Cathode device for metal electrochemical deposition and electrochemical reaction system

Abstract

The utility model provides a cathode device for metal electrochemical deposition and an electrochemical reaction system, and the cathode device comprises a protection tank located in the electrochemical reaction system, and a cathode conductive part and at least one cleaning assembly which are located in the protection tank; the at least one cleaning assembly is located on the first side of the cathode conductive piece. And the cleaning assembly is in soft contact with the cathode conductive piece. Liquid medicine on the surface of the cathode conductive part is cleaned through the cleaning assembly, soft contact between the cleaning assembly and the cathode conductive part cannot damage the cathode conductive part, the cleaning assembly is arranged on the first side, the cleaning efficiency can be improved, the cleaning effect of the cathode conductive part is improved, and the service life of the cathode conductive part is prolonged. Meanwhile, the utility model further provides an electrochemical reaction system, the electrochemical reaction system comprises the cathode device, cleaning is conducted through the cleaning assembly, the service life of the cathode device is prolonged, and a better film coating effect can be achieved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor manufacturing and photovoltaic manufacturing technology, and relates to a metal electrochemical reaction deposition technology, and in particular to a cathode device and an electrochemical reaction system for metal electrochemical deposition. Background Art

[0002] As an important method for electrochemical deposition of metals on silicon wafer surfaces, the horizontal electroplating process is widely used. Horizontal electroplating equipment mainly includes a reaction tank for carrying a chemical solution, a conductive cathode arranged at the height of the chemical solution in the reaction tank, and an insoluble anode arranged at the bottom of the reaction tank. During the electrochemical reaction, the part to be deposited is placed on the conductive cathode and in contact with it, and at the same time in contact with the chemical solution, to deposit a metal film. In order to prevent the conductive cathode in the reaction tank from contacting the chemical solution and causing corrosion, a protective tank is generally provided in the prior art in the reaction tank, and the conductive cathode is placed inside the protective tank to isolate the conductive cathode from the chemical solution.

[0003] However, since the workpiece to be deposited is transported in the reaction tank to complete the metal film deposition on the entire surface, the chemical solution will inevitably be brought to the conductive cathode in contact with the workpiece during the transportation process, causing corrosion of the conductive cathode. The existing technology is not ideal for protecting the conductive cathode from corrosion.

[0004] Therefore, how to prevent the chemical solution from corroding the conductive cathode and improve the protective effect of the conductive cathode is an urgent problem to be solved by those skilled in the art. Utility Model Content

[0005] The purpose of the present application is to provide a method for solving the problem in the prior art that the chemical solution cannot completely prevent the conductive cathode from contacting the conductive cathode, resulting in poor protective effect of the conductive cathode and easy corrosion by the chemical solution.

[0006] In a first aspect, the present application provides a cathode device for metal electrochemical deposition, characterized in that it comprises a protection tank, a cathode conductive member located in the protection tank, and at least one cleaning component, wherein the protection tank is disposed in a reaction tank of an electrochemical reaction system when in use;

[0007] The cathode conductive member rotates to contact the object to be deposited; the cathode conductive member includes a first side that rotates away from the object to be deposited and a second side that rotates close to the object to be deposited; at least one cleaning assembly is located on the first side of the cathode conductive member;

[0008] The cleaning component is in soft contact with the cathode conductive member.

[0009] In the present application, a cleaning assembly located on the first side of the cathode conductive member is used to promptly and effectively clean the chemical liquid that flows onto the surface of the cathode conductive member during the electrochemical reaction. Since the chemical liquid is driven from the first side to the second side during the rolling of the cathode conductive member, locating the cleaning assembly on the first side helps shorten the time the chemical liquid stays on the cathode conductive member, thereby achieving a better cleaning effect. At the same time, the cleaning assembly and the cathode conductive member are in soft contact to avoid damage to the surface of the cathode conductive member during the cleaning process, further improving the protective effect of the cathode conductive member and extending the service life of the cathode conductive member.

[0010] In one embodiment of the present invention, the cleaning component includes at least one of a soft-contact scraper and a liquid medicine absorber, which is used to scrape off the liquid medicine on the surface of the cathode conductive component or absorb the liquid medicine on the surface of the cathode conductive component to achieve a cleaning effect.

[0011] In one embodiment of the present invention, the soft contact scraping member includes at least one of an insulating soft scraping strip, a liquid spray unit, and a gas spray unit;

[0012] Wherein, the insulating soft scraping strip is made of insulating soft hydrophobic material.

[0013] In one embodiment of the present invention, the liquid medicine absorber includes at least one of a vacuum suction unit and a drying absorption unit.

[0014] In one embodiment of the present invention, the cathode device includes a plurality of cleaning components, and the plurality of cleaning components are respectively located on the first side and the second side of the cathode conductive member, or all the cleaning components are located on the first side of the cathode conductive member, so as to achieve a better cleaning effect.

[0015] In one embodiment of the present invention, the cleaning component is close to one end of the cathode conductive component and is lower than the top height of the cathode conductive component to prevent the cleaning component from touching the part to be deposited and causing damage to the part to be deposited.

[0016] In one embodiment of the present invention, the cathode conductive rod includes a protruding conductive region and an insulating region; the protruding conductive region has a larger diameter than the insulating region; and the insulating region is coated with an insulating layer. In this case, only the protruding conductive region needs to be cleaned, and the cleaning components are positioned one-to-one with each protruding conductive region to ensure effective cleaning of the cathode conductive member 120.

[0017] In an embodiment of the present invention, the material of the cathode conductive component includes one or more of metal titanium, copper and nickel.

[0018] In one embodiment of the present invention, a conveying member is further included in the reaction tank, and the top height of the conveying member is equal to the height of the cathode conductive member, so as to reduce the number of the cathode conductive members required to provide transmission power, increase the contact area between the part to be deposited and the liquid, and reduce energy loss to achieve a better coating effect.

[0019] Secondly, the present application also provides an electrochemical reaction system, including a cathode device as described above, which cleans the liquid without damage through the cleaning component, thereby extending the service life of the cathode device, which is conducive to achieving better coating effects and realizing large-scale industrial application of horizontal electroplating processes.

[0020] As described above, the present application provides a cathode device and electrochemical reaction system for metal electrochemical deposition. A cleaning assembly in soft contact with the cathode conductive member cleans the chemical solution on the surface of the cathode conductive member, preventing corrosion of the cathode conductive member by the chemical solution, thereby extending the service life of the cathode conductive member and saving costs. Furthermore, the soft contact between the cleaning assembly and the cathode conductive member does not damage the surface of the cathode conductive member. Furthermore, the cleaning assembly is positioned on the first side of the cathode conductive member to improve the cleaning efficiency of the cleaning assembly, further enhancing the cleaning effect and service life of the cathode conductive member, and facilitating the further development of horizontal electroplating processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Shown is a schematic diagram of the structure of a reaction tank for metal electrochemical deposition described in an embodiment of the present application.

[0022] Figure 2 Shown is a schematic structural diagram of a cathode device for metal electrochemical deposition described in an embodiment of the present application.

[0023] Figure 3 Shown is a schematic structural diagram of another cathode device for metal electrochemical deposition described in an embodiment of the present application.

[0024] Figure 4 Shown is a schematic structural diagram of another cathode device for metal electrochemical deposition described in an embodiment of the present application.

[0025] Figure 5 Shown is a schematic diagram of the cathode conductive structure described in an embodiment of the present application.

[0026] Component number description

[0027] 100 cathode device

[0028] 110 protection slots

[0029] 120 cathode conductive parts

[0030] 121 protruding conductive area

[0031] 122 Insulation Zone

[0032] 130 Cleanup Components

[0033] 200 reaction tank

[0034] 300 pieces to be deposited

[0035] 400 Transmission

[0036] 500 Reaction Anode DETAILED DESCRIPTION

[0037] The following describes the embodiments of the present application through specific examples. Those skilled in the art can easily understand the other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other unless they conflict.

[0038] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. Therefore, the illustrations only show components related to the present application and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0039] The following embodiments of the present application provide a cathode device and an electrochemical reaction system for metal electrochemical deposition. It should be noted that when the horizontal electroplating process is used to deposit a metal film, the part to be deposited is generally placed on the surface of the liquid medicine and in contact with it, and at the same time, the cathode conductive part is energized to achieve metal film deposition. Since the part to be deposited is not stationary during the electrochemical reaction, but is transported horizontally through the reaction tank so that the entire surface can contact the liquid medicine through the gaps between the protective tanks, thereby achieving metal film deposition on the entire plane. As the part to be deposited moves, the liquid medicine remaining on the surface of the part to be deposited during the electrochemical reaction can easily flow onto the cathode conductive part, causing an electrochemical reaction to occur on the surface of the cathode conductive part, thereby damaging the cathode conductive part. The following embodiments of the present application provide a cathode device and an electrochemical reaction system for metal electrochemical deposition, which protects the cathode conductive part from corrosion by the liquid medicine by removing the liquid medicine on the cathode conductive part, thereby solving the problem in the prior art that the cathode conductive part is poorly protected and easily corroded by the liquid medicine.

[0040] The cathode device and electrochemical reaction system for metal electrochemical deposition provided in the following embodiments of the present application include but are not limited to the function of cleaning the cathode in horizontal electroplating. Figure 1 The figure shows an electrochemical reaction system for metal electrochemical deposition, comprising a reaction tank 200 for carrying a chemical solution, a reaction anode 500 located at the bottom of the reaction tank 200, at least one cathode device 100 located on the surface of the chemical solution in the reaction tank 200, and a workpiece 300 to be deposited located on the cathode device 100 and in contact with the cathode device 100. The cathode device 100 includes a cathode conductive member 120 in electrical contact with the workpiece 300 to be deposited. The workpiece 300 to be deposited contacts the chemical solution through the gap between the cathode devices 100. The reaction anode 500, the chemical solution, the workpiece 300 to be deposited, the cathode conductive member 120, and the power supply form a path to achieve an electrochemical reaction on the workpiece 120 to be deposited. It should be noted that the following embodiments of the present application are illustratively described and explained in detail using an electrochemical reaction system for horizontal electroplating as an example, but are also applicable to other electrochemical reaction systems that require cathode cleaning.

[0041] The following will describe in detail the principles and implementation methods of a cathode device and an electrochemical reaction system for metal electrochemical deposition according to this embodiment in conjunction with the accompanying drawings, so that those skilled in the art can understand the cathode device and electrochemical reaction system for metal electrochemical deposition according to this application without the need for creative work.

[0042] like Figure 2 As shown, since the cathode conductive member 120 will be corroded by the chemical solution when in contact with it, this embodiment provides a cathode device 100 for metal electrochemical deposition, including a protective tank 110 located in the reaction tank body 200, and the cathode conductive member 120 and at least one cleaning component 130 in the protective tank 110. Among them, the protective tank 110 is used to isolate the cathode conductive member 120 from the chemical solution. Specifically, in order to make the part to be deposited 300 contact the cathode conductive member 120 and the chemical solution at the same time, the notch of the protective tank 110 and the top of the cathode conductive member 120 are at the same height as the chemical solution level; the specific shape and material of the protective tank 110 are not specifically limited here, as long as the cathode conductive member 120 can be placed. The cathode conductive member 120 rotates to contact the part to be deposited 300, and the cathode conductive member 120 includes a first side that rotates away from the part to be deposited 300 and a second side that rotates close to the part to be deposited 300. For example, as Figure 1 As shown, the part to be deposited 300 is conveyed from right to left, and the cathode conductive member 120 rotates counterclockwise, then the left side of the cathode conductive member 120 is the first side, and the right side is the second side. Of course, the part to be deposited 300 can also be set to be conveyed from left to right, then the right side of the cathode conductive member 120 is the first side, and the left side is the second side. This application does not make specific restrictions here.

[0043] At least one cleaning assembly 130 is located on the first side of the cathode conductive member 120. This cleaning assembly 130 is used to clean the chemical solution that flows through the object to be deposited 300 and onto the cathode conductive member 120. The chemical solution flows through the object to be deposited 300 and onto the surface of the cathode conductive member 120. The rotation of the cathode conductive member 120 causes the chemical solution to be carried from the first side to the second side. In this embodiment, the placement of the cleaning assembly on the first side of the cathode conductive member 120 facilitates the timely cleaning of the chemical solution on the surface of the cathode conductive member 120, shortening the time the chemical solution remains on the surface of the cathode conductive member 120 and achieving a better cleaning effect.

[0044] It should be noted that the cleaning assembly 130 and the cathode conductive member 120 are in soft contact. Specifically, soft contact refers to non-rigid contact that occurs on the surface of an object, involves slippage, and has a non-uniform pressure distribution across the contact surface, such as contact between gas, liquid, or soft elastic materials. Soft contact does not damage the surface of the cathode conductive member 120, preventing the cleaning assembly 130 from damaging the cathode conductive member 120 when removing the chemical solution from the surface of the cathode conductive member 120, thereby affecting the deposition effect.

[0045] Specifically, this embodiment will describe the structure of the cleaning assembly 130 and the specific method of removing the liquid on the surface of the cathode conductive member 120 and achieving soft contact with the cathode conductive member 120.

[0046] like Figure 2 As shown, the cleaning assembly 130 is disposed on the first side of the cathode conductive member 120. Because the first side of the cathode conductive member 120 is rotated away from the object to be deposited 300, the chemical solution flowing from the object to be deposited 300 onto the cathode conductive member 120 will first appear on the first side of the cathode conductive member 120. Therefore, placing the cleaning assembly 130 on the first side of the cathode conductive member 120 allows the cleaning assembly 130 to more quickly remove the chemical solution from the cathode conductive member 120, reducing the time the chemical solution remains on the surface of the cathode conductive member 120 and improving the protective effect of the cathode conductive member 120. Preferably, the cleaning assembly 130 can be disposed on the first side of the cathode conductive member 120, closer to the top of the cathode conductive member 120, to further reduce the time the chemical solution remains on the surface of the cathode conductive member 120.

[0047] Furthermore, the cleaning assembly 130 includes a soft-contact scraper that removes the liquid medicine by scraping the surface of the cathode conductive member 120. It should be noted that the portion of the soft-contact scraper that scrapes the surface of the cathode conductive member 120 can be a gas, a liquid, or a soft elastic hydrophobic material to achieve soft contact between the cleaning assembly 130 and the cathode conductive member 120.

[0048] Specifically, the soft-contact scraper includes an insulating soft scraper strip fixed to the first side of the cathode conductive member 120. The insulating soft scraper strip can be made of an insulating soft hydrophobic material such as rubber, silicone, or flexible plastic, and has a smooth, non-porous surface to prevent the insulating soft scraper strip from absorbing water and conducting electricity, thereby causing an electrochemical reaction in the cathode conductive member 120. Furthermore, the soft-contact scraper includes a clip or screw to secure the insulating soft scraper strip; alternatively, the insulating soft scraper strip is fixed to the inner wall of the protective groove 110 by heat pressing or bonding, and contacts the cathode conductive member 120.

[0049] Alternatively, the soft contact scraper includes a liquid spray unit or a gas spray unit, and the cleaning component 130 scrapes the surface of the cathode conductive member 120 with pressurized liquid or compressed gas. Exemplarily, the cleaning component 130 includes a nozzle or a nozzle and a liquid storage unit or a compressed gas storage unit connected to the nozzle or the nozzle, and the nozzle or the nozzle sprays pressurized liquid or compressed gas onto the surface of the cathode conductive member 120 to flush the cathode conductive member 120, thereby cleaning the liquid. It should be noted that the liquid or gas used for flushing can be pure water, compressed air or other liquid or gas that does not react with the liquid and the cathode conductive member 120, and this application does not make specific limitations here. Furthermore, the liquid storage unit also includes a pressure pump to ensure that the liquid has sufficient force when flushing the cathode conductive member 120, thereby improving the cleanliness of the cathode conductive member 120. Exemplarily, the nozzle or the nozzle and the liquid storage unit or the compressed gas storage unit can be connected by a pipeline.

[0050] Furthermore, the cleaning component 130 includes a liquid medicine absorbing component, which keeps the cathode conductive component 120 clean by absorbing the liquid medicine on the surface of the cathode conductive component 120. Specifically, the liquid medicine absorbing component includes a vacuum suction unit, which includes a needle located on the surface of the cathode conductive component 120 and a vacuum pump connected to the needle. The vacuum pump causes the needle to suck the liquid medicine on the surface of the cathode conductive component 120 during extraction, thereby keeping the surface of the cathode conductive component 120 clean and preventing the liquid medicine from corroding the cathode conductive component. It should be noted that the needle and the vacuum pump can be connected by a pipe, and a vacuum container can be provided on the pipe between the two to temporarily store the sucked liquid medicine.

[0051] Alternatively, the liquid medicine absorber includes a dry absorption unit. Specifically, the dry absorption unit comprises a dry cotton cloth or dry sponge placed on the surface of the cathode conductive member 120, which absorbs the liquid medicine from the surface of the cathode conductive member 120. It should be noted that the dry absorption unit can only absorb a limited amount of liquid medicine, and therefore needs to be replaced regularly to prevent the absorbed liquid medicine from reaching saturation or returning to the surface of the cathode conductive member 120.

[0052] Preferably, the cathode device 100 may include a plurality of cleaning components 130 to further clean the liquid on the surface of the cathode conductive member 120. Figure 3-4 As shown, cathode assembly 100 includes two cleaning assemblies 130 .

[0053] Specifically, if Figure 3 As shown, two cleaning assemblies 130 are respectively arranged on the first side and the second side of the cathode conductive member 120. The two cleaning assemblies 130 can have the same structure and clean the liquid on the surface of the cathode conductive member 120 in the same way, or the two cleaning assemblies 130 can have different structures and clean the liquid on the surface of the cathode conductive member 120 in different ways. Exemplarily, the cleaning assembly 130 arranged on the first side of the cathode conductive member 120 includes a liquid spraying unit, which sprays pressurized liquid onto the surface of the cathode conductive member 120 through a nozzle or a nozzle to rinse the cathode conductive member 120; the cleaning assembly 130 arranged on the second side of the cathode conductive member 120 includes a liquid absorber, wherein the liquid absorber includes a vacuum suction unit. At this time, since the liquid on the surface of the cathode conductive member 120 is rinsed more thoroughly, the vacuum suction unit is actually also used to suck the flushing liquid accumulated in the protective tank 110 from the cleaning assembly 130 on the first side to prevent the liquid in the protective tank 110 from overflowing. Alternatively, the cleaning assembly 130 disposed on the first side of the cathode conductive member 120 includes an insulating soft scraping strip to scrape and clean the cathode conductive member 120, and the cleaning assembly 130 disposed on the second side of the cathode conductive member 120 includes a drying and absorption unit to further clean the liquid on the surface of the cathode conductive member 120 to achieve a better cleaning effect. At the same time, since less liquid remains on the surface of the cathode conductive member 120 after cleaning by the cleaning assembly 130 disposed on the first side of the cathode conductive member 120, the time required for the drying and absorption unit to reach absorption saturation is longer, which can reduce the replacement frequency of the drying and absorption unit and improve production efficiency. It should be noted that the above provides two exemplary combinations of cleaning assemblies 130. In fact, the two cleaning assemblies 130 disposed on the first side and the second side of the cathode conductive member 120 can also be combined in other ways, as long as a better cleaning effect is achieved. This embodiment is not specifically limited here.

[0054] like Figure 4As shown, the cathode device 100 includes two cleaning assemblies 130, both of which are arranged on the first side of the cathode conductive member 120, wherein one cleaning assembly 130 is close to the object to be deposited 300, and the other cleaning assembly 130 is close to the bottom of the protective tank 110. The two cleaning assemblies 130 can have the same structure and clean the liquid on the surface of the cathode conductive member 120 in the same way, or the two cleaning assemblies 130 can also have different structures and clean the liquid on the surface of the cathode conductive member 120 in different ways. Exemplarily, the cleaning assembly 130 close to the object to be deposited 300 includes a vacuum suction unit, and the cleaning assembly 130 close to the bottom of the protective tank 110 includes an insulating elastic scraping strip. Since the insulating elastic scraping strip is hydrophobic, when scraping and cleaning the liquid on the surface of the cathode conductive member 120, it is easy to cause the liquid to accumulate locally. By sucking the liquid by the vacuum suction unit arranged above, the accumulation of the liquid can be avoided, thereby achieving a better cleaning effect. Alternatively, the cleaning assembly 130 near the object to be deposited 300 includes a gas injection unit that sprays compressed gas onto the surface of the cathode conductive member 120 through a nozzle or nozzle. The cleaning assembly 130 near the bottom of the protective tank 110 includes an insulating elastic scraping strip that flushes away the liquid medicine with compressed air, thereby preventing liquid medicine accumulation and achieving a better cleaning effect. It should be noted that the above provides two exemplary combinations of cleaning assemblies 130. In fact, the two cleaning assemblies 130 respectively arranged on the first side and the second side of the cathode conductive member 120 can also be combined in other ways, as long as a better cleaning effect is achieved. This embodiment is not specifically limited here.

[0055] The above is an exemplary embodiment of the cathode device 100 including two cleaning components 130. According to actual needs and actual conditions such as the volume of the protection tank 110, more cleaning components 130 can be set and combined in different ways to achieve better cleaning effects. This embodiment does not impose any specific restrictions here.

[0056] Furthermore, when the cathode conductive member 120 is a columnar structure having a certain length, since the cleaning area of ​​a single cleaning assembly 130 is limited, multiple cleaning assemblies 130 can be arranged along the length direction of the cathode conductive member 120. The interval between the cleaning assemblies 130 should be smaller than the cleaning range of the cleaning assembly 130 to ensure the cleaning effect of the cathode conductive member 120.

[0057] Furthermore, Figure 5As shown, the cathode conductive member 120 includes a protruding conductive area 121 and an insulating area 122, and the diameter of the protruding conductive area 121 is larger than that of the insulating area 122. When the deposited member 300 is subjected to an electrochemical reaction, the deposited member 300 is actually in electrical contact with the protruding conductive area 121 of the cathode conductive member 120 to achieve metal film deposition. Since the insulating area 122 of the cathode conductive member 120 is not charged, it will not corrode even if it comes into contact with the chemical solution, so only the protruding conductive area 121 needs to be cleaned. When setting up the cleaning component 130, it can be set one-to-one with the protruding conductive area 121 to ensure the cleaning effect of the cathode conductive member 120. Exemplarily, the cathode conductive member 120 is an integrally formed metal structure with a raised or recessed area, and an insulating coating is sprayed on the area corresponding to the insulating area 122 for insulation. Alternatively, the cathode conductive member 120 can be formed by splicing an insulating block with a smaller diameter and a conductive block with a larger diameter.

[0058] The cathode conductive member 120 may also be composed of a plurality of conductive balls arranged longitudinally. In this case, a cleaning assembly 130 may be provided corresponding to each conductive ball.

[0059] Preferably, if Figure 1-4 As shown, the cleaning assembly 130 is positioned near one end of the cathode conductive member 120 and is lower than the top of the cathode conductive member 120, thereby ensuring a certain gap between the cleaning assembly 130 and the object to be deposited 300. It should be noted that the object to be deposited is generally thin and fragile. For example, the thickness of a silicon wafer undergoing metal film deposition is 100 μm. The certain gap between the cleaning assembly 130 and the object to be deposited 300 prevents breakage of the object to be deposited 300, improves the production yield of the object to be deposited, and achieves better coating results.

[0060] Preferably, if Figure 1 As shown, the conveying member 400 is located in the reaction tank body 200 and is used to convey the part to be deposited 300. The height of the top of the conveying member 400 is equal to the height of the top of the cathode conductive member 120, that is, the conveying member 400 is in contact with the part to be deposited 300, and the conveying member 400 and the cathode conductive member 120 rotate in the same direction to achieve the conveyance of the part to be deposited. If the part to be deposited 300 is only transmitted through the cathode conductive member 120, it is necessary to set up a relatively dense cathode conductive member 120, resulting in a smaller area of ​​contact between the part to be deposited 300 and the liquid, and too many cathode conductive members 120 will lead to greater energy loss. By increasing the conveying member 400, the number of cathode conductive members 120 can be reduced, energy loss can be reduced and better coating effect can be achieved. Preferably, the material of the conveying member 400 can be an insulating material that generates a certain friction force when in contact with the part to be deposited 300.

[0061] Furthermore, the material of the cathode conductive member 120 includes one or more of metals including titanium, copper, and nickel.

[0062] Furthermore, the reaction anode 500 is a titanium mesh.

[0063] The cathode device for metal electrochemical deposition provided in this embodiment utilizes a cleaning assembly 130 in soft contact with the cathode conductive member 120 to clean the chemical solution that flows through the workpiece 300 to be deposited and onto the cathode conductive member 120 during the electrochemical reaction. This prevents chemical solution corrosion of the cathode conductive member 120, which could result in poor coating results. This extends the service life of the cathode conductive member 120 and reduces costs. Furthermore, because the cleaning assembly 130 is in soft contact with the cathode conductive member, it does not damage the surface of the cathode conductive member 120, thus preventing damage to the cathode conductive member 120 during the cleaning process. This further enhances the cleaning effect and service life of the cathode conductive member 120, and promotes the further development of horizontal electroplating processes.

[0064] This embodiment also provides an electrochemical reaction system, such as Figure 1 As shown, the electrochemical reaction system includes: a reaction tank 200 for carrying a chemical solution, a reaction anode 500 located at the bottom of the reaction tank 200, and at least one cathode device 100 located on the surface of the chemical solution within the reaction tank 200. The object to be deposited 300 is located on and in contact with the cathode device 100 to achieve horizontal electroplating. It should be noted that in the electrochemical reaction system provided in this embodiment, the cathode device 100 includes the cleaning assembly 130 as described above, which is used to clean the chemical solution on the surface of the cathode conductive member 120 and protect the cathode device 100 from corrosion by the chemical solution.

[0065] In summary, the cathode device and electrochemical reaction system for metal electrochemical deposition provided in the present application have a simple structure, and the cleaning component 130 cleans the liquid without damage, thereby extending the service life of the cathode conductive component 120, which is conducive to achieving better coating effects and realizing large-scale industrial application of horizontal electroplating processes.

[0066] The descriptions of the processes or structures corresponding to the above figures have different emphases. For parts that are not described in detail in a certain process or structure, please refer to the relevant descriptions of other processes or structures.

[0067] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical concepts disclosed in this application shall be covered by the claims of this application.

Claims

1. A cathode device for metal electrochemical deposition, characterized in that The invention comprises a protection tank, a cathode conductive member and at least one cleaning component arranged in the protection tank, wherein the protection tank is arranged in a reaction tank of an electrochemical reaction system when in use; The cathode conductive member rotates to contact the object to be deposited; the cathode conductive member includes a first side that rotates away from the object to be deposited and a second side that rotates close to the object to be deposited; at least one cleaning assembly is located on the first side of the cathode conductive member; The cleaning component is in soft contact with the cathode conductive member.

2. The cathode device according to claim 1, wherein The cleaning assembly includes at least one of a soft-touch scraper and a liquid absorber.

3. The cathode device according to claim 2, characterized in that The soft contact scraping member includes at least one of an insulating soft scraping strip, a liquid spraying unit and a gas spraying unit; Wherein, the insulating soft scraping strip is made of insulating soft hydrophobic material.

4. The cathode device according to claim 2, characterized in that The liquid medicine absorbing member includes at least one of a vacuum suction unit and a dry absorption unit.

5. The cathode device according to claim 2, characterized in that The cleaning components are multiple and are located on the first side and the second side of the cathode conductive member, respectively; or, all the cleaning components are located on the first side of the cathode conductive member.

6. The cathode device according to claim 1, wherein The cleaning component is close to one end of the cathode conductive member and has a height lower than the top end of the cathode conductive member.

7. The cathode device according to claim 1, wherein The cathode conductive rod includes a protruding conductive area and an insulating area; the diameter of the protruding conductive area is larger than that of the insulating area; and the surface of the insulating area is wrapped with an insulating layer.

8. The cathode device according to claim 1, wherein The material of the cathode conductive member includes one or more of metal titanium, copper and nickel.

9. The cathode device according to claim 1, wherein It also includes a conveying member located in the reaction tank, and the height of the top of the conveying member is equal to the height of the cathode conductive member.

10. An electrochemical reaction system, characterized in that: A cathode device comprising the cathode device according to any one of claims 1 to 9.

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