Defect detection device for polishing pad on polishing disk

Abstract

The utility model discloses a defect detection device for a polishing pad on a polishing disk, which is applied to the field of wafer grinding and comprises a polishing disk and a laser scanner bearing frame, a polishing pad mounting area is arranged on the surface of the polishing disc; a laser probe is exposed on the laser scanner bearing frame; the laser scanner bearing frame can move in the direction close to and away from the polishing disc; the laser scanner bearing frame and the polishing disc are correspondingly arranged, so that when the laser scanner bearing frame is close to the polishing disc, the laser probe is located above the polishing pad installation area. When the polishing pad is mounted in the polishing pad mounting area, the correspondingly arranged laser probe is used for emitting the laser beam to the surface of the polishing pad and receiving the laser beam reflected by the surface of the polishing pad, and then whether bubble defects exist between the polishing pad and the polishing disc or not is determined according to reflection delay, so that the detection accuracy is improved, and the detection efficiency is improved. And meanwhile, the movable laser scanner bearing frame is arranged, so that the detection flexibility is improved.

Description

Technical Field

[0001] The utility model relates to the field of wafer grinding, in particular to a polishing pad defect detection device on a polishing disk. Background Art

[0002] Chemical mechanical polishing (CMP), a crucial step in semiconductor device manufacturing, requires contact between a wafer and a polishing pad mounted on a polishing platen. However, existing CMP processes often create bubbles between the polishing pad and the platen, and the polishing pad itself, as a consumable component, is susceptible to damage. Furthermore, raised areas on the polishing pad's surface caused by bubbles between the pad and the platen, as well as damage to the pad itself, can easily lead to wafer breakage during polishing, reducing the yield rate of polished wafer devices.

[0003] Therefore, how to provide a device that can accurately detect bubbles between the polishing disc and the polishing pad, or surface defects such as protrusions on the polishing pad itself, is a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0004] In view of this, the purpose of the present invention is to provide a polishing pad defect detection device on a polishing disk, which solves the problems in the prior art that when the polishing pad is installed, bubbles are easily generated between the polishing pad and the polishing disk after pasting, and the polishing pad itself is easily damaged as a consumable part, and the damage to the polishing pad is easy to cause wafer fragments during grinding, resulting in a decrease in the yield rate of ground wafer devices.

[0005] In order to solve the above technical problems, the utility model provides a polishing pad defect detection device on a polishing disk, comprising:

[0006] Polishing disc and laser scanner carrier; the polishing disc surface is provided with a polishing pad mounting area;

[0007] The laser scanner carrier is provided with an exposed laser probe;

[0008] The laser scanner carrier is a laser scanner carrier that is movable in a direction approaching and away from the polishing plate;

[0009] The laser scanner carrier is arranged corresponding to the polishing plate, so that when the laser scanner carrier is close to the polishing plate, the laser probe is located above the polishing pad installation area.

[0010] Optionally, a rotation drive component is also included;

[0011] The rotating drive component is connected to the polishing disc, drives the polishing disc to rotate, and drives the polishing pad installation area to rotate relative to the laser probe; the rotation axis of the polishing disc is parallel to or coincides with the direction along which the laser probe points to the polishing pad installation area.

[0012] Optionally, the surface of the laser scanner carrier is provided with a plurality of laser probes located on the upper side of the polishing pad installation area.

[0013] Optionally, all the laser probes are arranged in a straight line.

[0014] Optionally, all of the laser probes are closely arranged along a straight line.

[0015] Optionally, the polishing pad mounting area is a circular polishing pad mounting area;

[0016] When the laser scanner carrier is close to the polishing plate, all the laser probes are arranged corresponding to a radius of the circular polishing pad installation area.

[0017] Optionally, the surface of the laser scanner carrier is provided with three laser probes located on the upper side of the polishing pad mounting area;

[0018] The three laser probes are arranged in a straight line, and the distance between adjacent laser probes is at least 1 cm.

[0019] Optionally, a sliding guide rail is provided on the surface of the laser scanner carrier corresponding to the polishing pad installation area;

[0020] The laser probe is matched and connected with the sliding guide rail.

[0021] Optionally, the laser scanner carrier further includes a slider matching the sliding guide rail;

[0022] The laser probe is connected to the slider, and the slider is connected to a driving cylinder that drives the slider to move.

[0023] Optionally, the laser scanner carrier includes a carrier vertical rod and a carrier crossbeam;

[0024] The vertical rods of the carrier frame are connected to the cross beams of the carrier frame;

[0025] The carrier frame vertical rod includes a rotating component that drives the carrier frame vertical rod to rotate with the axial center line of the carrier frame vertical rod as the rotation axis;

[0026] The laser scanner carrier is a laser scanner carrier that can be moved along the direction of approaching and moving away from the polishing plate through the rotating component.

[0027] Optionally, also include:

[0028] an image display component, and an analysis and processing component connected to the laser probe for receiving reflection delay information collected by the laser probe when a polishing pad is installed in the polishing pad installation area, and analyzing and processing the reflection delay information to obtain image information of the polishing pad surface;

[0029] The image display component that receives and displays the image information of the polishing pad surface is communicatively connected with the analysis and processing component.

[0030] As can be seen, the polishing pad defect detection device provided by the present invention includes a polishing disk and a laser scanner carrier, wherein a polishing pad mounting area is provided on the surface of the polishing disk, and a laser probe is exposed on the laser scanner carrier. The laser scanner carrier is a laser scanner carrier that is movable in a direction approaching and away from the polishing disk. The laser scanner carrier is arranged corresponding to the polishing disk so that when the laser scanner carrier is close to the polishing disk, the laser probe is located above the polishing pad mounting area. The utility model is configured such that the laser probe mounted on the laser scanner carrier is arranged so that when the laser scanner carrier is close to the polishing disk, the laser probe is correspondingly arranged above the polishing pad mounting area. When a polishing pad is installed in the polishing pad mounting area, the laser probe is used to emit a laser beam to the surface of the polishing pad and receive the laser beam reflected by the surface of the polishing pad. Then, based on the reflection delay, it is determined whether there is a bubble defect between the polishing pad and the polishing disk, thereby improving the accuracy of the detection by laser detection. At the same time, the laser scanner carrier is provided as a movable laser scanner carrier that is movable in a direction approaching and away from the polishing disk. This can prevent the laser scanner carrier from affecting the polishing process and improve the flexibility of the detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0032] Figure 1 A schematic structural diagram of a polishing pad defect detection device for a polishing disk provided by an embodiment of the present utility model;

[0033] Figure 2 This is a structural diagram of a method of grinding a wafer device using a polishing pad on a polishing plate in the prior art;

[0034] Figure 3A schematic top view of a polishing pad defect detection device for a polishing disk provided by an embodiment of the present invention;

[0035] Figure 4 An example diagram of a process for detecting defects on a polishing pad on a polishing plate provided by an embodiment of the present utility model;

[0036] Figures 1 to 3 In the figure, the reference numerals are described as follows:

[0037] 1- emitted laser beam, 2- reflected laser beam, 3- bubbles generated between the polishing pad and the polishing plate, 4- wafer device;

[0038] 100 - laser scanner carrier, 101 - laser probe, 102 - polishing pad, 103 - polishing disc. DETAILED DESCRIPTION

[0039] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0040] Example 1:

[0041] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a polishing pad defect detection device for a polishing disc provided by an embodiment of the present invention. The device may include:

[0042] Polishing disc 103 and laser scanner carrier 100; polishing disc 103 surface is provided with polishing pad 102 mounting area;

[0043] The laser scanner carrier 100 is exposed with a laser probe 101;

[0044] The laser scanner carrier 100 is movable in a direction close to and away from the polishing plate 103;

[0045] The laser scanner carrier 100 is arranged corresponding to the polishing plate 103 so that when the laser scanner carrier 100 is close to the polishing plate 103 , the laser probe 101 is located above the installation area of ​​the polishing pad 102 .

[0046] It should be noted that the polishing pad 102 mounting area provided on the surface of the polishing platen 103 in this embodiment is the area on the surface of the polishing platen 103 where the polishing pad 102 will subsequently be mounted. In the prior art, the polishing platen 103 is typically circular, and the polishing pad 102 is typically configured as a circular polishing pad 102 slightly smaller than the diameter of the polishing platen 103. Therefore, in this embodiment, the polishing pad 102 mounting area can be defined as an area on the surface of the polishing platen 103 that is bounded by a contour line that is a predetermined distance from the outer contour of the polishing platen 103. The predetermined distance can be set according to the size of the wafer being polished during chemical mechanical polishing. Furthermore, in this embodiment, the laser scanner carrier 100 is configured to be movable in directions toward and away from the polishing platen 103. This prevents the laser scanner carrier 100 from interfering with the subsequent polishing of the wafer by the polishing pad 102 after defect detection on the polishing platen 103, thereby preventing obstruction. Specifically, after the polishing pad 102 is pasted and installed on the polishing disk 103, the laser scanner carrier 100 can be moved in a direction close to the polishing disk 103 to move the laser probe 101 to a position corresponding to the polishing pad 102, so that the laser probe 101 emits a laser beam to the surface of the polishing pad 102, and uses the laser probe 101 to receive the laser beam 2 reflected by the surface of the polishing pad 102, and then determines whether there is a bubble defect between the polishing pad 102 and the polishing disk 103 based on the delay between the emitted laser beam 1 and the reflected laser beam 2 collected by the laser probe 101, that is, determines whether there is a bubble 3 generated by the installation between the polishing pad and the polishing disk and the position of the bubble based on the surface shape of the polishing pad 102.

[0047] In this embodiment, the laser scanner carrier 100 is exposed with a laser probe 101. Specifically, the laser probe 101 can be located within the laser scanner carrier 100, requiring only that the laser probe 101 be exposed to perform the steps of emitting and receiving the laser beam. Alternatively, the laser probe 101 can be directly located on the surface of the laser scanner carrier 100. In this embodiment, the specific location of the laser probe 101 on the surface of the laser scanner carrier 100 is not limited; as long as the laser probe 101 is able to emit a laser beam toward the polishing pad 102 and receive the laser beam 2 reflected by the polishing pad 102 during inspection, it is sufficient. For example, the laser probe 101 can be located on the side of the laser scanner carrier 100 facing the polishing pad 102, or on any side of the laser scanner carrier 100. The portion of the laser scanner carrier 100 where the laser probe 101 is located can move relative to the laser scanner carrier 100, allowing the laser probe 101 to reach a position corresponding to the mounting area of ​​the polishing pad 102. It should be further explained that, in this embodiment, when the laser scanner carrier 100 is close to the polishing disk 103, the laser probe 101 is located above the installation area of ​​the polishing pad 102. At this time, this embodiment is described as the surface of the polishing disk 103 with the polishing pad 102 installation area facing upward. Therefore, at this time, the laser probe 101 is set on the upper side of the installation area of ​​the polishing pad 102 during detection. In fact, the laser probe 101 is located in the direction pointing outward from the installation area of ​​the polishing pad 102. Preferably, the laser probe 101 can be set in the installation area of ​​the polishing pad 102, in a direction perpendicular to the surface pointing outward.

[0048] In addition, it should be noted that in this embodiment, when there are bubbles 3 generated between the polishing pad and the polishing plate, when the polishing pad 102 grinds the wafer device 4, the bubbles come into contact with the wafer device 4 and exert pressure on the wafer device 4, which can easily cause the wafer device 4 to break. Figure 2 , Figure 2This is a diagram of a structure for polishing a wafer device using a polishing pad on a polishing platen in the prior art. During inspection, the laser probe 101 does not move in a direction perpendicular to the surface where the polishing pad 102 is mounted, ensuring accurate defect detection of the polishing pad 102 mounted on the polishing platen 103. However, this embodiment does not limit the laser probe 101 to movement relative to the polishing platen 103 in a direction parallel to the surface where the polishing pad 102 is mounted, either toward or away from the polishing platen 103. The laser probe 101 can be configured to move relative to the polishing platen 103 in a direction parallel to the surface where the polishing pad 102 is mounted, either toward or away from the polishing platen 103, to reduce the number of laser probes 101 deployed and enable inspection of all polishing areas of the polishing pad 102 with fewer laser probes 101. Alternatively, the laser probe 101 can be configured to not move relative to the polishing platen 103 in a direction parallel to the surface where the polishing pad 102 is mounted, either toward or away from the polishing platen 103, to reduce the complexity of the device.

[0049] Furthermore, in order to improve the efficiency of detecting defects existing on the polishing pad 102 on the polishing plate 103, a rotation driving component may be further included;

[0050] The rotating drive component is connected to the polishing disc 103, driving the polishing disc 103 to rotate and causing the installation area of ​​the polishing pad 102 to rotate relative to the laser probe 101; the rotation axis of the polishing disc 103 is parallel to or coincides with the direction along which the laser probe 101 points to the installation area of ​​the polishing pad 102.

[0051] It should be noted that, in this embodiment, a rotating drive component is provided to be connected to the polishing disc 103, driving the polishing disc 103 to rotate, and at the same time causing the installation area of ​​the polishing pad 102 to rotate relative to the laser probe 101. Preferably, the rotation axis of the polishing disc 103 can be set to be parallel to the direction along which the laser probe 101 points to the installation area of ​​the polishing pad 102, so that the laser probe 101 can rotate around the geometric center point of the installation area of ​​the polishing pad 102. While ensuring the regularity of the device, the convenience of detection can be improved without increasing the difficulty of arranging the laser scanner carrier 100 and the laser probe 101.

[0052] Furthermore, in order to reduce the time for detecting installation defects between the polishing pad 102 and the polishing plate 103 , the surface of the laser scanner carrier 100 may be provided with a plurality of laser probes 101 located above the installation area of ​​the polishing pad 102 .

[0053] Because the single detection area of ​​the laser probe 101 is limited, even when the laser probe 101 rotates and scans around the geometric center of the polishing pad 102 installation area, it is necessary to perform detection in the plane along the direction of the geometric center pointing outward in the polishing pad 102 installation area in order to complete the detection of the polishing pad 102 installed in the polishing pad 102 installation area. Therefore, in order to reduce the detection duration and improve the detection efficiency, in this embodiment, multiple laser probes 101 can be set on the upper side of the polishing pad 102 installation area. Specifically, multiple laser probes 101 can be arranged in a plane parallel to the plane where the polishing pad 102 installation area is located, and arranged along the direction of the geometric center of the polishing pad 102 installation area pointing outward.

[0054] Furthermore, in order to reduce the number of laser probes 101 and ensure the efficiency of detecting the polishing pad 102 on the polishing plate 103 , all the laser probes 101 may be arranged in a straight line.

[0055] It should be noted that, in this embodiment, all laser probes 101 are arranged in a straight line, that is, multiple laser probes 101 are arranged in a plane parallel to the plane where the polishing pad 102 is installed, and are arranged in a straight line along the direction pointing outward from the geometric center of the polishing pad 102 installation area. This is based on reducing the number of laser probes 101 and improving the efficiency of the laser probe 101 in defect detection of the polishing pad 102 installed on the polishing disk 103.

[0056] Furthermore, in order to avoid missed detection areas, all the laser probes 101 may be arranged closely along a straight line.

[0057] It should be noted that, in this embodiment, all the laser probes 101 are arranged closely along a straight line, that is, two adjacent laser probes 101 arranged along a straight line are fitted together to minimize the distance between the detection areas of the two adjacent laser probes 101. It should be pointed out that the single detection area of ​​the general laser probe 101 is circular in shape. Therefore, in an ideal state, the detection areas of two adjacent laser probes 101 are tangent to each other to avoid missed detection areas of the polishing pad 102 installed on the polishing disk 103.

[0058] Furthermore, in order to improve the detection efficiency, the polishing pad 102 installation area may be set as a circular polishing pad 102 installation area;

[0059] When the laser scanner carrier 100 is close to the polishing plate 103 , all the laser probes 101 are arranged corresponding to a radius of the installation area of ​​the circular polishing pad 102 .

[0060] It should be noted that, in this embodiment, all the laser probes 101 arranged along a straight line are set to a radius setting corresponding to the circular polishing pad 102 installation area. At this time, after the laser probe 101 rotates around the center of the polishing pad 102 installation area for one circle, the detection of the polishing pad 102 installed in the polishing pad 102 installation area can be completed. Alternatively, in order to further reduce the detection time, all the laser probes 101 can be further set to a diameter setting corresponding to the circular polishing pad 102 installation area. At this time, after the laser probe 101 rotates around the center of the polishing pad 102 installation area for half a circle, the detection of the polishing pad 102 installed in the polishing pad 102 installation area can be completed.

[0061] Furthermore, in order to ensure the accuracy of the device detection and the simplicity of the device, the surface of the laser scanner carrier can be provided with three laser probes located on the upper side of the polishing pad installation area;

[0062] The three laser probes can be arranged in a straight line, and the distance between adjacent laser probes can be set to be at least 1 cm.

[0063] In this embodiment, corresponding to the size of the conventional polishing pad and the effective detection range of the laser probe, only three laser probes can be set. In order to ensure the smooth layout of the three laser probes and the simplicity of the laser probe layout, multiple laser probes can be arranged in a straight line, and the spacing between adjacent laser probes is not less than 1 cm. The specific setting can be made according to actual conditions.

[0064] Furthermore, in order to ensure the simplicity of the structure of the laser scanner carrier 100, reference may be made to Figure 3 , Figure 3 This is a schematic diagram of a top view of a polishing pad defect detection device for a polishing disk provided by an embodiment of the present invention. A laser scanner carrier 100 may be provided, comprising a carrier vertical rod and a carrier horizontal beam;

[0065] The vertical rods of the bearing frame are connected to the cross beams of the bearing frame;

[0066] The vertical rod of the carrier frame includes a rotating component that drives the vertical rod of the carrier frame to rotate with the axial center line of the vertical rod of the carrier frame as the rotation axis;

[0067] The laser scanner carriage 100 is movable in directions approaching and away from the polishing plate 103 by a rotating component.

[0068] It should be noted that in this embodiment, the laser scanner carrier 100 is configured to include a carrier vertical rod and a carrier cross beam, so that the carrier vertical rod is used to lift the carrier cross beam to the upper side of the polishing disk 103, and the carrier cross beam is used to carry the laser probe 101 to detect the polishing pad 102 installed on the polishing disk 103, thereby improving the simplicity of the structure of the laser scanner carrier 100. In addition, in this embodiment of the utility model, the laser scanner carrier 100 is configured to be a laser scanner carrier 100 that can be moved in the direction of approaching and moving away from the polishing disk 103 by a rotating component, and the laser probe 101 is moved close to and away from the polishing disk 103 by rotation. At this time, the exposed laser probe 101 on the laser scanner carrier 100 only approaches or moves away from the polishing disk 103 by circumferential rotation. Compared with the method of moving the laser scanner carrier 100 in a straight line to approach the polishing disk 103, the position of the laser probe 101 relative to the polishing disk 103 in this embodiment is more accurate, thereby improving the detection accuracy. In this embodiment, as Figure 3 As shown, the laser scanner carrier 100 can be used as Figure 3 When the corresponding polishing plate 103 is set, the polishing pad 102 is tested, and after the test is completed, the laser scanner carrier 100 is rotated to the position as shown in FIG. Figure 3 At the dotted line position in the figure, so that the wafer device can be processed using a polishing pad later.

[0069] In addition, in this embodiment, a vertical rod of the carrier can be provided to be fixedly connected to the polishing plate 103 to ensure that the relative position between the laser scanner carrier 100 and the polishing plate 103 is fixed, thereby improving detection efficiency and accuracy.

[0070] Furthermore, in order to improve the functionality of the device and ensure the visual effect of the detection results, the above detection device may further include:

[0071] an image display component, and an analysis and processing component that is in communication with the laser probe 101 to receive reflection delay information collected by the laser probe 101 when the polishing pad 102 is installed in the polishing pad 102 installation area, and analyze and process the reflection delay information to obtain image information of the surface of the polishing pad 102;

[0072] The image display component that receives and displays image information of the surface of the polishing pad 102 is communicatively connected to the analysis and processing component.

[0073] It should be noted that in this embodiment, an analysis and processing component is set up to process the reflection delay information collected by the laser probe 101, determine the detection results, and send them to the image display component for display, so that the operator can obtain the detection results in time and ensure the functionality of the device.

[0074] The polishing pad 102 defect detection device on the polishing disc 103 provided by the embodiment of the utility model includes a polishing disc 103 and a laser scanner carrier 100. The polishing disc 103 is provided with a polishing pad 102 installation area on the surface of the polishing disc 103. The laser scanner carrier 100 is exposed with a laser probe 101. The laser scanner carrier 100 is a laser scanner carrier 100 that can be moved in the direction of approaching and moving away from the polishing disc 103. The laser scanner carrier 100 is arranged corresponding to the polishing disc 103 so that when the laser scanner carrier 100 is close to the polishing disc 103, the laser probe 101 is located above the polishing pad 102 installation area. The utility model is to arrange a laser probe 101 mounted on a laser scanner carrier 100 so that when the laser scanner carrier 100 is close to the polishing disk 103, the laser probe 101 is correspondingly arranged above the installation area of ​​the polishing pad 102, so that when the polishing pad 102 is installed in the installation area of ​​the polishing pad 102, the laser probe 101 is used to emit a laser beam to the surface of the polishing pad 102, and receive the laser beam 2 reflected by the surface of the polishing pad 102, and then determine whether there is a bubble defect between the polishing pad 102 and the polishing disk 103 according to the reflection delay, and use laser detection to improve the accuracy of detection, and at the same time set the laser scanner carrier 100 as a movable laser scanner carrier 100 that can move in the direction of approaching and away from the polishing disk 103, which can avoid the laser scanner carrier 100 from affecting the grinding process and improve the flexibility of detection.

[0075] In addition, the embodiment of the present invention is connected to the polishing disc 103 by providing a rotating drive component to drive the polishing disc 103 to rotate, and at the same time, the installation area of ​​the polishing pad 102 is driven to rotate relative to the laser probe 101, so as to detect the polishing pad 102 installed on the polishing disc 103, thereby improving the detection efficiency; by providing a plurality of laser probes 101 located on the upper side of the installation area of ​​the polishing pad 102 on the surface of the laser scanner carrier 100, the detection time can be shortened; by arranging all the laser probes 101 in a straight line, the efficiency of the laser probe 101 in detecting defects on the polishing pad 102 installed on the polishing disc 103 can be improved on the basis of reducing the number of laser probes 101; by arranging all the laser probes 101 closely along a straight line, the distance between the detection areas of two adjacent laser probes 101 can be minimized. To avoid the existence of missed inspection areas of the polishing pad 102 installed on the polishing disk 103; all the laser probes 101 arranged along a straight line are set to a radius setting corresponding to the installation area of ​​the circular polishing pad 102, which can further shorten the inspection time and improve the inspection efficiency; by setting the laser scanner carrier 100 to include a carrier vertical rod and a carrier cross beam, the carrier vertical rod is used to lift the carrier cross beam to the upper side of the polishing disk 103, and the carrier cross beam is used to support the laser probe 101 to detect the polishing pad 102 installed on the polishing disk 103, thereby improving the simplicity of the structure of the laser scanner carrier 100; by setting an analysis and processing component, the reflection delay information collected by the laser probe 101 is processed, the detection result is determined, and it is sent to the image display component for display, so that the operator can obtain the detection result in time and ensure the functionality of the device.

[0076] Example 2:

[0077] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of a polishing pad defect detection device for a polishing disk provided by an embodiment of the present invention. Compared with the above embodiment 1, the difference between this device and the above embodiment 1 is that:

[0078] The surface of the laser scanner carrier 100 corresponding to the installation area of ​​the polishing pad 102 is provided with a sliding guide rail;

[0079] The laser probe 101 is matched and connected with the sliding guide rail.

[0080] It should be noted that in this embodiment, the laser scanner carrier 100 is provided with a sliding guide rail on the surface corresponding to the polishing pad 102 installation area, and the laser probe 101 is provided to be matched with the sliding guide rail. That is, the laser probe 101 is configured to be movable along the sliding guide rail, so that the laser probe 101 can move relative to the polishing pad 102 installed on the polishing disk 103 via the sliding guide rail to complete the detection of the polishing pad 102 on the polishing disk 103. The specific structure of the sliding guide rail is not limited in this embodiment. For example, the sliding guide rail can be arranged in a straight line along the geometric center of the polishing pad 102 installation area, pointing outward. Alternatively, the laser probe 101 can be arranged to have circumferential movement along the geometric center of the polishing pad 102 installation area to complete the detection of the polishing pad 102 installed on the polishing disk 103.

[0081] Furthermore, in order to improve the efficiency of detection, the laser scanner carrier 100 may further include a slider matching the sliding guide rail;

[0082] The laser probe 101 is connected to the slider, and the slider is connected to a driving cylinder that drives the slider to move.

[0083] In this embodiment, a cylinder is used to drive the slider to move the laser probe 101 along the sliding guide rail. There is no need for manual operation to move the laser probe 101 along the sliding guide rail, which improves the automation level of the device and further improves the efficiency of detection.

[0084] The device for detecting defects of the polishing pad 102 on the polishing disc 103 provided by the embodiment of the present invention is configured to provide a surface of the laser scanner carrier 100 corresponding to the installation area of ​​the polishing pad 102, provide a sliding guide rail, and provide a laser probe 101 that is matched and connected to the sliding guide rail. That is, the laser probe 101 is configured to be movable along the sliding guide rail, so that the laser probe 101 can move relative to the polishing pad 102 installed on the polishing disc 103 via the sliding guide rail, thereby completing the detection of the polishing pad 102 on the polishing disc 103, thereby improving the convenience of detection. In addition, the embodiment of the present invention improves the convenience of detection by configuring the laser probe 101 to be movable along the sliding guide rail, so that the laser probe 101 can move relative to the polishing pad 102 installed on the polishing disc 103 via the sliding guide rail, thereby improving the convenience of detection.

[0085] In a feasible embodiment, the polishing pad defect detection device on the polishing disk may specifically include the following structure:

[0086] A polishing disc, a laser scanner carrier, a rotation drive component, an image display component, and an analysis and processing component that is in communication with a laser probe to receive reflection delay information collected by the laser probe when a polishing pad is installed in the polishing pad installation area, and analyze and process the reflection delay information to obtain image information of the polishing pad surface; an image display component that receives and displays the image information of the polishing pad surface, and is in communication with the analysis and processing component; a polishing pad installation area is provided on the surface of the polishing disc, and the polishing pad installation area is a circular polishing pad installation area;

[0087] The laser scanner carrier is exposed with a laser probe; a plurality of laser probes are arranged on the surface of the laser scanner carrier above the polishing pad installation area, and all the laser probes are closely arranged along a straight line;

[0088] The laser scanner carrier includes a carrier vertical rod and a carrier cross beam, the carrier vertical rod is connected to the carrier cross beam, the carrier vertical rod includes a rotating component that uses the axial center line of the carrier vertical rod as a rotation axis to drive the carrier vertical rod to rotate, and the laser scanner carrier is a laser scanner carrier that can be moved in a direction close to and away from the polishing plate through the rotating component;

[0089] The laser scanner carrier is arranged corresponding to the polishing plate, so that when the laser scanner carrier is close to the polishing plate, the laser probe is located above the polishing pad mounting area, and all the laser probes are arranged corresponding to a radius of the circular polishing pad mounting area;

[0090] The rotating drive component is connected to the polishing disc, driving the polishing disc to rotate and driving the polishing pad installation area to rotate relative to the laser probe; the rotation axis of the polishing disc is parallel to or coincides with the direction along which the laser probe points to the polishing pad installation area.

[0091] In this embodiment, the method for detecting the polishing pad using the polishing pad defect detection device on the polishing disk can refer to Figure 4 , Figure 4 An example flow chart of a process for defect detection of a polishing pad on a polishing disk provided in an embodiment of the present invention may include the following steps:

[0092] Step S11: emitting a laser beam to the surface of the polishing pad using a laser probe;

[0093] Step S12: using a laser probe to receive the laser beam reflected from the polishing pad surface;

[0094] Step S13: analyzing the reflection delay information according to the time of emitting the laser beam and the time of receiving the laser beam to obtain the polishing pad surface image information;

[0095] Step S14: using the image display component to display the received polishing pad surface image information.

[0096] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0097] In addition, it should be noted that, in this document, relationships such as first and second, etc., are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include," "comprises," or any other variations thereof are intended to cover non-exclusive inclusion.

[0098] The above is a detailed introduction to the polishing pad defect detection device on the polishing disk provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the structure and core ideas of the present invention. At the same time, for general technical personnel in this field, based on the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A polishing pad defect detection device on a polishing disk, characterized in that: include: Polishing disc and laser scanner carrier; the polishing disc surface is provided with a polishing pad mounting area; The laser scanner carrier is provided with an exposed laser probe; The laser scanner carrier is a laser scanner carrier that is movable in a direction approaching and away from the polishing plate; The laser scanner carrier is arranged corresponding to the polishing plate, so that when the laser scanner carrier is close to the polishing plate, the laser probe is located above the polishing pad installation area.

2. The polishing pad defect detection device on the polishing disk according to claim 1, characterized in that: Also included is a rotary drive component; The rotating drive component is connected to the polishing disc, drives the polishing disc to rotate, and drives the polishing pad installation area to rotate relative to the laser probe; the rotation axis of the polishing disc is parallel to or coincides with the direction along which the laser probe points to the polishing pad installation area.

3. The polishing pad defect detection device on the polishing disk according to claim 1, characterized in that: The surface of the laser scanner carrier is provided with a plurality of laser probes located on the upper side of the polishing pad installation area.

4. The polishing pad defect detection device on the polishing disk according to claim 3, characterized in that: All the laser probes are arranged in a straight line.

5. The polishing pad defect detection device on the polishing disk according to claim 4, characterized in that: All the laser probes are closely arranged along a straight line.

6. The polishing pad defect detection device on the polishing disk according to claim 5, characterized in that: The polishing pad installation area is a circular polishing pad installation area; When the laser scanner carrier is close to the polishing plate, all the laser probes are arranged corresponding to a radius of the circular polishing pad installation area.

7. The polishing pad defect detection device on the polishing disk according to claim 1, characterized in that: The surface of the laser scanner carrier corresponding to the polishing pad installation area is provided with a sliding guide rail; The laser probe is matched and connected with the sliding guide rail.

8. The polishing pad defect detection device on the polishing disk according to claim 7, characterized in that: The laser scanner carrier also includes a slider matched with the sliding guide rail; The laser probe is connected to the slider, and the slider is connected to a driving cylinder that drives the slider to move.

9. The polishing pad defect detection device on the polishing disk according to claim 1, characterized in that: The laser scanner carrier includes a carrier vertical rod and a carrier crossbeam; The vertical rods of the carrier frame are connected to the cross beams of the carrier frame; The carrier frame vertical rod includes a rotating component that drives the carrier frame vertical rod to rotate with the axial center line of the carrier frame vertical rod as the rotation axis; The laser scanner carrier is a laser scanner carrier that can be moved along the direction of approaching and moving away from the polishing plate through the rotating component.

10. The polishing pad defect detection device on the polishing disk according to claim 1, characterized in that: Also includes: an image display component, and an analysis and processing component connected to the laser probe for receiving reflection delay information collected by the laser probe when a polishing pad is installed in the polishing pad installation area, and analyzing and processing the reflection delay information to obtain image information of the polishing pad surface; The image display component that receives and displays the image information of the polishing pad surface is communicatively connected with the analysis and processing component.

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