Diamond wire saw cutting monocrystalline silicon wafer and polycrystalline silicon wafer sorting inspection method

Abstract

The invention relates to a diamond wire saw cutting monocrystalline silicon wafer and polycrystalline silicon wafer sorting inspection method, which comprises that 1, an automatic sorting machine divides silicon wafers into A silicon wafers, A- silicon wafers and unidentified silicon wafers; 2, an operator picks out the dirty wafers and the dense line mark wafers from the unidentified silicon wafers, the dirty wafers are re-washed, and enter the step 1 so as to be sorted, the B wafers and the C wafers are sorted from the dense line mark wafers through visual inspection, the un-determined denseline mark wafers enter the step 1 and are subjected to wafer running sorting, and when the batch of the unidentified silicon wafers are generated, a step 3 is performed; 3, when the batch of the unidentified silicon wafers are generated, the operator performs reselection by using a wafer multifunctional parameter detector, a digital vernier caliper, a concentricity template, a feeler gauge and asurface roughness tester; 4, sampling inspection is performed; 5, classification boxing is performed; and 6, storage is performed. According to the present invention, by matching the automatic sortingmachine, the manual initial selection, the manual reselection and the sampling inspection, the wafers are divided into the A silicon wafers, the A- silicon wafers, the B wafers and the C wafers.

Description

technical field [0001] The invention relates to the technical field of silicon wafer production, in particular to a method for sorting and inspecting single and polycrystalline silicon wafers cut by a diamond wire saw. Background technique [0002] A production control and sorting method for silicon wafers is disclosed in the existing Chinese patent database. Its application number is 201410233065.0, and its application date is 2014.05.29. It includes the following steps: A. First, position the silicon rods in the same direction and then cut them into silicon wafers, and then keep the cut silicon wafers in the original positioning direction; or first cut the silicon rods into silicon wafers, and then cut Good silicon wafers are positioned in the same direction; B. Send the silicon wafers to the sorting machine, and embed the sorting program in the sorting machine to set the coordinate area according to the matrix shape, and then measure the thickness of the silicon wafers; C...

AI Technical Summary

Problems solved by technology

Its disadvantages are: the sorting operation of this method is too simple, it is difficult to apply in high-precision sorting, the quality of the sorted silicon wafers is difficult to guarantee, and it is not suitable for the current sorting and inspection of single and polycrystalline silicon wafers.