Packaging structure
By using elastic connecting components in the package structure to realize the vertical electrical connection between the electronic components and the upper substrate, the problem of excessively long circuit paths in the prior art is solved, and wiring is simplified and signal quality is improved.
Patent Information
- Application Number
- CN202422227047.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-09-11
AI Technical Summary
In the existing stacked packaging structure, electronic components with smaller heights cannot be directly vertically electrically connected to the upper substrate, and must be indirectly connected through the lower substrate and the electrical connection, resulting in too long circuit paths and complex wiring.
An elastic connecting component is adopted, including a first connecting member connected to the second electronic component and a second side connected to the second substrate, so as to realize a direct vertical electrical connection to avoid the arrangement of additional circuits on the lower substrate.
Vertical communication connection between lower-height electronic components and the upper substrate is achieved, circuit wiring is simplified, packaging product size is reduced and signal quality is improved.
Smart Images
Figure CN223260603U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor packaging, and in particular, to a packaging structure. Background Art
[0002] Current stacked packaging products often utilize a component stacking design. The drawback of this design is that the upper substrate can only be directly connected to the tallest electronic component. Smaller electronic components can only be electrically connected via the circuitry on the lower substrate and the solder balls connecting the upper and lower substrates.
[0003] Figure 1 FIG. 1 shows a schematic diagram of a packaging structure of the prior art. Figure 1 As shown, the packaging structure includes a first substrate 901, a second substrate 902, a chip 903, a first electronic component 904, a second electronic component 905 and an electrical connector 906. The first electronic component 904, the second electronic component 905 and the electrical connector 906 are respectively arranged above the first substrate 901 and electrically connected to the first substrate 901. The second substrate 902 is located above the first electronic component 904, the second electronic component 905 and the electrical connector 906, and the top of the first electronic component 904 and the electrical connector 906 are electrically connected to the bottom of the second substrate 902. The chip 903 is arranged above the second substrate 902 and electrically connected to the second substrate 902. The arrows in the figure represent the routes of the signals emitted by the second electronic component 905 and transmitted to the chip 903 through the first substrate 901, the electrical connector 906 and the second substrate 902 in sequence.
[0004] Figure 1 The disadvantage of the packaging structure of the prior art shown is that the second electronic component 905 cannot be electrically connected to the second substrate 902 in the vertical direction, and must pass through the circuit and electrical connector 906 on the first substrate 901 to be electrically connected to the second substrate 902. This requires additional circuits to be set up on the first substrate 901 and the circuit path between the second electronic component 905 and the second substrate 902 is longer.
[0005] In summary, the art needs to provide a packaging structure that can overcome the defects of the prior art. Utility Model Content
[0006] The present application provides a packaging structure that can solve the problems of the prior art. The purpose of the present application is achieved through the following technical solutions.
[0007] One embodiment of the present application provides a packaging structure, which includes: a first substrate; a second substrate, the second substrate is located above the first substrate; a first electronic component, the first electronic component is arranged between the first substrate and the second substrate, and the first electronic component is connected to the first substrate and the second substrate respectively; at least one second electronic component, the second electronic component is connected to the first substrate; at least one connecting component, the connecting component includes a first connecting member with elasticity, one side of the connecting component is connected to the second electronic component through the first connecting member, and the other side of the connecting component is connected to the second substrate.
[0008] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the connecting component also includes a connecting board and a second connecting member, one side of the connecting board is connected to the second electronic component through the first connecting member, and the other side of the connecting board is connected to the second substrate through the second connecting member.
[0009] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, each connecting component is connected to one or more second electronic components.
[0010] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, second electronic components of different heights are connected to the second substrate via connecting components having connecting plates of different thicknesses.
[0011] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the thickness of the connecting plate is determined according to the distance between the upper surface of the second electronic component and the lower surface of the second substrate.
[0012] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the first electronic component is a passive component.
[0013] In some optional embodiments, a packaging structure is provided according to one of the above embodiments of the present application, wherein the packaging structure also includes a chip, which is arranged above the second substrate and connected to the second substrate, and the chip is electrically connected to the second electronic component through the second substrate and the connecting component.
[0014] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the chip is electrically connected to the second electronic component through the second substrate.
[0015] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the first substrate, the first electronic component and the second substrate are connected in sequence to form a first circuit, and the first substrate, the second electronic component, the connecting component and the second substrate are connected in sequence to form a second circuit.
[0016] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the second circuit is located within the projection range of the connecting component on the first substrate and the second substrate in the vertical direction.
[0017] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the first connector is a spring pin.
[0018] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the second electronic component is a passive component or an active component.
[0019] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the connecting board is a circuit board.
[0020] The advantages of the packaging structure according to the embodiment of the present application are: it enables electronic components with lower height to communicate vertically with the upper substrate, without the need to set up circuits connecting electronic components and solder balls on the lower substrate, reducing the difficulty of circuit wiring and helping to reduce the size of the packaged product; reducing the length of the signal transmission path, which is conducive to improving signal quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Other features, objects and advantages of the present application will become more apparent through the detailed description of non-limiting embodiments of the present application with reference to the following drawings.
[0022] Figure 1 A schematic diagram of a packaging structure of the prior art is shown;
[0023] Figure 2 A schematic diagram of a packaging structure according to an embodiment of the present application is shown;
[0024] Figure 3 Shown as Figure 2 A schematic diagram of a connection component of a packaging structure according to an embodiment of the present application is shown;
[0025] Figure 4 A schematic diagram showing a packaging structure according to a second embodiment of the present application is shown;
[0026] Figure 5 A schematic diagram showing a packaging structure according to a third embodiment of the present application is shown;
[0027] Figure 6-1 、 6-2 and 6-3 show a schematic diagram of a production process of a packaging structure according to an embodiment of the present application;
[0028] Reference numerals and component names: 1-first substrate, 2-second substrate, 3-first electronic component, 4-second electronic component, 5-connecting component, 6-chip, 11-first circuit layer, 21-second circuit layer, 31-first electrical connector, 41-second electrical connector, 51-first connector, 52-second connector, 53-connecting plate, 61-third electrical connector, 101-first substrate, 102-first circuit layer, 103-first electronic component, 103a-electrical connector, 104-second electronic component, 104a-electrical connector, 105-second substrate, 106-second circuit layer, 107-connecting component, 108-first connector, 109-electrical connector, 901-first substrate, 902-second substrate, 903-chip, 904-first electronic component, 905-second electronic component, 906-electrical connector. DETAILED DESCRIPTION
[0029] The following describes the specific implementation methods of the present application in conjunction with the accompanying drawings and examples. Through the contents of this specification, those skilled in the art can clearly and completely understand the technical solutions, technical problems solved, and technical effects produced by the present application. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. In addition, for ease of description, only the parts relevant to the present application are shown in the accompanying drawings.
[0030] It should be readily understood that the meanings of “on,” “over,” and “over…” in this application should be interpreted in the broadest sense, such that “on” not only means “directly on something,” but also means “on something” including intermediate components or layers therebetween.
[0031] Furthermore, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used herein to describe the relationship of one element or component to another element or component illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90° or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.
[0032] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of this application. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application. At the same time, terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of this application. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this application without substantially changing the technical content.
[0033] As used herein, the term "layer" refers to a portion of a material comprising an area having a certain thickness. A layer may extend over the entire underlying or superstructure, or may have an extent that is less than the extent of the underlying or superstructure. In addition, a layer may be an area of a homogeneous or inhomogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure or between any pair of horizontal planes therebetween. A layer may extend horizontally, vertically and / or along a tapered surface. A substrate may be a layer, may include one or more layers therein, and / or may have one or more layers thereon, above and / or below. A layer may include multiple layers. For example, a semiconductor layer may include one or more doped or undoped semiconductor layers, and may have the same or different materials.
[0034] The term "electrical connector" as used herein may refer to a pad or a bump. Examples of the bump include a gold bump (usually rectangular, made of gold), a solder bump (usually round, made of copper and tin), and a pillar bump (usually octagonal or polygonal, made of copper and tin or lead and tin).
[0035] In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.
[0036] Figure 2 A schematic diagram of a packaging structure according to an embodiment of the present application is shown. Figure 3 Shown as Figure 2 FIG. 1 is a schematic diagram of a connection component of a packaging structure according to an embodiment of the present application. Figures 2 to 3As shown, the packaging structure includes: a first substrate 1; a second substrate 2, the second substrate 2 is located above the first substrate 1; a first electronic component 3, the first electronic component 3 is arranged between the first substrate 1 and the second substrate 2, and the first electronic component 3 is connected to the first substrate 1 and the second substrate 2 respectively; at least one second electronic component 4, the second electronic component 4 is connected to the first substrate 1; at least one connecting component 5, the connecting component 5 includes a first connecting member 51 with elasticity, one side of the connecting component 5 is connected to the second electronic component 4 through the first connecting member 51, and the other side of the connecting component 5 is connected to the second substrate 2.
[0037] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the elastic first connector 51 can adapt to the distance difference between the upper surface of the second electronic component 4 and the lower surface of the second substrate 2 caused by the size of the second electronic component 4 itself, the tolerance or error during installation, and the warping of the first substrate 1 through its elasticity, thereby ensuring that the connecting component 5 can be stably electrically connected to the second electronic component 4; preferably, the first connector 51 can be a spring pin.
[0038] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the connecting component 5 also includes a connecting plate 53 and a second connecting member 52, one side of the connecting plate 53 is connected to the second electronic component 4 through the first connecting member 51, and the other side of the connecting plate 53 is connected to the second substrate 2 through the second connecting member 52.
[0039] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, each connecting component 5 is connected to one or more second electronic components 4 .
[0040] In some optional embodiments, according to the packaging structure provided by one embodiment of the present application, the second electronic components 4 of different heights are connected to the second substrate 2 via the connecting member 5 having connecting plates 53 of different thicknesses.
[0041] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the thickness of the connecting plate 53 is determined according to the distance between the upper surface of the second electronic component 4 and the lower surface of the second substrate 2 .
[0042] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the second electronic component 4 can have different sizes and heights, and the electronic components 4 of different heights can be electrically connected to the second substrate 2 through connecting components 5 of different thicknesses.
[0043] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the first electronic component 3 is a passive component.
[0044] In some optional embodiments, a packaging structure is provided according to one of the above embodiments of the present application, wherein the packaging structure also includes a chip 6, which is arranged above the second substrate 2 and connected to the second substrate 2, and the chip 6 is electrically connected to the second electronic component 4 through the second substrate 2 and the connecting component 5.
[0045] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the chip 6 is electrically connected to the second electronic component 4 through the second substrate 2 .
[0046] In some optional embodiments, according to the package structure provided by one of the aforementioned embodiments of the present application, the first substrate 1, the first electronic component 3, and the second substrate 2 are sequentially connected to form a first circuit, and the first substrate 1, the second electronic component 4, the connecting member 5, and the second substrate 2 are sequentially connected to form a second circuit. The second electronic component 4 can be connected to the chip 6 via the shortest path through the second circuit.
[0047] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the second circuit is located within the projection range of the connecting component 5 on the first substrate 1 and the second substrate 2 in the vertical direction.
[0048] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the second electronic component 4 is a passive component or an active component.
[0049] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the connecting board 53 is a circuit board.
[0050] In some optional embodiments, a packaging structure is provided according to one of the above embodiments of the present application, wherein a first circuit layer 11 is provided on the first substrate 1, a second circuit layer 21 is provided on the second substrate 2, the first electronic component 3 is electrically connected to the first circuit layer 11 and the second circuit layer 21 respectively through a first electrical connector 31, and the second electronic component 4 is electrically connected to the first circuit layer 11 through a second electrical connector 41.
[0051] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the second circuit layer 21 passes through the second substrate 2 , and the chip 6 is electrically connected to the second circuit layer 21 through the third electrical connector 61 .
[0052] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the first electronic component 3 and the second electronic component 4, and the multiple first electronic components 3 and the multiple second electronic components 4 can be electrically connected through the first circuit layer 11.
[0053] In some optional embodiments, according to the packaging structure provided in one embodiment of the present application, Figure 2 The arrows in the figure show the signal transmission path between the second electronic component 4 and the chip 6. The second electronic component 4 can be vertically connected to the second circuit layer 21 on the second substrate 2 through the connecting component 5. The signal emitted by the second electronic component 4 can be transmitted to the chip 6 through the connecting component 5 and the second substrate 2 in sequence; the signal emitted by the second electronic component 4 can also pass through other electronic components 4 and then be transmitted to the chip 6 through the connecting component 5 and the second substrate 2.
[0054] Figure 4 FIG. 1 shows a schematic diagram of a packaging structure according to a second embodiment of the present application. Figure 4 As shown, electronic components 4 of different heights can also be electrically connected to the second substrate 2 through the same connecting component 5 , and the elastic first connecting member 51 can adapt to and connect electronic components 4 of different heights.
[0055] Figure 5 FIG. 1 shows a schematic diagram of a packaging structure according to a third embodiment of the present application. Figure 5 As shown, when the two ends of the first substrate 1 are warped, the distance between the electronic component 4 and the connecting component 5 may become inconsistent. At this time, the elastic first connecting member 51 can automatically adapt to the different distances between the electronic component 4 and the connecting component 5 and connect the electronic component 4. Figure 6-1 、 6-2 6-3 shows a schematic diagram of the production process of the packaging structure according to an embodiment of the present application. Figure 6-1 、 6-2 As shown in Figure 6-3, the production process of the package structure includes the following steps:
[0056] Step 1001: providing a first substrate 101, wherein a first circuit layer 102 is provided on the first substrate 101;
[0057] Step 1002: Disposing a first electronic component 103 and a second electronic component 104 on the first substrate 101, wherein the first electronic component 103 is electrically connected to the first circuit layer 102 via an electrical connector 103a, and the second electronic component 104 is electrically connected to the first circuit layer 102 via an electrical connector 104a;
[0058] Step 1003: providing a second substrate 105 , wherein a second circuit layer 106 is provided on the second substrate 105 ;
[0059] Step 1004: disposing a connecting component 107 and an electrical connecting component 109 on the second substrate 105, wherein a first elastic connecting component 108 is disposed on the connecting component 107; and
[0060] Step 1005: Combine the components made in steps 1002 and 1004, wherein the connecting component 107 is connected to the second electronic component 104 via the first connecting component 108, and the electrical connecting component 109 is connected to the first electronic component 103, wherein the elastic first connecting component 108 can adapt to the distance difference between the upper surface of the second electronic component 104 and the lower surface of the second substrate 105 caused by the size of the second electronic component 104 itself, the tolerance or error during installation, and the warping of the first substrate 101 through its elasticity, thereby ensuring that the connecting component 107 can be stably electrically connected to the second electronic component 104.
[0061] The advantages of the packaging structure according to the embodiment of the present application are: it enables electronic components with lower height to communicate vertically with the upper substrate, without the need to set up circuits connecting electronic components and solder balls on the lower substrate, reducing the difficulty of circuit wiring and helping to reduce the size of the packaged product; reducing the length of the signal transmission path, which is conducive to improving signal quality.
[0062] Although the present application has been described and illustrated with reference to specific embodiments of the present application, these descriptions and illustrations are not intended to limit the present application. It will be clearly understood by those skilled in the art that various changes may be made and that equivalent elements may be substituted within the embodiments without departing from the scope of protection of the present application as defined by the claims. Due to variables in the manufacturing process, etc., there may be differences between the technical reproduction in the present application and the actual device. There may be other embodiments of the present application that are not specifically described. The description and illustrations should be regarded as illustrative, not restrictive, and modifications may be made according to the purpose and spirit of the present application, all of which are within the scope of protection of the claims. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations may be recombined, subdivided, or arranged to form equivalent methods without departing from the teachings of the present application. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit the present application.
Claims
1. A packaging structure, characterized in that: include; a first substrate; a second substrate, the second substrate being located above the first substrate; a first electronic component, the first electronic component being disposed between the first substrate and the second substrate, and the first electronic component being connected to the first substrate and the second substrate respectively; at least one second electronic component, the second electronic component being connected to the first substrate; At least one connecting component includes a first connecting member having elasticity, one side of the connecting component is connected to the second electronic component through the first connecting member, and the other side of the connecting component is connected to the second substrate.
2. The packaging structure according to claim 1, wherein: The connecting component further includes a connecting plate and a second connecting member. One side of the connecting plate is connected to the second electronic component through the first connecting member, and the other side of the connecting plate is connected to the second substrate through the second connecting member.
3. The packaging structure according to claim 2, wherein: Each of the connecting components is connected to one or more of the second electronic components.
4. The packaging structure according to claim 3, wherein: The second electronic components of different heights are connected to the second substrate through the connection member having the connection plates of different thicknesses.
5. The packaging structure according to claim 4, wherein: The thickness of the connecting plate is determined according to the distance between the upper surface of the second electronic component and the lower surface of the second substrate.
6. The packaging structure according to claim 1, wherein: The first electronic component is a passive component.
7. The packaging structure according to claim 1, wherein: The packaging structure further includes a chip, which is disposed above the second substrate and connected to the second substrate. The chip is electrically connected to the second electronic component through the second substrate and the connecting component.
8. The packaging structure according to claim 7, wherein: The chip is electrically connected to the second electronic component through the second substrate.
9. The packaging structure according to claim 1, wherein: The first substrate, the first electronic component, and the second substrate are sequentially connected to form a first circuit. The first substrate, the second electronic component, the connecting component, and the second substrate are sequentially connected to form a second circuit.
10. The packaging structure according to claim 9, wherein: The second circuit is located within a projection range of the connecting component on the first substrate and the second substrate in a vertical direction.