also includes a support component (2), a material tray lifting component (3), a motion component (4), a positioning component (5), a buffer component (6), a detection component (7) and a material receiving component (8); the bottom surface of the lower camera light source (1) is provided with the support component (2), the top surface of the support component (2) is provided with the material tray lifting component (3), the top surface of the support component (2) is provided with the motion component (4), the side surface of the motion component (4) is provided with the positioning component (5), the bottom surface of the positioning component (5) is provided with the buffer component (6), the top surface of the support component (2) is provided with the detection component (7), and the top surface of the material tray lifting component (3) is provided with the material receiving component (8).

2. The high and low temperature chamber equipment for chip testing according to claim 1, characterized in that: The support assembly (2) comprises a fixed base plate (201), a waste support (202) and a waste tray (203); the bottom surface of the lower camera light source (1) is provided with the fixed base plate (201), the top surface of the fixed base plate (201) is provided with the waste support (202), and the top surface of the waste support (202) is provided with the waste tray (203).

3. The high and low temperature chamber equipment for chip testing according to claim 2, characterized in that: The material tray lifting assembly (3) comprises a lifting base (301), a control box (302), a lifting arm (303), a support platform (304) and a material storage tray (305); the lifting base (301) is provided on the top surface of the fixed base plate (201), the control box (302) is provided on the top surface of the lifting base (301), the lifting arm (303) is provided at the output end of the control box (302), the lifting arm (303) is provided on the inner side of the lifting base (301), the support platform (304) is provided on the top surface of the lifting arm (303), the material storage tray (305) is provided on the top surface of the support platform (304), and a plurality of groups of material storage trays (305) are provided.

4. The high and low temperature chamber equipment for chip testing according to claim 2, characterized in that: The motion assembly (4) includes a support frame (401), a Y-axis motion module (402), an X-axis motion module (403) and an X-axis drag chain (404); the top surface of the fixed base plate (201) is provided with the support frame (401), the top surface of the support frame (401) is provided with the Y-axis motion module (402), the top surface of the Y-axis motion module (402) is provided with the X-axis motion module (403), and the top surface of the Y-axis motion module (402) is provided with the X-axis drag chain (404).

5. The high and low temperature chamber equipment for chip testing according to claim 4, characterized in that: The positioning assembly (5) comprises a positioning bracket (501), a Z-axis motion module (502), a positioning motor (503), a motion suction nozzle (504), a connecting air pipe (505) and a visual positioning camera (506); a positioning bracket (501) is provided on the side of the X-axis motion module (403), the positioning bracket (501) is provided on the bottom surface of the X-axis drag chain (404), four groups of positioning brackets (501) are provided, a Z-axis motion module (502) is provided on the side of the positioning bracket (501), a positioning motor (503) is provided on the top surface of the Z-axis motion module (502), a motion suction nozzle (504) is provided at the output end of the positioning motor (503), a connecting air pipe (505) is provided on the top surface of the positioning motor (503), and a visual positioning camera (506) is provided on the side of the positioning bracket (501).

6. The high and low temperature chamber equipment for chip testing according to claim 5, characterized in that: The buffer assembly (6) comprises a limit slide bar (601), a limit top plate (602), a buffer bottom plate (603), a buffer spring (604) and a sliding plate (605); the limit slide bar (601) is provided on the inner side of the Z-axis motion module (502), the limit top plate (602) is provided on the top surface of the limit slide bar (601), the buffer bottom plate (603) is provided on the bottom surface of the limit slide bar (601), the buffer bottom plate (604) is provided on the top surface of the buffer bottom plate (603), four groups of buffer springs (604) are provided, the other end of the buffer spring (604) is provided with a sliding plate (605), and the sliding plate (605) is provided on the outer side of the limit slide bar (601).

7. The high and low temperature chamber equipment for chip testing according to claim 2, characterized in that: The detection component (7) comprises a clamping base (701), a clamping support (702), a sliding support (703), a limiting rod (704), a test fixture base (705) and a test tool (706); the top surface of the fixed base plate (201) is provided with a clamping base (701), the top surface of the clamping base (701) is provided with a clamping support (702), the side surface of the clamping support (702) is provided with a sliding support (703), the side surface of the clamping support (702) is provided with a limiting rod (704), the top surface of the sliding support (703) is provided with a test fixture base (705), and the top surface of the test fixture base (705) is provided with a test tool (706).

8. The high and low temperature chamber equipment for chip testing according to claim 4, characterized in that: The material receiving assembly (8) comprises a material tray bracket (801), a material receiving platform (802), a rotating shaft (803) and a rotating support block (804); the material tray bracket (801) is provided on the top surface of the support frame (401), the material tray bracket (801) is provided in two groups, the material receiving platform (802) is provided on the side of the material tray bracket (801), the rotating shaft (803) is provided on the inner side of the material receiving platform (802), the rotating shaft (803) is provided in two groups, and the rotating support block (804) is provided on the outer side of the rotating shaft (803), the rotating support block (804) is provided in two groups.

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