The invention relates to a diamond wire saw cutting monocrystalline silicon wafer and polycrystalline silicon wafer sorting inspection method, which comprises that 1, an automatic sorting machine divides silicon wafers into A silicon wafers, A- silicon wafers and unidentified silicon wafers; 2, an operator picks out the dirty wafers and the dense line mark wafers from the unidentified silicon wafers, the dirty wafers are re-washed, and enter the step 1 so as to be sorted, the B wafers and the C wafers are sorted from the dense line mark wafers through visual inspection, the un-determined denseline mark wafers enter the step 1 and are subjected to wafer running sorting, and when the batch of the unidentified silicon wafers are generated, a step 3 is performed; 3, when the batch of the unidentified silicon wafers are generated, the operator performs reselection by using a wafer multifunctional parameter detector, a digital vernier caliper, a concentricity template, a feeler gauge and asurface roughness tester; 4, sampling inspection is performed; 5, classification boxing is performed; and 6, storage is performed. According to the present invention, by matching the automatic sortingmachine, the manual initial selection, the manual reselection and the sampling inspection, the wafers are divided into the A silicon wafers, the A- silicon wafers, the B wafers and the C wafers.