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22results about How to "Meet process requirements" patented technology

Anisotropic conductive film attaching machine

The utility model discloses an anisotropic conductive film pasting machine, including ACF pasting machine body, the outer wall fixed connection of ACF pasting machine body has workstation, the top fixed connection of workstation has back type support spare, the top fixed connection of back type support spare has the guide plate, the top of guide plate is equipped with two T type long grooves, and the inner wall of two T type long grooves all are connected with T type block slidingly. The utility model discloses a plurality of connecting rod pressing mechanism of electric push rod drive, and the stable fixing of substrate is realized through the synchronous down pressure of four rubber sleeves, effectively prevents the displacement problem in the process of pasting, and significantly improves the pasting accuracy, and T type long groove and T type block sliding structure cooperation movable pasting board, realize the quick adjustment of substrate position, satisfy the technological demand of different pasting position, adopt the cooperation of sliding slot type L type board with adjustable nut, make two L type boards can be according to different size substrate flexible adjustment fixed position, and the equipment adaptability is improved greatly.
Owner:HUANGGANG YOUXINGDA OPTOELECTRONICS TECH CO LTD

Ammonia fuel regenerative combustion device

This utility model relates to an ammonia fuel regenerative combustion device, belonging to the field of energy conservation and emission reduction. It includes an ammonia fuel regenerative chamber and a combustion-supporting chamber, both connected to the furnace via connecting ports. The ammonia fuel regenerative chamber is equipped with a three-way reversing valve for introducing ammonia fuel and discharging flue gas. The ammonia fuel regenerative chamber contains an ammonia cracking regenerative body, a denitrification reducing agent injector, and a denitrification regenerative body. The porosity of both the ammonia cracking and denitrification regenerative bodies gradually decreases along the flue gas outflow (ammonia inflow) direction. The combustion-supporting chamber has a combustion-supporting gas inlet. The angle of the denitrification reducing agent injector is adjustable. An ammonia cracking catalyst is mounted on the ceramic skeleton of the ammonia cracking regenerative body. An SCR reduction catalyst is mounted on the ceramic skeleton of the denitrification regenerative body. This utility model can improve flame stability, increase ammonia cracking efficiency and denitrification efficiency, and reduce NO₂ levels in the combustion device. x Emissions will be reduced to achieve zero carbon emissions from the heating furnace.
Owner:CHONGQING CISDI THERMAL & ENVIRONMENTAL ENG CO LTD

A painting production line for automotive control arms

ActiveCN118023037BThe process is closely connectedMeet process requirements
This invention provides a painting production line for automotive control arms, belonging to the field of automotive parts processing technology. It includes a frame, a circulating traction mechanism, a preheating furnace, a painting mechanism, and a baking furnace. The circulating traction mechanism includes two parallel traction chains, with several horizontal tie rods evenly spaced between them. The tie rods are rotatably connected to the chain link pins of the traction chains. The traction chains are pulled by several guide sprockets to form a preheating straight section adapted to the preheating furnace, a first vertical painting traction section, a horizontal painting traction section, a second vertical painting traction section, and a baking straight section adapted to the baking furnace. The preheating straight section, the horizontal painting traction section, and the baking straight section are all in a horizontal traction state. The first and second vertical painting traction sections are parallel and vertical. The tie rods are equipped with hangers for suspending workpieces. Workpieces are loaded before the preheating straight section and unloaded after the baking straight section. This invention has the advantages of low energy consumption and high efficiency.
Owner:ZHEJIANG WANFENG SHANGDA COATING TECH CO LTD

Design method of four-way valve controlled AGC cylinder for flatness control of plate mill

ActiveCN116894304BImprove rewind speedMeet process requirementsGeometric CADServomotor componentsFour-way valveMechanical design
This invention provides a design method for a four-way valve-controlled AGC cylinder for planar shape control in medium-thick plate rolling mills, relating to the fields of hydraulic control and mechanical design technology. The method first calculates the piston diameter of the AGC cylinder based on the maximum rolling force of the mill and the maximum design working pressure of the AGC cylinder. The calculated piston diameter is then rounded upwards to determine the piston diameter D. Next, based on the relationship between the steady-state retraction speed of the AGC cylinder and the piston rod diameter, and the piston diameter D, the piston rod diameter is calculated. A lower limit for the piston rod diameter is calculated based on the strength requirements of the piston rod during rolling. Finally, the final piston rod diameter d is determined by the larger of the calculated piston rod diameter and the lower limit. The AGC cylinder designed based on this invention is beneficial for meeting the process requirements of hot rolling planar shape control and improving production line efficiency.
Owner:NORTHEASTERN UNIV CHINA

Formation method of semiconductor structure

PendingCN121925110AMeet process requirementsIncreased Design FreedomSemiconductor structureEngineering physics
A forming method of a semiconductor structure comprises the steps that a substrate comprises a first region and a second region; modifying the second core material layer in the second region to form a third core material layer having an etching selection ratio with the second core material layer; forming a first core material layer; patterning the first core material layer to form a first core layer; forming a first side wall; patterning the second core material layer and the third core material layer in the second region to form a second core layer and a third core layer; forming a second side wall; forming a third protection layer; patterning the third core layer by taking the third protective layer as a mask; the second side walls and the third core layer are used as masks to pattern the target material layer, first target structures and second target structures are formed, and the pitch of the adjacent first target structures is smaller than or equal to the pitch of the adjacent second target structures. The SAQP process and the SALELE process are formed at the same time, and the design freedom degree in the patterning process is improved.
Owner:SEMICON MFG INT (SHANGHAI) CORP

Die bonding mechanism and die bonding equipment

The utility model relates to the technical field of die bonders, in particular to a die bonding mechanism, which comprises an adjusting assembly, a ZR motor fixed on the adjusting assembly, a die bonding arm fixed at the position of the output end of the ZR motor, an adsorption assembly rotatably mounted on the die bonding arm, and a fixing assembly fixed at the position of the output end of the ZR motor, the output end of the ZR motor drives the adsorption assembly to rotate on the die bonding arm, and the ZR motor can drive the vertical movement of the die bonding arm and the rotation of the adsorption assembly at the same time, thereby simplifying the overall structure of the die bonding mechanism, reducing the mechanical inertia, and more accurately controlling the vertical position of the die bonding arm and the rotation angle of the adsorption assembly. Therefore, the positioning of the wafer in the adsorption, transfer and placement process is more accurate, the die bonding quality and the product yield are improved, the position of the adsorption assembly connected with the adjusting assembly can be finely adjusted by the adjusting assembly, different die bonding process requirements and working scenes are adapted, and the die bonding mechanism has higher universality and flexibility.
Owner:SHENZHEN WANFUDA INTELLIGENT EQUIP CO LTD

A thin film drying apparatus and method thereof

PendingCN122665750AThe air inlet and outlet angles are adjustableWind speed adjustable
This invention belongs to the technical field of thin film drying equipment, and relates to a thin film drying device and method. The thin film drying device includes a substrate conveying assembly and an air-knife film drying assembly. The substrate conveying assembly conveys the substrate, and the air-knife film drying assembly dries the wet film on the substrate surface. The air-knife film drying assembly includes an inlet / outlet section, a control section, an air outlet section, an air velocity sensing system, and an air velocity control system. The control section has a control duct and multiple control components. Each control component includes an air valve and a drive component. The air valve is disposed within the control duct, and the drive component controls the rotation of the air valve to adjust the airflow angle and air velocity at the inlet / outlet. The air velocity sensing system and the air velocity control system are interconnected to monitor the air velocity at the air outlet. The air velocity control system controls the control components based on the monitoring signal from the air velocity sensing system to adjust the rotation angle of the air valve within the control duct. This invention reduces the impact of airflow on wet film formation, reduces film formation defects, and improves film quality.
Owner:HANGZHOU MICROQUANTA SEMICON CO LTD

Formation method of semiconductor structure

PendingCN121925109AMeet process requirementsIncreased Design FreedomSemiconductor structureEngineering
A forming method of a semiconductor structure comprises the steps that a substrate comprises a first region and a second region; patterning the first core material layer to form a first core layer; forming a first side wall; patterning the second core material layer to form a second core layer; performing modification treatment on the second core layer exposed in the second region to form a third core layer having an etching selection ratio with the remaining second core layer; forming a second side wall covering the side walls of the second core layer and the third core layer; the second side walls and the third core layer are used as masks to pattern the target material layer, first target structures and second target structures are formed, and the pitch of the adjacent first target structures is smaller than or equal to the pitch of the adjacent second target structures. According to the invention, the SAQP process and the SALELE process are formed at the same time, the degree of freedom of design in the patterning process is improved, and a part of redundant first target structures in the first region adopting the SAQP process can be removed under the condition that a photomask and process steps are not increased.
Owner:SEMICON MFG INT (SHANGHAI) CORP

Low-carbon zero-carbon ironmaking device and method

PendingCN121852629AMeet process requirementsVortex flow apparatusFluidised-bed furnacesProcess engineeringBubbling fluidized bed
The invention relates to the technical field of ferrous metallurgy, in particular to a low-carbon zero-carbon ironmaking device and method.The low-carbon zero-carbon ironmaking device comprises a fluidized bed system and a smelting reduction furnace system, and the fluidized bed system comprises a fluidized bed feeding pipe, a fluidized bed discharging pipe, a fluidized bed air inlet and a fluidized bed air outlet; the fluidized bed system is a multi-stage fluidized bed or a multi-layer fluidized bed, when the fluidized bed system is the multi-stage fluidized bed, at least one stage of fluidized bed is a bubbling fluidized bed, and when the fluidized bed system is the multi-layer fluidized bed, at least one fluidized bed layer is a bubbling bed layer; the smelting reduction furnace system comprises at least one smelting reduction furnace; and the fluidized bed discharge pipe is connected with a solid material spray gun of the smelting reduction furnace. According to the device and the method, the carbon reducing agent and the hydrogen reducing agent can be simultaneously applied in any proportion, and the process requirements of the transition stage of carbon smelting and hydrogen smelting are met.
Owner:SHANDONG PROVINCE METALLURGICAL ENG CO LTD

A grid arrangement and ion source apparatus

ActiveCN224609849UMeet performance evaluation needsaccurate assessment
The utility model relates to the technical field of semiconductor processing equipment, concretely relates to a grid device and ion source equipment. The grid device includes conducting assembly, screen grid, acceleration grid, deceleration grid and grid mounting plate, screen grid, acceleration grid and deceleration grid are sequentially laminated and mutually spaced insulation settings, and all are installed in the open end of external ion source shell through grid mounting plate, screen grid, acceleration grid and deceleration grid all are insulated with grid mounting plate setting, and deceleration grid is close to grid mounting plate setting and is electrically connected with external current detection module through conducting assembly to output the current for detecting. The application is through the insulation setting of screen grid, acceleration grid, deceleration grid with grid mounting plate, and adds conducting assembly, and deceleration grid can be electrically connected with external current detection module through conducting assembly, and the current of deceleration grid is detected, so that the performance of ion source is more accurately evaluated, and the increasingly higher process requirement and stability requirement are satisfied.
Owner:ANGCHENG PRECISION INSTR (SHENZHEN) CO LTD

Chemical water treatment device for thermal power plant

ActiveCN224207574URealize dynamic blocking preventionReduce local accumulationMoving filtering element filtersFiltrationControl theory
The utility model discloses a chemical water treatment device for a thermal power plant, which belongs to the technical field of chemical water treatment equipment for thermal power plants and comprises a support bottom plate, a horizontal drum and a plurality of groups of filter units. Racks suitable for the ends of the rollers are arranged at the two ends of the supporting bottom plate. The two ends of the horizontal roller are open, the horizontal roller is provided with a containing cavity with the preset operation length, and the horizontal roller is rotationally arranged between the two racks and has the preset vertical distance with the supporting operation face of the supporting bottom plate. The roller is connected with a rotary drive, the rotary drive is suitable for driving the roller to rotate relative to the rack, and the rack is provided with a sealing cover plate for sealing the corresponding end of the roller; the corresponding sealing cover plates are respectively provided with a water inlet pipe and a water outlet pipe suitable for water inlet and outlet of the roller; the multiple groups of filtering units are arranged at intervals along the water inlet and outlet direction of the roller and are suitable for filtering water in the roller, so that dynamic blockage prevention of the filter screen is realized, the filtering flux is maintained, the manual cleaning frequency is reduced, and the efficiency of raw water entering the next treatment stage is improved.
Owner:ANHUI HUADIAN SUZHOU POWER GENERATION

Organic phase preparation and reduced pressure distillation equipment

The utility model discloses organic phase preparation and reduced pressure distillation equipment which comprises a distillation tank body, a separation assembly is arranged on the distillation tank body, and the distillation tank body is communicated with a condenser; the separation assembly comprises an extension pipe communicated with the condenser, the lower end of the extension pipe is communicated with a recovery tank, one side of the extension pipe is communicated with a separation pipe, a functional joint is arranged at the position, close to the separation pipe, of the extension pipe, and a water pan is slidably connected into the separation pipe. According to the utility model, through the arrangement of the separation assembly, when reduced pressure distillation is carried out, the outlet pipe slides firstly, the water pan is transversely arranged at the functional section, the output obtained by distillation is guided into the detection device, the detection device is used for carrying out purity detection on the output so as to judge whether the process requirement is met or not, and after the purity meets the requirement, the outlet pipe slides again, so that the output is separated. And the output can enter the recovery tank along the extension pipe.
Owner:QINGDAO UNIV OF SCI & TECH +1

Grape grading and automatic weight matching equipment and method based on three-level RFID tracking

PendingCN122499983AInhibit sheddingavoid bruises
The application discloses a grape grading and sorting and automatic weight matching equipment and method based on three-stage RFID tracking, and the equipment comprises an RFID tray, a visual and weight integrated inspection unit, a three-stage RFID identification device, a to-be-queued buffer area, a main sorting line, a universal wheel transmission device and a sorting and packaging table, each RFID tray serves as a record carrier, and the three-stage RFID identification device serves as a data identification device. The application realizes full-automatic grading and weight matching of grapes, realizes double-dimension detection of appearance and weight through the visual and weight integrated inspection unit, realizes seamless tracking and error-proof checking through the three-stage RFID read-only identification node, realizes automatic weight matching combination of grape clusters through the to-be-queued buffer area and a dynamic queuing algorithm, completely eliminates the operation link of repeatedly picking up grape clusters by manual operation, realizes impact-free flexible sorting and conveying of the tray through the main sorting line and the universal wheel transmission device, and thus the mechanical damage rate and the labor cost are greatly reduced.
Owner:SICHUAN ACADEMY OF AGRICULTURAL MACHINERY SCIENCES

A variable frequency converter control method based on multi-section speed superposition and number selection

PendingCN122512831AMeet process requirementsrapid impact
This invention discloses a frequency converter control method based on multi-speed superposition and number selection, relating to the field of frequency converter drive control technology. It includes: pre-setting N digital input terminals in the frequency converter, configuring a base frequency value and a time-varying waveform function for each terminal; configuring the final output frequency as the sum of the products of the base frequency value and the waveform function of each activated terminal; determining the activation sequence of each terminal according to the target process curve; the frequency converter calculating and superimposing the instantaneous frequency contribution value of each activated terminal in real time to generate the final output frequency to drive the motor. This invention replaces traditional fixed frequency values ​​with waveform functions such as ramp functions, pulse functions, and exponential decay functions, allowing the synthesis of complex process speed curves using simple digital input terminals. While ensuring control performance, it significantly reduces hardware costs and can be widely applied in injection molding machines, die-casting machines, textile machinery, and other applications.
Owner:QINGDAO HIWITS METER +1

High precision wafer alignment device

The application relates to the technical field of temporary wafer bonding, in particular to a high-precision wafer alignment device which mainly solves the technical problem of low precision of a wafer alignment device. The device comprises a rack, a visual mechanism, an adsorption table plate, an XYZ three-axis platform, a rotating platform and an adjusting platform. The rack comprises a base and a gantry, the visual mechanism is installed above the crossbeam of the gantry, the adsorption table plate is fixed below the crossbeam of the gantry, the XYZ three-axis platform is installed on the base and located at the inner side of the gantry, the rotating platform is installed on the XYZ three-axis platform, and the adjusting platform comprises a bottom plate, a top plate and a leveling assembly. The bottom plate is fixed on the rotating platform, and the leveling assembly is connected between the bottom plate and the top plate and is circumferentially spaced apart and distributed with multiple sets. On one hand, the device can realize position calibration of a lower wafer and an upper wafer, and on the other hand, the device can avoid precision reduction caused by taking down, transferring and placing, and the two aspects can guarantee the precision when the upper and lower wafers are finally fixed, so that the process requirement is met.
Owner:NORTHWEST INST OF ELECTRONIC EQUIP TECH (SECOND RES INST OF CHINA ELECTRONICS TECH GRP CORP)

Semiconductor laser device and method for adjusting spot energy distribution

ActiveCN121813107BImprove manufacturing precisionMeet process requirementsLaser detailsLaser output parameters controlLight spotLight beam
This application discloses a semiconductor laser device and a method for adjusting the energy distribution of a light spot. The semiconductor laser device includes a laser, an adjusting lens, an imaging lens, and an imaging element. The adjusting lens, imaging lens, and imaging element are arranged sequentially and at intervals along a first straight line. The adjusting lens has an input side and an output side. The input side is provided with a first microlens array, which has multiple first dimming surfaces arranged in an array. The output side is arranged with multiple inclined surfaces. The curvature of the multiple first dimming surfaces changes sequentially along a second straight line, and each inclined surface extends obliquely along the second straight line, with the angle between the multiple inclined surfaces and the second straight line changing sequentially along the second straight line. The light beam passes sequentially through the first dimming surfaces, the dimming inclined surfaces, and the imaging lens and is projected onto the imaging element, so that the energy of the light spot on the imaging surface changes sequentially along the second straight line. The semiconductor laser device of this application can adjust the energy of the light spot to have a multi-segment distribution.
Owner:SHENZHEN VIVLASER TECH CO LTD

Training method and using method of optical proximity effect correction model and electronic equipment

The invention provides a training method and a using method of an optical proximity effect correction model and electronic equipment, and relates to the technical field of photolithographic processes, and the method comprises the following steps: obtaining a graphic feature of a first graphic, the absolute value of the difference between a mask error enhancement factor MEEF estimation value of a first measurement point location of the first graph and a MEEF theoretical value of the first measurement point location is greater than a first preset threshold value; screening a second graph matched with the graph feature in the sample chip; determining a plurality of second measurement point locations of the second graph; and taking the photoresist line width corresponding to each second measurement point as an input, taking the mask line width corresponding to each second measurement point as an output, and training the optical proximity effect correction model to enable the value of the loss function to be smaller than a second preset threshold, the value of the loss function is positively correlated with the absolute value of the difference between the MEEF estimation value of each second measurement point and the MEEF measurement value of the second measurement point.
Owner:SHENZHEN PENGXIN MICRO INTEGRATED CIRCUIT MFG CO LTD

A middle motor body positioning module and method

PendingCN122315997AEliminate control timing errorsLock instantlySuction forceClassical mechanics
This invention relates to a positioning module and method for a mid-drive motor body. The module includes a body positioning plate, a body positioning seat, an elastic inner support clamp, a central shaft, a lifting cylinder, a guide column, and a return spring. During the press-fitting process, the guide column and the inner support clamp holding the rotor shaft dynamically cooperate to achieve follow-up centering. When the rotor shaft descends to a preset position, the guide column triggers the compression of the return spring. Utilizing the physical property that the outer diameter of the spring naturally expands after being compressed, the elastic inner support clamp drives the body's inner hole to uniformly expand and lock it radially. This method solves the problem of instantaneous body displacement caused by strong magnetic attraction during the press-fitting of the mid-drive motor rotor shaft. It achieves adaptive switching of "flexible introduction - rigid locking" without the need for additional locking power and triggered at the same frequency as the main press-fitting motion, ensuring the product's coaxiality and assembly quality.
Owner:SHENZHEN HONEST MECHATRONIC EQUIP CO LTD

Method for three-dimensional measurement and indexing of turbine top cover or bottom ring guide vane shaft hole

The application provides a three-dimensional measurement indexing processing method for a water turbine top cover or bottom ring guide vane shaft hole, and relates to the field of water turbine manufacturing.The method is based on advanced three-dimensional measurement technology, theoretically calculates and determines the coordinates of the center of each guide vane shaft hole, establishes a theoretical coordinate system, measures the top cover or bottom ring opening surface, base cylindrical surface and guide vane shaft hole in sequence through a laser tracker and a reflecting target ball, establishes a measurement coordinate system with the actual measurement position of the workpiece as a reference, and matches the actual measurement coordinate system with the theoretical coordinate system to analyze and obtain the real position deviation of the center of the currently measured guide vane shaft hole.The coaxiality precision of the top cover and the bottom ring guide vane shaft hole after processing can be greatly improved through the measurement of the guide vane shaft hole, and the original alignment preparation time can be greatly reduced to improve the use efficiency of the machine tool.
Owner:DONGFANG ELECTRIC MACHINERY