Chip testing equipment

Abstract

The utility model discloses a chip testing device, which comprises a machine table, a testing circuit board, a chip grabbing mechanism and a driving mechanism, the driving mechanism is configured to drive the chip grabbing mechanism to move in the three-axis direction, the chip testing device is characterized in that the machine table is provided with a positioning table, and the positioning table is provided with two charging tray placing positions; the chip grabbing mechanism comprises two sets of grabbing assemblies which are oppositely arranged, the two sets of grabbing assemblies comprise the first grabbing assembly and the second grabbing assembly, the second grabbing assembly is connected with the driving mechanism, and the first grabbing assembly is movably connected with the second grabbing assembly through a plurality of guide rods; a separating air cylinder is arranged on the side portion of the second material grabbing assembly, an output shaft of the separating air cylinder is connected with the first material grabbing assembly, and the separating air cylinder is configured to drive the first material grabbing assembly to be close to or away from the second material grabbing assembly. A plurality of suction cups are arranged on each grabbing assembly. According to the utility model, the detection efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of chip testing, in particular to a chip testing device. Background Art

[0002] Chips are inextricably linked to our lives and hold a crucial position. Cars, mobile phones, and appliances all rely on them. Any product associated with the word "technology" requires chips. Chips are the brains and heart of all electronic products and devices.

[0003] After the chips are produced, they are not put into use immediately. Because during the production process, there will be defective chips due to various reasons. Therefore, all chips need to be tested to see if their performance is qualified. During chip testing, the chips are placed on the chip testing equipment for rapid testing.

[0004] In the prior art, there are two main types of chip testing equipment: the first type: rotary detection, in which multiple suction cups are installed on a rotating table, and each suction cup adsorbs a chip and rotates to the test position for testing. In this method, a vibration plate is used to load the material, and the suction cup adsorbs a product and rotates it into position for testing. The second type: the chips are installed in a tray, and each chip is in a silo of a tray. Then, a suction cup is used to grab the chip from the tray and move it to the test position for testing. After the test is completed, the suction cup is put back into the silo corresponding to the tray. For the second structure, generally, either a single suction cup structure or a multi-suction cup structure is used. The multi-suction cup structure is generally a single row, and the silo on the tray is generally multi-row. In this method, the detection efficiency is relatively low. Therefore, how to improve the detection efficiency is a direction that those skilled in the art need to work hard on. Summary of the Invention

[0005] The utility model aims to provide a chip testing device, which improves the chip testing efficiency by using the structure.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a chip testing device, comprising a machine, a test circuit board mounted on the machine, a chip grabbing mechanism and a driving mechanism, wherein the driving mechanism is configured to drive the chip grabbing mechanism to move horizontally, longitudinally and vertically.

[0007] The machine platform is provided with a positioning platform, and the positioning platform is provided with two material tray placement positions;

[0008] The chip grabbing mechanism includes two sets of grabbing assemblies arranged opposite to each other, the two sets of grabbing assemblies include a first grabbing assembly and a second grabbing assembly, the second grabbing assembly is connected to the driving mechanism, and the first grabbing assembly is movably connected to the second grabbing assembly via a plurality of guide rods;

[0009] A separation cylinder is provided on the side of the second grabbing assembly, the output shaft of the separation cylinder is connected to the first grabbing assembly, and the separation cylinder is configured to drive the first grabbing assembly to move closer to or away from the second grabbing assembly;

[0010] Each of the material grabbing components is provided with a plurality of suction cups.

[0011] In the above technical solution, the material grabbing assembly includes a mounting plate, at least one transverse slide rail, multiple sets of suction cup mounting assemblies and a variable distance module, each of the suction cups is mounted on the bottom of a set of the suction cup mounting assemblies, the transverse slide rail is mounted on the mounting plate, and the tops of the multiple sets of the suction cup mounting assemblies are slidably connected to the transverse slide rail;

[0012] The distance-changing module is mounted on the mounting plate, and is configured to drive multiple groups of the suction cup mounting assemblies to move along the transverse slide rail, and to make adjacent suction cup mounting assemblies move closer to or farther away from each other.

[0013] In the above technical solution, the pitch-changing module includes a pitch-changing cylinder and a pitch-changing plate, the pitch-changing cylinder is mounted on the mounting plate, the pitch-changing plate is arranged beside the mounting plate, the pitch-changing cylinder is configured to drive the pitch-changing plate to move vertically, and the suction cup mounting assembly is arranged between the pitch-changing plate and the transverse slide rail;

[0014] The pitch-changing plate is provided with a plurality of pitch-changing slots spaced laterally apart, and the distance between the tops of adjacent pitch-changing slots is smaller than the distance between the bottoms of adjacent pitch-changing slots;

[0015] A guide wheel is rotatably mounted on the upper side wall of each suction cup mounting assembly, and the guide wheel of each suction cup mounting assembly is inserted into one of the pitch-changing slots;

[0016] When the pitch change plate moves upward, the guide wheel moves to the bottom of the pitch change slot, and the adjacent suction cup mounting assemblies move away from each other; when the pitch change plate moves downward, the guide wheel moves to the top of the pitch change slot, and the adjacent suction cup mounting assemblies move closer to each other.

[0017] In the above technical solution, the suction cup mounting assembly includes a vertical plate and a connecting rod, one side of the vertical plate is slidably connected to the horizontal slide rail, and the other side of the vertical plate is provided with two limit plates, and the connecting rod is vertically movably connected to the two limit plates;

[0018] The two limiting plates are spaced apart from each other, each limiting plate is provided with a through hole, and the middle portion of the connecting rod is movably inserted into the two through holes;

[0019] The top and middle parts of the connecting rod are respectively provided with an upper limit part and a lower limit part. The upper limit part is arranged above the upper limit plate, and the lower limit part is arranged between the two limit plates. A spring is also sleeved on the outside of the connecting rod, and the top of the spring is against the bottom surface of the upper limit plate, and the bottom of the spring is against the lower limit part. The spring pushes the connecting rod to move downward so that the upper limit part is against the top surface of the upper limit plate.

[0020] In the above technical solution, the bottom of the connecting rod has a cavity, a joint is provided on the middle outer surface of the connecting rod and connected to the top of the cavity, the joint is connected to an air pipe, and the suction cup is installed at the bottom of the connecting rod and connected to the cavity.

[0021] In the above technical solution, a U-shaped plate is further provided on the vertical plate below the limit plate, and a U-shaped groove is provided on the U-shaped plate. The middle part of the connecting rod is movably set in the U-shaped groove, and two cross-sections are symmetrically provided on the outer surface of the middle part of the connecting rod, and the cross-sections on both sides are respectively in contact with the two side surfaces of the U-shaped groove.

[0022] In the above technical solution, the first material grabbing assembly is arranged on the front side of the second material grabbing assembly, a connecting plate is installed on the side of the mounting plate of the second material grabbing assembly, the connecting plate is arranged parallel to the guide rod, and the separation cylinder is installed on the connecting plate;

[0023] The front end of the connecting plate is provided with a longitudinal strip groove, and the side of the first grabbing component is provided with a convex portion, which passes through the longitudinal strip groove and is arranged opposite to the separation cylinder, and the output shaft of the separation cylinder is connected to the convex portion.

[0024] In the above technical solution, a plurality of negative pressure suction holes are provided on the bottom surface of the material tray placement position.

[0025] In the above technical solution, the chip grabbing mechanism is movably arranged above the test circuit board and the material tray placement position;

[0026] The driving mechanism includes a transverse driving mechanism, a longitudinal driving mechanism and a vertical driving mechanism. The longitudinal driving mechanism is divided into two groups. The two groups of longitudinal driving mechanisms are installed on the machine platform. The test circuit board and the material tray are placed between the two groups of longitudinal driving mechanisms.

[0027] Both ends of the transverse drive mechanism are mounted on two sets of longitudinal drive mechanisms, and the two sets of longitudinal drive mechanisms are configured to drive the transverse drive mechanism to move longitudinally;

[0028] The vertical driving mechanism is mounted on the horizontal driving mechanism, and the horizontal driving mechanism is configured to drive the vertical driving mechanism to move horizontally. The chip grabbing mechanism is mounted on the vertical driving mechanism, and the vertical driving mechanism is configured to drive the chip grabbing mechanism to move vertically.

[0029] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0030] 1. The utility model utilizes the tray placement position for positioning and placement, and the chip is grabbed by the chip grabbing mechanism. In addition, two sets of grabbing components are adopted, and each grabbing component is equipped with multiple suction cups. In this way, multiple rows of chips in the tray can be grabbed and tested at the same time, effectively improving the detection efficiency.

[0031] 2. The suction cups in this utility model are installed on the suction cup mounting assembly, and the variable distance module is used to drive the suction cup mounting assembly to move closer or farther away from each other, thereby realizing the variable distance of adjacent suction cups. This makes it suitable for grabbing chips on trays with small pitches and for testing chips on test sites with large pitches, thereby improving the detection efficiency.

[0032] 3. The two groups of grabbing components of the utility model are driven closer or farther away by a separation cylinder, which is convenient for grabbing chips in two adjacent rows and also for placing the corresponding chips in the test positions of two adjacent rows for chip testing, thereby improving the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic structural diagram of the first embodiment of the present invention;

[0034] Figure 2 This is a schematic diagram of the structure of the first embodiment of the present invention (with the material tray installed);

[0035] Figure 3 This is a schematic structural diagram of the chip grabbing mechanism in the first embodiment of the present invention;

[0036] Figure 4 This is a schematic structural diagram of the second material grabbing assembly in the first embodiment of the present utility model;

[0037] Figure 5 yes Figure 4 Schematic diagram of the three-dimensional structure;

[0038] Figure 6 This is a schematic structural diagram of the suction cup mounting assembly in Example 1 of the present utility model;

[0039] Figure 7 This is a partial structural diagram of the longitudinal drive mechanism in the first embodiment of the present invention (showing that part of the cross frame is installed on the longitudinal drive mechanism);

[0040] Figure 8 This is a partial structural diagram of the transverse drive mechanism in Example 1 of the present utility model (showing that part of the slide is installed on the transverse drive mechanism);

[0041] Figure 9 It is a partial structural diagram of the vertical drive mechanism in the first embodiment of the present utility model (showing that part of the chip grabbing mechanism is installed on the vertical drive mechanism).

[0042] Among them: 1. Machine; 11. Positioning table; 12. Material tray placement; 13. Negative pressure suction hole; 14. Material tray; 2. Test circuit board; 21. Test position; 3. Chip grabbing mechanism; 31. First grabbing assembly; 32. Second grabbing assembly; 33. Guide rod; 34. Separation cylinder; 35. Suction cup; 36. Connecting plate; 37. Longitudinal strip groove; 38. Protrusion; 41. Mounting plate; 42. Horizontal slide rail; 43. Suction cup mounting assembly; 431. Guide wheel; 432. Vertical plate; 433. Connecting rod; 434. Limit plate; 435. Upper limit part; 436. Lower Limiting part; 437, spring; 438, joint; 439, U-shaped plate; 4331, section; 44, pitch-changing cylinder; 45, pitch-changing plate; 46, pitch-changing slot; 5, driving mechanism; 51, transverse driving mechanism; 511, transverse frame; 512, transverse guide rail; 513, transverse lead screw; 514, transverse motor; 52, longitudinal driving mechanism; 521, longitudinal frame; 522, longitudinal slide rail; 523, longitudinal lead screw; 524, longitudinal motor; 53, vertical driving mechanism; 531, slide; 532, vertical motor; 533, vertical lead screw; 534, vertical slide rail. DETAILED DESCRIPTION

[0043] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0044] Example 1: See Figure 1-9 As shown, a chip testing device includes a machine 1, a test circuit board 2 mounted on the machine 1, a chip grabbing mechanism 3 and a driving mechanism 5, wherein the driving mechanism 5 is configured to drive the chip grabbing mechanism 3 to move horizontally, longitudinally and vertically.

[0045] The machine 1 is provided with a positioning platform 11, and the positioning platform 11 is provided with two tray placement positions 12;

[0046] The chip grabbing mechanism 3 includes two groups of relatively arranged grabbing components, the two groups of grabbing components include a first grabbing component 31 and a second grabbing component 32, the second grabbing component 32 is connected to the driving mechanism 5, and the first grabbing component 31 is movably connected to the second grabbing component 32 through multiple guide rods 33; wherein, the end of the guide rod is installed on the second grabbing component, and the first grabbing component is interactively connected to the guide rod.

[0047] A separation cylinder 34 is provided on the side of the second grabbing assembly 32. The output shaft of the separation cylinder 34 is connected to the first grabbing assembly 31. The separation cylinder 34 is configured to drive the first grabbing assembly 31 to move closer to or away from the second grabbing assembly 32.

[0048] Each of the grabbing components is provided with a plurality of suction cups 35 .

[0049] Among them, a plurality of negative pressure suction holes 13 are provided on the bottom surface of the tray placement position 12, so that the tray 14 is directly placed on the two tray placement positions of the positioning table, and the tray is adsorbed and limited on the tray placement position through the negative pressure suction holes. Two tray placement positions are set, so that two trays can be placed at the same time. After the chip grabbing test in one tray is completed, the chip in another tray can be grabbed for testing, and the operator or robot can take away the other tray that has been tested and replace the tray with the chip to be tested.

[0050] Among them, there are multiple test positions 21 on the test circuit board. Preferably, there are two rows of test positions, and the number of test positions in each row matches the number of suction cups in a group of grabbing components (of course, more test positions can be set, and different test positions can test different chips). Among them, in order to ensure that more chips can be placed in a material tray, the distance between adjacent rows of chips will be relatively small, and in order to ensure the accuracy of chip testing, the distance between adjacent rows of test positions will be set larger. Therefore, by setting a separation cylinder, when in use, the separation cylinder output shaft retracts, the two rows of suction cups of the two groups of grabbing components are close to each other, and the suction cups of the two groups of grabbing components will face each other. There are two rows of chips on the tray, and then the driving mechanism drives the chip grabbing mechanism to move to the top of the tray. Each suction cup faces a chip and drives it to move down. The suction cup rests on the chip, and then the chip is adsorbed. The driving mechanism drives it to move above the test circuit board. During the movement, the output shaft of the separation cylinder extends to push the two sets of grabbing components away from each other. When the chip grabbing mechanism moves to the top of the test circuit board, each suction cup of the two sets of grabbing components faces a test position, and then the driving mechanism drives it to descend so that the suction cup rests on the test position of the test circuit board, and the chip is tested by energizing the test position (at this time, the suction cup still maintains suction to adsorb the chip). After the test is completed, the drive mechanism drives it to move upward, so that the chip is separated from the test circuit board, and then moves toward the tray. During this process, the output shaft of the separation cylinder retracts, driving the two sets of grabbing components to move closer to each other. When it moves above the tray, each chip will face the original empty position, and then the drive mechanism drives it downward, so that the chip falls back onto the tray where the chip was originally placed. The suction cup stops sucking air and can also blow air in the opposite direction, so that the chip is separated from the suction cup by its own weight (or a combination of the blowing force of the suction cup). The drive mechanism then drives the chip grabbing mechanism to move upward, horizontally or vertically to other positions on the tray, facing other undetected chips, and repeats the above actions to detect the next batch of chips. In this way, the same drive mechanism can be used to drive the chip grabbing mechanism to perform grabbing and testing on two rows of chips, effectively improving the detection efficiency.

[0051] See also Figure 3-5 As shown, the material grabbing assembly includes a mounting plate 41, at least one transverse slide rail 42, multiple sets of suction cup mounting assemblies 43 and a variable distance module. Each of the suction cups 35 is mounted on the bottom of a set of the suction cup mounting assemblies 43. The transverse slide rail 42 is mounted on the mounting plate 41. The tops of the multiple sets of suction cup mounting assemblies 43 are slidably connected to the transverse slide rail 42.

[0052] The distance-changing module is mounted on the mounting plate 41 , and is configured to drive multiple groups of the suction cup mounting assemblies 43 to move along the transverse slide rail 42 , and to move adjacent suction cup mounting assemblies 43 closer to or farther away from each other.

[0053] Among them, in order to ensure the accuracy and test effect of the test, a certain distance needs to be provided between adjacent test positions in each row on the test circuit board to prevent mutual interference in the test processes of adjacent test positions (or multiple test circuit boards are set, and a test position is set on each test circuit board. In this way, if a test position has a problem, the test circuit board can be directly replaced). Therefore, after the distance between the two rows of test positions is increased, a certain distance needs to be reserved between adjacent test positions in each row of test positions. The setting of the separation cylinder is to facilitate the adjustment of the distance between the two rows of gripping components, and the suction cup mounting components are slidably set on the horizontal slide rail. Therefore, the setting of the variable distance module can drive adjacent suction cup mounting components to approach each other or move away from each other at the same time, so that the distance between adjacent suction cups can be adjusted. When the gripping component moves above the material tray to adsorb or place the chip, the variable distance module will drive the suction cup mounting components to approach each other, so that each suction cup can adsorb the corresponding chip from the material tray, or place the chip into the corresponding position of the material tray. When the grabbing assembly moves above the test circuit board, the variable distance module drives the adjacent suction cup mounting assemblies away from each other, increasing the lateral distance between adjacent chips, so that each chip faces a test position to ensure normal chip testing.

[0054] See also Figure 3-5 As shown, the pitch-changing module includes a pitch-changing cylinder 44 and a pitch-changing plate 45. The pitch-changing cylinder 44 is mounted on the mounting plate 41. The pitch-changing plate 45 is disposed beside the mounting plate 41. The pitch-changing cylinder is configured to drive the pitch-changing plate to move vertically. The output shaft of the pitch-changing cylinder is connected to the pitch-changing plate. The suction cup mounting assembly 43 is disposed between the pitch-changing plate 45 and the transverse slide rail 42.

[0055] The pitch-variable plate 45 is laterally spaced apart with a plurality of pitch-variable slots 46. The distance between the tops of adjacent pitch-variable slots 46 is smaller than the distance between the bottoms of adjacent pitch-variable slots 46. The width between the tops of two adjacent pitch-variable slots is a1, and the width between the bottoms of two adjacent pitch-variable slots is a2. The distance a1 is smaller than the distance a2. The pitch-variable plate is a conventional structure.

[0056] A guide wheel 431 is rotatably mounted on the upper side wall of each suction cup mounting assembly 43 , and the guide wheel 431 of each suction cup mounting assembly 43 is inserted into one of the pitch-changing slots 46 ;

[0057] When the pitch change plate moves upward, the guide wheel moves to the bottom of the pitch change slot, and the adjacent suction cup mounting assemblies move away from each other; when the pitch change plate moves downward, the guide wheel moves to the top of the pitch change slot, and the adjacent suction cup mounting assemblies move closer to each other.

[0058] Since the vertical position of the suction cup mounting assembly relative to the mounting plate does not change, the extension and retraction of the pitch cylinder output shaft drives the pitch plate up and down, adjusting the top and bottom positions of the pitch slot. Therefore, as the pitch slot position changes, the guide wheel moves laterally, driving the suction cup mounting assembly along the transverse rail to adjust the distance between adjacent suction cups. The guide wheel's diameter matches the width of the pitch slot and is smaller than its length. Therefore, as the pitch plate moves up and down, it pulls the guide wheel laterally through the pitch slot.

[0059] See also Figure 6 As shown, the suction cup mounting assembly 43 includes a vertical plate 432 and a connecting rod 433. One side of the vertical plate 432 is slidably connected to the horizontal slide rail 42. Two limit plates 434 are provided on the other side of the vertical plate 432. The connecting rod 433 is vertically movably connected to the two limit plates 434.

[0060] The two limiting plates 434 are spaced apart from each other, and each limiting plate 434 is provided with a through hole, and the middle portion of the connecting rod 433 is movably inserted into the two through holes;

[0061] The top and middle parts of the connecting rod 433 are respectively provided with an upper limit part 435 and a lower limit part 436. The upper limit part 435 is arranged above the upper limit plate 434, and the lower limit part 436 is arranged between the two limit plates 434. A spring 437 is also sleeved on the outside of the connecting rod 433. The top of the spring 437 abuts on the bottom surface of the upper limit plate 434, and the bottom of the spring 437 abuts on the lower limit part 436. The spring 437 pushes the connecting rod 433 to move downward, so that the upper limit part 435 abuts on the top surface of the upper limit plate 434.

[0062] In this embodiment, in order to ensure that the suction cup can stably hold the chip and the chip can also be stably pressed against the test position, during use, the driving mechanism drives the grabbing assembly to move downward, and the suction cup will first contact the chip. At this time, the driving mechanism continues to drive the grabbing assembly downward, that is, it will push the mounting plate, the vertical plate, and the limit plate downward, compress the spring through the limit plate, and use the restoring force of the spring to push the suction cup downward, so that the suction cup is stably pressed against the chip, and then use the negative pressure to stably adsorb the chip through the suction cup. When the driving mechanism drives the grabbing assembly upward again, the spring will recover, causing the connecting rod to move downward and return to its original position. When the suction cup grabs the chip and places it on the test position, the driving mechanism will also drive the grabbing assembly downward, using the limit plate to compress the spring, so that the restoring force of the spring is used to apply downward pressure to the connecting rod and the suction cup, so that the chip is stably pressed on the test position of the test circuit board, ensuring the stability of the chip test. In this way, the elastic pressure of the spring is used to apply downward pressure to the chip by the suction cup. This is a flexible force, not a rigid pressure, to prevent the suction cup or the connecting rod from crushing the chip or the test circuit board. In this way, even if there is a certain error in the position of the driving mechanism driving the grabbing assembly to move downward (the accuracy is not very high), there will be no problem of damage to the chip or the test circuit board.

[0063] The bottom of the connecting rod 433 has a cavity, and a connector 438 is provided on the outer surface of the middle portion of the connecting rod, which is connected to the top of the cavity. The connector is connected to an air pipe (not shown in the air pipe diagram), and the suction cup is installed at the bottom of the connecting rod and is connected to the cavity. In this way, the cavity is at the bottom of the connecting rod, and the cavity forms an airway connecting the air pipe and the suction cup. The length of the cavity can be shorter, which can improve the efficiency and effect of negative pressure adsorption. At the same time, the connecting rod only needs to punch a hole at the bottom to form a cavity, and punch holes in the side wall to connect to the cavity for the installation of the connector, which is convenient for the processing of the connecting rod. In addition, the strength of the connecting rod is higher than that of a fully hollow connecting rod, and it is not easy to be damaged and has a longer service life.

[0064] See also Figure 6 As shown, a U-shaped plate 439 is further provided on the vertical plate 432 below the limit plate 434 below, and a U-shaped groove is provided on the U-shaped plate 439. The middle part of the connecting rod 433 is movably set in the U-shaped groove, and two cut surfaces 4331 are symmetrically provided on the outer surface of the middle part of the connecting rod 433, and the cut surfaces 4331 on both sides are respectively in contact with the two side surfaces of the U-shaped groove.

[0065] In this embodiment, the connecting rod is cylindrical in shape. Since it moves within the through hole and is provided with an upper limit portion and a lower limit portion, the connecting rod is axially and radially limited, but its circumferential rotational freedom is not limited. Therefore, during the up-and-down movement of the connecting rod, some rotation may occur. When the suction cup adsorbs the chip and places it on the test position, if the chip rotates a certain angle, unstable contact or lack of contact may occur, resulting in test failure. Therefore, it is necessary to limit the circumferential rotational freedom of the connecting rod. If the connecting rod and the through hole are made into a polygonal structure, the circumferential rotational freedom can be limited, but this structure is more difficult and expensive to manufacture. Therefore, in this embodiment, a U-shaped plate is provided on the vertical plate below the limit plate, and cut surfaces are directly provided on both sides of the connecting rod. The cut surfaces are used to contact the side surfaces of the U-shaped groove of the U-shaped plate to achieve circumferential rotational limitation, which is low in manufacturing cost. The joint is provided below the U-shaped plate. When the connecting rod moves up and down, the joint will not collide with the U-shaped plate or cause interference.

[0066] See also Figure 3-5 As shown, the first grabbing assembly 31 is arranged on the front side of the second grabbing assembly 32, and a connecting plate 36 is installed on the side of the mounting plate 41 of the second grabbing assembly 32. The connecting plate 36 is arranged parallel to the guide rod 33, and the separation cylinder 34 is installed on the connecting plate 36;

[0067] A longitudinal strip groove 37 is provided at the front end of the connecting plate 36, and a convex portion 38 is provided on the side of the first grabbing component 31. The convex portion 38 passes through the longitudinal strip groove 37 and is arranged opposite to the separation cylinder 34. The output shaft of the separation cylinder 34 is connected to the convex portion 38.

[0068] In this embodiment, in order to ensure the accuracy of the extension and retraction of the separation cylinder output shaft and the accuracy of the positions of the first and second grabbing assemblies when they approach or move away from each other, a connecting plate is provided, and a longitudinal strip groove is provided on the connecting plate. The longitudinal strip groove is provided parallel to the separation cylinder output shaft, and the separation cylinder output shaft is also provided parallel to the guide rod. In addition, the protrusion passes through the longitudinal strip groove and is connected to the output shaft of the separation cylinder. When the separation cylinder output shaft is extended and the protrusion contacts the front end of the longitudinal strip groove, the first and second grabbing assemblies move away from each other. When the separation cylinder output shaft is retracted and the protrusion contacts the rear end of the longitudinal strip groove, the first and second grabbing assemblies move toward each other. In this way, the positions of the first and second grabbing assemblies approaching and moving away from each other are accurate and stable.

[0069] See also Figure 1 、 2As shown in Figures 7-9, the chip grabbing mechanism 3 is movably arranged above the test circuit board 2 and the tray placement position 12; the test circuit board is arranged at the rear side of the tray placement position.

[0070] The driving mechanism 5 includes a transverse driving mechanism 51, a longitudinal driving mechanism 52, and a vertical driving mechanism 53. The longitudinal driving mechanism 52 is divided into two groups. The two groups of longitudinal driving mechanisms 52 are installed on the machine 1. The test circuit board 2 and the tray placement position 12 are arranged between the two groups of longitudinal driving mechanisms 52.

[0071] Both ends of the transverse driving mechanism 51 are mounted on two sets of longitudinal driving mechanisms 52 , and the two sets of longitudinal driving mechanisms 52 are configured to drive the transverse driving mechanism 51 to move longitudinally;

[0072] The vertical driving mechanism 53 is mounted on the horizontal driving mechanism 51 , and the horizontal driving mechanism 51 is configured to drive the vertical driving mechanism 53 to move horizontally. The chip grabbing mechanism 3 is mounted on the vertical driving mechanism 53 , and the vertical driving mechanism 53 is configured to drive the chip grabbing mechanism 3 to move vertically.

[0073] The chip grabbing mechanism is driven by the horizontal drive mechanism, the longitudinal drive mechanism and the vertical drive mechanism to move in the X, Y and Z directions to realize the chip grabbing, moving, detecting and placing actions.

[0074] See also Figure 1 、 2 As shown in Figures 7-9, the longitudinal drive mechanism 52 includes a longitudinal frame 521, a longitudinal slide rail 522, a longitudinal lead screw 523 and a longitudinal motor 524. The longitudinal frame 521 is mounted on the machine platform 1, and the longitudinal slide rail 522 and the longitudinal motor 524 are mounted on the longitudinal frame 521. The longitudinal lead screw 523 is arranged parallel to the side of the longitudinal slide rail 522, and both ends of the longitudinal lead screw are rotatably connected to the longitudinal frame. The longitudinal motor 524 is configured to drive the longitudinal lead screw 523 to rotate.

[0075] The transverse driving mechanism 51 includes a transverse frame 511, a transverse guide rail 512 arranged on the transverse frame 511, a transverse screw 513 and a transverse motor 514. The end of the transverse frame 511 is slidingly connected to the longitudinal slide rail 522 on one side, and the longitudinal screw 523 is connected to the end of the transverse frame 511 (threaded connection); the transverse screw 513 is arranged parallel to the side of the transverse guide rail 512, and the two ends of the transverse screw 513 are rotatably connected to the transverse frame 511. The transverse motor 514 is configured to drive the transverse screw 513 to rotate; when the longitudinal screw rotates, it drives the transverse frame to move longitudinally along the longitudinal slide rail.

[0076] The vertical drive mechanism 53 includes a slide 531, a vertical motor 532, a vertical lead screw 533, and a vertical slide rail 534. The slide 531 is slidably mounted on the transverse guide rail 512 and is screwed to the transverse lead screw 513. The vertical slide rail 534 is mounted on the slide 531. The rear end of the second grabbing assembly 32 is slidably mounted to the vertical slide rail 534. The vertical lead screw 533 is parallel to the side of the vertical slide rail 534. Both ends of the vertical lead screw 533 are rotatably mounted to the slide 531. The middle portion of the vertical lead screw 533 is screwed to the second grabbing assembly 32. The vertical motor 532 is configured to rotate the vertical lead screw 533. When the vertical lead screw rotates, it drives the second grabbing assembly to move vertically along the vertical slide rail.

[0077] In this embodiment, the longitudinal motor drives the longitudinal lead screw to rotate, which drives the horizontal frame to move longitudinally along the longitudinal slide rail, that is, to move forward and backward, and at the same time drives the vertical drive mechanism and the chip grabbing mechanism to move forward and backward. When the transverse motor drives the transverse lead screw to rotate, it drives the slide to move laterally along the transverse guide rail, that is, to move left and right, and at the same time drives the chip grabbing mechanism above the vertical drive mechanism to move left and right. When the vertical motor drives the vertical lead screw to rotate, it drives the second grabbing assembly to move vertically along the vertical slide rail, that is, to move up and down, thereby driving the second grabbing assembly to move up and down. Since the first grabbing assembly is also connected to the second grabbing assembly, it will simultaneously drive the first grabbing assembly to move along with the second grabbing assembly, thus enabling the chip grabbing mechanism to move in three directions.

[0078] In this embodiment, the driving mechanism uses a motor and a lead screw as the main force components, which have high precision and good stability, thereby ensuring the accuracy of chip grabbing and placement.

[0079] Of course, the drive mechanism may also employ a transverse cylinder, a longitudinal cylinder, a vertical cylinder, and corresponding transverse slide rails, longitudinal slide rails, and vertical slide rails to achieve transverse, longitudinal, and vertical movement of the chip grabbing mechanism. Alternatively, the drive mechanism may be of other forms as long as it can achieve three-axis movement of the chip grabbing mechanism.

Claims

1. A chip testing device comprising a platform, a test circuit board mounted on the platform, a chip gripping mechanism, and a drive mechanism, wherein the drive mechanism is configured to drive the chip gripping mechanism to move horizontally, longitudinally, and vertically, and is characterized in that: The machine platform is provided with a positioning platform, and the positioning platform is provided with two material tray placement positions; The chip grabbing mechanism includes two sets of grabbing assemblies arranged opposite to each other, the two sets of grabbing assemblies include a first grabbing assembly and a second grabbing assembly, the second grabbing assembly is connected to the driving mechanism, and the first grabbing assembly is movably connected to the second grabbing assembly via a plurality of guide rods; A separation cylinder is provided on the side of the second grabbing assembly, the output shaft of the separation cylinder is connected to the first grabbing assembly, and the separation cylinder is configured to drive the first grabbing assembly to move closer to or away from the second grabbing assembly; Each of the material grabbing components is provided with a plurality of suction cups.

2. The chip testing device according to claim 1, wherein: The material grabbing assembly includes a mounting plate, at least one transverse slide rail, multiple sets of suction cup mounting assemblies and a variable distance module, each of the suction cups is mounted on the bottom of a set of the suction cup mounting assemblies, the transverse slide rail is mounted on the mounting plate, and the tops of the multiple sets of suction cup mounting assemblies are slidably connected to the transverse slide rail; The distance-changing module is mounted on the mounting plate, and is configured to drive multiple groups of the suction cup mounting assemblies to move along the transverse slide rail, and to make adjacent suction cup mounting assemblies move closer to or farther away from each other.

3. The chip testing device according to claim 2, wherein: The pitch-changing module includes a pitch-changing cylinder and a pitch-changing plate, wherein the pitch-changing cylinder is mounted on the mounting plate, and the pitch-changing plate is disposed beside the mounting plate. The pitch-changing cylinder is configured to drive the pitch-changing plate to move vertically, and the suction cup mounting assembly is disposed between the pitch-changing plate and the transverse slide rail. The pitch-changing plate is provided with a plurality of pitch-changing slots spaced laterally apart, and the distance between the tops of adjacent pitch-changing slots is smaller than the distance between the bottoms of adjacent pitch-changing slots; A guide wheel is rotatably mounted on the upper side wall of each suction cup mounting assembly, and the guide wheel of each suction cup mounting assembly is inserted into one of the pitch-changing slots; When the pitch change plate moves upward, the guide wheel moves to the bottom of the pitch change slot, and the adjacent suction cup mounting assemblies move away from each other; when the pitch change plate moves downward, the guide wheel moves to the top of the pitch change slot, and the adjacent suction cup mounting assemblies move closer to each other.

4. The chip testing device according to claim 2, wherein: The suction cup mounting assembly includes a vertical plate and a connecting rod, one side of the vertical plate is slidably connected to the horizontal slide rail, and the other side of the vertical plate is provided with two limit plates, and the connecting rod is vertically movably connected to the two limit plates; The two limiting plates are spaced apart from each other, each limiting plate is provided with a through hole, and the middle portion of the connecting rod is movably inserted into the two through holes; The top and middle parts of the connecting rod are respectively provided with an upper limit part and a lower limit part. The upper limit part is arranged above the upper limit plate, and the lower limit part is arranged between the two limit plates. A spring is also sleeved on the outside of the connecting rod, and the top of the spring is against the bottom surface of the upper limit plate, and the bottom of the spring is against the lower limit part. The spring pushes the connecting rod to move downward so that the upper limit part is against the top surface of the upper limit plate.

5. The chip testing device according to claim 4, wherein: The bottom of the connecting rod has a cavity, and a joint is provided on the outer surface of the middle part of the connecting rod and connected to the top of the cavity. The joint is connected to an air pipe, and the suction cup is installed at the bottom of the connecting rod and connected to the cavity.

6. The chip testing device according to claim 4, wherein: A U-shaped plate is also provided on the vertical plate below the limit plate below, and a U-shaped groove is provided on the U-shaped plate. The middle part of the connecting rod is movably set in the U-shaped groove, and two cross-sections are symmetrically provided on the outer surface of the middle part of the connecting rod, and the cross-sections on both sides are respectively in contact with the two side surfaces of the U-shaped groove.

7. The chip testing device according to claim 2, wherein: The first material grabbing assembly is arranged on the front side of the second material grabbing assembly, a connecting plate is installed on the side of the mounting plate of the second material grabbing assembly, the connecting plate is arranged parallel to the guide rod, and the separation cylinder is installed on the connecting plate; The front end of the connecting plate is provided with a longitudinal strip groove, and the side of the first grabbing component is provided with a convex portion, which passes through the longitudinal strip groove and is arranged opposite to the separation cylinder, and the output shaft of the separation cylinder is connected to the convex portion.

8. The chip testing device according to claim 1, wherein: A plurality of negative pressure suction holes are provided on the bottom surface of the material tray placement position.

9. The chip testing device according to claim 1, wherein: The chip grabbing mechanism is movably arranged above the test circuit board and the material tray placement position; The driving mechanism includes a transverse driving mechanism, a longitudinal driving mechanism and a vertical driving mechanism. The longitudinal driving mechanism is divided into two groups. The two groups of longitudinal driving mechanisms are installed on the machine platform. The test circuit board and the material tray are placed between the two groups of longitudinal driving mechanisms. Both ends of the transverse drive mechanism are mounted on two sets of longitudinal drive mechanisms, and the two sets of longitudinal drive mechanisms are configured to drive the transverse drive mechanism to move longitudinally; The vertical driving mechanism is mounted on the horizontal driving mechanism, and the horizontal driving mechanism is configured to drive the vertical driving mechanism to move horizontally. The chip grabbing mechanism is mounted on the vertical driving mechanism, and the vertical driving mechanism is configured to drive the chip grabbing mechanism to move vertically.

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